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TECHNET Archives


August 1997


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Table of Contents:

"Leslie O. Connally" <[log in to unmask]>: re: [TECHNET] Micro-organisms in rinses (3 messages)
(Fab) IPC "B" Coupon (3 messages)
(TechNet): Assy: Dewetting (1 message)
(TECHNET)Temp peak (1 message)
0.35 mm Drill Bits (2 messages)
0603's on vias (2 messages)
<No subject> (9 messages)
? (1 message)
A bit off topic (1 message)
Accurate Gold Efficiency Test (1 message)
Adhesive Printing (2 messages)
ADMIN: ChipNet Moved to the new mailsystem. (1 message)
ADMIN: ComplianceNet Moved to the new mail system. (1 message)
ADMIN: IPCsm840 Moved to the new mailsystem. (1 message)
ADMIN: Roadmap Moved to the new mailsystem. (1 message)
ADMIN: TechNet Moved to the new mailsystem. (3 messages)
ADMIN: Test Message - please disregard. (2 messages)
ADMIN: Where are the archives? (1 message)
ADVICE (1 message)
Aluminium substrates (4 messages)
Annular Ring Limits (8 messages)
Annular ring relief and wave solder (1 message)
Aqueous In-line Cleaner (4 messages)
Artwork (1 message)
Asm Shock/Vib. Specs. (4 messages)
Asm: Shock and Vibration Specs (1 message)
ASS/FAB Plating racks for Flexible circuit (2 messages)
ASSEM: flux alone or flux with solder (2 messages)
ASSEM: flux alone or flux with solder -Reply (2 messages)
ASSEM: Installing RF Shielding Cans (2 messages)
Assem: Procurement Manager and Component Engineer (2 messages)
Assy & Design SMT (3 messages)
ASSY: BENCH (HAND) CLEANING SURVEY (5 messages)
ASSY: BENCH (HAND) CLEANING SURVEY -Reply (1 message)
ASSY: Blowholes (1 message)
Assy: bridges (1 message)
Assy: bridges at wave soldereing (6 messages)
Assy: bridges at wave soldering (1 message)
Assy: Component Date Codes For solderability (4 messages)
ASSY: Component Name (2 messages)
ASSY: Component Name -Reply (1 message)
Assy: Component Solder vs Assy Solder (3 messages)
ASSY: Crest clean line AXAREL/Nickel incompatibility (2 messages)
Assy: Mass Lead Trimmers (2 messages)
assy: Micro BGA (1 message)
Assy: Overtime efficiency studies (4 messages)
Assy: Pad Design For Wave Solder (1 message)
Assy: Pad Design For Wave Solder -Reply (1 message)
Assy: Panasonic 8mm & 12 mm Feeder Problems (1 message)
Assy: Rework Gold finger/Tab.. (2 messages)
ASSY: screenprint doe/test board (3 messages)
Assy: Solder usage statistics f/Wave Solder (2 messages)
ASSY: Soldering to Nickel Plate (1 message)
Assy: SPC for PCB assembly (5 messages)
Assy: Various Questions on J-Std-001 (4 messages)
ASSY:Blowholes, nonconforming defect or nonconforming process ind icator? (3 messages)
ASSY:Solder mask staining (1 message)
Automated Inspection for PCA's (2 messages)
Automated Vision Equipment (2 messages)
Bellcore TR-NWT-000078 (1 message)
Best protection for gold plated edge connector (2 messages)
BGA DFM (3 messages)
BGA Solder Ball Merge (1 message)
BGA Solder Ball Migration (3 messages)
BGA's peds reconstruction (2 messages)
Buried Resistor (6 messages)
cc:Mail Link to SMTP Undeliverable Message (1 message)
CCA - Active? (2 messages)
Chemicals for electroplating (1 message)
Classroom Demo's (2 messages)
Cleaning Baked Flux (4 messages)
Cleaning Baked Flux -Reply (5 messages)
Compositech, CL200+ (1 message)
copper vias (1 message)
Creating a interconnect with hard gold (1 message)
Creating an interconnect of hard to access gol (2 messages)
Creating an interconnect of hard to access gold pads (2 messages)
CTE with CIC (2 messages)
CuCl2 etchant (2 messages)
CuMo (1 message)
Cut and clinch systems (2 messages)
DES, FAB: X-Outs (7 messages)
DES: Electrical Test Inf. (7 messages)
DES: Pads (2 messages)
Design: Half Oz Copper (4 messages)
DFM and DFT about BGAs (1 message)
Die Attach (2 messages)
Direct Plating Technologies (4 messages)
disregard this message (1 message)
Drumside Treated Foil (6 messages)
EIC Viscometer and Others (1 message)
EIC Viscometer and Others (fwd) (1 message)
EIFCO DRILLING MACHINE (1 message)
Electroless vs. electrolytic platings (1 message)
