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TECHNET Archives


August 1997


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Table of Contents:

"Leslie O. Connally" <[log in to unmask]>: re: [TECHNET] Micro-organisms in rinses (3 messages)
(Fab) IPC "B" Coupon (3 messages)
(TechNet): Assy: Dewetting (1 message)
(TECHNET)Temp peak (1 message)
0.35 mm Drill Bits (2 messages)
0603's on vias (2 messages)
<No subject> (67 messages)
? (1 message)
A bit off topic (1 message)
Accurate Gold Efficiency Test (1 message)
Adhesive Printing (2 messages)
ADMIN: ChipNet Moved to the new mailsystem. (1 message)
ADMIN: ComplianceNet Moved to the new mail system. (1 message)
ADMIN: IPCsm840 Moved to the new mailsystem. (1 message)
ADMIN: Roadmap Moved to the new mailsystem. (1 message)
ADMIN: TechNet Moved to the new mailsystem. (3 messages)
ADMIN: Test Message - please disregard. (2 messages)
ADMIN: Where are the archives? (1 message)
ADVICE (1 message)
Aluminium substrates (4 messages)
Annular Ring Limits (8 messages)
Annular ring relief and wave solder (1 message)
Aqueous In-line Cleaner (4 messages)
Artwork (1 message)
Asm Shock/Vib. Specs. (4 messages)
Asm: Shock and Vibration Specs (1 message)
ASS/FAB Plating racks for Flexible circuit (2 messages)
ASSEM: flux alone or flux with solder (2 messages)
ASSEM: flux alone or flux with solder -Reply (2 messages)
ASSEM: Installing RF Shielding Cans (2 messages)
Assem: Procurement Manager and Component Engineer (2 messages)
Assy & Design SMT (3 messages)
ASSY: BENCH (HAND) CLEANING SURVEY (5 messages)
ASSY: BENCH (HAND) CLEANING SURVEY -Reply (1 message)
ASSY: Blowholes (1 message)
Assy: bridges (1 message)
Assy: bridges at wave soldereing (6 messages)
Assy: bridges at wave soldering (1 message)
Assy: Component Date Codes For solderability (4 messages)
ASSY: Component Name (2 messages)
ASSY: Component Name -Reply (1 message)
Assy: Component Solder vs Assy Solder (3 messages)
ASSY: Crest clean line AXAREL/Nickel incompatibility (2 messages)
Assy: Mass Lead Trimmers (2 messages)
assy: Micro BGA (1 message)
Assy: Overtime efficiency studies (4 messages)
Assy: Pad Design For Wave Solder (1 message)
Assy: Pad Design For Wave Solder -Reply (1 message)
Assy: Panasonic 8mm & 12 mm Feeder Problems (1 message)
Assy: Rework Gold finger/Tab.. (2 messages)
ASSY: screenprint doe/test board (3 messages)
Assy: Solder usage statistics f/Wave Solder (2 messages)
ASSY: Soldering to Nickel Plate (1 message)
Assy: SPC for PCB assembly (5 messages)
Assy: Various Questions on J-Std-001 (4 messages)
ASSY:Blowholes, nonconforming defect or nonconforming process ind icator? (3 messages)
ASSY:Solder mask staining (1 message)
Automated Inspection for PCA's (2 messages)
Automated Vision Equipment (2 messages)
Bellcore TR-NWT-000078 (1 message)
Best protection for gold plated edge connector (2 messages)
BGA DFM (3 messages)
BGA Solder Ball Merge (1 message)
BGA Solder Ball Migration (3 messages)
BGA's peds reconstruction (2 messages)
Buried Resistor (6 messages)
cc:Mail Link to SMTP Undeliverable Message (2 messages)
CCA - Active? (2 messages)
Chemicals for electroplating (1 message)
Classroom Demo's (2 messages)
Cleaning Baked Flux (4 messages)
Cleaning Baked Flux -Reply (5 messages)
Compositech, CL200+ (1 message)
copper vias (1 message)
Creating a interconnect with hard gold (1 message)
Creating an interconnect of hard to access gol (2 messages)
Creating an interconnect of hard to access gold pads (2 messages)
CTE with CIC (2 messages)
CuCl2 etchant (2 messages)
CuMo (1 message)
Cut and clinch systems (2 messages)
DES, FAB: X-Outs (7 messages)
DES: Electrical Test Inf. (7 messages)
DES: Pads (2 messages)
Design: Half Oz Copper (4 messages)
DFM and DFT about BGAs (1 message)
Die Attach (2 messages)
Direct Plating Technologies (4 messages)
disregard this message (1 message)
Drumside Treated Foil (6 messages)
EIC Viscometer and Others (1 message)
EIC Viscometer and Others (fwd) (1 message)
EIFCO DRILLING MACHINE (1 message)
Electroless vs. electrolytic platings (1 message)
Electrostatic dissipative (3 messages)
entek (3 messages)
Etch cuts and drilling of finished raw boards (3 messages)
Etchant / Chemical Usage (1 message)
Exactra Autoroll (1 message)
EXCEPTIONS TO J-STD-001 (1 message)
Exposed Copper on Gold Fingers Reliability (1 message)
Exposed Copper on Gold Fingers Reliability: REPLY (1 message)
FAB (2 messages)
FAB - IPC response to report (2 messages)
FAB- Post plasma Cleaning (2 messages)
Fab/Assy: IST Test Method (1 message)
FAB/ASSY: Thermal Vias (6 messages)
Fab/Assy: Thermal Vias-more info (2 messages)
FAB/DES:Molded Plastic Conductive Circuits? (4 messages)
FAB: .006" PCB Fabricators Required. (2 messages)
FAB: Board Material (3 messages)
FAB: Clean Room environments (6 messages)
FAB: Coefficients of Thermal Expansion (1 message)
FAB: Copper-Invar-Copper (2 messages)
FAB: Flexible circuit suppliers wanted (9 messages)
FAB: IPC-6012 & Lifted Lands (3 messages)
FAB: IST (5 messages)
FAB: OSP COATINGS (5 messages)
FAB: Reliability tests through ageing (1 message)
FAB: Vacrel dryfilm laminator needed (3 messages)
FAB: VIA FILL IN A CAVITY (1 message)
FAB: Wire Bondable Au/Ni Etch Resist (1 message)
FAB:Copper/Tin Build-up on Plating Racks (2 messages)
Fabrication-RS274X (1 message)
Failure Analysis, RF power FETs (3 messages)
faraday cup (1 message)
Finish for wirebond (4 messages)
Flex PWB in SMT International 97 (1 message)
Flexible Circuit Technology Book (1 message)
Forums (1 message)
Fusible Links (3 messages)
Fusible Links -Reply (1 message)
FW: BGA Reclamation (1 message)
GDS 2 (2 messages)
GEN: CAM Operator seeks your opinion. (2 messages)
GEN: MATERIAL SOURCES (1 message)
GEN: Where to Buy Bellcore Specs... (1 message)
Getek (2 messages)
GLASS BODY DIODES (3 messages)
Gold / Silver Incompatibility for Adhesives (6 messages)
gold ball bonding (3 messages)
gold ball bonding -Reply (1 message)
Gold Connector Thickness (2 messages)
Gold Flash (1 message)
Gold/Tin Mystery (1 message)
HASL Equipment plus & minuses (2 messages)
Help (3 messages)
HELP HELP HELP (4 messages)
High PIN Density PCB Design (1 message)
Hole Filler (2 messages)
how to pin gauge holes? (4 messages)
how to remove silk screen (4 messages)
how to remove silk screen -Reply (1 message)
Idents before or after HASL-- Reply (1 message)
Immersion Golde over Nickel for edge connectors (1 message)
Information on Feed & Bleed systems (3 messages)
Information on LT90 Specifications (2 messages)
InnerLayers treatment (3 messages)
Intermetallic of Cu-Ni-Sn/Pb (1 message)
IPC "B" Coupon (1 message)
IPC Printed Circuits Expo '98 (1 message)
IPC-D-317A Crosstalk Equation Question (2 messages)
IPCchat session announcement (1 message)
IPCWorks '97 (1 message)
J/STD Changes (1 message)
Job listing (4 messages)
JOHN OSULLIVAN <[log in to unmask]>: [TECHNET] Solder mask material (1 message)
Just a Test, Please ignore. (1 message)
Law suit & breast implants! (3 messages)
Long Term Failures in Multilayer PCBs (5 messages)
Looking for Literature (1 message)
Metal finishing (2 messages)
micro bga (8 messages)
Micro-organisms in rinses (4 messages)
MIL Standard 202 and 208 (1 message)
MIL STD for Flex (2 messages)
MIL-STD-2118 (1 message)
Milliscopes / Boroscopes (1 message)
Misregistration/Annular Ring (7 messages)
Moisture in Liquid Nitrogen (2 messages)
Moisture Sensative Components (2 messages)
Moisture Sensitive Products (5 messages)
Molded Plastic Circuits (2 messages)
Nickel palladium (1 message)
No Subject (1 message)
No-clean (1 message)
No-clean and OSP (1 message)
No-clean flux query (7 messages)
No-clean rework qualification (5 messages)
No-clean VS Water soluable soldering (2 messages)
no-clean wire solder and flux pen question (1 message)
Np-clean flux (1 message)
Optimum via size for test point use (1 message)
Original C4 paper from IBM Journal (1969) (1 message)
OSP coating (1 message)
PCB baking (2 messages)
PCB baking & Thermal cycles (2 messages)
PCB Failures (3 messages)
PCB Industry in Japan (3 messages)
PCB Layout Services (1 message)
PCB related questions (3 messages)
Peel strength value Cu tracks (1 message)
Photoplotter Information... (1 message)
Photoresist Applications (1 message)
Pin gage reference (3 messages)
Please remove my name (1 message)
PMC Bezels (1 message)
Positive Etchback vs De-smear (1 message)
Printable, Peelable Solder Masks (3 messages)
Printable, Peelable Solder Masks (fwd) (1 message)
PTH Troubleshooting- Search for Authors (2 messages)
Pull test (2 messages)
PWB Questions (2 messages)
R Test Mesage (1 message)
RE : OSP (1 message)
Reduced oxide (2 messages)
reflow standards for leaded devices (1 message)
Reliability of reworked PCB's (1 message)
repair of circuit traces (2 messages)
Reply to press pin equipment query (1 message)
Request (1 message)
REVIEW Technet (1 message)
Rework cooling rate (6 messages)
Re[2]: [TECHNET] Adhesive Printing (1 message)
Re[2]: [TECHNET] Finish for wirebond (1 message)
Re[2]: [TECHNET] Gold / Silver Incompatibility for Adhesives (3 messages)
RMA FLUX CORROSION ON PLASTIC PARTS (2 messages)
Roku-Roku Sangyo, Ltd. (2 messages)
rs274x (1 message)
Sales Engineer position (1 message)
Sales Position/Tech Service (2 messages)
Saponifier - Armakleen (1 message)
SELV Specification (1 message)
Sequential Build Multilayer (1 message)
SHADOW PROCESS (5 messages)
Silver Cond. Ink (1 message)
SIR test coupo (1 message)
SIR test coupons (2 messages)
SMOBC (1 message)
SMT Plus Inc. (1 message)
SNEC mtg (1 message)
Solder joint design (2 messages)
SOLDER JOINT PULL STRENGTH (2 messages)
Solder mask m (1 message)
Solder mask material (10 messages)
Solder mask material -Reply (3 messages)
solderability after baking (1 message)
SSD technology (3 messages)
Strip tin-lead (1 message)
Subj: Alternative CCA Marking Labels (2 messages)
Subscribe (5 messages)
Subscription (1 message)
SUPPLIER INFO --FLEX PLUS (1 message)
Surface prep prior to solder mask (2 messages)
Survey Input (1 message)
Systronic Stencil Cleaner (1 message)
telephone number (2 messages)
telephone number -Reply (1 message)
telephone number SMT PLUS (3 messages)
Test Die and Substrate (1 message)
Test, Please ignore (1 message)
Test, please ignore, 970811-1 (1 message)
test, please ignore. (1 message)
Test,please ignore. (1 message)
Testing only (1 message)
Testing only -Reply (1 message)
Testing Services (2 messages)
Thermal Ties (1 message)
Thermal ties aka spokes (2 messages)
To Job Posters (2 messages)
Training materials (1 message)
TSOP susceptibility to temperature (1 message)
UL Testing (2 messages)
Unsubscribe (28 messages)
unsubscribe try # 2 (1 message)
Unsubscribe... (1 message)
unsubskrive (1 message)
Use of SMD shields for shielding pre reflow (ASSEM) (2 messages)
used smt equipment (2 messages)
Vendors for oxide treatment on copper laminates (1 message)
Via hole/pad size (13 messages)
Via Inductance (4 messages)
Vibration and Shock Summary (1 message)
Virus warning (4 messages)
Virus Warning Hoaxes (1 message)
Water borne conformal coat (1 message)
Water soluble paste slump (1 message)
wave profile needed (2 messages)
Wave Solder Books/Article Recommendations (1 message)
Weld Repair of cores (2 messages)
Welding Stamps? (2 messages)
wet mask thickness gauge (5 messages)
Wire Harness Tool (1 message)
X-RAY DAMAGE TO COMPONENTS (3 messages)
X-RAY DAMAGE TO COMPONENTS -Reply (2 messages)
[2]SSD technology (1 message)
[FAB] IST WWW link (1 message)
[TECHNET UNSUBSCRIBE] (1 message)
[TECHNET] Adhesive Printing (1 message)
[TECHNET] EIC Viscometer and Others (1 message)
[TECHNET] FAB/ASSY: Thermal Vias (1 message)
[TECHNET] FAB: Flexible circuit suppliers wanted (1 message)
[TECHNET] Finish for wirebond (1 message)
[TECHNET] Gold / Silver Incompatibility for Adhesives (1 message)
[TECHNET] Printable, Peelable Solder Masks (1 message)
[TECHNET] PTH Troubleshooting- Search for Authors (1 message)
[TECHNET] Rework cooling rate (1 message)
[TECHNET] Re[2]: [TECHNET] Adhesive Printing (1 message)
[TECHNET] Solder mask material -Reply (1 message)
[TechNet] Unsubscribe (1 message)
[T] Annular Ring Limits (2 messages)
[T] Annular Ring/Non-Functional Lands/Misregistration (1 message)
[T] Assy & Design SMT (1 message)
[T] Design: Half Oz Copper (1 message)
[T] Long Term Failures in Multilayer PCBs (1 message)
[T] PCB Failures (1 message)
[T] Rework cooling rate (1 message)
[T] Solder joint design (1 message)

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New Thread

"Leslie O. Connally" <[log in to unmask]>: re: [TECHNET] Micro-organisms in rinses

Re: "Leslie O. Connally" <[log in to unmask]>: re: [TECHNET] Micro-organisms in rinses

Andy RJ McKean <[log in to unmask]>

Thu, 14 Aug 1997 09:47:03 GMT

42 lines

Re: "Leslie O. Connally" <[log in to unmask]>: re: [TECHNET] Micro-organisms in rinses

Leslie O. Connally <[log in to unmask]>

Thu, 14 Aug 1997 09:58:38 -0700

67 lines

Re: "Leslie O. Connally" <[log in to unmask]>: re: [TECHNET] Micro-organisms in rinses

Graham Naisbitt <[log in to unmask]>

Mon, 18 Aug 1997 22:17:39 UT

69 lines

New Thread

(Fab) IPC "B" Coupon

(Fab) IPC "B" Coupon

David Tyler <[log in to unmask]>

Wed, 6 Aug 1997 12:51:08 -0400

31 lines

Re: (Fab) IPC "B" Coupon

Lisa Williams <[log in to unmask]>

Wed, 6 Aug 1997 12:52:43 -0500

46 lines

Re: (Fab) IPC "B" Coupon

Orna and Yehuda <[log in to unmask]>

Fri, 8 Aug 1997 01:18:09 +0300

163 lines

New Thread

(TechNet): Assy: Dewetting

(TechNet): Assy: Dewetting

Poh Kong Hui <[log in to unmask]>

Sat, 30 Aug 1997 00:23:26 +0800

21 lines

New Thread

(TECHNET)Temp peak

(TECHNET)Temp peak

[log in to unmask]

Wed, 27 Aug 1997 08:00:30 +0200

30 lines

New Thread

0.35 mm Drill Bits

0.35 mm Drill Bits

H.N.Muralidhara <[log in to unmask]>

Sat, 9 Aug 1997 10:20:37 +0530

10 lines

0.35 mm Drill Bits

H.N.Muralidhara <[log in to unmask]>

Fri, 8 Aug 1997 13:29:53 +0530 (IST)

