Welcome to wherever you are,
I prepare a specification guide for my company and want know, which
"official" standards/specifications are existing or be useing for
measuring the thickness of plating the copper thickness in plated
through holes.
IPC and MIL are specifying only to measure at three different location
in the hole. To compare electrolytic copper plating I have heard that
there are specifications where to measure exactly (e.g. 25 micron
beneath the copper clad etc.)
Can anyone give me a short hint, were I can find such a specification
and which name it has?

Many thanks in advance
Roland Herold
ATOTECH Deutschland GmbH
Germany

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