Electrostatic dissipative (3 messages)
entek (3 messages)
Etch cuts and drilling of finished raw boards (3 messages)
Etchant / Chemical Usage (1 message)
Exactra Autoroll (1 message)
EXCEPTIONS TO J-STD-001 (1 message)
Exposed Copper on Gold Fingers Reliability (1 message)
Exposed Copper on Gold Fingers Reliability: REPLY (1 message)
FAB (2 messages)
FAB - IPC response to report (2 messages)
FAB- Post plasma Cleaning (2 messages)
Fab/Assy: IST Test Method (1 message)
FAB/ASSY: Thermal Vias (6 messages)
Fab/Assy: Thermal Vias-more info (2 messages)
FAB/DES:Molded Plastic Conductive Circuits? (4 messages)
FAB: .006" PCB Fabricators Required. (2 messages)
FAB: Board Material (3 messages)
FAB: Clean Room environments (6 messages)
FAB: Coefficients of Thermal Expansion (1 message)
FAB: Copper-Invar-Copper (2 messages)
FAB: Flexible circuit suppliers wanted (9 messages)
FAB: IPC-6012 & Lifted Lands (3 messages)
FAB: IST (5 messages)
FAB: OSP COATINGS (5 messages)
FAB: Reliability tests through ageing (1 message)
FAB: Vacrel dryfilm laminator needed (3 messages)
FAB: VIA FILL IN A CAVITY (1 message)
FAB: Wire Bondable Au/Ni Etch Resist (1 message)
FAB:Copper/Tin Build-up on Plating Racks (2 messages)
Fabrication-RS274X (1 message)
Failure Analysis, RF power FETs (3 messages)
faraday cup (1 message)
Finish for wirebond (4 messages)
Flex PWB in SMT International 97 (1 message)
Flexible Circuit Technology Book (1 message)
Forums (1 message)
Fusible Links (3 messages)
Fusible Links -Reply (1 message)
FW: BGA Reclamation (1 message)
GDS 2 (2 messages)
GEN: CAM Operator seeks your opinion. (2 messages)
GEN: MATERIAL SOURCES (1 message)
GEN: Where to Buy Bellcore Specs... (1 message)
Getek (2 messages)
GLASS BODY DIODES (3 messages)
Gold / Silver Incompatibility for Adhesives (6 messages)
gold ball bonding (3 messages)
gold ball bonding -Reply (1 message)
Gold Connector Thickness (2 messages)
Gold Flash (1 message)
Gold/Tin Mystery (1 message)
HASL Equipment plus & minuses (2 messages)
Help (3 messages)
HELP HELP HELP (4 messages)
High PIN Density PCB Design (1 message)
Hole Filler (2 messages)
how to pin gauge holes? (4 messages)
how to remove silk screen (4 messages)
how to remove silk screen -Reply (1 message)
Idents before or after HASL-- Reply (1 message)
Immersion Golde over Nickel for edge connectors (1 message)
Information on Feed & Bleed systems (3 messages)
Information on LT90 Specifications (2 messages)
InnerLayers treatment (3 messages)
Intermetallic of Cu-Ni-Sn/Pb (1 message)
IPC "B" Coupon (1 message)
IPC Printed Circuits Expo '98 (1 message)
IPC-D-317A Crosstalk Equation Question (2 messages)
IPCchat session announcement (1 message)
IPCWorks '97 (1 message)
J/STD Changes (1 message)
Job listing (4 messages)
JOHN OSULLIVAN <[log in to unmask]>: [TECHNET] Solder mask material (1 message)
Just a Test, Please ignore. (1 message)
Law suit & breast implants! (3 messages)
Long Term Failures in Multilayer PCBs (5 messages)
Looking for Literature (1 message)
Metal finishing (2 messages)
micro bga (8 messages)
Micro-organisms in rinses (4 messages)
MIL Standard 202 and 208 (1 message)
MIL STD for Flex (2 messages)
MIL-STD-2118 (1 message)
Milliscopes / Boroscopes (1 message)
Misregistration/Annular Ring (7 messages)
Moisture in Liquid Nitrogen (2 messages)
Moisture Sensative Components (2 messages)
Moisture Sensitive Products (5 messages)
Molded Plastic Circuits (2 messages)
Nickel palladium (1 message)
No Subject (1 message)
No-clean (1 message)
No-clean and OSP (1 message)
No-clean flux query (7 messages)
No-clean rework qualification (5 messages)
No-clean VS Water soluable soldering (2 messages)
no-clean wire solder and flux pen question (1 message)
Np-clean flux (1 message)
Optimum via size for test point use (1 message)
Original C4 paper from IBM Journal (1969) (1 message)
OSP coating (1 message)
PCB baking (2 messages)
PCB baking & Thermal cycles (2 messages)
PCB Failures (3 messages)
PCB Industry in Japan (3 messages)
PCB Layout Services (1 message)
PCB related questions (3 messages)
Peel strength value Cu tracks (1 message)