40 lines

New Thread

0603's on vias

0603's on vias

Frank Hinojos <[log in to unmask]>

Thu, 21 Aug 1997 09:39:37 -0700

18 lines

Re: 0603's on vias

Richard Krug <[log in to unmask]>

Mon, 25 Aug 1997 08:28:08 EST

20 lines

New Thread

<No subject>

<No subject>

cctc <[log in to unmask]>

Mon, 4 Aug 1997 13:44:59 +0800

21 lines

<No subject>

28/07/97 20:08

16 lines

<No subject>

7/24/97 1:35 PM

40 lines

<No subject>

27/06/97 12:04

19 lines

<No subject>

Fri, 27 Jun 1997 12:05:37 -0400

62 lines

<No subject>

8/5/97 12:18 PM

14 lines

<No subject>

Monday, August 04, 1997 1:11PM

15 lines

<No subject>

Tuesday August 12, 1997

27 lines

<No subject>

8/6/97 8:48 AM

17 lines

<No subject>

8/7/97 9:24 AM

44 lines

<No subject>

Wed, 6 Aug 1997 12:21:42 -0600 CDT

21 lines

<No subject>

8/7/97 3:30 PM

15 lines

<No subject>

8/8/97 10:29 AM

7 lines

<No subject>

8/8/97 10:22 AM

18 lines

<No subject>

8/8/97 10:29 AM

7 lines

<No subject>

6/18/97 8:42 PM

26 lines

<No subject>

8/8/97 11:13 AM

25 lines

<No subject>

8/8/97 11:01 AM

22 lines

<No subject>

8/8/97 11:13 AM

25 lines

<No subject>

8/11/97 11:00 AM

14 lines

<No subject>

8/11/97 1:49 PM

41 lines

<No subject>

Tuesday, August 12, 1997 11:40AM

16 lines

<No subject>

Tuesday, August 12, 1997 5:10PM

38 lines

<No subject>

Guy Atkins <[log in to unmask]>

Wed, 13 Aug 1997 10:38:17 -0400

18 lines

<No subject>

8/12/97 8:05 PM

49 lines

<No subject>

8/13/97 4:48 PM

46 lines

<No subject>

Andy RJ McKean <[log in to unmask]>

Wed, 13 Aug 1997 16:47:03 GMT

9 lines

<No subject>

8/13/97 3:58 PM

12 lines

<No subject>

Wednesday, August 13, 1997 6:45 PM

81 lines

<No subject>

8/14/97 9:50 AM

10 lines

<No subject>

Thursday, August 14, 1997 2:05AM

8 lines

<No subject>

Thursday, August 14, 1997 8:16AM

12 lines

<No subject>

8/14/97 5:49 PM

16 lines

<No subject>

8/14/97 2:38 PM

48 lines

<No subject>

Tuesday, August 06, 1996 12:12PM

9 lines

<No subject>

8/14/97 2:25 PM

48 lines

<No subject>

[log in to unmask]

Thu, 14 Aug 1997 18:09:20 PST

13 lines

<No subject>

Thursday, August 14, 1997 8:09 AM

16 lines

<No subject>

8/14/97 9:50 AM

42 lines

<No subject>

Leslie O. Connally <[log in to unmask]>

Fri, 15 Aug 1997 08:11:37 -0700

21 lines

<No subject>

JoAnn Amerson <[log in to unmask]>

Fri, 15 Aug 1997 11:37:08 +0000

59 lines

<No subject>

8/15/97 11:13 AM

18 lines

<No subject>

???@???

14/08/97 17:58

33 lines

<No subject>

8/15/97 1:54 PM

14 lines

<No subject>

8/14/97 2:38 PM

48 lines

<No subject>

Friday, August 15, 1997 2:52 PM

55 lines

<No subject>

Ron Lohrbach <[log in to unmask]>

Sat, 16 Aug 1997 14:35:34 -0800

21 lines

<No subject>

8/18/97 3:13 AM

13 lines

<No subject>

Saturday, August 16, 1997 12:05AM

25 lines

<No subject>

8/19/97 3:14 PM

15 lines

<No subject>

8/20/97

34 lines

<No subject>

Wednesday, August 20, 1997 11:57AM

29 lines

<No subject>

8/21/97 7:03 AM

43 lines

<No subject>

8/20/97 2:06 PM

55 lines

<No subject>

???@???

8/20/97 2:54 PM

23 lines

<No subject>

Friday, August 22, 1997 11:43AM

68 lines

<No subject>

8/23/97

429 lines

<No subject>

8/21/97 11:22 AM

39 lines

<No subject>

8/21/97 12:49 PM

11 lines

<No subject>

Tuesday, August 12, 1997 11:40AM

9540 lines

<No subject>

Tuesday, August 12, 1997 11:40AM

9539 lines

<No subject>

8/26/97 1:08 PM

10 lines

<No subject>

8/25/97 8:11 AM

28 lines

<No subject>

Thursday, August 28, 1997 9:22AM

18 lines

<No subject>

Thursday, August 28, 1997 9:22AM

15 lines

<No subject>

Friday, August 29, 1997 5:12AM

60 lines

<No subject>

Friday, August 29, 1997 12:39PM

9 lines

New Thread

?

Re: ?

Dmitriy Sklyar <[log in to unmask]>

Wed, 13 Aug 1997 10:39:26 -0500

37 lines

New Thread

A bit off topic

A bit off topic

JoAnn Amerson <[log in to unmask]>

Fri, 15 Aug 1997 11:52:00 +0000

49 lines

New Thread

Accurate Gold Efficiency Test

Accurate Gold Efficiency Test

Makmur, Rummy <[log in to unmask]>

Mon, 4 Aug 1997 09:44:40 -0700

20 lines

New Thread

Adhesive Printing

Adhesive Printing

Erik Olson <[log in to unmask]>

Mon, 25 Aug 1997 19:02:59 -0500

23 lines

Re: Adhesive Printing

[log in to unmask]

Tue, 26 Aug 1997 09:26:45 -0400

21 lines

New Thread

ADMIN: ChipNet Moved to the new mailsystem.

ADMIN: ChipNet Moved to the new mailsystem.

Dmitriy Sklyar <[log in to unmask]>

Fri, 1 Aug 1997 13:55:13 -0500

365 lines

New Thread

ADMIN: ComplianceNet Moved to the new mail system.

ADMIN: ComplianceNet Moved to the new mail system.

Dmitriy Sklyar <[log in to unmask]>

Fri, 1 Aug 1997 13:55:03 -0500

365 lines

New Thread

ADMIN: IPCsm840 Moved to the new mailsystem.

ADMIN: IPCsm840 Moved to the new mailsystem.

Dmitriy Sklyar <[log in to unmask]>

Fri, 1 Aug 1997 13:55:08 -0500

365 lines

New Thread

ADMIN: Roadmap Moved to the new mailsystem.

ADMIN: Roadmap Moved to the new mailsystem.

Dmitriy Sklyar <[log in to unmask]>

Fri, 1 Aug 1997 13:55:17 -0500

365 lines

New Thread

ADMIN: TechNet Moved to the new mailsystem.

ADMIN: TechNet Moved to the new mailsystem.

Dmitriy Sklyar <[log in to unmask]>

Fri, 1 Aug 1997 11:08:40 -0500

116 lines

Re: ADMIN: TechNet Moved to the new mailsystem.

Ulrich Korndoerfer <[log in to unmask]>

Sat, 2 Aug 1997 16:04:07 +0200

39 lines

Re: ADMIN: TechNet Moved to the new mailsystem.

Dmitriy Sklyar <[log in to unmask]>

Mon, 4 Aug 1997 11:59:53 -0500

77 lines

New Thread

ADMIN: Test Message - please disregard.

ADMIN: Test Message - please disregard.

Dmitriy Sklyar <[log in to unmask]>

Tue, 12 Aug 1997 09:33:22 -0500

23 lines

Re: ADMIN: Test Message - please disregard.

Cristian Bomboe <[log in to unmask]>

Tue, 12 Aug 1997 18:54:16 +-300

74 lines

New Thread

ADMIN: Where are the archives?

ADMIN: Where are the archives?

Orna and Yehuda <[log in to unmask]>

Wed, 6 Aug 1997 00:49:50 +0300

20 lines

New Thread

ADVICE

ADVICE

cctc <[log in to unmask]>

Tue, 5 Aug 1997 08:56:26 +0800

21 lines

New Thread

Aluminium substrates

Aluminium substrates

Paul Gould <[log in to unmask]>

Fri, 22 Aug 1997 21:30:39 +0100

19 lines

Re: Aluminium substrates

markl <[log in to unmask]>

Thu, 28 Aug 1997 16:31:58 -0700

28 lines

Re: Aluminium substrates

drilbert <[log in to unmask]>

Thu, 28 Aug 1997 18:22:04 -0700

36 lines

Re: Aluminium substrates

markl <[log in to unmask]>

Fri, 29 Aug 1997 08:17:51 -0700

42 lines

New Thread

Annular Ring Limits

Annular Ring Limits

Chris Gardini-ECG005 <[log in to unmask]>

Fri, 22 Aug 1997 13:24:49 -0500

20 lines

Re: Annular Ring Limits

David Arivett <[log in to unmask]>

Fri, 22 Aug 1997 15:52:21 -0500

34 lines

Re: Annular Ring Limits

[log in to unmask]

Fri, 22 Aug 1997 17:48:59 -0400

25 lines

Re: Annular ring limits

Don Walker <[log in to unmask]>

Fri, 22 Aug 1997 16:59:55 -0500

49 lines

Re: Annular Ring Limits

[log in to unmask]

Sun, 24 Aug 1997 21:40:04 -0700

30 lines

Re: Annular Ring Limits

David Arivett <[log in to unmask]>

Mon, 25 Aug 1997 08:43:53 -0500

41 lines

Re: Annular Ring Limits

Leslie O. Connally <[log in to unmask]>

Wed, 27 Aug 1997 10:04:20 -0700

49 lines

Re: Annular Ring Limits

drilbert <[log in to unmask]>

Wed, 27 Aug 1997 19:28:41 -0700

56 lines

New Thread

Annular ring relief and wave solder

Annular ring relief and wave solder

Frank Hinojos <[log in to unmask]>

Fri, 29 Aug 1997 18:22:17 -0700

18 lines

New Thread

Aqueous In-line Cleaner

Aqueous In-line Cleaner

Alan Kreplick <[log in to unmask]>

Fri, 1 Aug 1997 13:02:02 -0400

35 lines

Re: Aqueous In-line Cleaner

Graham Naisbitt <[log in to unmask]>

Sat, 2 Aug 1997 23:29:32 UT

91 lines

Re: Aqueous In-line Cleaner

[log in to unmask]

Sun, 3 Aug 1997 09:37:04 -0400

26 lines

Re: Aqueous In-line Cleaner

Graham Naisbitt <[log in to unmask]>

Sun, 3 Aug 1997 23:24:43 UT

47 lines

New Thread

Artwork

Artwork

OBRIEN GERARD <[log in to unmask]>

Mon, 25 Aug 1997 09:16:50 -0400

18 lines

New Thread

Asm Shock/Vib. Specs.

Re: Asm Shock/Vib. Specs.

[log in to unmask]

Tue, 12 Aug 1997 10:58:11 -0400

25 lines

Re: Asm Shock/Vib. Specs.

GeoFranck <[log in to unmask]>

Wed, 13 Aug 1997 09:26:56 -0400

67 lines

Re: Asm Shock/Vib. Specs.

Sheila Smith <[log in to unmask]>

Wed, 13 Aug 1997 10:06:08 -0400

80 lines

Re: Asm Shock/Vib. Specs.

Brian Hyde <[log in to unmask]>

Wed, 13 Aug 1997 11:40:49 EDT

50 lines

New Thread

Asm: Shock and Vibration Specs

Asm: Shock and Vibration Specs

GeoFranck <[log in to unmask]>

Mon, 11 Aug 1997 12:56:20 -0400

23 lines

New Thread

ASS/FAB Plating racks for Flexible circuit

ASS/FAB Plating racks for Flexible circuit

Dejan <[log in to unmask]>

Mon, 11 Aug 1997 13:39:38 -0700

18 lines

Re: ASS/FAB Plating racks for Flexible circuit

[log in to unmask]

Thu, 21 Aug 1997 16:39:22 -0400

16 lines

New Thread

ASSEM: flux alone or flux with solder

ASSEM: flux alone or flux with solder

Raymond Klein <[log in to unmask]>

Tue, 12 Aug 1997 12:11:37 -0700

27 lines

ASSEM: flux alone or flux with solder

Jim Herard <[log in to unmask]>

Wed, 13 Aug 1997 08:36:26 -0400

66 lines

New Thread

ASSEM: flux alone or flux with solder -Reply

ASSEM: flux alone or flux with solder -Reply

MIKE J. LOPEZ <[log in to unmask]>

Wed, 13 Aug 1997 07:29:34 -0400

17 lines

Re: ASSEM: flux alone or flux with solder -Reply

Greg Parke <[log in to unmask]>

Wed, 13 Aug 1997 07:52:50 -0400

16 lines

New Thread

ASSEM: Installing RF Shielding Cans

ASSEM: Installing RF Shielding Cans

Barry Allen <[log in to unmask]>

Wed, 27 Aug 1997 14:29:42 -0400

26 lines

Re: ASSEM: Installing RF Shielding Cans

John Wick 595-6667 <[log in to unmask]>

Thu, 28 Aug 1997 14:50:00 -0400

20 lines

New Thread

Assem: Procurement Manager and Component Engineer

Assem: Procurement Manager and Component Engineer

Nancy Nelson <[log in to unmask]>

Fri, 8 Aug 1997 14:18:00 CDT

44 lines

Re: Assem: Procurement Manager and Component Engineer

Pratap Singh <[log in to unmask]>

Sat, 16 Aug 1997 11:14:23 -0700

16 lines

New Thread

Assy & Design SMT

Assy & Design SMT

Tully, Marti (AZ15) <[log in to unmask]>

Wed, 20 Aug 1997 14:06:07 -0500

42 lines

Re: Assy & Design SMT

Robinson, Mike (AZ75) <[log in to unmask]>

Wed, 20 Aug 1997 15:59:53 -0500

34 lines

Re: Assy & Design SMT

[log in to unmask]

Thu, 21 Aug 1997 09:49:26 -0500

163 lines

New Thread

ASSY: BENCH (HAND) CLEANING SURVEY

ASSY: BENCH (HAND) CLEANING SURVEY

Jim Marsico 516-595-5879 <[log in to unmask]>

Thu, 21 Aug 1997 14:50:00 -0400

45 lines

Re: ASSY: BENCH (HAND) CLEANING SURVEY

Kenny Bloomquist <[log in to unmask]>

Thu, 21 Aug 1997 12:34:23 -0700

56 lines

Re: ASSY: BENCH (HAND) CLEANING SURVEY

Sheila Smith <[log in to unmask]>

Thu, 21 Aug 1997 15:47:23 -0400

51 lines

Re: ASSY: BENCH (HAND) CLEANING SURVEY

Howard Feldmesser <[log in to unmask]>

Thu, 21 Aug 1997 16:48:37 -0400

54 lines

Re: ASSY: BENCH (HAND) CLEANING SURVEY

Lepsche, Thomas G (NM75) <[log in to unmask]>

Fri, 22 Aug 1997 10:29:06 -0600

55 lines

New Thread

ASSY: BENCH (HAND) CLEANING SURVEY -Reply

ASSY: BENCH (HAND) CLEANING SURVEY -Reply

DEAN MAY <[log in to unmask]>

Thu, 21 Aug 1997 16:15:07 -0500

55 lines

New Thread

ASSY: Blowholes

ASSY: Blowholes

[log in to unmask]

Mon, 18 Aug 1997 20:20:59 -0500

91 lines

New Thread

Assy: bridges

Assy: bridges

Blanchet,Richard <[log in to unmask]>

Sat, 16 Aug 1997 08:31:00 -0400

18 lines

New Thread

Assy: bridges at wave soldereing

Assy: bridges at wave soldereing

Blanchet,Richard <[log in to unmask]>

Fri, 15 Aug 1997 11:13:00 -0400

24 lines

Re: Assy: bridges at wave soldereing

Aric J Parr <[log in to unmask]>

Fri, 15 Aug 1997 11:32:53 -0500

35 lines

Re: Assy: bridges at wave soldereing

Paul Gould <[log in to unmask]>

Fri, 15 Aug 1997 19:44:40 +0100

44 lines

Re: Assy: bridges at wave soldereing

Vincent P. Quigley <[log in to unmask]>

Fri, 15 Aug 1997 16:20:50 EDT

11 lines

Re: Assy: bridges at wave soldereing

Lainie Loveless <[log in to unmask]>

Mon, 18 Aug 1997 07:18:59 -0500

25 lines

Re: Assy: bridges at wave soldereing

Denis Meloche <[log in to unmask]>

Mon, 18 Aug 1997 10:22:53 -0400

38 lines

New Thread

Assy: bridges at wave soldering

Re: Assy: bridges at wave soldering

[log in to unmask]

