(no subject) (1 Message)
(REL) Thermal Cycling Questions (3 Messages)
(TN): Mold flash (1 Message)
(TN): Mould flash (1 Message)
...no subject... (1 Message)
2nd hand Depanelization Router (1 Message)
2nd hand DIP Inserter (1 Message)
<No subject> (10 Messages)
<None> (1 Message)
A Christmas Verse (1 Message)
A happy new year!!!Taipei Telephone changes from 7 digit to 8. TAIPEI TELEPHONE CHANGE.doc [16/16] (1 Message)
About GR3 test (1 Message)
ADMIN: IPC Policy on Job Postings (1 Message)
ADMIN: Mail List administrator on vacation (1 Message)
ADMIN: Test - please ignore (1 Message)
AOI programming: where is it done??? (3 Messages)
AOI scanning (1 Message)
Applying Art to Replicas of WWII A-2 Leather Flying Jackets (1 Message)
Area calculation (10 Messages)
area of a cylinder (1 Message)
ass'y (3 Messages)
Assembly (Solderability) (1 Message)
Assembly Type's? (2 Messages)
assy (1 Message)
ASSY: ADHESIVE SOURCE (3 Messages)
ASSY: Bakeout (1 Message)
Assy: COB Wirebond Verification (2 Messages)
ASSY: Delamination (1 Message)
ASSY: Eutectic TBGA Reliability (1 Message)
ASSY: gold finger tab plating repair (7 Messages)
ASSY: Heat Sinks on High Power Devices (2 Messages)
Assy: IC trays (2 Messages)
Assy: Isolated Grounded Iron Tips (2 Messages)
Assy: Pre-heating of PCBs (1 Message)
Assy: Selective soldering (4 Messages)
Assy: Selective soldering -Reply (1 Message)
ASSY: SMT Gluing (3 Messages)
ASSY:BGA Moisture Handling (2 Messages)
ASSY:White residue after cleaning (6 Messages)
Axial part age (1 Message)
Bar Solder (3 Messages)
Bar Solder -Reply (1 Message)
BATTELLE FLOWING GAS TEST (3 Messages)
Battelle Mixed Flowing Gas Test (1 Message)
Beiersdorf -tapes (1 Message)
Beiersdorf UK Ltd. (2 Messages)
Bellcore (2 Messages)
Bent Lead IC (1 Message)
BGA Coplanarity (10 Messages)
BGA re-balling shop (1 Message)
BGA Reballing (1 Message)
BGA Reballing -Reply (1 Message)
BGA repair shop (1 Message)
BGA Sockets (3 Messages)
BGA XRAY INSPECTION DEVICES (3 Messages)
BGA's: 2 sided reflow? (1 Message)
BGA: Double Side (2 Messages)
Board Flatness (16 Messages)
Board flatness -Reply (1 Message)
Brushing of solderballs (2 Messages)
Bumped Flip Chip (1 Message)
Camtek AOI (1 Message)
Chip Capacitors (1 Message)
Christmas message (1 Message)
Cleanliness Standards (2 Messages)
Clogged Drill Flutes/Debris in holes (2 Messages)
Clogged Drill Flutes/Debris in holes -Reply (1 Message)
Clogged Drill Flutes/Debris in holes-reply (1 Message)
Conformal coating failure analysis lab (2 Messages)
Continuity (1 Message)
Coplanarity of IC (1 Message)
Copper Core PWB's (2 Messages)
copper spots after laminat (1 Message)
copper spots after lamination (4 Messages)
Cost comparisons TH vs SMT (12 Messages)
Crack detection under BGA? (4 Messages)
Cupric Chloride Etching (1 Message)
CuSn Intermetallic growth (1 Message)
depanelization of PCBs (6 Messages)
DES: V-Grooving Multi-layer bd. (5 Messages)
DES: V-Grooving Multi-layer bd. -Reply (2 Messages)
Design: vias:current carrying capability (5 Messages)
Design:Component pad (4 Messages)
Design:Component pad -Reply (3 Messages)
Dielectric constant per ASTM D150 (3 Messages)
Dillard's Holiday Quote Server (1 Message)
Directional Plasma Etch (1 Message)
Do we really need ionic contamination measurement eq (1 Message)
Double Sided Assembly (1 Message)
Double Sided Reflow (1 Message)
Dry Film Solder Mask Tenting of Vias (4 Messages)
Electronic Industry Survey Request (3 Messages)
entek plus and flux remover (2 Messages)
entek plus process (8 Messages)
