(TN) Why solder balls on a BGA (2 Messages)
0402 capacitors (1 Message)
1.5V ICs and how to avoid ESD damages (2 Messages)
22Gauge Equivalent (3 Messages)
:Pad design for SMT converted leaded cap.. (1 Message)
<No subject> (5 Messages)
A TECHNOLOGY COMES OF AGE: IPC 2001 FLEX CONFERENCE CALL FOR PAPERS! (1 Message)
ADHESIVE COATED JUMPER WIRE (3 Messages)
Anodic Protection of Electroless Nickel (1 Message)
Antw: Re: [TN] Re: [TN] Re: [TN] RE: [TN]RE: [TN]PRESIÓN DE VACÍO (1 Message)
Antw: Re: [TN] Re: [TN] Re: [TN] RE:[TN]RE: [TN]PRESIÓN DE VACÍO (1 Message)
Antw: [TN] Microsectionning (1 Message)
Antw: [TN] Phase transistions in solder joints (3 Messages)
Antwort: Re: [TN] electroless nickel gold stepplating problems (1 Message)
APEX HDI and Microvia Status of Standardization Free Forum (1 Message)
APEX IPC TechNet Meeting (6 Messages)
Assembly Overlay (5 Messages)
BGA Underfill... (9 Messages)
Book Review: "Electrical Engineering For The Non-Degreed Engineer" (1 Message)
Bow and twist: Need clarification (8 Messages)
Broken traces at PTV barrel (4 Messages)
BTU Calculation for Reflow Ovens? (4 Messages)
Call for Papers - DC Learning Symposium (2 Messages)
CAM Software (3 Messages)
Cameras at APEX - Policy (1 Message)
Cameras at APEX... (2 Messages)
Can RF connectors be reflowed? (8 Messages)
Circumfrential Void (6 Messages)
Circumfrential Voids (3 Messages)
Collar Heat-sink (3 Messages)
Comparing AOI systems (1 Message)
Conformal Coating BGA (5 Messages)
Connector (7 Messages)
Connector Question (1 Message)
Conversions and Terms (11 Messages)
CQFP cracking... (5 Messages)
Defect Codes (2 Messages)
Did anybody see the news about "IT"? (5 Messages)
Documentation Notes (3 Messages)
DPMO metrics question for member (2 Messages)
Drilling through Assemblies (5 Messages)
DUT board???? (2 Messages)
electroless nickel gold stepplating problems (3 Messages)
ENIG article (2 Messages)
ENIG moisture reisistance - Ni corrosion (2 Messages)
Enviro Testing (1 Message)
Etronix exhibition (4 Messages)
FAB-Group B Failure (3 Messages)
Fillet formation on SS assly (1 Message)
Flex-circuit Stiffeners (4 Messages)
Follow-up of Circumferential Void issue (2 Messages)
fractions (12 Messages)
Fractions, fractions, fractions (1 Message)
fracture joint update (1 Message)
fractured joints (8 Messages)
Gold Fingers & Connector Reliability (2 Messages)
Handling of Assembled PCBs (2 Messages)
Heat sink on BGAs (1 Message)
Heat Strengthening (1 Message)
Help for reliability thermal cycle (1 Message)
Help! PDI Tester (1 Message)
High Freq. Connectors (3 Messages)
High Reflectance Marking (Screening) Ink (1 Message)
I'm here!!! (3 Messages)
IMHO (6 Messages)
Increased Phosphorus in Electroless Ni (19 Messages)
Increased Phosphorus in Electroless Ni, following up (1 Message)
Independent Test Labs (1 Message)
IPC A 600 (3 Messages)
IPC Base Materials Committee Tempe Interim Meeting Announcement (1 Message)
IPC Base Materials Committee Tempe Interim Meeting Remin der (1 Message)
IPC Base Materials Committee Tempe Interim Meeting Reminder (1 Message)
IPC SDDC January Presentation Invitation (1 Message)
IPC Seeking Agenda Items for Expo 2001 Panel Discussions (1 Message)
IPC-600 (2 Messages)
Isolation problem (1 Message)
JUMPER WIRE (1 Message)
Kester #971 Soldering Flux (1 Message)
laboratory press (1 Message)
Latest Bellcore Spec (2 Messages)
Lead carbonate growth during humdity testing (4 Messages)
Let's hook-up at APEX... (13 Messages)
Looking for 1% rpacks (1 Message)
Looking for ASI (4 Messages)
Looking for copy right marking info on the PCBs (1 Message)
looking for Jim Terveen (1 Message)
looking for Toroid winding machine (2 Messages)
Measles Charts (3 Messages)
Meeting notice ; Smoky Mountain Designers Council (1 Message)
Microsectionning (3 Messages)
Mil-Std-2000A vs IPC 610 (4 Messages)
minimum trace width for repair (3 Messages)
minimum trace with for repair (2 Messages)
Mystery Clip (2 Messages)