Fri, 15 Aug 1997 17:04:33 -0600

51 lines

New Thread

Assy: Component Date Codes For solderability

Assy: Component Date Codes For solderability

Sherman Banks <[log in to unmask]>

Wed, 13 Aug 1997 07:13:11 PDT

42 lines

Assy: Component Date Codes For solderability

Sherman Banks <[log in to unmask]>

Wed, 20 Aug 1997 06:41:03 PDT

44 lines

Assy: Component Date Codes For solderability

[log in to unmask]

Wed, 20 Aug 1997 16:14:46 +0200

68 lines

Re: Assy: Component Date Codes For solderability

Denis Meloche <[log in to unmask]>

Wed, 20 Aug 1997 10:58:10 -0400

64 lines

New Thread

ASSY: Component Name

ASSY: Component Name

Christy Graham <[log in to unmask]>

Wed, 13 Aug 1997 15:52:53 -0800

17 lines

Re: ASSY: Component Name

Connie Korth <[log in to unmask]>

Tue, 19 Aug 1997 10:02:22 CDT

24 lines

New Thread

ASSY: Component Name -Reply

ASSY: Component Name -Reply

Marshall Canaday <[log in to unmask]>

Thu, 14 Aug 1997 08:02:34 -0400

11 lines

New Thread

Assy: Component Solder vs Assy Solder

Assy: Component Solder vs Assy Solder

[log in to unmask]

Thu, 28 Aug 1997 10:48:10 PDT

27 lines

Re: Assy: Component Solder vs Assy Solder

Denis Meloche <[log in to unmask]>

Thu, 28 Aug 1997 14:01:50 -0400

49 lines

Re: Assy: Component Solder vs Assy Solder

[log in to unmask]

Thu, 28 Aug 1997 13:27:51 -0500

63 lines

New Thread

ASSY: Crest clean line AXAREL/Nickel incompatibility

ASSY: Crest clean line AXAREL/Nickel incompatibility

Devitt, Ken <[log in to unmask]>

Fri, 8 Aug 1997 08:27:57 -0400

35 lines

Re: ASSY: Crest clean line AXAREL/Nickel incompatibility

[log in to unmask]

Fri, 8 Aug 1997 10:33:48 -0400

21 lines

New Thread

Assy: Mass Lead Trimmers

Assy: Mass Lead Trimmers

Kenny Bloomquist <[log in to unmask]>

Mon, 4 Aug 1997 15:34:00 -0700

23 lines

Re: Assy: Mass Lead Trimmers

Tucker, Steve (KS) <[log in to unmask]>

Tue, 5 Aug 1997 06:25:04 -0700

108 lines

New Thread

assy: Micro BGA

assy: Micro BGA

Greg Parke <[log in to unmask]>

Mon, 11 Aug 1997 09:52:05 -0400

26 lines

New Thread

Assy: Overtime efficiency studies

Assy: Overtime efficiency studies

[log in to unmask]

Thu, 21 Aug 1997 11:18:28 -0500

25 lines

Re: Assy: Overtime efficiency studies

Denis Meloche <[log in to unmask]>

Thu, 21 Aug 1997 12:45:11 -0400

51 lines

Re: Assy: Overtime efficiency studies

Ed Cosper <[log in to unmask]>

Thu, 21 Aug 1997 12:44:10 -0500

85 lines

Re: Assy: Overtime efficiency studies

[log in to unmask]

Fri, 22 Aug 1997 07:29:30 -0400

31 lines

New Thread

Assy: Pad Design For Wave Solder

Assy: Pad Design For Wave Solder

Ron Hollandsworth <[log in to unmask]>

Tue, 5 Aug 1997 10:27:38 -0500

28 lines

New Thread

Assy: Pad Design For Wave Solder -Reply

Assy: Pad Design For Wave Solder -Reply

Larry Campbell <[log in to unmask]>

Tue, 5 Aug 1997 13:52:11 -0400

43 lines

New Thread

Assy: Panasonic 8mm & 12 mm Feeder Problems

Assy: Panasonic 8mm & 12 mm Feeder Problems

Mark W. Spitnale <[log in to unmask]>

Thu, 28 Aug 1997 08:56:13 -0500

31 lines

New Thread

Assy: Rework Gold finger/Tab..

Re: Assy: Rework Gold finger/Tab..

Poh Kong Hui <[log in to unmask]>

Wed, 27 Aug 1997 23:46:57 +0800

19 lines

Re: Assy: Rework Gold finger/Tab..

[log in to unmask]

Wed, 27 Aug 1997 11:50:54 -0500

46 lines

New Thread

ASSY: screenprint doe/test board

ASSY: screenprint doe/test board

Greg Parke <[log in to unmask]>

Tue, 5 Aug 1997 17:55:17 -0400

27 lines

Re: ASSY: screenprint doe/test board

Denis Meloche <[log in to unmask]>

Wed, 6 Aug 1997 09:54:52 -0400

53 lines

Re: ASSY: screenprint doe/test board

Jim Marsico 516-595-5879 <[log in to unmask]>

Wed, 6 Aug 1997 11:21:00 -0400

31 lines

New Thread

Assy: Solder usage statistics f/Wave Solder

Assy: Solder usage statistics f/Wave Solder

[log in to unmask]

Tue, 26 Aug 1997 10:42:46 -0500

18 lines

Re: Assy: Solder usage statistics f/Wave Solder

Denis Meloche <[log in to unmask]>

Wed, 27 Aug 1997 10:43:24 -0400

31 lines

New Thread

ASSY: Soldering to Nickel Plate

ASSY: Soldering to Nickel Plate

Paul Gould <[log in to unmask]>

Fri, 15 Aug 1997 19:45:43 +0100

19 lines

New Thread

Assy: SPC for PCB assembly

Assy: SPC for PCB assembly

Blanchet,Richard <[log in to unmask]>

Tue, 12 Aug 1997 17:00:00 -0400

19 lines

Re: Assy: SPC for PCB assembly

Vickie Chapman <[log in to unmask]>

Tue, 12 Aug 1997 15:07:46 -0700

41 lines

Re: Assy: SPC for PCB assembly

Tully, Marti (AZ15) <[log in to unmask]>

Tue, 12 Aug 1997 17:35:54 -0500

22 lines

Re: Assy: SPC for PCB assembly

Joel Yocom <jyocom@[192.168.0.1]>

Tue, 12 Aug 1997 19:05:25 +0000

18 lines

Re: Assy: SPC for PCB assembly

Martin Farrell <[log in to unmask]>

Wed, 13 Aug 1997 08:27:03 +0000

25 lines

New Thread

Assy: Various Questions on J-Std-001

Assy: Various Questions on J-Std-001

Kasprzak, Bill (esd) US <[log in to unmask]>

Thu, 7 Aug 1997 09:04:00 PDT

37 lines

Re: Assy: Various Questions on J-Std-001

[log in to unmask]

Thu, 7 Aug 1997 10:26:33 -0400

13 lines

Re: Assy: Various Questions on J-Std-001

Jack Crawford <[log in to unmask]>

Thu, 7 Aug 1997 09:52:05 -0500

84 lines

Re: Assy: Various Questions on J-Std-001

[log in to unmask]

Thu, 7 Aug 1997 10:49:54 EDT

80 lines

New Thread

ASSY:Blowholes, nonconforming defect or nonconforming process ind icator?

ASSY:Blowholes, nonconforming defect or nonconforming process ind icator?

Ryaby, John <[log in to unmask]>

Thu, 14 Aug 1997 19:04:37 -0400

28 lines

Re: ASSY:Blowholes, nonconforming defect or nonconforming process ind icator?

Dwight Mattix <[log in to unmask]>

Fri, 15 Aug 1997 08:24:42 -0700

50 lines

Re: ASSY:Blowholes, nonconforming defect or nonconforming process ind icator?

Steve Mikell <[log in to unmask]>

Sat, 16 Aug 1997 22:02:52 -0500

50 lines

New Thread

ASSY:Solder mask staining

ASSY:Solder mask staining

[log in to unmask]

Tue, 5 Aug 1997 14:41:21 EDT

26 lines

New Thread

Automated Inspection for PCA's

Automated Inspection for PCA's

Vickie Chapman <[log in to unmask]>

Wed, 6 Aug 1997 08:48:10 -0700

23 lines

Re: Automated Inspection for PCA's

Rick Kompelien <[log in to unmask]>

Wed, 6 Aug 1997 12:27:09 -0500

29 lines

New Thread

Automated Vision Equipment

Automated Vision Equipment

[log in to unmask]

Tue, 12 Aug 1997 17:38:08 EDT

20 lines

Re: Automated Vision Equipment

drilbert <[log in to unmask]>

Tue, 12 Aug 1997 16:39:14 -0700

32 lines

New Thread

Bellcore TR-NWT-000078

Re: Bellcore TR-NWT-000078

Don Walker <[log in to unmask]>

Mon, 4 Aug 1997 08:38:17 -0500

52 lines

New Thread

Best protection for gold plated edge connector

Best protection for gold plated edge connector

Cristian Bomboe <[log in to unmask]>

Wed, 13 Aug 1997 14:27:40 +-300

17 lines

Re: Best protection for gold plated edge connector

Paul Gould <[log in to unmask]>

Sat, 16 Aug 1997 07:55:02 +0100

35 lines

New Thread

BGA DFM

BGA DFM

[log in to unmask]

Fri, 15 Aug 1997 15:52:30 MDT

24 lines

Re: BGA DFM

David Hoover <[log in to unmask]>

Sat, 16 Aug 1997 06:27:15 -0700

39 lines

Re: BGA DFM

[log in to unmask]

Sat, 16 Aug 1997 14:54:15 -0400

34 lines

New Thread

BGA Solder Ball Merge

Re: BGA Solder Ball Merge

Dr. Nimal Liyanage <[log in to unmask]>

Fri, 29 Aug 1997 15:50:31 -0400

12 lines

New Thread

BGA Solder Ball Migration

BGA Solder Ball Migration

Dennis Fall <[log in to unmask]>

Fri, 29 Aug 1997 12:39:04 -0500

17 lines

Re: BGA Solder Ball Migration

Viswanath Valluri <[log in to unmask]>

Fri, 29 Aug 1997 10:59:11 -0700

26 lines

Re: BGA Solder Ball Migration

Yuen, Mike <[log in to unmask]>

Fri, 29 Aug 1997 16:13:00 CDT

17 lines

New Thread

BGA's peds reconstruction

BGA's peds reconstruction

Tamir Ben-Shoshan <[log in to unmask]>

Sun, 3 Aug 1997 09:11:39 +0200

18 lines

Re: BGA's peds reconstruction

[log in to unmask]

Mon, 4 Aug 1997 08:52:27 EDT

35 lines

New Thread

Buried Resistor

Buried Resistor

[log in to unmask]

Fri, 8 Aug 1997 10:29:57 +0400

12 lines

Re: Buried Resistor

Aric J Parr <[log in to unmask]>

Fri, 8 Aug 1997 10:07:17 -0500

23 lines

Re: Buried Resistor

Mike Wilson <[log in to unmask]>

Fri, 8 Aug 1997 11:04:03 -0700

26 lines

Re: Buried Resistor

John Nelson <[log in to unmask]>

Fri, 8 Aug 1997 11:29:46 -0400

21 lines

Re: Buried Resistor

[log in to unmask]

Fri, 8 Aug 1997 11:29:14 -0500

21 lines

Re: Buried Resistor

[log in to unmask]

Fri, 8 Aug 1997 13:36:58 -0400

11 lines

New Thread

cc:Mail Link to SMTP Undeliverable Message

cc:Mail Link to SMTP Undeliverable Message

[log in to unmask]

Tue, 5 Aug 1997 08:39:58 -0500

21 lines

cc:Mail Link to SMTP Undeliverable Message

Tue, 05 Aug 97 08:17:31 -0500

12 lines

New Thread

CCA - Active?

CCA - Active?

Dan Brandler <[log in to unmask]>

Tue, 5 Aug 1997 11:20:16 -0700

17 lines

Re: CCA - Active?

Dennis Maggi <[log in to unmask]>

Tue, 5 Aug 1997 16:32:10 -0400

26 lines

New Thread

Chemicals for electroplating

Chemicals for electroplating

Cristian Bomboe <[log in to unmask]>

Tue, 26 Aug 1997 11:54:08 +-300

15 lines

New Thread

Classroom Demo's

Classroom Demo's

Nachbor, Suzanne (MN51) <[log in to unmask]>

Thu, 28 Aug 1997 10:06:00 PDT

32 lines

Re: Classroom Demo's

JoAnn Amerson <[log in to unmask]>

Thu, 28 Aug 1997 11:25:56 +0000

27 lines

New Thread

Cleaning Baked Flux

Cleaning Baked Flux

Lainie Loveless <[log in to unmask]>

Tue, 12 Aug 1997 10:40:08 -0500

23 lines

Re: Cleaning Baked Flux

Tezak Tim <[log in to unmask]>

Tue, 12 Aug 1997 14:56:00 -0400

38 lines

Re: Cleaning Baked Flux

Graham Naisbitt <[log in to unmask]>

Tue, 12 Aug 1997 23:37:34 UT

52 lines

Re: Cleaning Baked Flux

[log in to unmask]

Tue, 12 Aug 1997 20:56:55 -0400

28 lines

New Thread

Cleaning Baked Flux -Reply

Re: Cleaning Baked Flux -Reply

Eric Bromley <[log in to unmask]>

Mon, 25 Aug 1997 11:31:02 -0400

51 lines

Re: Cleaning Baked Flux -Reply

[log in to unmask]

Mon, 25 Aug 1997 14:45:54 -0500

70 lines

Re: Cleaning Baked Flux -Reply

Rick Taormino <[log in to unmask]>

Mon, 25 Aug 1997 17:42:06 -0700

75 lines

Re: Cleaning Baked Flux -Reply

Karen Tellefsen <[log in to unmask]>

Mon, 25 Aug 1997 20:41:54 -0700

81 lines

Re: Cleaning Baked Flux -Reply

Darrell Bonzo <[log in to unmask]>

Tue, 26 Aug 1997 07:53:07 -0700

100 lines

New Thread

Compositech, CL200+

Compositech, CL200+

Mirka Halas <[log in to unmask]>

Thu, 28 Aug 1997 09:27:46 -0400

27 lines

New Thread

copper vias

copper vias

Eric Henning <[log in to unmask]>

Wed, 13 Aug 1997 10:09:19 -0400

18 lines

New Thread

Creating a interconnect with hard gold

Re: Creating a interconnect with hard gold

Nachbor, Suzanne (MN51) <[log in to unmask]>

Mon, 11 Aug 1997 11:05:00 PDT

9 lines

New Thread

Creating an interconnect of hard to access gol

Re: Creating an interconnect of hard to access gol

Aric J Parr <[log in to unmask]>

Fri, 8 Aug 1997 10:09:58 -0500

31 lines

Re: Creating an interconnect of hard to access gol

MCHAN <[log in to unmask]>

Fri, 8 Aug 1997 11:04:35 -0400

17 lines

New Thread

Creating an interconnect of hard to access gold pads

Creating an interconnect of hard to access gold pads

[log in to unmask]

Fri, 8 Aug 1997 10:22:57 -0400

23 lines

Re: Creating an interconnect of hard to access gold pads

Denis Meloche <[log in to unmask]>

Fri, 8 Aug 1997 11:06:32 -0400

43 lines

New Thread

CTE with CIC

CTE with CIC

[log in to unmask]

Thu, 14 Aug 1997 11:16:18 -0400

16 lines

Re: CTE with CIC

Edwards, Ted A (AZ75) <[log in to unmask]>

Thu, 14 Aug 1997 14:08:51 -0500

18 lines

New Thread

CuCl2 etchant

CuCl2 etchant

Suixin Zhang <[log in to unmask]>

Thu, 21 Aug 1997 14:54:54 +0100

30 lines

Re: CuCl2 etchant

[log in to unmask]

Thu, 21 Aug 1997 10:48:23 -0400

16 lines

New Thread

CuMo

CuMo

[log in to unmask]

Tue, 5 Aug 1997 16:07:12 +0200

18 lines

New Thread

Cut and clinch systems

Cut and clinch systems

Challoner, Scott <[log in to unmask]>

Mon, 18 Aug 1997 10:16:00 CDT

18 lines

Re: Cut and clinch systems

DeCantillon, Marc <[log in to unmask]>

Wed, 20 Aug 1997 14:30:09 -0500

41 lines

New Thread

DES, FAB: X-Outs

DES, FAB: X-Outs

Steve Collins <[log in to unmask]>

Thu, 21 Aug 1997 11:22:19 -0600

48 lines

Re: DES, FAB: X-Outs

Joel Mearig <[log in to unmask]>

Thu, 21 Aug 1997 11:16:11 -0700

69 lines

Re: DES, FAB: X-Outs

Frank Hinojos <[log in to unmask]>

Sun, 24 Aug 1997 10:51:27 -0700

29 lines

Re: DES, FAB: X-Outs

[log in to unmask]

Mon, 25 Aug 1997 06:28:19 -0400

22 lines

Re: DES, FAB: X-Outs

Paul Gould <[log in to unmask]>

Mon, 25 Aug 1997 20:47:16 +0100

30 lines

DES, FAB: X-Outs

Jim Herard <[log in to unmask]>

Tue, 26 Aug 1997 18:28:08 -0400

77 lines

Re: DES, FAB: X-Outs

[log in to unmask]

Thu, 28 Aug 1997 23:29:53 -0400

19 lines

New Thread

DES: Electrical Test Inf.