entek plus process -Reply (2 Messages)
Equipment (2 Messages)
Equivalence Factors for Ionic Cleanliness Testing (1 Message)
esd safe brushes (3 Messages)
Etchant for Au/Sn solder (2 Messages)
Etchant Recycling System (4 Messages)
Extraneous Posts! (5 Messages)
FAB/ASSY U.S. ATP funds available for R&D projects (1 Message)
FAB: AOI machine (1 Message)
FAB: DST Foil And Oxide -- Q2 (4 Messages)
FAB: File Size - Data Sets (9 Messages)
FAB: Getters (3 Messages)
FAB: Laser Blind Vias (4 Messages)
Fanamation, Inc. and Optodine, Inc. (1 Message)
filling vias (1 Message)
filling vias! (8 Messages)
Filter press for effluent treatment (3 Messages)
Flux Corrosivity (2 Messages)
Flux Evaluation (1 Message)
Gen: DCA Paradox (3 Messages)
Gen: Older software needed (1 Message)
Gen: Soldermask Adhesion (4 Messages)
GEN: Technology Forecast (2 Messages)
GEN: That's it (3 Messages)
Gen:Pin sealing of hybrids (1 Message)
Glue Stencil Print (1 Message)
Glue Stencil Print -Reply (1 Message)
Gold plating thicknes (4 Messages)
Good Wishes (12 Messages)
Good Wishes !! (2 Messages)
Good Wishes -Reply (2 Messages)
hand soldering on wave soldered board (6 Messages)
Happy Holidays (1 Message)
heeelp - NON-THERMAL RELIEVED VIAS AND COPPER PLANES (7 Messages)
heelp-NON-THERMAL RELIEVED VIAS AND COPPER PLANES (1 Message)
help (1 Message)
Help! I need .062 10 / 1 laminate. (3 Messages)
Help! I need .062 10 / 1 laminate. -Reply (2 Messages)
High Temperature application (2 Messages)
Holidays (2 Messages)
How old components can be acceptable under IPC? (1 Message)
HP 7580B Plotter (2 Messages)
Hybrid Packaging Specs (1 Message)
ignore this test (1 Message)
Impedances on Dram SIMM's (1 Message)
Independent Lab (2 Messages)
Industry Conditions for Card Assembly Thermal Stress (2 Messages)
INFO: Need e-mail address for Guenter Grossman (1 Message)
Inquiry - MicroVia Filling Methods (1 Message)
ion exchange (1 Message)
ion exchange resins (2 Messages)
IPC standards for stencil printing (2 Messages)
IPC-A-610 Conformance ? (3 Messages)
IPC-SM-785 Accelerated reliability Test Vehicle (4 Messages)
IPC-SM-785 Accelerated reliability Test Vehicle sample size (3 Messages)
IPC-SM-785 Accelerated reliability Test Vehicle samplesize (2 Messages)
IPCchat session announcement (4 Messages)
JEDEC SIMMS/DIMMS Requirements (1 Message)
Lead attachment equipment (1 Message)
Liquid Photo Imagible Solder Mask and Vias (6 Messages)
looking for ovp (1 Message)
Material Shortage (1 Message)
Measure Amount of Flux applied to a board (2 Messages)
Measuring Etch Depth (1 Message)
MERRY XMAS!!! Merry Xmas New.doc [10/10] (1 Message)
Methods for measuring the amount of flux applied to a board (1 Message)
Methods for measuring the amount of flux applied to... (1 Message)
microscopes (1 Message)
Minimum spacing for 250 volts (2 Messages)
Moisture Sensitivity Derating (1 Message)
Mylar removal systems. (1 Message)
Ni/Au and Press-Pin! (4 Messages)
No-clean flux core solder wire (2 Messages)
Non CFC lubricants. (7 Messages)
OH MY GOD !!!!!!! (1 Message)
OH MY GOD !!!!!!! NOooooooo (5 Messages)
Old components with tin leads (1 Message)
Orientation of PLCC's and QFP's (2 Messages)
Paint & scratch (1 Message)
PCB'S (4 Messages)
PCMI (1 Message)
Personal Messages/False Subjects (2 Messages)
Photo Chemical Machining Institute (1 Message)
Planar Magnetics (2 Messages)
Plating (9 Messages)
Plating Adhesions and Poiso (1 Message)
Plating figure calculator program (1 Message)
Protection for gold co (1 Message)
Protection for gold connectors /dark gold (4 Messages)