Photoplotter Information... (1 message)
Photoresist Applications (1 message)
Pin gage reference (3 messages)
Please remove my name (1 message)
PMC Bezels (1 message)
Positive Etchback vs De-smear (1 message)
Printable, Peelable Solder Masks (3 messages)
Printable, Peelable Solder Masks (fwd) (1 message)
PTH Troubleshooting- Search for Authors (2 messages)
Pull test (2 messages)
PWB Questions (2 messages)
R Test Mesage (1 message)
RE : OSP (1 message)
Reduced oxide (2 messages)
reflow standards for leaded devices (1 message)
Reliability of reworked PCB's (1 message)
repair of circuit traces (2 messages)
Reply to press pin equipment query (1 message)
Request (1 message)
REVIEW Technet (1 message)
Rework Cooling Rate (6 messages)
Re[2]: [TECHNET] Adhesive Printing (1 message)
Re[2]: [TECHNET] Finish for wirebond (1 message)
Re[2]: [TECHNET] Gold / Silver Incompatibility for Adhesives (3 messages)
RMA FLUX CORROSION ON PLASTIC PARTS (2 messages)
Roku-Roku Sangyo, Ltd. (2 messages)
rs274x (1 message)
Sales Engineer position (1 message)
Sales Position/Tech Service (2 messages)
Saponifier - Armakleen (1 message)
SELV Specification (1 message)
Sequential Build Multilayer (1 message)
SHADOW PROCESS (5 messages)
Silver Cond. Ink (1 message)
SIR test coupo (1 message)
SIR test coupons (2 messages)
SMOBC (1 message)
SMT Plus Inc. (1 message)
SNEC mtg (1 message)
Solder joint design (2 messages)
SOLDER JOINT PULL STRENGTH (2 messages)
Solder mask m (1 message)
Solder mask material (10 messages)
Solder mask material -Reply (3 messages)
solderability after baking (1 message)
SSD technology (3 messages)
Strip tin-lead (1 message)
Subj: Alternative CCA Marking Labels (2 messages)
SUBSCRIBE (5 messages)
Subscription (1 message)
SUPPLIER INFO --FLEX PLUS (1 message)
Surface prep prior to solder mask (2 messages)
Survey Input (1 message)
Systronic Stencil Cleaner (1 message)
telephone number (2 messages)
telephone number -Reply (1 message)
telephone number SMT PLUS (3 messages)
Test Die and Substrate (1 message)
Test, Please ignore (1 message)
Test, please ignore, 970811-1 (1 message)
test, please ignore. (1 message)
Test,please ignore. (1 message)
Testing only (1 message)
Testing only -Reply (1 message)
Testing Services (2 messages)
Thermal Ties (1 message)
Thermal ties aka spokes (2 messages)
To Job Posters (2 messages)
Training materials (1 message)
TSOP susceptibility to temperature (1 message)
UL Testing (2 messages)
UNSUBSCRIBE (28 messages)
unsubscribe try # 2 (1 message)
Unsubscribe... (1 message)
unsubskrive (1 message)
Use of SMD shields for shielding pre reflow (ASSEM) (2 messages)
used smt equipment (2 messages)
Vendors for oxide treatment on copper laminates (1 message)
Via hole/Pad size (13 messages)
Via Inductance (4 messages)
Vibration and Shock Summary (1 message)
Virus warning (4 messages)
Virus Warning Hoaxes (1 message)
Water borne conformal coat (1 message)
Water soluble paste slump (1 message)
wave profile needed (2 messages)
Wave Solder Books/Article Recommendations (1 message)
Weld Repair of cores (2 messages)
Welding Stamps? (2 messages)
wet mask thickness gauge (5 messages)
Wire Harness Tool (1 message)
X-RAY DAMAGE TO COMPONENTS (3 messages)
X-RAY DAMAGE TO COMPONENTS -Reply (2 messages)
[2]SSD technology (1 message)
[FAB] IST WWW link (1 message)
[TECHNET UNSUBSCRIBE] (1 message)
[TECHNET] Adhesive Printing (1 message)
[TECHNET] FAB/ASSY: Thermal Vias (1 message)
[TECHNET] Finish for wirebond (1 message)
[TECHNET] Gold / Silver Incompatibility for Adhesives (1 message)
[TECHNET] PTH Troubleshooting- Search for Authors (1 message)
[TECHNET] Rework cooling rate (1 message)
[TECHNET] Solder mask material -Reply (1 message)
[TechNet] Unsubscribe (1 message)
[T] Annular Ring Limits (2 messages)
[T] Annular Ring/Non-Functional Lands/Misregistration (1 message)
[T] Assy & Design SMT (1 message)
[T] Design: Half Oz Copper (1 message)
[T] Long Term Failures in Multilayer PCBs (1 message)
[T] PCB Failures (1 message)
[T] Rework cooling rate (1 message)
[T] Solder joint design (1 message)