DES: Electrical Test Inf.

Steve Collins <[log in to unmask]>

Thu, 14 Aug 1997 09:22:23 -0600

30 lines

Re: DES: Electrical Test Inf.

Lisa Williams <[log in to unmask]>

Thu, 14 Aug 1997 10:41:23 -0500

40 lines

Re: DES: Electrical Test Inf.

Delsen Testing Laboratories <[log in to unmask]>

Thu, 14 Aug 1997 09:03:52 -0700

28 lines

Re: DES: Electrical Test Inf.

Nancy Nelson <[log in to unmask]>

Thu, 14 Aug 1997 12:18:00 CDT

45 lines

Re: DES: Electrical Test Inf.

[log in to unmask]

Thu, 14 Aug 1997 13:50:30 -0400

9 lines

Re: DES: Electrical Test Inf.

[log in to unmask]

Thu, 14 Aug 1997 14:19:12 -0400

32 lines

Re: DES: Electrical Test Inf.

[log in to unmask]

Fri, 15 Aug 1997 07:34:54 -0400

15 lines

New Thread

DES: Pads

Re[2]: DES: Pads

[log in to unmask]

Mon, 4 Aug 1997 09:34:41 -0400

27 lines

Re: DES: Pads

Frank Hinojos <[log in to unmask]>

Mon, 28 Jul 1997 16:57:55 -0700

32 lines

New Thread

Design: Half Oz Copper

Design: Half Oz Copper

GeoFranck <[log in to unmask]>

Thu, 14 Aug 1997 17:09:48 -0400

20 lines

Re: Design: Half Oz Copper

Andrew J. Scholand <[log in to unmask]>

Fri, 15 Aug 1997 02:00:53 -0400

58 lines

Re: Design: Half Oz Copper

[log in to unmask]

Sun, 17 Aug 1997 17:43:47 -0400

36 lines

Re: Design: Half Oz Copper

D. Rooke <[log in to unmask]>

Mon, 18 Aug 1997 18:57:50 -0400

49 lines

New Thread

DFM and DFT about BGAs

Re: DFM and DFT about BGAs

Khalid Kidari <[log in to unmask]>

Thu, 14 Aug 1997 17:33:44 -0400

16 lines

New Thread

Die Attach

Die Attach

Denis Meloche <[log in to unmask]>

Fri, 22 Aug 1997 11:21:02 -0400

21 lines

Re: Die Attach

Roback, Tim <[log in to unmask]>

Fri, 22 Aug 1997 13:09:00 -0600

22 lines

New Thread

Direct Plating Technologies

Direct Plating Technologies

Cristian Bomboe <[log in to unmask]>

Thu, 14 Aug 1997 11:07:35 +-300

18 lines

Re: Direct Plating Technologies

Eugene Watkins <[log in to unmask]>

Thu, 14 Aug 1997 07:54:52 -0700

35 lines

Re: Direct Plating Technologies

Eugene Watkins <[log in to unmask]>

Thu, 14 Aug 1997 09:27:53 -0700

35 lines

Re: Direct Plating Technologies

Don Vischulis <[log in to unmask]>

Fri, 15 Aug 1997 20:19:52 -0500

30 lines

New Thread

disregard this message

disregard this message

[log in to unmask]

Fri, 1 Aug 1997 15:13:08 PST

9 lines

New Thread

Drumside Treated Foil

Drumside Treated Foil

Paula Ryan <[log in to unmask]>

Mon, 11 Aug 1997 11:00:46 EDT

18 lines

Re: Drumside Treated Foil

Aric J Parr <[log in to unmask]>

Mon, 11 Aug 1997 10:34:04 -0500

19 lines

Re: Drumside Treated Foil

Steves <[log in to unmask]>

Mon, 11 Aug 1997 11:24:25 +0000

14 lines

Re: Drumside Treated Foil

[log in to unmask]

Mon, 11 Aug 1997 12:21:46 -0400

11 lines

Re: Drumside Treated Foil

yisrael leshman <[log in to unmask]>

Tue, 12 Aug 1997 15:08:13 +0300

33 lines

Re: Drumside Treated Foil

Wolfgang Erat <[log in to unmask]>

Tue, 12 Aug 1997 11:38:22 -0400

47 lines

New Thread

EIC Viscometer and Others

EIC Viscometer and Others

CSS Asia Co., Ltd. <[log in to unmask]>

Fri, 29 Aug 1997 17:14:30 +0900

31 lines

New Thread

EIC Viscometer and Others (fwd)

Re: EIC Viscometer and Others (fwd)

Michael Barmuta <[log in to unmask]>

Fri, 29 Aug 1997 08:19:24 -0700

11 lines

New Thread

EIFCO DRILLING MACHINE

EIFCO DRILLING MACHINE

H.N.Muralidhara <[log in to unmask]>

Fri, 8 Aug 1997 13:29:53 +0530

44 lines

New Thread

Electroless vs. electrolytic platings

Electroless vs. electrolytic platings

[log in to unmask]

Tue, 12 Aug 1997 03:32:37 -0400

31 lines

New Thread

Electrostatic dissipative

Re: Electrostatic dissipative

Phil Bavaro <[log in to unmask]>

Sat, 2 Aug 1997 11:22:37 -0700

95 lines

Re: Electrostatic dissipative

Bob West <[log in to unmask]>

Tue, 5 Aug 1997 10:05:20 -0700

143 lines

Re: Electrostatic dissipative

Bob West <[log in to unmask]>

Tue, 5 Aug 1997 10:06:28 -0700

103 lines

New Thread

entek

entek

Gloria Ebert <[log in to unmask]>

Tue, 5 Aug 1997 10:43:00 -0700

15 lines

Re: entek

Kenny, James <[log in to unmask]>

Tue, 5 Aug 1997 09:51:32 -0700

28 lines

Re: entek

Michael Forrester <[log in to unmask]>

Tue, 5 Aug 1997 13:36:40 -0400

23 lines

New Thread

Etch cuts and drilling of finished raw boards

Etch cuts and drilling of finished raw boards

Thomas Phelps <[log in to unmask]>

Thu, 7 Aug 1997 12:11:14 -0400

42 lines

Re: Etch cuts and drilling of finished raw boards

Furrow, Robert Gordon (Robert) <[log in to unmask]>

Thu, 7 Aug 1997 13:05:08 -0400

61 lines

Re: Etch cuts and drilling of finished raw boards

Tucker, Steve (KS) <[log in to unmask]>

Thu, 7 Aug 1997 11:29:10 -0700

55 lines

New Thread

Etchant / Chemical Usage

Etchant / Chemical Usage

Keith Birchfield <[log in to unmask]>

Wed, 13 Aug 1997 15:39:35 +0000

34 lines

New Thread

Exactra Autoroll

Exactra Autoroll

SCOTT BALLER <[log in to unmask]>

Wed, 6 Aug 1997 10:15:24 PST

15 lines

New Thread

EXCEPTIONS TO J-STD-001

EXCEPTIONS TO J-STD-001

David Girard <[log in to unmask]>

Thu, 7 Aug 1997 13:50:56 -0400

27 lines

New Thread

Exposed Copper on Gold Fingers Reliability

Exposed Copper on Gold Fingers Reliability

Anne Marie Trujillo <[log in to unmask]>

Wed, 6 Aug 1997 10:51:00 PDT

15 lines

New Thread

Exposed Copper on Gold Fingers Reliability: REPLY

Exposed Copper on Gold Fingers Reliability: REPLY

Jim Herard <[log in to unmask]>

Wed, 6 Aug 1997 19:12:54 -0400

71 lines

New Thread

FAB

FAB

[log in to unmask]

Tue, 26 Aug 1997 15:03:51 -0400

20 lines

Re: FAB

Larry J. Fisher <[log in to unmask]>

Fri, 29 Aug 1997 21:11:20 -0400

48 lines

New Thread

FAB - IPC response to report

Re: FAB - IPC response to report

Ed Cosper <[log in to unmask]>

Fri, 22 Aug 1997 16:28:56 -0500

57 lines

Re: FAB - IPC response to report

David Bergman <[log in to unmask]>

Thu, 28 Aug 1997 14:47:54 -0500

76 lines

New Thread

FAB- Post plasma Cleaning

FAB- Post plasma Cleaning

Bill Chou <[log in to unmask]>

Tue, 19 Aug 1997 13:17:15 -0800

27 lines

Re: FAB- Post plasma Cleaning

Thomas, Kevin <[log in to unmask]>

Tue, 19 Aug 1997 16:04:00 -0700

48 lines

New Thread

Fab/Assy: IST Test Method

Fab/Assy: IST Test Method

Reed, Randy <[log in to unmask]>

Fri, 8 Aug 1997 14:37:04 -0700

49 lines

New Thread

FAB/ASSY: Thermal Vias

Re: FAB/ASSY: Thermal Vias

Dejan <[log in to unmask]>

Fri, 1 Aug 1997 09:41:32 -0700

23 lines

Re: FAB/ASSY: Thermal Vias

John Laur <[log in to unmask]>

Fri, 1 Aug 1997 12:04:41 -0500

19 lines

Re: Fab/Assy: Thermal Vias

Afri Singh <[log in to unmask]>

Wed, 6 Aug 1997 16:01:38 -0400

44 lines

Re: Fab/Assy: Thermal Vias

David Tyler <[log in to unmask]>

Thu, 7 Aug 1997 07:07:12 -0400

57 lines

Re: FAB/ASSY: Thermal Vias

CSS Asia Co., Ltd. <[log in to unmask]>

Fri, 8 Aug 1997 17:37:50 +0900

46 lines

Re: FAB/ASSY: Thermal Vias

John Laur <[log in to unmask]>

Mon, 11 Aug 1997 08:23:18 -0500

25 lines

New Thread

Fab/Assy: Thermal Vias-more info

Fab/Assy: Thermal Vias-more info

[log in to unmask]

Fri, 1 Aug 1997 10:45:23 PDT

27 lines

Re: Fab/Assy: Thermal Vias-more info

LES CONNALLY <[log in to unmask]>

Fri, 1 Aug 1997 13:09:18 -0700

54 lines

New Thread

FAB/DES:Molded Plastic Conductive Circuits?

FAB/DES:Molded Plastic Conductive Circuits?

Greg Finlay <[log in to unmask]>

Wed, 27 Aug 1997 11:14:54 -0400

26 lines

Re: FAB/DES:Molded Plastic Conductive Circuits?

David Bergman <[log in to unmask]>

Fri, 29 Aug 1997 07:12:09 -0500

66 lines

Re: FAB/DES:Molded Plastic Conductive Circuits?

Edwards, Ted A (AZ75) <[log in to unmask]>

Fri, 29 Aug 1997 08:46:11 -0500

20 lines

Re: FAB/DES:Molded Plastic Conductive Circuits?

Pratap Singh <[log in to unmask]>

Fri, 29 Aug 1997 12:31:39 -0700

13 lines

New Thread

FAB: .006" PCB Fabricators Required.

FAB: .006" PCB Fabricators Required.

Greg Finlay <[log in to unmask]>

Fri, 15 Aug 1997 11:59:50 -0400

15 lines

Re: FAB: .006" PCB Fabricators Required.

mark leasure <[log in to unmask]>

Fri, 15 Aug 1997 09:27:42 -0700

24 lines

New Thread

FAB: Board Material

FAB: Board Material

Pucket, Larry Lee <[log in to unmask]>

Wed, 27 Aug 1997 09:06:59 -0600

28 lines

Re: FAB: Board Material

Keith Larson <[log in to unmask]>

Wed, 27 Aug 1997 10:43:19 -0500

56 lines

Re: FAB: Board Material

markl <[log in to unmask]>

Thu, 28 Aug 1997 17:06:42 -0700

37 lines

New Thread

FAB: Clean Room environments

FAB: Clean Room environments

Ed Cosper <[log in to unmask]>

Mon, 11 Aug 1997 15:48:21 -0500

48 lines

Re: FAB: Clean Room environments

[log in to unmask]

Mon, 11 Aug 1997 19:55:46 -0400

16 lines

Re: FAB: Clean Room environments

[log in to unmask]

Tue, 12 Aug 1997 07:32:51 PST

29 lines

Re: FAB: Clean Room environments

Leslie O. Connally <[log in to unmask]>

Tue, 12 Aug 1997 11:31:29 -0700

83 lines

Re: FAB: Clean Room environments

[log in to unmask]

Tue, 12 Aug 1997 13:05:58 -0400

26 lines

FAB: Clean Room environments

Eltek Ltd. - Process Engineering <[log in to unmask]>

Wed, 13 Aug 1997 09:11:37 +0300

28 lines

New Thread

FAB: Coefficients of Thermal Expansion

Re: FAB: Coefficients of Thermal Expansion

[log in to unmask]

Sat, 2 Aug 1997 16:48:57 -0400

33 lines

New Thread

FAB: Copper-Invar-Copper

FAB: Copper-Invar-Copper

Luis Rivera <[log in to unmask]>

Tue, 12 Aug 1997 06:00:00 CDT

34 lines

Re: FAB: Copper-Invar-Copper

Leslie O. Connally <[log in to unmask]>

Wed, 13 Aug 1997 08:21:25 -0700

54 lines

New Thread

FAB: Flexible circuit suppliers wanted

FAB: Flexible circuit suppliers wanted

YAP CHOW LAN <[log in to unmask]>

Tue, 5 Aug 1997 18:17:10 +0800

25 lines

Re: FAB: Flexible circuit suppliers wanted

Brian Nelson - General Manager <[log in to unmask]>

Tue, 5 Aug 1997 07:49:24 +0000

80 lines

Re: FAB: Flexible circuit suppliers wanted

Florencio Eiranova <[log in to unmask]>

Tue, 5 Aug 1997 12:53:17 -0500

55 lines

Re: FAB: Flexible circuit suppliers wanted

Joel Yocom <[log in to unmask]>

Tue, 5 Aug 1997 18:09:01 +0000

23 lines

Re: FAB: Flexible circuit suppliers wanted

[log in to unmask]

Tue, 5 Aug 1997 20:02:57 -0400

13 lines

Re: FAB: Flexible circuit suppliers wanted

Denis Meloche <[log in to unmask]>

Wed, 6 Aug 1997 10:10:44 -0400

42 lines

Re: FAB: Flexible circuit suppliers wanted

Larry Crane <[log in to unmask]>

Wed, 6 Aug 1997 10:55:12 -0400

66 lines

Re: FAB: Flexible circuit suppliers wanted

Joel Yocom <jyocom@[192.168.0.1]>

Wed, 6 Aug 1997 11:20:42 +0000

26 lines

Re: FAB: Flexible circuit suppliers wanted

mark leasure <[log in to unmask]>

Tue, 12 Aug 1997 09:13:37 -0700

28 lines

New Thread

FAB: IPC-6012 & Lifted Lands

FAB: IPC-6012 & Lifted Lands

Thad McMillan <[log in to unmask]>

Tue, 5 Aug 1997 14:01:00 CDT

36 lines

Re: FAB: IPC-6012 & Lifted Lands

Lisa Williams <[log in to unmask]>

Tue, 5 Aug 1997 16:43:06 -0500

49 lines

Re: FAB: IPC-6012 & Lifted Lands

Ed Cosper <[log in to unmask]>

Tue, 5 Aug 1997 17:05:30 -0500

66 lines

New Thread

FAB: IST

FAB: IST

Orna and Yehuda <[log in to unmask]>

Fri, 8 Aug 1997 00:28:45 +0300

33 lines

Re: FAB: IST

Delsen Testing Laboratories <[log in to unmask]>

Thu, 7 Aug 1997 16:30:16 -0700

74 lines

Re: FAB: IST

D. Rooke <[log in to unmask]>

Thu, 7 Aug 1997 19:30:49 -0400

48 lines

Re: FAB: IST

[log in to unmask]

Fri, 8 Aug 1997 09:43:44 -0400

27 lines

Re: FAB: IST

Gabriela Bogdan <[log in to unmask]>

Fri, 8 Aug 1997 17:57:28 +0000

45 lines

New Thread

FAB: OSP COATINGS

FAB: OSP COATINGS

Jim Marsico 516-595-5879 <[log in to unmask]>

Fri, 8 Aug 1997 11:01:00 -0400

28 lines

Re: FAB: OSP COATINGS

[log in to unmask]