QFP coplanarity (1 Message)
re FANUC 5T CONTROLLER (2 Messages)
Re Filling Vias (1 Message)
Re Isotherm (1 Message)
Reflow Profile - 90/10, Alloy 42 (4 Messages)
Reliability: Via plugging V/S keeping them open (2 Messages)
remove the stinking spammer size (4 Messages)
Request for assistance (2 Messages)
Request for assistance -Reply (1 Message)
resend mail (1 Message)
Resistivity (3 Messages)
revearse treat foil (2 Messages)
revearse treat foil -Reply (2 Messages)
revearse treat foil -Reply -Reply (2 Messages)
revearse treat foil -Reply -Reply -Reply (2 Messages)
Rework BGA (2 Messages)
Screenprint process control (2 Messages)
Selective Soldering (1 Message)
SET NOMAIL (1 Message)
SET TechNet nomail (1 Message)
Shear/Pull-tester (1 Message)
Single side (what that? On shore you're joking right?) (1 Message)
SIR acceleration factor (1 Message)
SM Tape and Reel Specifications (3 Messages)
Soft Beam users (1 Message)
Solder Mask Question (1 Message)
Solder paste height measurement (1 Message)
Solder Pot Temp (2 Messages)
Solderball symptoms - repaired by laser - repercussions? (1 Message)
Source for Silver Paste for PCB Repairing (1 Message)
specs (2 Messages)
Stacked pcb boards (1 Message)
Standard layer naming for Autocad (and the like) files. (1 Message)
standard workship for BGA process. (1 Message)
Statistical Software (1 Message)
Storage of Raw pcb to maintain solderability (1 Message)
Subj: SRT BGA Repair (1 Message)
Subject: TN:shielding...is this all there is?? [SMT EMI shields] (1 Message)
Subscribe (2 Messages)
Supplier (3 Messages)
TechNet Digest - 2 Dec 1997 to 3 Dec 1997 (1 Message)
TechNet Xmas Poem (6 Messages)
Technology... (1 Message)
Tenting/Plugging via's under BGA's (1 Message)
Test method for Evaluation of cleaning processes for SMT soldering (1 Message)
TH part solderability concerns (1 Message)
thanks (4 Messages)
Thermal Reliefs (2 Messages)
Thin Films Product Manager (1 Message)
Thiourea (3 Messages)
Through-hole-to-SM conversion (1 Message)
TN:shielding...is this all there is?? (5 Messages)
tombstoning (1 Message)
transisiton of g10 (2 Messages)
TSOP, TQFP reliability (5 Messages)
Ultrasonic Guage (2 Messages)
Under Develope of the Wet Film Solder Mask (11 Messages)
Under Develope of the Wet Film Solder Mask -Reply (1 Message)
unsubscribe (4 Messages)
Use half empty solder paste jar next day? (1 Message)
used filter press (1 Message)
V-grooving (1 Message)
V-Scoring (7 Messages)
V-Scoring -Reply (2 Messages)
Vacrel for sale (1 Message)
Via in Pad for BGA (6 Messages)
Vias under BGA (1 Message)
Wanted: Expert in Rigid Flex manufacturing (3 Messages)
waste treatment (1 Message)
waste treatment -Reply (1 Message)
Waste Water Systems (2 Messages)
Wave solder temp (2 Messages)
Western Plastics Exposition (4 Messages)
White residue (8 Messages)
White residue -Reply (1 Message)
white residue... (4 Messages)
X-ray inspection machine (4 Messages)
[ADMIN] Phone number correction (1 Message)
[Assem] 5-22c Rd Robin Call for Participants (1 Message)
[TECHNET] POST LAM EDGE FINISHING (1 Message)
[TN] Assy: Selective soldering (1 Message)
[TN] Bumped Flip Chip (1 Message)
[TN] depanelization of PCBs (1 Message)
[TN] entek plus process (3 Messages)
[TN] filling vias! (2 Messages)
[TN] Good Wishes (1 Message)
[TN] No-clean flux core solder wire (1 Message)
[TN] re FANUC 5T CONTROLLER (1 Message)
[TN] revearse treat foil -Reply (1 Message)
[TN] Storage of Raw pcb to maintain solderability (1 Message)
[TN] Wave solder temp (2 Messages)
[TN] White residue (1 Message)