REGARDING           Screenprint process control

I am setting up a Cyberoptics LSM2 unit to measure and monitor paste height
and volume of deposits on PCBs.

I am wondering what is the most accepted method of measuring paste when
selecting a baseline. ie, with the LSM you can measure from the top of paste
to the soldermask, top of paste to substrate, or if there is any uncovered pad
from the top of paste to the pad.

Really I'm asking if it ok/accepted to measure from soldermask or substrate to
top of paste. Is soldermask thickness consistant enough to do this or will the
substrate be etched somewhat to introduce another variable.

How are other people out there using their paste height measuring equipment to
keep screenprinting under control.

Any comment will be appreciated.

Regards
John O'Sullivan.

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