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Date

Size

New Thread

"Leslie O. Connally" <[log in to unmask]>: re: [TECHNET] Micro-organisms in rinses

Re: "Leslie O. Connally" <[log in to unmask]>: re: [TECHNET] Micro-organisms in rinses

Graham Naisbitt

Mon, 18 Aug 1997 22:17:39 UT

69 lines

Re: "Leslie O. Connally" <[log in to unmask]>: re: [TECHNET] Micro-organisms in rinses

Leslie O. Connally

Thu, 14 Aug 1997 09:58:38 -0700

67 lines

Re: "Leslie O. Connally" <[log in to unmask]>: re: [TECHNET] Micro-organisms in rinses

Andy RJ McKean

Thu, 14 Aug 1997 09:47:03 GMT

42 lines

New Thread

(Fab) IPC "B" Coupon

Re: (Fab) IPC "B" Coupon

Orna and Yehuda

Fri, 8 Aug 1997 01:18:09 +0300

163 lines

Re: (Fab) IPC "B" Coupon

Lisa Williams

Wed, 6 Aug 1997 12:52:43 -0500

46 lines

(Fab) IPC "B" Coupon

David Tyler

Wed, 6 Aug 1997 12:51:08 -0400

31 lines

New Thread

(TechNet): Assy: Dewetting

(TechNet): Assy: Dewetting

Poh Kong Hui

Sat, 30 Aug 1997 00:23:26 +0800

21 lines

New Thread

(TECHNET)Temp peak

(TECHNET)Temp peak

<>

Wed, 27 Aug 1997 08:00:30 +0200

30 lines

New Thread

0.35 mm Drill Bits

0.35 mm Drill Bits

H.N.Muralidhara

Fri, 8 Aug 1997 13:29:53 +0530 (IST)

40 lines

0.35 mm Drill Bits

H.N.Muralidhara

Sat, 9 Aug 1997 10:20:37 +0530

10 lines

New Thread

0603's on vias

Re: 0603's on vias

Richard Krug

Mon, 25 Aug 1997 08:28:08 EST

20 lines

0603's on vias

Frank Hinojos

Thu, 21 Aug 1997 09:39:37 -0700

18 lines

New Thread

<No subject>

<No subject>

<>

8/20/97 2:54 PM

23 lines

<No subject>

Ron Lohrbach

Sat, 16 Aug 1997 14:35:34 -0800

21 lines

<No subject>

<>

14/08/97 17:58

33 lines

<No subject>

JoAnn Amerson

Fri, 15 Aug 1997 11:37:08 +0000

59 lines

<No subject>

Leslie O. Connally

Fri, 15 Aug 1997 08:11:37 -0700

21 lines

<No subject>

<>

Thu, 14 Aug 1997 18:09:20 PST

13 lines

<No subject>

Andy RJ McKean

Wed, 13 Aug 1997 16:47:03 GMT

9 lines

<No subject>

Guy Atkins

Wed, 13 Aug 1997 10:38:17 -0400

18 lines

<No subject>

cctc

Mon, 4 Aug 1997 13:44:59 +0800

21 lines

New Thread

?

Re: ?

Dmitriy Sklyar

Wed, 13 Aug 1997 10:39:26 -0500

37 lines

New Thread

A bit off topic

A bit off topic

JoAnn Amerson

Fri, 15 Aug 1997 11:52:00 +0000

49 lines

New Thread

Accurate Gold Efficiency Test

Accurate Gold Efficiency Test

Makmur, Rummy

Mon, 4 Aug 1997 09:44:40 -0700

20 lines

New Thread

Adhesive Printing

Re: Adhesive Printing

<>

Tue, 26 Aug 1997 09:26:45 -0400

21 lines

Adhesive Printing

Erik Olson

Mon, 25 Aug 1997 19:02:59 -0500

23 lines

New Thread

ADMIN: ChipNet Moved to the new mailsystem.

ADMIN: ChipNet Moved to the new mailsystem.

Dmitriy Sklyar

Fri, 1 Aug 1997 13:55:13 -0500

365 lines

New Thread

ADMIN: ComplianceNet Moved to the new mail system.

ADMIN: ComplianceNet Moved to the new mail system.

Dmitriy Sklyar

Fri, 1 Aug 1997 13:55:03 -0500

365 lines

New Thread

ADMIN: IPCsm840 Moved to the new mailsystem.

ADMIN: IPCsm840 Moved to the new mailsystem.

Dmitriy Sklyar

Fri, 1 Aug 1997 13:55:08 -0500

365 lines

New Thread

ADMIN: Roadmap Moved to the new mailsystem.

ADMIN: Roadmap Moved to the new mailsystem.

Dmitriy Sklyar

Fri, 1 Aug 1997 13:55:17 -0500

365 lines

New Thread

ADMIN: TechNet Moved to the new mailsystem.

Re: ADMIN: TechNet Moved to the new mailsystem.

Dmitriy Sklyar

Mon, 4 Aug 1997 11:59:53 -0500

77 lines

Re: ADMIN: TechNet Moved to the new mailsystem.

