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Date: | Thu, 25 Feb 1999 08:43:37 -0500 |
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Try "Reflow Soldering to Gold", by Sherman Banks of Trimble Navigation, Ltd.
It appeared in "Electronic Packaging and Production"`s June 1995 issue.
Rob Schetty
Shipley/Shipley Ronal
Freeport NY USA
-----Original Message-----
From: Richard G. Wenda <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Thursday, February 18, 1999 2:21 PM
Subject: [TN] gold embrittlement
Dear TN,
I am looking for a white paper or perhaps an article on the effects of
gold volume to solder reflow reliability. Apparently NCMS had an
article in ~spring of '96, co-authored by Wenger and Janus,
determining that 3% was an allowable percentage.
If you know how I can find this paper I would appreciate it. If you
know of more recent studies that might help as well.
Thank you, Rich.
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