回覆 : [TN] Immersion Tin (3 Messages)
回覆 : [TN] Look (1 Message)
回覆 : [TN] Looking for OFHC copper and cleaner (1 Message)
% of finger contacts on boards (2 Messages)
(no subject) (1 Message)
10oz or more laminated with Polyimide (2 Messages)
3 oz copper stack up (2 Messages)
603's on My's hydra heads (2 Messages)
8 inch floppy disks (2 Messages)
90/10 Plated Tin/Lead Needed (1 Message)
: Defluxing PLCC's (1 Message)
: Jumper Wires etc. etc. etc. (2 Messages)
: Pickup angle for Fuji CP4 machine (2 Messages)
: Press-fit with Immersion NiAu or OCC (4 Messages)
<No subject> (10 Messages)
<no subject>Impedance question (1 Message)
? Impedance Calculator at IPC's WEB site. (6 Messages)
Adapter from SSOP-20 to DIP20 (2 Messages)
Additional Cpk Questions (3 Messages)
Additional information for our HASL vs SMT processing (1 Message)
Adhesion measurement-metal on glass fiber (1 Message)
ADVICE ON TECHNET (NOT LEAD BAN) (2 Messages)
annular ring (4 Messages)
Assembly Equipment Exchange (2 Messages)
Assembly Touch-up Material (1 Message)
ASSY and FAB:fine pitch, copper weight and solder mask (1 Message)
Assy: Enclosures for Dongles... (2 Messages)
Assy: Jumper wires, Bifilar wire to be precise... (2 Messages)
Assy: Prototyping Band-aid... (4 Messages)
Assy: Strange new PCB Technology? (7 Messages)
Assy: Strange new PCB Technology? -Reply (1 Message)
AW: [TN] Laminate supplier. (1 Message)
AWG (4 Messages)
B36 comb patterns (1 Message)
Board House (6 Messages)
Breakaways removing mask and damaging boards (4 Messages)
Ceramic Boards (5 Messages)
CircuiTree Info (1 Message)
CITC (2 Messages)
Cleaning - Plasma vs. Wet (1 Message)
Cleaning circuit boards (2 Messages)
CLTE (2 Messages)
coil stress relief (through hole) (1 Message)
Component Defect Percentage/PPM (2 Messages)
component designators (3 Messages)
Component Land to Land Spacing (4 Messages)
Conductor X-section for specified current (1 Message)
CONFORMAL COATING (2 Messages)
Conformal Coating on Naval Avionics PWAs (3 Messages)
Connector (1 Message)
Contact Force/Pressure (4 Messages)
Conveyorised plating line (1 Message)
Copper Cleaning/Deoxidizing (1 Message)
Copper Sample Supplier (3 Messages)
Copper Sample Supplier -Reply (1 Message)
Cost Estimation Paper (1 Message)
Cpk Question (9 Messages)
Defective BGAs? (15 Messages)
Defluxing PLCC's (2 Messages)
Defluxing systems (1 Message)
Desiccant Bags (1 Message)
Dieter Bergman Roast (1 Message)
Dieter Bergman Roast at IPC Printed Circuits Expo '99 (1 Message)
Differences Between Post Separation and IL Separation (3 Messages)
Drill Rings (1 Message)
Dull solder (2 Messages)
electrical cleanance (1 Message)
electrical clearance (5 Messages)
English expression (14 Messages)
English expression --- Guenter (1 Message)
Entek 106A OSP (6 Messages)
Experience with No Clean Paste and No Clean Flux (1 Message)
flat weave English expression (1 Message)
Flex - dynamic 3 layer (3 Messages)
Flux questions (2 Messages)
Foil and Cap Lamination For Rigid PWB product (2 Messages)
FR4 dielectric constant (4 Messages)
FR4 PWB Material (3 Messages)
Fusion bond Teflon/Tetra ICDs (1 Message)
Galvanic reactions (6 Messages)
GEN: TinStrip II and Etch Resist (1 Message)
gold embrittlement (3 Messages)
Gold Finger Slivers (3 Messages)
Gold spec. (2 Messages)
Gold Wire Bonding (2 Messages)
Hand soldering tip temperature (1 Message)