Fri, 8 Aug 1997 15:32:05 -0500

41 lines

Re: FAB: OSP COATINGS

[log in to unmask]

Sat, 9 Aug 1997 08:32:45 -0400

14 lines

Re: FAB: OSP COATINGS

Michael Barmuta <[log in to unmask]>

Tue, 12 Aug 1997 11:16:17 -0700

45 lines

Re: FAB: OSP COATINGS

Greg Bartlett <[log in to unmask]>

Wed, 13 Aug 1997 08:43:11 +0000

110 lines

New Thread

FAB: Reliability tests through ageing

FAB: Reliability tests through ageing

Orna and Yehuda <[log in to unmask]>

Mon, 1 Sep 1997 00:14:58 +0300

34 lines

New Thread

FAB: Vacrel dryfilm laminator needed

FAB: Vacrel dryfilm laminator needed

Jan Thuesen <[log in to unmask]>

Thu, 21 Aug 1997 12:07:58 +0200

24 lines

Re: FAB: Vacrel dryfilm laminator needed

[log in to unmask]

Fri, 22 Aug 1997 22:21:50 -0400

13 lines

Re: FAB: Vacrel dryfilm laminator needed

Anil K Singh <[log in to unmask]>

Sat, 23 Aug 1997 19:38:36 +0530

34 lines

New Thread

FAB: VIA FILL IN A CAVITY

FAB: VIA FILL IN A CAVITY

[log in to unmask]

Mon, 25 Aug 1997 17:22:26 -0400

22 lines

New Thread

FAB: Wire Bondable Au/Ni Etch Resist

FAB: Wire Bondable Au/Ni Etch Resist

Andy Magee <[log in to unmask]>

Fri, 29 Aug 1997 08:27:36 -0500

15 lines

New Thread

FAB:Copper/Tin Build-up on Plating Racks

FAB:Copper/Tin Build-up on Plating Racks

Hans Rohr <[log in to unmask]>

Wed, 13 Aug 1997 21:45:41 -0400

37 lines

Re: FAB:Copper/Tin Build-up on Plating Racks

David Hoover <[log in to unmask]>

Wed, 13 Aug 1997 22:43:27 -0700

40 lines

New Thread

Fabrication-RS274X

Fabrication-RS274X

Brian Nelson - General Manager <[log in to unmask]>

Tue, 5 Aug 1997 10:13:00 +0000

81 lines

New Thread

Failure Analysis, RF power FETs

Failure Analysis, RF power FETs

Sheila Smith <[log in to unmask]>

Mon, 4 Aug 1997 16:11:41 -0400

19 lines

Re: Failure Analysis, RF power FETs

Denis Meloche <[log in to unmask]>

Tue, 5 Aug 1997 09:24:52 -0400

34 lines

Re: Failure Analysis, RF power FETs

Lyle Gold (MSMail) <[log in to unmask]>

Tue, 5 Aug 1997 13:29:00 -0700

16 lines

New Thread

faraday cup

faraday cup

Lim Teong Kheng <[log in to unmask]>

Wed, 13 Aug 1997 21:24:03 +0800

12 lines

New Thread

Finish for wirebond

Finish for wirebond

[log in to unmask]

Thu, 14 Aug 1997 11:15:51 -0400

14 lines

Re: Finish for wirebond

Robert Schetty <[log in to unmask]>

Thu, 14 Aug 1997 18:32:27 UT

28 lines

Re: Finish for wirebond

Warren Szkolnicki <[log in to unmask]>

Thu, 14 Aug 1997 14:38:43 -0700

87 lines

Re: Finish for wirebond

David Anderson <[log in to unmask]>

Thu, 14 Aug 1997 20:19:15 -0500

42 lines

New Thread

Flex PWB in SMT International 97

Flex PWB in SMT International 97

KoizumiT <[log in to unmask]>

Fri, 22 Aug 1997 23:37:22 JST

15 lines

New Thread

Flexible Circuit Technology Book

Re: Flexible Circuit Technology Book

Phil Culpovich <[log in to unmask]>

Fri, 29 Aug 1997 10:48:38 -0700

21 lines

New Thread

Forums

Re: Forums

Karen Mitall <[log in to unmask]>

Fri, 1 Aug 1997 11:40:50 -0400

115 lines

New Thread

Fusible Links

Fusible Links

Kimmey, Frank <[log in to unmask]>

Fri, 15 Aug 1997 13:34:59 -0700

38 lines

Re: Fusible Links

Fred Pescitelli <[log in to unmask]>

Sun, 17 Aug 1997 14:45:59 -0400

48 lines

Re: Fusible Links

CSS Asia Co., Ltd. <[log in to unmask]>

Wed, 20 Aug 1997 15:39:30 +0900

49 lines

New Thread

Fusible Links -Reply

Re: Fusible Links -Reply

MIKE J. LOPEZ <[log in to unmask]>

Mon, 18 Aug 1997 11:07:31 -0400

9 lines

New Thread

FW: BGA Reclamation

FW: BGA Reclamation

Signorelli, Paul <[log in to unmask]>

Tue, 5 Aug 1997 10:49:48 -0600

18 lines

New Thread

GDS 2

GDS 2

[log in to unmask]

Wed, 27 Aug 1997 14:32:08 +0100

16 lines

Re: GDS 2

[log in to unmask]

Thu, 28 Aug 1997 10:56:44 -0400

18 lines

New Thread

GEN: CAM Operator seeks your opinion.

GEN: CAM Operator seeks your opinion.

Mark R. Steele <[log in to unmask]>

Fri, 22 Aug 1997 00:17:33 -0700

36 lines

Re: GEN: CAM Operator seeks your opinion.

Dick Desrosiers <[log in to unmask]>

Fri, 22 Aug 1997 10:18:44 EDT

21 lines

New Thread

GEN: MATERIAL SOURCES

GEN: MATERIAL SOURCES

Jim Marsico 516-595-5879 <[log in to unmask]>

Wed, 13 Aug 1997 12:54:00 -0400

38 lines

New Thread

GEN: Where to Buy Bellcore Specs...

GEN: Where to Buy Bellcore Specs...

Doug McKean <[log in to unmask]>

Mon, 4 Aug 1997 13:27:43 -0400

24 lines

New Thread

Getek

Getek

Paul Stolar <[log in to unmask]>

Fri, 22 Aug 1997 09:49:22 -0600

13 lines

Re: Getek

Frank Hinojos <[log in to unmask]>

Fri, 22 Aug 1997 08:56:07 -0700

29 lines

New Thread

GLASS BODY DIODES

GLASS BODY DIODES

Gabriela Bogdan <[log in to unmask]>

Wed, 6 Aug 1997 19:21:45 +0000

23 lines

Re: GLASS BODY DIODES

[log in to unmask]

Wed, 6 Aug 1997 13:04:20 +0000

29 lines

Re: GLASS BODY DIODES

Bogdan Gaby <[log in to unmask]>

Thu, 7 Aug 1997 09:02:15 -0700

34 lines

New Thread

Gold / Silver Incompatibility for Adhesives

Re: Gold / Silver Incompatibility for Adhesives

Jan Bokhove <[log in to unmask]>

Thu, 7 Aug 1997 11:10:27 +0200

30 lines

Re: Gold / Silver Incompatibility for Adhesives

Sheila Smith <[log in to unmask]>

Thu, 7 Aug 1997 08:20:28 -0400

48 lines

Re: Gold / Silver Incompatibility for Adhesives

David Anderson <[log in to unmask]>

Thu, 7 Aug 1997 09:24:47 -0500

48 lines

Re: Gold / Silver Incompatibility for Adhesives

Jan Bokhove <[log in to unmask]>

Thu, 7 Aug 1997 16:44:18 +0200

33 lines

Re: Gold / Silver Incompatibility for Adhesives

David Anderson <[log in to unmask]>

Thu, 7 Aug 1997 09:47:15 -0500

68 lines

Re: Gold / Silver Incompatibility for Adhesives

[log in to unmask]

Thu, 7 Aug 1997 15:25:00 +0200

22 lines

New Thread

gold ball bonding

gold ball bonding

[log in to unmask]

Fri, 15 Aug 1997 13:54:52 -0400

19 lines

Re: gold ball bonding

Warren Szkolnicki <[log in to unmask]>

Fri, 15 Aug 1997 13:40:45 -0700

93 lines

Re: gold ball bonding

Paul Stolar <[log in to unmask]>

Fri, 15 Aug 1997 15:20:03 -0600

21 lines

New Thread

gold ball bonding -Reply

gold ball bonding -Reply

David Anderson <[log in to unmask]>

Fri, 15 Aug 1997 16:17:41 -0500

43 lines

New Thread

Gold Connector Thickness

Gold Connector Thickness

Quality Dept. - Eltek Ltd. <[log in to unmask]>

Wed, 20 Aug 1997 13:33:11 +0300

29 lines

Gold Connector Thickness

[log in to unmask]

Wed, 20 Aug 1997 14:53:12 +0200

27 lines

New Thread

Gold Flash

Gold Flash

Barbara Burcham <[log in to unmask]>

Tue, 19 Aug 1997 13:04:32 -0700

15 lines

New Thread

Gold/Tin Mystery

Gold/Tin Mystery

[log in to unmask]

Tue, 12 Aug 1997 16:03:22 +0200

27 lines

New Thread

HASL Equipment plus & minuses

HASL Equipment plus & minuses

Steve Collins <[log in to unmask]>

Mon, 11 Aug 1997 13:14:33 -0600

24 lines

Re: HASL Equipment plus & minuses

[log in to unmask]

Mon, 11 Aug 1997 17:31:12 -0400

14 lines

New Thread

Help

Help

Eltek Ltd. - Process Engineering <[log in to unmask]>

Mon, 18 Aug 1997 10:09:45 +0300

19 lines

Re: Help

Ted Stern <[log in to unmask]>

Mon, 18 Aug 1997 09:50:57 -0700

36 lines

Re: Help

fgolisan <[log in to unmask]>

Mon, 18 Aug 1997 09:47:08 PST

24 lines

New Thread

HELP HELP HELP

HELP HELP HELP

Alan Butler <[log in to unmask]>

Mon, 4 Aug 1997 05:10:35 -0400

22 lines

Re: HELP HELP HELP

Robby Dunnagan <[log in to unmask]>

Mon, 4 Aug 1997 08:06:21 -0400

32 lines

Re: HELP HELP HELP

LES CONNALLY <[log in to unmask]>

Mon, 4 Aug 1997 09:08:14 -0700

42 lines

Re: HELP HELP HELP

[log in to unmask]

Mon, 4 Aug 1997 13:33:12 -0400

14 lines

New Thread

High PIN Density PCB Design

High PIN Density PCB Design

Varadaraj.K <[log in to unmask]>

Fri, 29 Aug 1997 08:22:40 +0530

31 lines

New Thread

Hole Filler

Hole Filler

Sok-Peng Lim-CTUA145 <[log in to unmask]>

Wed, 20 Aug 1997 00:26:49 -0500

26 lines

Re: Hole Filler

Scott B. Westheimer <[log in to unmask]>

Wed, 20 Aug 1997 21:23:10 +0800

13 lines

New Thread

how to pin gauge holes?

how to pin gauge holes?

[log in to unmask]

Tue, 12 Aug 1997 14:21:47 MST

30 lines

Re: how to pin gauge holes?

drilbert <[log in to unmask]>

Tue, 12 Aug 1997 16:29:11 -0700

48 lines

Re: how to pin gauge holes?

Hans Rohr <[log in to unmask]>

Tue, 12 Aug 1997 21:00:57 -0400

40 lines

Re: how to pin gauge holes?

Ed Cosper <[log in to unmask]>

Wed, 13 Aug 1997 10:06:50 -0500

67 lines

New Thread

how to remove silk screen

how to remove silk screen

Raymond Klein <[log in to unmask]>

Wed, 13 Aug 1997 15:51:47 -0700

19 lines

Re: how to remove silk screen

sbryan <[log in to unmask]>

Wed, 13 Aug 1997 16:50:11 PST

13 lines

Re: how to remove silk screen

mel moschler <[log in to unmask]>

Thu, 14 Aug 1997 08:37:32 -0700

28 lines

Re: how to remove silk screen

Larry J. Fisher <[log in to unmask]>

Mon, 18 Aug 1997 22:07:33 -0400

35 lines

New Thread

how to remove silk screen -Reply

how to remove silk screen -Reply

MIKE J. LOPEZ <[log in to unmask]>

Thu, 14 Aug 1997 07:15:32 -0400

10 lines

New Thread

Idents before or after HASL-- Reply

Re: Idents before or after HASL-- Reply

[log in to unmask]

Mon, 4 Aug 1997 09:35:35 -0400

40 lines

New Thread

Immersion Golde over Nickel for edge connectors

Immersion Golde over Nickel for edge connectors

Galetsky Franz <[log in to unmask]>

Sat, 16 Aug 1997 13:20:12 +-400

22 lines

New Thread

Information on Feed & Bleed systems

Information on Feed & Bleed systems

System Administrator <[log in to unmask]>

Sat, 23 Aug 1997 16:47:18 +0530

23 lines

Re: Information on Feed & Bleed systems

[log in to unmask]

Sun, 24 Aug 1997 06:56:19 -0400

17 lines

Re: Information on Feed & Bleed systems

Ted Stern <[log in to unmask]>

Mon, 25 Aug 1997 08:09:51 -0700

36 lines

New Thread

Information on LT90 Specifications

Information on LT90 Specifications

Anthony Balraj <[log in to unmask]>

Tue, 5 Aug 1997 19:33:25 +0530

19 lines

Re: Information on LT90 Specifications

David Bergman <[log in to unmask]>

Tue, 5 Aug 1997 10:45:18 -0500

48 lines

New Thread

InnerLayers treatment

InnerLayers treatment

Cristian Bomboe <[log in to unmask]>

Fri, 15 Aug 1997 09:00:26 +-300

20 lines

Re: InnerLayers treatment

[log in to unmask]

Fri, 15 Aug 1997 21:50:21 -0400

23 lines

Re: InnerLayers treatment

D. Rooke <[log in to unmask]>

Mon, 18 Aug 1997 19:08:57 -0400

36 lines

New Thread

Intermetallic of Cu-Ni-Sn/Pb

Re: Intermetallic of Cu-Ni-Sn/Pb

Martin Farrell <[log in to unmask]>

Fri, 15 Aug 1997 12:21:50 +0000

21 lines

New Thread

IPC "B" Coupon

IPC "B" Coupon

David Tyler <[log in to unmask]>

Wed, 6 Aug 1997 09:26:01 -0400

96 lines

New Thread

IPC Printed Circuits Expo '98

IPC Printed Circuits Expo '98

Kim Behr <[log in to unmask]>

Mon, 18 Aug 1997 10:17:37 -0500

237 lines

New Thread

IPC-D-317A Crosstalk Equation Question

IPC-D-317A Crosstalk Equation Question

Scott Gurst <[log in to unmask]>

Tue, 12 Aug 1997 12:45:10 -0600

34 lines

Re: IPC-D-317A Crosstalk Equation Question

John Nieznanski <[log in to unmask]>

Thu, 14 Aug 1997 09:03:36 -0400

32 lines

New Thread

IPCchat session announcement

IPCchat session announcement

[log in to unmask]

Mon, 4 Aug 1997 14:22:17 -0700

35 lines

New Thread

IPCWorks '97

IPCWorks '97

Lisa Williams <[log in to unmask]>

Mon, 25 Aug 1997 14:54:06 -0500

37 lines

New Thread

J/STD Changes

Re: J/STD Changes

[log in to unmask]

Fri, 8 Aug 1997 20:33:58 -0400

24 lines

New Thread

Job listing

Job listing

[log in to unmask]

Tue, 5 Aug 1997 22:42:39 -0400

21 lines

Job listing

Luis Rivera <[log in to unmask]>

Wed, 6 Aug 1997 06:00:00 CDT

26 lines

Re: Job listing

OMNI High Tech Industries Ltd. (OHTIL) <[log in to unmask]>

Thu, 7 Aug 1997 10:39:25 +0600

41 lines

Job listing

Luis Rivera <[log in to unmask]>

Thu, 7 Aug 1997 06:00:00 CDT

20 lines

New Thread

JOHN OSULLIVAN <[log in to unmask]>: [TECHNET] Solder mask material

Re: JOHN OSULLIVAN <[log in to unmask]>: [TECHNET] Solder mask material

Andy RJ McKean <[log in to unmask]>

Thu, 14 Aug 1997 14:38:03 GMT

31 lines

New Thread

Just a Test, Please ignore.

Just a Test, Please ignore.

KoizumiT <[log in to unmask]>

Wed, 20 Aug 1997 17:00:44 JST

10 lines

New Thread

Law suit & breast implants!