Ulrich Korndoerfer

Sat, 2 Aug 1997 16:04:07 +0200

39 lines

ADMIN: TechNet Moved to the new mailsystem.

Dmitriy Sklyar

Fri, 1 Aug 1997 11:08:40 -0500

116 lines

New Thread

ADMIN: Test Message - please disregard.

Re: ADMIN: Test Message - please disregard.

Cristian Bomboe

Tue, 12 Aug 1997 18:54:16 +-300

74 lines

ADMIN: Test Message - please disregard.

Dmitriy Sklyar

Tue, 12 Aug 1997 09:33:22 -0500

23 lines

New Thread

ADMIN: Where are the archives?

ADMIN: Where are the archives?

Orna and Yehuda

Wed, 6 Aug 1997 00:49:50 +0300

20 lines

New Thread

ADVICE

ADVICE

cctc

Tue, 5 Aug 1997 08:56:26 +0800

21 lines

New Thread

Aluminium substrates

Re: Aluminium substrates

markl

Fri, 29 Aug 1997 08:17:51 -0700

42 lines

Re: Aluminium substrates

drilbert

Thu, 28 Aug 1997 18:22:04 -0700

36 lines

Re: Aluminium substrates

markl

Thu, 28 Aug 1997 16:31:58 -0700

28 lines

Aluminium substrates

Paul Gould

Fri, 22 Aug 1997 21:30:39 +0100

19 lines

New Thread

Annular Ring Limits

Re: Annular Ring Limits

drilbert

Wed, 27 Aug 1997 19:28:41 -0700

56 lines

Re: Annular Ring Limits

Leslie O. Connally

Wed, 27 Aug 1997 10:04:20 -0700

49 lines

Re: Annular Ring Limits

David Arivett

Mon, 25 Aug 1997 08:43:53 -0500

41 lines

Re: Annular Ring Limits

<>

Sun, 24 Aug 1997 21:40:04 -0700

30 lines

Re: Annular ring limits

Don Walker

Fri, 22 Aug 1997 16:59:55 -0500

49 lines

Re: Annular Ring Limits

<>

Fri, 22 Aug 1997 17:48:59 -0400

25 lines

Re: Annular Ring Limits

David Arivett

Fri, 22 Aug 1997 15:52:21 -0500

34 lines

Annular Ring Limits

Chris Gardini-ECG005

Fri, 22 Aug 1997 13:24:49 -0500

20 lines

New Thread

Annular ring relief and wave solder

Annular ring relief and wave solder

Frank Hinojos

Fri, 29 Aug 1997 18:22:17 -0700

18 lines

New Thread

Aqueous In-line Cleaner

Re: Aqueous In-line Cleaner

Graham Naisbitt

Sun, 3 Aug 1997 23:24:43 UT

47 lines

Re: Aqueous In-line Cleaner

<>

Sun, 3 Aug 1997 09:37:04 -0400

26 lines

Re: Aqueous In-line Cleaner

Graham Naisbitt

Sat, 2 Aug 1997 23:29:32 UT

91 lines

Aqueous In-line Cleaner

Alan Kreplick

Fri, 1 Aug 1997 13:02:02 -0400

35 lines

New Thread

Artwork

Artwork

OBRIEN GERARD

Mon, 25 Aug 1997 09:16:50 -0400

18 lines

New Thread

Asm Shock/Vib. Specs.

Re: Asm Shock/Vib. Specs.

Brian Hyde

Wed, 13 Aug 1997 11:40:49 EDT

50 lines

Re: Asm Shock/Vib. Specs.

Sheila Smith

Wed, 13 Aug 1997 10:06:08 -0400

80 lines

Re: Asm Shock/Vib. Specs.

GeoFranck

Wed, 13 Aug 1997 09:26:56 -0400

67 lines

Re: Asm Shock/Vib. Specs.