Happy Steve Day! (3 Messages)
Help (1 Message)
Help - Unknown Chip - addendum (1 Message)
Help - Unknown Chip - addendum II (1 Message)
Help - Unknown Chip to identify (2 Messages)
Help!! Big problem (solder resist vs die attach) (3 Messages)
Hole Chart v/s Drill chart on fab drawings (4 Messages)
IEC-950 (1 Message)
Immersion Gold contaminated with Copper (10 Messages)
Immersion Tin (3 Messages)
Impedance Calculator Question.... (2 Messages)
Impedance Modeling (2 Messages)
Impedance problem (1 Message)
Impedance simulations vs empirical data; was blank (1 Message)
inspection guage (2 Messages)
Instructions (1 Message)
Interferometry (Fringe counting both ways?) (4 Messages)
Intermetalics (6 Messages)
Intermetallics (12 Messages)
IPC A -610B CLASS II / CLASSIII (2 Messages)
IPC Acceptance Criteria for Visual and Cosmetic Defects (1 Message)
IPC Drilling and Routing Subcommittee Needs a Few Good Men (1 Message)
IPC News Release: IPC Getting Lead out at IPCWorks '99 (1 Message)
IST quality testing (2 Messages)
Jumper wires, haywires, oops wires, etc.... (4 Messages)
Labels on product for outside use (2 Messages)
Laminate - Tetra-2 (4 Messages)
Laminate cracks & Acceptance criteria (4 Messages)
Laminate supplier. (1 Message)
Land Pattern Calculator errors (1 Message)
Layer count and board size?? (2 Messages)
Lead removal (10 Messages)
Lead Removal (for the Final Time) (3 Messages)
Lead removal again (3 Messages)
Lead removal? (8 Messages)
Looking for OFHC copper and cleaner (4 Messages)
looking for pcb fab (1 Message)
looking for pcb fab(take 2) (1 Message)
LOW CTE PWB MATERIAL FOR BGA (1 Message)
Material Specification (1 Message)
Material Specification -Reply (2 Messages)
Measurement of copper thickness in plated through holes (2 Messages)
Melting Range (1 Message)
micro via technology (2 Messages)
Microballs in wavesoldering (3 Messages)
Microvia (1 Message)
Mil Spec (6 Messages)
MIL-STD-883 (2 Messages)
MINAMI printer ? (1 Message)
Minimum Bend radius in a flex (4 Messages)
Need advice -- ISO 9000 (2 Messages)
Need help finding board house (2 Messages)
Need parts for Panasonic MPA 80 MV100 (2 Messages)
No Clean Process (1 Message)
Non contact drill ring setting M/c (1 Message)
non-plated through hole question (2 Messages)
non-plated through hole question -Reply (1 Message)
Number of Heat Cycles (1 Message)
Only 7 more!!! (13 Messages)
optimizing laminate usage (5 Messages)
OSP Thickness Variations... (1 Message)
Palladium underplate for Cu-Ni-Au system (4 Messages)
Panelization (2 Messages)
Panelization Software for PCB's (4 Messages)
PBGA Ball Shear Standard? (1 Message)
PCB House Referral, round 2 (3 Messages)
PCB Rework Reliability (6 Messages)
PCB Routing (2 Messages)
PCBs in high vacuum (3 Messages)
Peelable mask (10 Messages)
photoresists for copper etching (3 Messages)
Pick & Place - Contact Systems vs. Multitroniks (2 Messages)
Pin-in-paste problem (2 Messages)
Plasma etching (1 Message)
Plating solder onto isolated areas (1 Message)
PPM data for HASL versus Organic Coated boards (3 Messages)
Prepreg storage (1 Message)
Preventive Action From Boards Delamination (1 Message)
Pulse (2 Messages)
PWB Materials strategy (2 Messages)
PWB Outgassing (2 Messages)
R&R Gage study (1 Message)
R&R Guage study (4 Messages)
Re Cpk (1 Message)
Regeneration of cupric chloride etchant (3 Messages)
Removal of Lead (13 Messages)
