One word . . . Caution. Gold and lead form an intermetallic and this can
lead to peeling on reworked contacts. It might be a better approach to
strip off the gold as well and then replate with gold. I know of some
shops that strip both gold and nickel when reworking contact areas. It is
a lot easier to activate Cu for subsequent plating than it is Ni. If the
Ni isn't fully acitvated this too can lead to peeling.
Bruce
[log in to unmask] on 02/18/99 02:18:50 PM
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Subject: [TN] Rework information
Gold contact rework
We are replating gold contacts that has been contaminated with solder
paste. The process is to remove the solder paste from the contacts, clean
the area and then apply gold using the same principle of pcb gold plating.
Is there any reliability issue with such process? Is there any particular
analysis to validate the process?
Any information in this matter will be helpful.
Enid Dávila
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