<>

Tue, 12 Aug 1997 10:58:11 -0400

25 lines

New Thread

Asm: Shock and Vibration Specs

Asm: Shock and Vibration Specs

GeoFranck

Mon, 11 Aug 1997 12:56:20 -0400

23 lines

New Thread

ASS/FAB Plating racks for Flexible circuit

Re: ASS/FAB Plating racks for Flexible circuit

<>

Thu, 21 Aug 1997 16:39:22 -0400

16 lines

ASS/FAB Plating racks for Flexible circuit

Dejan

Mon, 11 Aug 1997 13:39:38 -0700

18 lines

New Thread

ASSEM: flux alone or flux with solder

ASSEM: flux alone or flux with solder

Jim Herard

Wed, 13 Aug 1997 08:36:26 -0400

66 lines

ASSEM: flux alone or flux with solder

Raymond Klein

Tue, 12 Aug 1997 12:11:37 -0700

27 lines

New Thread

ASSEM: flux alone or flux with solder -Reply

Re: ASSEM: flux alone or flux with solder -Reply

Greg Parke

Wed, 13 Aug 1997 07:52:50 -0400

16 lines

ASSEM: flux alone or flux with solder -Reply

MIKE J. LOPEZ

Wed, 13 Aug 1997 07:29:34 -0400

17 lines

New Thread

ASSEM: Installing RF Shielding Cans

Re: ASSEM: Installing RF Shielding Cans

John Wick 595-6667

Thu, 28 Aug 1997 14:50:00 -0400

20 lines

ASSEM: Installing RF Shielding Cans

Barry Allen

Wed, 27 Aug 1997 14:29:42 -0400

26 lines

New Thread

Assem: Procurement Manager and Component Engineer

Re: Assem: Procurement Manager and Component Engineer

Pratap Singh

Sat, 16 Aug 1997 11:14:23 -0700

16 lines

Assem: Procurement Manager and Component Engineer

Nancy Nelson

Fri, 8 Aug 1997 14:18:00 CDT

44 lines

New Thread

Assy & Design SMT

Re: Assy & Design SMT

<>

Thu, 21 Aug 1997 09:49:26 -0500

163 lines

Re: Assy & Design SMT

Robinson, Mike (AZ75)

Wed, 20 Aug 1997 15:59:53 -0500

34 lines

Assy & Design SMT

Tully, Marti (AZ15)

Wed, 20 Aug 1997 14:06:07 -0500

42 lines

New Thread

ASSY: BENCH (HAND) CLEANING SURVEY

Re: ASSY: BENCH (HAND) CLEANING SURVEY

Lepsche, Thomas G (NM75)