remove (1 Message)
Removing Debris from Holes before Electroless Deposition (7 Messages)
removing unused inner pads ? (18 Messages)
removing unused inner pads ? -Reply (2 Messages)
Response (1 Message)
Rework information (3 Messages)
Robber Pad (2 Messages)
Rough Route Edge & Burr (1 Message)
Sealing sockets prior to potting. (4 Messages)
Search Engines (7 Messages)
Search Engines...(ya gotta' see this one!) (1 Message)
seeking aluminum wedge bonding advice (1 Message)
Shainin Method (3 Messages)
SMT assy issue (2 Messages)
SMT dispensing systems (4 Messages)
Sn composition/thickness on vertical and horizontal pads (3 Messages)
SNEC Meeting (1 Message)
Soft gold electroplate (2 Messages)
Soft gold purity,hardness and bondabilty (5 Messages)
Solder bridges (1 Message)
Solder Bridging (5 Messages)
solder composition (5 Messages)
solder composition (kinda' long...) (2 Messages)
Solder Composition for TBGA (2 Messages)
solder joint temps (2 Messages)
Solder Mask Clearances on dogbone vias (4 Messages)
solder paste residues (5 Messages)
Solder Paste Volume (1 Message)
Solder Paste volume Standards (10 Messages)
Solder tip to ground parameters (3 Messages)
Solder Volume MAchine Evaluation (2 Messages)
Solderability Tester (2 Messages)
Soldering Iron tips checks (2 Messages)
Solderless Wirewrap (3 Messages)
Spacers (4 Messages)
Specification for 2 mil conductor lines at pwb's (1 Message)
Specifications (2 Messages)
Squeegee Speed (4 Messages)
Squeegee Speed Follow-Up (4 Messages)
Steve Day (1 Message)
Storage of assembled boards at - 50 degrees Celcius (6 Messages)
Subsciber Information (1 Message)
Surface Insulation Resistance (1 Message)
TechNet Digest - 15 Feb 1999 (1 Message)
TechNet: confirmation required (6F2282) (4 Messages)
Tektronix Bare Board Tester (2 Messages)
Test (1 Message)
Test and ESS (3 Messages)
Test for Press fit v/s OSP coating (1 Message)
Tetra-Etch Alternative (1 Message)
thermal management - suppliers (2 Messages)
Thermo.Au ball bonding on Cu/Ni/flash Pd/flash Au (1 Message)
Tin Stripping; Immersion Tin (6 Messages)
Tooling Cost (1 Message)
Track to track spacing? (2 Messages)
UK POWER UTILITY (3 Messages)
UL 840 Section 12 (1 Message)
Underfill soldermask (1 Message)
unsubscribe (1 Message)
Used Equipment (1 Message)
Used PCB machines (7 Messages)
V-Grooves on Glass (3 Messages)
Vacuum frame/Hydraulic press (2 Messages)
Virus Alert (4 Messages)
Voltage Across 1206 SMD (5 Messages)
Warp & Twist (1 Message)
Warped boards using Studs (1 Message)
Wave Solder Carriers Cooling system (8 Messages)
Wave soldering machine (3 Messages)
Wavesoldering SSOP's (7 Messages)
Weird Gerber Problem-FIXED, Now: Waving Chip Networks.. (1 Message)
Weird Gerber Problem-FIXED, Now: Waving Chip Networks... (3 Messages)
Weird Gerber Problem... (3 Messages)
What is EP GC 02 DIN EN 60249-2? (1 Message)
White Residue between Solder Pads (3 Messages)
wierd gerber problem (1 Message)
Wire Bond, in over in our heads (3 Messages)
Y2k (6 Messages)
You guys are too much!! (4 Messages)
Your Message Sent on Tue, 23 Feb 1999 11:30:36 -0000 (1 Message)
[ Re: [TN] Search Engines] (2 Messages)
[TN] Adapter from SSOP-20 to DIP20 (3 Messages)
[TN] Defective BGAs? (1 Message)
[TN] Intermetallics (2 Messages)
[TN] R&R Guage study (1 Message)
[TN] Wave soldering machine (1 Message)
[TN] Wavesoldering SSOP's (1 Message)