Re: Law suit & breast implants!

[log in to unmask]

Tue, 19 Aug 1997 17:53:36 -0400

18 lines

Re: Law suit & breast implants!

David Bergman <[log in to unmask]>

Tue, 19 Aug 1997 17:15:42 -0500

26 lines

Re: Law suit & breast implants!

Anil K Singh <[log in to unmask]>

Wed, 20 Aug 1997 06:55:50 +0530

34 lines

New Thread

Long Term Failures in Multilayer PCBs

Long Term Failures in Multilayer PCBs

LANE, Stephen (Collroad) <[log in to unmask]>

Mon, 4 Aug 1997 08:25:00 +0000

42 lines

Re: Long Term Failures in Multilayer PCBs

Nachbor, Suzanne (MN51) <[log in to unmask]>

Mon, 4 Aug 1997 14:25:00 PDT

17 lines

Re: Long Term Failures in Multilayer PCBs

Gary Woodford <[log in to unmask]>

Mon, 4 Aug 1997 15:40:05 +0100

29 lines

Long Term Failures in Multilayer PCBs

LANE, Stephen (Collroad) <[log in to unmask]>

Thu, 21 Aug 1997 07:03:00 +0000

47 lines

Re: Long Term Failures in Multilayer PCBs

Aric J Parr <[log in to unmask]>

Thu, 21 Aug 1997 07:49:35 -0500

20 lines

New Thread

Looking for Literature

Looking for Literature

Denis Meloche <[log in to unmask]>

Tue, 26 Aug 1997 11:31:40 -0400

36 lines

New Thread

Metal finishing

Metal finishing

tonghh <[log in to unmask]>

Sat, 16 Aug 1997 21:44:02 +0800

19 lines

Re: Metal finishing

Bob Mesick <[log in to unmask]>

Sat, 16 Aug 1997 08:56:21 -0700

29 lines

New Thread

micro bga

micro bga

Vertefeuille, Russ (AZ77) <[log in to unmask]>

Thu, 7 Aug 1997 15:30:16 -0500

19 lines

Re: micro bga

MCHAN <[log in to unmask]>

Thu, 7 Aug 1997 16:51:16 -0400

23 lines

Re: micro bga

Guenter Grossmann <[log in to unmask]>

Fri, 8 Aug 1997 11:54:44 +0200

29 lines

Re: micro bga

[log in to unmask]

Fri, 8 Aug 1997 10:15:27 -0400

19 lines

Re: micro bga

Butch White <[log in to unmask]>

Fri, 8 Aug 1997 11:13:31 -0700

33 lines

Re: micro bga

[log in to unmask]

Fri, 8 Aug 1997 11:49:30 -0700

22 lines

Re: micro bga

Robert Schetty <[log in to unmask]>

Fri, 8 Aug 1997 20:01:17 UT

32 lines

Re: micro bga

mark leasure <[log in to unmask]>

Tue, 12 Aug 1997 08:46:45 -0700

32 lines

New Thread

Micro-organisms in rinses

Micro-organisms in rinses

Andy RJ McKean <[log in to unmask]>

Thu, 14 Aug 1997 09:05:01 GMT

10 lines

Re: Micro-organisms in rinses

Leslie O. Connally <[log in to unmask]>

Thu, 14 Aug 1997 08:15:21 -0700

31 lines

Re: Micro-organisms in rinses

Ted Stern <[log in to unmask]>

Thu, 14 Aug 1997 09:33:54 -0700

33 lines

Re: Micro-organisms in rinses

Edwards, Ted A (AZ75) <[log in to unmask]>

Thu, 14 Aug 1997 13:11:08 -0500

17 lines

New Thread

MIL Standard 202 and 208

MIL Standard 202 and 208

K.Varadaraj <[log in to unmask]>

Fri, 15 Aug 1997 08:10:54 +0530

20 lines

New Thread

MIL STD for Flex

MIL STD for Flex

KoizumiT <[log in to unmask]>

Thu, 7 Aug 1997 18:41:42 JST

17 lines

Re: MIL STD for Flex

Jon Holmen <[log in to unmask]>

Tue, 19 Aug 1997 12:13:53 -0500

28 lines

New Thread

MIL-STD-2118

MIL-STD-2118

KoizumiT <[log in to unmask]>

Sat, 2 Aug 1997 15:23:12 JST

17 lines

New Thread

Milliscopes / Boroscopes

Milliscopes / Boroscopes

Whitehouse, Jim <[log in to unmask]>

Fri, 22 Aug 1997 09:26:00 CDT

10 lines

New Thread

Misregistration/Annular Ring

Misregistration/Annular Ring

Richard MacCutcheon <[log in to unmask]>

Thu, 28 Aug 1997 08:48:00 -0600

28 lines

Re: Misregistration/Annular Ring

Dick Desrosiers <[log in to unmask]>

Thu, 28 Aug 1997 15:17:03 EDT

18 lines

Re: Misregistration/Annular Ring

[log in to unmask]

Thu, 28 Aug 1997 12:29:34 PDT

46 lines

Re: Misregistration/Annular Ring

Paul Gould <[log in to unmask]>

Thu, 28 Aug 1997 23:14:30 +0100

67 lines

Re: Misregistration/Annular Ring

drilbert <[log in to unmask]>

Thu, 28 Aug 1997 18:12:24 -0700

58 lines

Re: Misregistration/Annular Ring

Mark R Ford <[log in to unmask]>

Fri, 29 Aug 1997 09:02:07 EDT

78 lines

Re: Misregistration/Annular Ring

Richard MacCutcheon <[log in to unmask]>

Fri, 29 Aug 1997 08:33:00 -0600

102 lines

New Thread

Moisture in Liquid Nitrogen

Moisture in Liquid Nitrogen

Ostertag Tom <[log in to unmask]>

Wed, 20 Aug 1997 12:50:11 U

25 lines

Re: Moisture in Liquid Nitrogen

[log in to unmask]

Wed, 20 Aug 1997 16:56:28 -0500

50 lines

New Thread

Moisture Sensative Components

Moisture Sensative Components

John Vivari <[log in to unmask]>

Fri, 29 Aug 1997 12:22:23 -0400

15 lines

Moisture Sensative Components

John Vivari <[log in to unmask]>

Fri, 29 Aug 1997 13:57:38 -0400

18 lines

New Thread

Moisture Sensitive Products

Moisture Sensitive Products

MIKE J. LOPEZ <[log in to unmask]>

Wed, 20 Aug 1997 07:14:51 -0400

11 lines

Re: Moisture Sensitive Products

Bob West <[log in to unmask]>

Mon, 25 Aug 1997 09:35:03 -0700

28 lines

Re: Moisture Sensitive Products

Bob West <[log in to unmask]>

Thu, 28 Aug 1997 07:18:15 -0700

27 lines

Re: Moisture Sensitive Products

Lolmaugh, Scott (AZ15) <[log in to unmask]>

Thu, 28 Aug 1997 10:30:59 -0500

15 lines

Re: Moisture Sensitive Products

[log in to unmask]

Thu, 28 Aug 1997 11:26:22 -0500

47 lines

New Thread

Molded Plastic Circuits

Molded Plastic Circuits

MR GEORGE D GREGOIRE <[log in to unmask]>

Fri, 29 Aug 1997 01:06:01 -0500

23 lines

Re: Molded Plastic Circuits

[log in to unmask]

Fri, 29 Aug 1997 13:35:42 -0500

22 lines

New Thread

Nickel palladium

Nickel palladium

tonghh <[log in to unmask]>

Sun, 31 Aug 1997 14:27:58 +0800

17 lines

New Thread

No Subject

No Subject

[log in to unmask]

Wed, 27 Aug 1997 11:42:02 -0400

15 lines

New Thread

No-clean

No-clean

[log in to unmask]

Thu, 14 Aug 1997 16:51:51 MDT

22 lines

New Thread

No-clean and OSP

No-clean and OSP

[log in to unmask]

Thu, 21 Aug 1997 16:57:19 MDT

20 lines

New Thread

No-clean flux query

No-clean flux query

[log in to unmask]

Fri, 1 Aug 1997 10:31:09 MDT

28 lines

Re: No-clean flux query

Graham Naisbitt <[log in to unmask]>

Sun, 3 Aug 1997 23:21:02 UT

64 lines

Re: No-clean flux query

Lepsche, Thomas G (NM75) <[log in to unmask]>

Mon, 4 Aug 1997 07:45:47 -0600

85 lines

Re: No-clean flux query

Graham Naisbitt <[log in to unmask]>

Mon, 4 Aug 1997 22:28:27 UT

145 lines

Re: No-clean flux query

Denis Meloche <[log in to unmask]>

Tue, 5 Aug 1997 09:11:27 -0400

46 lines

Re: No-clean flux query

Denis Meloche <[log in to unmask]>

Tue, 5 Aug 1997 09:30:48 -0400

167 lines

Re: No-clean flux query

Graham Naisbitt <[log in to unmask]>

Wed, 6 Aug 1997 15:05:42 UT

190 lines

New Thread

No-clean rework qualification

No-clean rework qualification

[log in to unmask]

Mon, 18 Aug 1997 15:31:48 MDT

37 lines

Re: No-clean rework qualification

Graham Naisbitt <[log in to unmask]>

Mon, 18 Aug 1997 23:57:28 UT

86 lines

Re: No-clean rework qualification

Denis Meloche <[log in to unmask]>

Tue, 19 Aug 1997 08:59:06 -0400

66 lines

Re: No-clean rework qualification

Karen Tellefsen <[log in to unmask]>

Wed, 20 Aug 1997 18:05:23 -0700

69 lines

Re: No-clean rework qualification

Denis Meloche <[log in to unmask]>

Thu, 21 Aug 1997 10:14:25 -0400

87 lines

New Thread

No-clean VS Water soluable soldering

No-clean VS Water soluable soldering

[log in to unmask]

Tue, 26 Aug 1997 09:24:34 MDT

18 lines

Re: No-clean VS Water soluable soldering

[log in to unmask]

Wed, 27 Aug 1997 20:17:26 -0400

15 lines

New Thread

no-clean wire solder and flux pen question

no-clean wire solder and flux pen question

[log in to unmask]

Mon, 11 Aug 1997 15:06:08 MDT

26 lines

New Thread

Np-clean flux

Np-clean flux

[log in to unmask]

Wed, 13 Aug 1997 08:08:19 MDT

24 lines

New Thread

Optimum via size for test point use

Optimum via size for test point use

LLOYD TOFTE <[log in to unmask]>

Mon, 25 Aug 1997 18:08:40 -0500

18 lines

New Thread

Original C4 paper from IBM Journal (1969)

Original C4 paper from IBM Journal (1969)

tana <[log in to unmask]>

Tue, 26 Aug 1997 10:00:21 +0100

37 lines

New Thread

OSP coating

Re: OSP coating

[log in to unmask]

Mon, 1 Sep 1997 00:32:08 -0500

41 lines

New Thread

PCB baking

PCB baking

[log in to unmask]

Wed, 13 Aug 1997 12:46:12 EDT

21 lines

Re: PCB baking

Leslie O. Connally <[log in to unmask]>

Wed, 13 Aug 1997 12:46:38 -0700

48 lines

New Thread

PCB baking & Thermal cycles

PCB baking & Thermal cycles

[log in to unmask]

Thu, 14 Aug 1997 10:49:52 +0200

28 lines

Re: PCB baking & Thermal cycles

Leslie O. Connally <[log in to unmask]>

Thu, 14 Aug 1997 08:09:15 -0700

45 lines

New Thread

PCB Failures

PCB Failures

Rosario D. Salvo <[log in to unmask]>

Fri, 29 Aug 1997 12:03:46 -0400

22 lines

PCB Failures

Richard MacCutcheon <[log in to unmask]>

Fri, 29 Aug 1997 10:34:00 -0600

36 lines

Re: PCB Failures

Joe Dickson <[log in to unmask]>

Fri, 29 Aug 1997 10:25:37 PST

52 lines

New Thread

PCB Industry in Japan

PCB Industry in Japan

Omni High Tech Industries Ltd. (OHTIL) <[log in to unmask]>

Tue, 12 Aug 1997 20:05:18 +0600

42 lines

Re: PCB Industry in Japan

Kuwako, Fujio(MMS) <[log in to unmask]>

Wed, 13 Aug 1997 11:31:57 +0900

89 lines

Re: PCB Industry in Japan

[log in to unmask]

Wed, 13 Aug 1997 09:59:56 -0500

38 lines

New Thread

PCB Layout Services

PCB Layout Services

Daniel Doherty <[log in to unmask]>

Mon, 4 Aug 1997 13:40:20 -0700

24 lines

New Thread

PCB related questions

PCB related questions

Robert Moss <[log in to unmask]>

Mon, 25 Aug 1997 13:51:01 -0400

22 lines

Re: PCB related questions

Kimmey, Frank <[log in to unmask]>

Mon, 25 Aug 1997 11:19:28 -0700

39 lines

Re: PCB related questions

Barry Allen <[log in to unmask]>

Tue, 26 Aug 1997 07:53:15 -0400

36 lines

New Thread

Peel strength value Cu tracks

Peel strength value Cu tracks

peter dahlen <[log in to unmask]>

Wed, 6 Aug 1997 12:08:32 +0000

39 lines

New Thread

Photoplotter Information...

Photoplotter Information...

Nelson Calimquim <[log in to unmask]>

Thu, 21 Aug 1997 09:04:55 -0700

22 lines

New Thread

Photoresist Applications

Photoresist Applications

Marcello Stanco <[log in to unmask]>

Thu, 14 Aug 1997 22:05:39 -0700

21 lines

New Thread

Pin gage reference

Pin gage reference

[log in to unmask]

Thu, 14 Aug 1997 11:18:05 -0400

13 lines

Re: Pin gage reference

[log in to unmask]

Thu, 14 Aug 1997 13:47:22 -0400

13 lines

Re: Pin gage reference

Don Vischulis <[log in to unmask]>

Fri, 15 Aug 1997 19:47:48 -0500

62 lines

New Thread

Please remove my name

Re: Please remove my name

[log in to unmask]

Tue, 5 Aug 1997 11:32:16 +0800

12 lines

New Thread

PMC Bezels

PMC Bezels

Andrew Buonviri <[log in to unmask]>

Fri, 15 Aug 1997 10:14:41 -0400

19 lines

New Thread

Positive Etchback vs De-smear

Positive Etchback vs De-smear

Ferrell-2 Bobby <[log in to unmask]>

Mon, 4 Aug 1997 08:31:33 -0400

22 lines

New Thread

Printable, Peelable Solder Masks

Printable, Peelable Solder Masks

Whitehouse, Jim <[log in to unmask]>

Tue, 19 Aug 1997 07:43:00 CDT

11 lines

Re: Printable, Peelable Solder Masks

Larry J. Fisher <[log in to unmask]>

Tue, 19 Aug 1997 17:03:02 -0400

25 lines

Re: Printable, Peelable Solder Masks

Karen Tellefsen <[log in to unmask]>

Wed, 20 Aug 1997 17:43:18 -0700

20 lines

New Thread

Printable, Peelable Solder Masks (fwd)

Re: Printable, Peelable Solder Masks (fwd)

Michael Barmuta <[log in to unmask]>

Thu, 21 Aug 1997 09:29:58 -0700

11 lines

New Thread

PTH Troubleshooting- Search for Authors

PTH Troubleshooting- Search for Authors

Ted F Myers <[log in to unmask]>

Fri, 22 Aug 1997 23:35:44 +0100

19 lines

Re: PTH Troubleshooting- Search for Authors

Leslie O. Connally <[log in to unmask]>

Mon, 25 Aug 1997 08:11:37 -0700

36 lines

New Thread

Pull test

Pull test

John XIE <[log in to unmask]>

Tue, 19 Aug 1997 09:43:00 -0700

25 lines

Re: Pull test

Ted Stern <[log in to unmask]>

Tue, 19 Aug 1997 13:40:15 -0700

43 lines

New Thread

PWB Questions

PWB Questions

rob <[log in to unmask]>

Thu, 7 Aug 1997 10:05:08 -0700

28 lines

Re: PWB Questions

Sheila Smith <[log in to unmask]>

Thu, 7 Aug 1997 14:19:55 -0400

38 lines

New Thread

R Test Mesage

R Test Mesage

VOLPE, RAY <[log in to unmask]>

Thu, 14 Aug 1997 12:41:51 -0400

12 lines

New Thread

RE : OSP

RE : OSP

Eltek Ltd. - Process Engineering <[log in to unmask]>

Wed, 13 Aug 1997 09:11:39 +0300

43 lines

New Thread

Reduced oxide

Reduced oxide

Eltek Ltd. - Process Engineering <[log in to unmask]>

Mon, 25 Aug 1997 12:52:30 +0300

22 lines

Re: Reduced oxide

[log in to unmask]