Fri, 22 Aug 1997 10:29:06 -0600

55 lines

Re: ASSY: BENCH (HAND) CLEANING SURVEY

Howard Feldmesser

Thu, 21 Aug 1997 16:48:37 -0400

54 lines

Re: ASSY: BENCH (HAND) CLEANING SURVEY

Sheila Smith

Thu, 21 Aug 1997 15:47:23 -0400

51 lines

Re: ASSY: BENCH (HAND) CLEANING SURVEY

Kenny Bloomquist

Thu, 21 Aug 1997 12:34:23 -0700

56 lines

ASSY: BENCH (HAND) CLEANING SURVEY

Jim Marsico 516-595-5879

Thu, 21 Aug 1997 14:50:00 -0400

45 lines

New Thread

ASSY: BENCH (HAND) CLEANING SURVEY -Reply

ASSY: BENCH (HAND) CLEANING SURVEY -Reply

DEAN MAY

Thu, 21 Aug 1997 16:15:07 -0500

55 lines

New Thread

ASSY: Blowholes

ASSY: Blowholes

<>

Mon, 18 Aug 1997 20:20:59 -0500

91 lines

New Thread

Assy: bridges

Assy: bridges

Blanchet,Richard

Sat, 16 Aug 1997 08:31:00 -0400

18 lines

New Thread

Assy: bridges at wave soldereing

Re: Assy: bridges at wave soldereing

Denis Meloche

Mon, 18 Aug 1997 10:22:53 -0400

38 lines

Re: Assy: bridges at wave soldereing

Lainie Loveless

Mon, 18 Aug 1997 07:18:59 -0500

25 lines

Re: Assy: bridges at wave soldereing

Vincent P. Quigley

Fri, 15 Aug 1997 16:20:50 EDT

11 lines

Re: Assy: bridges at wave soldereing

Paul Gould

Fri, 15 Aug 1997 19:44:40 +0100

44 lines

Re: Assy: bridges at wave soldereing

Aric J Parr

Fri, 15 Aug 1997 11:32:53 -0500

35 lines

Assy: bridges at wave soldereing

Blanchet,Richard

Fri, 15 Aug 1997 11:13:00 -0400

24 lines

New Thread

Assy: bridges at wave soldering

Re: Assy: bridges at wave soldering

<>

Fri, 15 Aug 1997 17:04:33 -0600

51 lines

New Thread

Assy: Component Date Codes For solderability

Re: Assy: Component Date Codes For solderability

Denis Meloche

Wed, 20 Aug 1997 10:58:10 -0400

64 lines

Assy: Component Date Codes For solderability

<>

Wed, 20 Aug 1997 16:14:46 +0200

68 lines

Assy: Component Date Codes For solderability

Sherman Banks

Wed, 20 Aug 1997 06:41:03 PDT

44 lines

Assy: Component Date Codes For solderability

Sherman Banks

Wed, 13 Aug 1997 07:13:11 PDT

42 lines

New Thread

ASSY: Component Name

Re: ASSY: Component Name

Connie Korth

Tue, 19 Aug 1997 10:02:22 CDT

24 lines

ASSY: Component Name

Christy Graham

Wed, 13 Aug 1997 15:52:53 -0800

17 lines

New Thread

ASSY: Component Name -Reply

ASSY: Component Name -Reply

Marshall Canaday

Thu, 14 Aug 1997 08:02:34 -0400

11 lines

New Thread

Assy: Component Solder vs Assy Solder

Re: Assy: Component Solder vs Assy Solder

<>

Thu, 28 Aug 1997 13:27:51 -0500

63 lines

Re: Assy: Component Solder vs Assy Solder

Denis Meloche

Thu, 28 Aug 1997 14:01:50 -0400

49 lines

Assy: Component Solder vs Assy Solder

<>

Thu, 28 Aug 1997 10:48:10 PDT

27 lines

New Thread

ASSY: Crest clean line AXAREL/Nickel incompatibility

Re: ASSY: Crest clean line AXAREL/Nickel incompatibility

<>

Fri, 8 Aug 1997 10:33:48 -0400

21 lines

ASSY: Crest clean line AXAREL/Nickel incompatibility

Devitt, Ken

Fri, 8 Aug 1997 08:27:57 -0400

35 lines

New Thread

Assy: Mass Lead Trimmers

Re: Assy: Mass Lead Trimmers

Tucker, Steve (KS)

Tue, 5 Aug 1997 06:25:04 -0700

108 lines

Assy: Mass Lead Trimmers

Kenny Bloomquist

Mon, 4 Aug 1997 15:34:00 -0700

23 lines

New Thread

assy: Micro BGA

assy: Micro BGA

Greg Parke

Mon, 11 Aug 1997 09:52:05 -0400

26 lines

New Thread

Assy: Overtime efficiency studies

Re: Assy: Overtime efficiency studies

<>

Fri, 22 Aug 1997 07:29:30 -0400

31 lines

Re: Assy: Overtime efficiency studies

Ed Cosper

Thu, 21 Aug 1997 12:44:10 -0500

85 lines

Re: Assy: Overtime efficiency studies

Denis Meloche

Thu, 21 Aug 1997 12:45:11 -0400

51 lines

Assy: Overtime efficiency studies

<>

Thu, 21 Aug 1997 11:18:28 -0500

25 lines

New Thread

Assy: Pad Design For Wave Solder

Assy: Pad Design For Wave Solder

Ron Hollandsworth

Tue, 5 Aug 1997 10:27:38 -0500

28 lines

New Thread

Assy: Pad Design For Wave Solder -Reply

Assy: Pad Design For Wave Solder -Reply

Larry Campbell

Tue, 5 Aug 1997 13:52:11 -0400

43 lines

New Thread

Assy: Panasonic 8mm & 12 mm Feeder Problems

Assy: Panasonic 8mm & 12 mm Feeder Problems

Mark W. Spitnale

Thu, 28 Aug 1997 08:56:13 -0500

31 lines

New Thread

Assy: Rework Gold finger/Tab..

Re: Assy: Rework Gold finger/Tab..

<>

Wed, 27 Aug 1997 11:50:54 -0500

46 lines

Re: Assy: Rework Gold finger/Tab..

Poh Kong Hui

Wed, 27 Aug 1997 23:46:57 +0800

19 lines

New Thread

ASSY: screenprint doe/test board

Re: ASSY: screenprint doe/test board

Jim Marsico 516-595-5879

Wed, 6 Aug 1997 11:21:00 -0400

31 lines

Re: ASSY: screenprint doe/test board

Denis Meloche

Wed, 6 Aug 1997 09:54:52 -0400

53 lines

ASSY: screenprint doe/test board

Greg Parke

Tue, 5 Aug 1997 17:55:17 -0400

27 lines

New Thread

Assy: Solder usage statistics f/Wave Solder

Re: Assy: Solder usage statistics f/Wave Solder

Denis Meloche

Wed, 27 Aug 1997 10:43:24 -0400

31 lines

Assy: Solder usage statistics f/Wave Solder

<>

Tue, 26 Aug 1997 10:42:46 -0500

18 lines

New Thread

ASSY: Soldering to Nickel Plate

ASSY: Soldering to Nickel Plate

Paul Gould

Fri, 15 Aug 1997 19:45:43 +0100

19 lines

New Thread

Assy: SPC for PCB assembly

Re: Assy: SPC for PCB assembly

Martin Farrell

Wed, 13 Aug 1997 08:27:03 +0000

25 lines

Re: Assy: SPC for PCB assembly

Joel Yocom

Tue, 12 Aug 1997 19:05:25 +0000

18 lines

Re: Assy: SPC for PCB assembly

Tully, Marti (AZ15)

Tue, 12 Aug 1997 17:35:54 -0500

22 lines

Re: Assy: SPC for PCB assembly

Vickie Chapman

Tue, 12 Aug 1997 15:07:46 -0700

41 lines

Assy: SPC for PCB assembly

Blanchet,Richard

Tue, 12 Aug 1997 17:00:00 -0400

19 lines

New Thread

Assy: Various Questions on J-Std-001

Re: Assy: Various Questions on J-Std-001

<>

Thu, 7 Aug 1997 10:49:54 EDT

80 lines

Re: Assy: Various Questions on J-Std-001

Jack Crawford

Thu, 7 Aug 1997 09:52:05 -0500

84 lines

Re: Assy: Various Questions on J-Std-001

<>

Thu, 7 Aug 1997 10:26:33 -0400

13 lines

Assy: Various Questions on J-Std-001

Kasprzak, Bill (esd) US

Thu, 7 Aug 1997 09:04:00 PDT

37 lines

New Thread

ASSY:Blowholes, nonconforming defect or nonconforming process ind icator?