Need information about MLCC cutter knife (1 Message)
Ni/Au solderabilty (4 Messages)
Nomenclature with Immersion Tin/Silver (8 Messages)
OK Steve now... (1 Message)
Package Styles (3 Messages)
Pad design for SMT converted leaded cap.. (3 Messages)
PCB Baking (6 Messages)
pcb design (1 Message)
PCB Design for Radial Insertion (4 Messages)
PCB design training (1 Message)
PCB Equipment Rating (1 Message)
PGBA Cold solder joints (2 Messages)
Phase transistions in solder joints (3 Messages)
Pin gages and hole sizes (1 Message)
Pink ESD Bags (6 Messages)
Placement of Chip resistors deposited element (4 Messages)
Plated Castillations (1 Message)
Polaroid Digital Camera DMC Ie (3 Messages)
Power Connector Qual (2 Messages)
preaching (1 Message)
Prevent oxidation (3 Messages)
PRO-E to Gerber files? (2 Messages)
PVA2000 spray machine? (1 Message)
PWB hole size verification (13 Messages)
Question on IPC-A-610 (2 Messages)
Re Flux Residue (1 Message)
Re Fractured Connections (3 Messages)
RECYCLING OF DEVELOPER AND STRIPPER BY ULTRAFILTER SYSTEMS (2 Messages)
reliability (2 Messages)
Reminder: Flexible Circuits Committee Meetings During IPC Winter Interim Meetings (1 Message)
Resistor and Capacitor Array (2 Messages)
Resistor Component Markings (2 Messages)
RF Surface mount... (23 Messages)
RO vs. DI Water. (2 Messages)
ROSIN FLUX RESIDUE (2 Messages)
Sayonara (For Now) (1 Message)
Sceptor/Valor (1 Message)
Septor/Valor (1 Message)
SET Technet NOMAIL (1 Message)
silver epoxy & solder coated parts (14 Messages)
Silver vs OSP surface finish (9 Messages)
Skip plating in Ni (1 Message)
SMC termination materials (1 Message)
SMD soldering problems (1 Message)
SMT components on BOT SIDE (3 Messages)
So, how was the Spaghetti Factory Dinner? (1 Message)
solder fume extraction (3 Messages)
Solderability Test Station (3 Messages)
Soldering iron temperature (2 Messages)
Spahetti Factory (1 Message)
SPC in PCB Fab (1 Message)
SPC Subcommittee Meetings at IPC Winter Interim Meetings (1 Message)
Spec on Fine Pitch (1 Message)
Special through hole pad design (6 Messages)
Specification Inquirey (1 Message)
Spray fluxing (6 Messages)
Spread the knowledge...let's share...reason for BGA crac k (2 Messages)
Spread the knowledge...let's share...reason for BGA crack (4 Messages)
squashed pancakes (7 Messages)
Storage of Electrolytic caps (2 Messages)
Surface Insulation Resistance, Flux (2 Messages)
Surface Mount Assembly Houses (1 Message)
SV: [TN] Isolation problem (1 Message)
Taconic RF35 (3 Messages)
Taping equipment for smd (2 Messages)
TCE for FR-4 (6 Messages)
Teaching Fractions (2 Messages)
TechNet Digest - 26 Jan 2001 - Special issue (#2001-51) (1 Message)
TechNet Digest - 30 Jan 2001 (#2001-60) (1 Message)
Test (2 Messages)
Test Board for Class 3 qualification (4 Messages)
test test (1 Message)
test vehicles (1 Message)
The APEX Connection point (2 Messages)
Track width to pad width. (2 Messages)
translations (1 Message)
uBGA assy yield problem : PWB not stable and stencil spe cification (2 Messages)
uBGA assy yield problem : PWB not stable and stencil specification (1 Message)
unsubscribe (2 Messages)
Unused Inner Layer Pads: Remove or Not? (12 Messages)
Urgent...Open underneath the BGA (5 Messages)
Use of ODB++ (6 Messages)
V-groove dimensions. (3 Messages)
V-groove dimessions. (2 Messages)
V-Groove on PWB's (2 Messages)
V-Grove on PWB's (2 Messages)
Wash baskets (9 Messages)
Watch APEX keynote WebCast from your computer (1 Message)
Water Consumption reduction (3 Messages)
Water/moisture absorbed by rigid printed circuit boards (3 Messages)
Wave Soldering (4 Messages)
we have an extra APEX room (1 Message)
Where was Steve? (4 Messages)
wire bonding (thanks) (1 Message)
Wire/Harness (1 Message)
Wiring Bonding (4 Messages)
WTB: Icos AOI (1 Message)
www.pcbworld.com (1 Message)
[TN] Connector Question (1 Message)
[TN] Let's hook-up at APEX...AN OPEN INVITATION TO MEET (3 Messages)