Mon, 25 Aug 1997 09:20:21 -0400

51 lines

New Thread

reflow standards for leaded devices

reflow standards for leaded devices

Stephen L. Mead <[log in to unmask]>

Wed, 27 Aug 1997 11:41:06 -0400

27 lines

New Thread

Reliability of reworked PCB's

Reliability of reworked PCB's

Guenter Grossmann <[log in to unmask]>

Tue, 26 Aug 1997 09:14:31 +0200

19 lines

New Thread

repair of circuit traces

repair of circuit traces

OBRIEN GERARD <[log in to unmask]>

Tue, 12 Aug 1997 08:15:49 -0400

18 lines

Re: repair of circuit traces

Art Shuler <[log in to unmask]>

Tue, 12 Aug 1997 10:35:04 -0400

22 lines

New Thread

Reply to press pin equipment query

Reply to press pin equipment query

Natalie Sharp <[log in to unmask]>

Fri, 8 Aug 1997 12:23:26 U

35 lines

New Thread

Request

Request

[log in to unmask]

Wed, 20 Aug 1997 22:27:19 -0400

8 lines

New Thread

REVIEW Technet

REVIEW Technet

Jen Hatton <[log in to unmask]>

Mon, 25 Aug 1997 07:46:26 CDT

15 lines

New Thread

Rework cooling rate

Rework cooling rate

[log in to unmask]

Tue, 5 Aug 1997 15:13:28 MDT

18 lines

Re: Rework cooling rate

Gary D. Peterson <[log in to unmask]>

Wed, 6 Aug 1997 09:36:13 -0600

59 lines

Re: Rework cooling rate

John Guy <[log in to unmask]>

Wed, 13 Aug 1997 08:41:06 -0500

121 lines

Re: Rework cooling rate

Guenter Grossmann <[log in to unmask]>

Wed, 13 Aug 1997 16:48:25 +0200

52 lines

Re: Rework cooling rate

John Guy <[log in to unmask]>

Wed, 13 Aug 1997 11:23:31 -0500

165 lines

Re: Rework Cooling Rate

[log in to unmask]

Wed, 13 Aug 1997 15:48:16 -0400

36 lines

New Thread

Re[2]: [TECHNET] Adhesive Printing

Re: Re[2]: [TECHNET] Adhesive Printing

[log in to unmask]

Tue, 26 Aug 1997 17:13:18 +0000

67 lines

New Thread

Re[2]: [TECHNET] Finish for wirebond

Re: Re[2]: [TECHNET] Finish for wirebond

Robert Schetty <[log in to unmask]>

Fri, 15 Aug 1997 22:31:38 UT

35 lines

New Thread

Re[2]: [TECHNET] Gold / Silver Incompatibility for Adhesives

Re: Re[2]: [TECHNET] Gold / Silver Incompatibility for Adhesives

Paul Stavrides <[log in to unmask]>

Thu, 7 Aug 1997 11:46:38 -0400

20 lines

Re: Re[2]: [TECHNET] Gold / Silver Incompatibility for Adhesives

Luc Boschmans <[log in to unmask]>

Fri, 8 Aug 1997 17:54:13 +0200

77 lines

Re: Re[2]: [TECHNET] Gold / Silver Incompatibility for Adhesives

Jan Bokhove <[log in to unmask]>

Mon, 11 Aug 1997 15:26:12 +0200

43 lines

New Thread

RMA FLUX CORROSION ON PLASTIC PARTS

RMA FLUX CORROSION ON PLASTIC PARTS

David T. Novick <[log in to unmask]>

Fri, 22 Aug 1997 07:23:12 PST

26 lines

Re: RMA FLUX CORROSION ON PLASTIC PARTS

[log in to unmask]

Fri, 22 Aug 1997 10:58:12 +0000

50 lines

New Thread

Roku-Roku Sangyo, Ltd.

Roku-Roku Sangyo, Ltd.

William Johnson <[log in to unmask]>

Thu, 28 Aug 1997 00:49:11 UT

10 lines

Re: Roku-Roku Sangyo, Ltd.

Kuwako, Fujio(MMS) <[log in to unmask]>

Thu, 28 Aug 1997 14:27:08 +0900

25 lines

New Thread

rs274x

rs274x

[log in to unmask]

Tue, 05 Aug 97 08:21:35 -0500

37 lines

New Thread

Sales Engineer position

Sales Engineer position

[log in to unmask]

Mon, 11 Aug 1997 15:57:37 -0400

15 lines

New Thread

Sales Position/Tech Service

Sales Position/Tech Service

DAVID MANDER <[log in to unmask]>

Fri, 22 Aug 1997 23:12:31 -0500

13 lines

Re: Sales Position/Tech Service

Scott B. Westheimer <[log in to unmask]>

Sat, 23 Aug 1997 11:36:03 +0800

19 lines

New Thread

Saponifier - Armakleen

Saponifier - Armakleen

Wesley Samples <[log in to unmask]>

Tue, 12 Aug 1997 15:50:10 +0000

33 lines

New Thread

SELV Specification

SELV Specification

[log in to unmask]

Thu, 21 Aug 1997 09:41:37 +0400

19 lines

New Thread

Sequential Build Multilayer

Sequential Build Multilayer

D. Rooke <[log in to unmask]>

Thu, 7 Aug 1997 21:09:17 -0400

31 lines

New Thread

SHADOW PROCESS

SHADOW PROCESS

Luis Hernandez <[log in to unmask]>

Thu, 14 Aug 1997 15:32:28 -0700

17 lines

Re: SHADOW PROCESS

Cristian Bomboe <[log in to unmask]>

Fri, 15 Aug 1997 19:39:26 +-300

65 lines

Re: SHADOW PROCESS

Carroll, George (MIS, GEFanuc, NA) <[log in to unmask]>

Fri, 15 Aug 1997 16:32:08 -0400

40 lines

Re: SHADOW PROCESS

[log in to unmask]

Fri, 15 Aug 1997 18:34:55 -0400

8 lines

Re: SHADOW PROCESS

[log in to unmask]

Fri, 15 Aug 1997 22:06:44 -0400

18 lines

New Thread

Silver Cond. Ink

Silver Cond. Ink

Fred Pescitelli <[log in to unmask]>

Wed, 6 Aug 1997 12:02:21 -0400

18 lines

New Thread

SIR test coupo

Re: SIR test coupo

Rex Breunsbach <[log in to unmask]>

Thu, 21 Aug 1997 08:32:08 -0800

12 lines

New Thread

SIR test coupons

SIR test coupons

[log in to unmask]

Wed, 20 Aug 1997 15:37:14 MDT

26 lines

Re: SIR test coupons

Karen Tellefsen <[log in to unmask]>

Wed, 20 Aug 1997 17:38:03 -0700

40 lines

New Thread

SMOBC

SMOBC

annie laberge <[log in to unmask]>

Fri, 15 Aug 1997 12:09:45 -0400

21 lines

New Thread

SMT Plus Inc.

SMT Plus Inc.

Alderete, Michael (MS Mail) <[log in to unmask]>

Thu, 21 Aug 1997 14:52:54 -0700

25 lines

New Thread

SNEC mtg

SNEC mtg

[log in to unmask]

Tue, 5 Aug 1997 16:49:53 -0400

11 lines

New Thread

Solder joint design

Solder joint design

[log in to unmask]

Fri, 29 Aug 1997 10:11:35 +0200

24 lines

Re: Solder joint design

John Guy <[log in to unmask]>

Fri, 29 Aug 1997 08:23:37 -0500

44 lines

New Thread

SOLDER JOINT PULL STRENGTH

SOLDER JOINT PULL STRENGTH

[log in to unmask]

Tue, 19 Aug 1997 11:37:33 -0400

19 lines

Re: SOLDER JOINT PULL STRENGTH

Bogdan Gaby <[log in to unmask]>

Wed, 20 Aug 1997 11:19:00 -0700

31 lines

New Thread

Solder mask m

Re: Solder mask m

JOHN OSULLIVAN <[log in to unmask]>

Fri, 15 Aug 1997 16:47:52 -0400

24 lines

New Thread

Solder mask material

Solder mask material

JOHN OSULLIVAN <[log in to unmask]>

Thu, 14 Aug 1997 17:49:25 -0400

20 lines

Re: Solder mask material

Aric J Parr <[log in to unmask]>

Thu, 14 Aug 1997 13:50:40 -0500

26 lines

Re: Solder mask material

jdeking <[log in to unmask]>

Thu, 14 Aug 1997 17:33:25 -0400

40 lines

Re: Solder mask material

[log in to unmask]

Thu, 14 Aug 1997 17:44:32 -0400

11 lines

Re: Solder mask material

[log in to unmask]

Thu, 14 Aug 1997 18:15:50 -0400

16 lines

Re: Solder mask material

[log in to unmask]

Thu, 14 Aug 1997 23:38:33 -0400

15 lines

Re: Solder mask material

roberto tulman <[log in to unmask]>

Fri, 15 Aug 1997 21:04:08 +0300

25 lines

Re: Solder mask material

[log in to unmask]

Fri, 15 Aug 1997 15:37:05 -0400

8 lines

Re: Solder mask material

Don Vischulis <[log in to unmask]>

Fri, 15 Aug 1997 20:27:56 -0500

31 lines

Re: Solder mask material

Larry J. Fisher <[log in to unmask]>

Mon, 18 Aug 1997 22:22:02 -0400

31 lines

New Thread

Solder mask material -Reply

Solder mask material -Reply

Dennis Ostendorf <[log in to unmask]>

Thu, 14 Aug 1997 14:03:17 -0500

37 lines

Re: Solder mask material -Reply

annie laberge <[log in to unmask]>

Thu, 14 Aug 1997 16:49:39 -0400

55 lines

Re: Solder mask material -Reply

Afri Singh <[log in to unmask]>

Fri, 15 Aug 1997 15:27:58 -0400

64 lines

New Thread

solderability after baking

Re: solderability after baking

Leslie O. Connally <[log in to unmask]>

Thu, 14 Aug 1997 11:32:59 -0700

20 lines

New Thread

SSD technology

SSD technology

Cristian Bomboe <[log in to unmask]>

Thu, 14 Aug 1997 11:01:10 +-300

17 lines

SSD technology

MR GEORGE D GREGOIRE <[log in to unmask]>

Sat, 16 Aug 1997 00:05:10 -0500

30 lines

Re: SSD technology

Cristian Bomboe <[log in to unmask]>

Tue, 19 Aug 1997 09:23:23 +-300

99 lines

New Thread

Strip tin-lead

Re: Strip tin-lead

[log in to unmask]

Mon, 11 Aug 1997 23:51:56 -0400

16 lines

New Thread

Subj: Alternative CCA Marking Labels

Subj: Alternative CCA Marking Labels

Ron Hollandsworth <[log in to unmask]>

Tue, 19 Aug 1997 15:14:48 -0500

22 lines

Re: Subj: Alternative CCA Marking Labels

Aric J Parr <[log in to unmask]>

Tue, 19 Aug 1997 15:58:57 -0500

22 lines

New Thread

Subscribe

Subscribe

Tevels, John R (RFC MS-Mail) <[log in to unmask]>

Thu, 7 Aug 1997 13:22:00 -0400

14 lines

Subscribe

[log in to unmask]

Tue, 12 Aug 1997 00:15:42 -0400

8 lines

Re: Subscribe

Dmitriy Sklyar <[log in to unmask]>

Wed, 13 Aug 1997 09:38:10 -0500

47 lines

subscribe

Jan Thuesen <[log in to unmask]>

Tue, 19 Aug 1997 11:26:09 +0200

18 lines

SUBSCRIBE

[log in to unmask]

Tue, 26 Aug 1997 09:17:43 CST

10 lines

New Thread

Subscription

Subscription

[log in to unmask]

Fri, 15 Aug 1997 12:20:36 -0500

15 lines

New Thread

SUPPLIER INFO --FLEX PLUS

SUPPLIER INFO --FLEX PLUS

Bernard Kessler & Associates LTD <[log in to unmask]>

Wed, 6 Aug 1997 12:42:54 -0400

23 lines

New Thread

Surface prep prior to solder mask

Surface prep prior to solder mask

[log in to unmask]

Fri, 1 Aug 1997 19:49:25 -0400

13 lines

Re: Surface prep prior to solder mask

Jim Douglas <[log in to unmask]>

Sat, 2 Aug 1997 12:02:41 +-100

72 lines

New Thread

Survey Input

Survey Input

Kasprzak, Bill (esd) US <[log in to unmask]>

Fri, 22 Aug 1997 07:59:00 PDT

43 lines

New Thread

Systronic Stencil Cleaner

Systronic Stencil Cleaner

[log in to unmask]

Tue, 26 Aug 1997 17:17:06 +0000

15 lines

New Thread

telephone number

telephone number

OBRIEN GERARD <[log in to unmask]>

Thu, 14 Aug 1997 09:50:17 -0400

18 lines

telephone number

OBRIEN GERARD <[log in to unmask]>

Thu, 14 Aug 1997 09:50:17 -0400

54 lines

New Thread

telephone number -Reply

telephone number -Reply

Marshall Canaday <[log in to unmask]>

Thu, 14 Aug 1997 11:04:59 -0400

12 lines

New Thread

telephone number SMT PLUS

Re: telephone number SMT PLUS

[log in to unmask]

Thu, 14 Aug 1997 08:09:41 -0700

24 lines

Re: telephone number SMT PLUS

mark leasure <[log in to unmask]>

Thu, 14 Aug 1997 08:33:56 -0700

39 lines

Re: telephone number SMT PLUS

David Hoover <[log in to unmask]>

Thu, 14 Aug 1997 20:42:09 -0700

36 lines

New Thread

Test Die and Substrate

Test Die and Substrate

Larry Crane <[log in to unmask]>

Fri, 29 Aug 1997 11:20:44 -0400

20 lines

New Thread

Test, Please ignore

Test, Please ignore

Alderete, Michael <[log in to unmask]>

Mon, 4 Aug 1997 12:25:09 -0700

12 lines

New Thread

Test, please ignore, 970811-1

Test, please ignore, 970811-1

Alderete, Michael <[log in to unmask]>

Mon, 11 Aug 1997 09:54:51 -0700

11 lines

New Thread

test, please ignore.

test, please ignore.

Alderete, Michael <[log in to unmask]>

Thu, 7 Aug 1997 16:42:27 -0700

11 lines

New Thread

Test,please ignore.

Test,please ignore.

Motoyo Wajima <[log in to unmask]>

Tue, 5 Aug 1997 10:35:18 +0900

20 lines

New Thread

Testing only

Testing only

Melinda Robinson <[log in to unmask]>

Fri, 1 Aug 1997 18:37:32 -0500

11 lines

New Thread

Testing only -Reply

Testing only -Reply

MIKE J. LOPEZ <[log in to unmask]>

Sat, 2 Aug 1997 10:36:25 -0400

9 lines

New Thread

Testing Services

Re: Testing Services

Sheila Smith <[log in to unmask]>

Wed, 20 Aug 1997 09:01:19 -0400

16 lines

Re: Testing Services

Ted Stern <[log in to unmask]>

Wed, 20 Aug 1997 08:35:40 -0700

39 lines

New Thread

Thermal Ties

Re: Thermal Ties

Urry, John @ SLG <[log in to unmask]>

Mon, 4 Aug 1997 17:12:00 MDT

80 lines

New Thread

Thermal ties aka spokes

Thermal ties aka spokes

Jay DeKing (EMA) <[log in to unmask]>

Fri, 1 Aug 1997 16:13:55 -0400

21 lines

Re: Thermal ties aka spokes

[log in to unmask]

Sun, 3 Aug 1997 01:00:43 -0400

78 lines

New Thread

To Job Posters

To Job Posters

Steve Underwood <[log in to unmask]>

Wed, 27 Aug 1997 06:19:12 -0600

35 lines

Re: To Job Posters

David Bergman <[log in to unmask]>

Fri, 29 Aug 1997 07:05:29 -0500

37 lines

New Thread

Training materials

Training materials

Jim Herard <[log in to unmask]>

Wed, 27 Aug 1997 19:20:51 -0400

37 lines

New Thread

TSOP susceptibility to temperature

TSOP susceptibility to temperature

Joel Mearig <[log in to unmask]>

Tue, 19 Aug 1997 15:38:53 -0700

14 lines

New Thread

UL Testing

UL Testing

[log in to unmask]

Mon, 18 Aug 1997 11:39:04 MST

23 lines

Re: UL Testing

Delsen Testing Laboratories <[log in to unmask]>

Mon, 18 Aug 1997 16:50:16 -0700

46 lines

New Thread

Unsubscribe

Unsubscribe

IR Harty <[log in to unmask]>

Tue, 5 Aug 1997 10:06:50 +0100

10 lines

unsubscribe

Hatfield, Mike <[log in to unmask]>

Tue, 5 Aug 1997 10:36:30 -0500

12 lines

unsubscribe

[log in to unmask]

Thu, 7 Aug 1997 17:57:01 +0200

15 lines

Re: unsubscribe

JoAnn Amerson <[log in to unmask]>

Thu, 7 Aug 1997 15:35:28 +0000

28 lines

unsubscribe

Volk, Raymond (MN51) <[log in to unmask]>

Fri, 8 Aug 1997 10:35:30 -0500

12 lines

Re: unsubscribe

Dmitriy Sklyar <[log in to unmask]>

Fri, 8 Aug 1997 11:43:02 -0500

44 lines

unsubscribe

Taylor Michelle Bodziak <[log in to unmask]>

Sun, 10 Aug 1997 11:19:57 -0400

13 lines

Unsubscribe

Dan Lee <[log in to unmask]>

Mon, 11 Aug 1997 07:59:09 -0800

20 lines

UNSUBSCRIBE

[log in to unmask]

Mon, 11 Aug 1997 13:39:16 EDT

17 lines

Re: UNSUBSCRIBE

Dmitriy Sklyar <[log in to unmask]>

Mon, 11 Aug 1997 13:33:36 -0500

55 lines

Unsubscribe

[log in to unmask]

Mon, 11 Aug 1997 13:28:49 CST

14 lines

Unsubscribe

Krawczyk, Russ <[log in to unmask]>

Mon, 11 Aug 1997 15:14:38 -0500

18 lines

unsubscribe

[log in to unmask]

Fri, 15 Aug 1997 14:30:37 -0400

8 lines

UNSUBSCRIBE

[log in to unmask]

Mon, 18 Aug 1997 09:13:34 -0600

12 lines

UNSUBSCRIBE

[log in to unmask]

Tue, 19 Aug 1997 15:21:49 EDT

8 lines

Unsubscribe

Adzahar Bin Samat <[log in to unmask]>

Fri, 22 Aug 1997 16:02:20 +0800

12 lines

UNSUBSCRIBE

Jen Hatton <[log in to unmask]>

Fri, 22 Aug 1997 11:45:06 CDT

11 lines

UNSUBSCRIBE

[log in to unmask]

Fri, 22 Aug 1997 16:20:46 EDT

19 lines

Unsubscribe

[log in to unmask]

Sat, 23 Aug 1997 01:47:00 -0400

9 lines

Re: UNSUBSCRIBE

Dmitriy Sklyar <[log in to unmask]>

Mon, 25 Aug 1997 12:20:13 -0500

42 lines

Re: UNSUBSCRIBE

Dmitriy Sklyar <[log in to unmask]>

Mon, 25 Aug 1997 12:34:14 -0500

47 lines

Re: UNSUBSCRIBE

JoAnn Amerson <[log in to unmask]>

Mon, 25 Aug 1997 13:47:42 +0000

25 lines

Re: UNSUBSCRIBE

Rick Taormino <[log in to unmask]>

Mon, 25 Aug 1997 17:40:01 -0700

58 lines

Re: UNSUBSCRIBE

LayCheng Ong <[log in to unmask]>

Mon, 25 Aug 1997 19:41:51 -0500

11 lines

unsubscribe

Jay Breeden <[log in to unmask]>

Tue, 26 Aug 1997 07:24:50 -0400

15 lines

UNSUBSCRIBE

Marie Evans <[log in to unmask]>

Wed, 27 Aug 1997 08:26:48 -0700

9 lines

Re: UNSUBSCRIBE

Baruch Schifman <[log in to unmask]>

Thu, 28 Aug 1997 12:04:27 +0300

19 lines

Re: UNSUBSCRIBE

JoAnn Amerson <[log in to unmask]>

Thu, 28 Aug 1997 08:09:26 +0000

64 lines

New Thread

unsubscribe try # 2

unsubscribe try # 2

Volk, Raymond (MN51) <[log in to unmask]>

Wed, 13 Aug 1997 07:52:47 -0500

12 lines

New Thread

Unsubscribe...

Unsubscribe...

Lyle Dove <[log in to unmask]>

Sun, 10 Aug 1997 14:23:17 -0500

13 lines

New Thread

unsubskrive

unsubskrive

[log in to unmask]

Wed, 13 Aug 1997 08:55:43 +0200

12 lines

New Thread

Use of SMD shields for shielding pre reflow (ASSEM)

RE: Use of SMD shields for shielding pre reflow (ASSEM)

"John Wick"@[log in to unmask]

Thu, 28 Aug 1997 14:45:00 EDT

44 lines

Re: Use of SMD shields for shielding pre reflow (ASSEM)

"John Wick"@[log in to unmask]

Thu, 28 Aug 1997 14:45:00 EDT

77 lines

New Thread

used smt equipment

used smt equipment

Tucker, Steve (KS) <[log in to unmask]>

Tue, 12 Aug 1997 11:08:37 -0700

81 lines

Re: used smt equipment

[log in to unmask]

Thu, 14 Aug 1997 07:07:34 EDT

45 lines

New Thread

Vendors for oxide treatment on copper laminates

Re: Vendors for oxide treatment on copper laminates

LES CONNALLY <[log in to unmask]>

Mon, 4 Aug 1997 11:14:14 -0700

51 lines

New Thread

Via hole/pad size

Re: Via hole/pad size

Shaub, John, E (PA62) <[log in to unmask]>

Fri, 1 Aug 1997 13:00:30 -0400

68 lines

Re: Via hole/pad size

[log in to unmask]

Mon, 4 Aug 1997 07:26:37 -0400

20 lines

Re: Via hole/pad size

Jay DeKing (EMA) <[log in to unmask]>

Mon, 4 Aug 1997 11:32:10 -0400

104 lines

Re: Via hole/pad size

Mitch Morey <[log in to unmask]>

Mon, 4 Aug 1997 10:19:57 -0700

67 lines

Re: Via hole/pad size

Paul Gould <[log in to unmask]>

Mon, 4 Aug 1997 21:10:13 +0100

48 lines

Re: Via hole/pad size

Shaub, John, E (PA62) <[log in to unmask]>

Mon, 4 Aug 1997 16:39:44 -0400

76 lines

Re: Via hole/pad size

peter dahlen <[log in to unmask]>

Tue, 5 Aug 1997 08:57:57 +0000

54 lines

Re: Via hole/pad size

[log in to unmask]

Tue, 5 Aug 1997 09:30:36 -0400

32 lines

Re: Via hole/pad size

roberto tulman <[log in to unmask]>

Tue, 5 Aug 1997 20:11:38 +0300

43 lines

Re: Via hole/pad size

Paul Gould <[log in to unmask]>

Tue, 5 Aug 1997 23:39:05 +0100

88 lines

Re: Via hole/pad size

peter dahlen <[log in to unmask]>

Wed, 6 Aug 1997 08:24:54 +0000

59 lines

Re: Via hole/pad size

[log in to unmask]

Wed, 6 Aug 1997 10:32:18 -0400

17 lines

Via hole/Pad size

Paul Gould <[log in to unmask]>

Wed, 6 Aug 1997 16:06:50 +0100

81 lines

New Thread

Via Inductance

Re: Via Inductance

Doug McKean <[log in to unmask]>

Tue, 5 Aug 1997 09:05:21 -0400

65 lines

Re: Via Inductance

Jack Olson <[log in to unmask]>

Tue, 5 Aug 1997 08:38:05 -0700

26 lines

Re: Via Inductance

Doug McKean <[log in to unmask]>

Tue, 5 Aug 1997 11:58:09 -0400

45 lines

Re: Via Inductance

JoAnn Amerson <[log in to unmask]>

Tue, 5 Aug 1997 12:30:16 +0000

27 lines

New Thread

Vibration and Shock Summary

Vibration and Shock Summary

GeoFranck <[log in to unmask]>

Thu, 14 Aug 1997 17:16:37 -0400

22 lines

New Thread

Virus warning

Virus warning

Karen Mitall <[log in to unmask]>

Wed, 27 Aug 1997 15:51:35 -0400

66 lines

Re: Virus warning

Warren Szkolnicki <[log in to unmask]>

Wed, 27 Aug 1997 16:46:42 -0700

63 lines

Re: Virus warning

Erik Ievins <[log in to unmask]>

Wed, 27 Aug 1997 22:24:18 +0000

25 lines

Re: Virus warning

Peter Lymn <[log in to unmask]>

Thu, 28 Aug 1997 14:35:13 +0100

88 lines

New Thread

Virus Warning Hoaxes

Virus Warning Hoaxes

Mark Ross <[log in to unmask]>

Wed, 27 Aug 1997 22:59:55 -0400

17 lines

New Thread

Water borne conformal coat

Re: Water borne conformal coat

[log in to unmask]

Wed, 27 Aug 1997 13:03:16 -0500

29 lines

New Thread

Water soluble paste slump

Water soluble paste slump

Graham Naisbitt <[log in to unmask]>

Tue, 12 Aug 1997 13:51:06 UT

42 lines

New Thread

wave profile needed

wave profile needed

MIKE J. LOPEZ <[log in to unmask]>

Tue, 5 Aug 1997 12:18:56 -0400

18 lines

Re: wave profile needed

Aric J Parr <[log in to unmask]>

Tue, 5 Aug 1997 15:03:49 -0500

19 lines

New Thread

Wave Solder Books/Article Recommendations

Wave Solder Books/Article Recommendations

[log in to unmask]

Wed, 27 Aug 1997 07:11:38 -0500

19 lines

New Thread

Weld Repair of cores

Weld Repair of cores

Darren J. Mertens <[log in to unmask]>

Wed, 13 Aug 1997 14:53:05 EST

13 lines

Re: Weld Repair of cores

Wolfgang Erat <[log in to unmask]>

Wed, 13 Aug 1997 15:15:54 -0400

29 lines

New Thread

Welding Stamps?

Welding Stamps?

Darren J. Mertens <[log in to unmask]>

Wed, 6 Aug 1997 14:57:04 EST

15 lines

Welding Stamps?

Darren J. Mertens <[log in to unmask]>

Mon, 11 Aug 1997 14:44:04 EST

15 lines

New Thread

wet mask thickness gauge

wet mask thickness gauge

Radhakrishna N <[log in to unmask]>

Tue, 26 Aug 1997 13:08:14 -0700

16 lines

Re: wet mask thickness gauge

Aric J Parr <[log in to unmask]>

Tue, 26 Aug 1997 07:24:29 -0500

20 lines

Re: wet mask thickness gauge

[log in to unmask]

Tue, 26 Aug 1997 13:37:15 -0400

13 lines

Re: wet mask thickness gauge

Afri Singh <[log in to unmask]>

Tue, 26 Aug 1997 19:56:39 -0400

27 lines

Re: wet mask thickness gauge

Larry J. Fisher <[log in to unmask]>

Fri, 29 Aug 1997 20:40:53 -0400

23 lines

New Thread

Wire Harness Tool

Re: Wire Harness Tool

Bob West <[log in to unmask]>

Thu, 14 Aug 1997 07:18:52 -0700

29 lines

New Thread

X-RAY DAMAGE TO COMPONENTS

X-RAY DAMAGE TO COMPONENTS

Gabriela Bogdan <[log in to unmask]>

Wed, 27 Aug 1997 20:39:57 +0000

25 lines

Re: X-RAY DAMAGE TO COMPONENTS

Lepsche, Thomas G (NM75) <[log in to unmask]>

Wed, 27 Aug 1997 12:16:11 -0600

35 lines

Re: X-RAY DAMAGE TO COMPONENTS

Love, David (MS Mail) <[log in to unmask]>

Wed, 27 Aug 1997 11:43:45 -0700

123 lines

New Thread

X-RAY DAMAGE TO COMPONENTS -Reply

X-RAY DAMAGE TO COMPONENTS -Reply

John Swinehart <[log in to unmask]>

Wed, 27 Aug 1997 13:48:08 -0400

36 lines

Re: X-RAY DAMAGE TO COMPONENTS -Reply

Gabriela Bogdan <[log in to unmask]>

Thu, 28 Aug 1997 19:23:23 +0000

44 lines

New Thread

[2]SSD technology

Re: [2]SSD technology

Yuen, Mike <[log in to unmask]>

Tue, 19 Aug 1997 09:42:00 CDT

13 lines

New Thread

[FAB] IST WWW link

[FAB] IST WWW link

D. Rooke <[log in to unmask]>

Sat, 9 Aug 1997 15:29:30 -0400

18 lines

New Thread

[TECHNET UNSUBSCRIBE]

[TECHNET UNSUBSCRIBE]

Eileen Ong <[log in to unmask]>

Fri, 8 Aug 1997 09:30:01 +0800

12 lines

New Thread

[TECHNET] Adhesive Printing

Re[2]: [TECHNET] Adhesive Printing

MCHAN <[log in to unmask]>

Tue, 26 Aug 1997 09:55:33 -0400

20 lines

New Thread

[TECHNET] EIC Viscometer and Others

Re: [TECHNET] EIC Viscometer and Others

Fri, 29 Aug 1997 08:16:49 pdt

54 lines

New Thread

[TECHNET] FAB/ASSY: Thermal Vias

RE(2): [TECHNET] FAB/ASSY: Thermal Vias

[log in to unmask]

Fri, 8 Aug 1997 08:27:56 +0100

15 lines

New Thread

[TECHNET] FAB: Flexible circuit suppliers wanted

[TECHNET] FAB: Flexible circuit suppliers wanted

08/05/97 06:17:10 PM

16 lines

New Thread

[TECHNET] Finish for wirebond

Re[2]: [TECHNET] Finish for wirebond

Paul Stolar <[log in to unmask]>

Thu, 14 Aug 1997 16:09:35 -0600

24 lines

New Thread

[TECHNET] Gold / Silver Incompatibility for Adhesives

Re[2]: [TECHNET] Gold / Silver Incompatibility for Adhesives

MCHAN <[log in to unmask]>

Thu, 7 Aug 1997 11:16:08 -0400

26 lines

New Thread

[TECHNET] Printable, Peelable Solder Masks

Re: [TECHNET] Printable, Peelable Solder Masks

Wed, 20 Aug 1997 16:04:49 pdt

39 lines

New Thread

[TECHNET] PTH Troubleshooting- Search for Authors

Re[2]: [TECHNET] PTH Troubleshooting- Search for Authors

pcfab <[log in to unmask]>

Tue, 26 Aug 1997 13:27:34 -0800

20 lines

New Thread

[TECHNET] Rework cooling rate

Re[2]: [TECHNET] Rework cooling rate

MCHAN <[log in to unmask]>

Wed, 13 Aug 1997 11:47:25 -0400

24 lines

New Thread

[TECHNET] Re[2]: [TECHNET] Adhesive Printing

[TECHNET] Re[2]: [TECHNET] Adhesive Printing

Tuesday August 26, 1997 14:55

18 lines

New Thread

[TECHNET] Solder mask material -Reply

Re[2]: [TECHNET] Solder mask material -Reply

TOM BRESNAN <[log in to unmask]>

Thu, 14 Aug 1997 17:42:41 PST

18 lines

New Thread

[TechNet] Unsubscribe

[TechNet] Unsubscribe

Terry Pearo <[log in to unmask]>

Fri, 22 Aug 1997 07:29:58 -0700

11 lines

New Thread

[T] Annular Ring Limits

Re: [T] Annular Ring Limits

[log in to unmask]

Wed, 27 Aug 1997 20:30:51 -0400

42 lines

Re: [T] Annular Ring Limits

Devitt, Ken <[log in to unmask]>

Thu, 28 Aug 1997 10:46:16 -0400

68 lines

New Thread

[T] Annular Ring/Non-Functional Lands/Misregistration

Re: [T] Annular Ring/Non-Functional Lands/Misregistration

[log in to unmask]

Fri, 29 Aug 1997 08:39:34 -0400

51 lines

New Thread

[T] Assy & Design SMT

Re: [T] Assy & Design SMT

[log in to unmask]

Thu, 21 Aug 1997 10:05:58 -0400

22 lines

New Thread

[T] Design: Half Oz Copper

Re: [T] Design: Half Oz Copper

[log in to unmask]

Tue, 19 Aug 1997 06:33:49 -0400

23 lines

New Thread

[T] Long Term Failures in Multilayer PCBs

Re: [T] Long Term Failures in Multilayer PCBs

[log in to unmask]

Thu, 21 Aug 1997 10:05:45 -0400

26 lines

New Thread

[T] PCB Failures

Re: [T] PCB Failures

[log in to unmask]

Fri, 29 Aug 1997 18:06:18 -0400

29 lines

New Thread

[T] Rework cooling rate

Re: [T] Rework cooling rate

[log in to unmask]

Sun, 17 Aug 1997 17:43:32 -0400

33 lines

New Thread

[T] Solder joint design

Re: [T] Solder joint design

[log in to unmask]

Fri, 29 Aug 1997 18:05:16 -0400

25 lines

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