Re: ASSY:Blowholes, nonconforming defect or nonconforming process ind icator?

Steve Mikell

Sat, 16 Aug 1997 22:02:52 -0500

50 lines

Re: ASSY:Blowholes, nonconforming defect or nonconforming process ind icator?

Dwight Mattix

Fri, 15 Aug 1997 08:24:42 -0700

50 lines

ASSY:Blowholes, nonconforming defect or nonconforming process ind icator?

Ryaby, John

Thu, 14 Aug 1997 19:04:37 -0400

28 lines

New Thread

ASSY:Solder mask staining

ASSY:Solder mask staining

<>

Tue, 5 Aug 1997 14:41:21 EDT

26 lines

New Thread

Automated Inspection for PCA's

Re: Automated Inspection for PCA's

Rick Kompelien

Wed, 6 Aug 1997 12:27:09 -0500

29 lines

Automated Inspection for PCA's

Vickie Chapman

Wed, 6 Aug 1997 08:48:10 -0700

23 lines

New Thread

Automated Vision Equipment

Re: Automated Vision Equipment

drilbert

Tue, 12 Aug 1997 16:39:14 -0700

32 lines

Automated Vision Equipment

<>

Tue, 12 Aug 1997 17:38:08 EDT

20 lines

New Thread

Bellcore TR-NWT-000078

Re: Bellcore TR-NWT-000078

Don Walker

Mon, 4 Aug 1997 08:38:17 -0500

52 lines

New Thread

Best protection for gold plated edge connector

Re: Best protection for gold plated edge connector

Paul Gould

Sat, 16 Aug 1997 07:55:02 +0100

35 lines

Best protection for gold plated edge connector

Cristian Bomboe

Wed, 13 Aug 1997 14:27:40 +-300

17 lines

New Thread

BGA DFM

Re: BGA DFM

<>

Sat, 16 Aug 1997 14:54:15 -0400

34 lines

Re: BGA DFM

David Hoover

Sat, 16 Aug 1997 06:27:15 -0700

39 lines

BGA DFM

<>

Fri, 15 Aug 1997 15:52:30 MDT

24 lines

New Thread

BGA Solder Ball Merge

Re: BGA Solder Ball Merge

Dr. Nimal Liyanage

Fri, 29 Aug 1997 15:50:31 -0400

12 lines

New Thread

BGA Solder Ball Migration

Re: BGA Solder Ball Migration

Yuen, Mike

Fri, 29 Aug 1997 16:13:00 CDT

17 lines

Re: BGA Solder Ball Migration

Viswanath Valluri

Fri, 29 Aug 1997 10:59:11 -0700

26 lines

BGA Solder Ball Migration

Dennis Fall

Fri, 29 Aug 1997 12:39:04 -0500

17 lines

New Thread

BGA's peds reconstruction

Re: BGA's peds reconstruction

<>

Mon, 4 Aug 1997 08:52:27 EDT

35 lines

BGA's peds reconstruction

Tamir Ben-Shoshan

Sun, 3 Aug 1997 09:11:39 +0200

18 lines

New Thread

Buried Resistor

Re: Buried Resistor

<>

Fri, 8 Aug 1997 13:36:58 -0400

11 lines

Re: Buried Resistor

<>

Fri, 8 Aug 1997 11:29:14 -0500

21 lines

Re: Buried Resistor

John Nelson

Fri, 8 Aug 1997 11:29:46 -0400

21 lines

Re: Buried Resistor

Mike Wilson

Fri, 8 Aug 1997 11:04:03 -0700

26 lines

Re: Buried Resistor

Aric J Parr

Fri, 8 Aug 1997 10:07:17 -0500

23 lines

Buried Resistor

<>

Fri, 8 Aug 1997 10:29:57 +0400

12 lines

New Thread

cc:Mail Link to SMTP Undeliverable Message

cc:Mail Link to SMTP Undeliverable Message

<>

Tue, 5 Aug 1997 08:39:58 -0500

21 lines

New Thread

CCA - Active?

Re: CCA - Active?

Dennis Maggi

Tue, 5 Aug 1997 16:32:10 -0400

26 lines

CCA - Active?

Dan Brandler

Tue, 5 Aug 1997 11:20:16 -0700

17 lines

New Thread

Chemicals for electroplating

Chemicals for electroplating

Cristian Bomboe

Tue, 26 Aug 1997 11:54:08 +-300

15 lines

New Thread

Classroom Demo's

Re: Classroom Demo's

JoAnn Amerson

Thu, 28 Aug 1997 11:25:56 +0000

27 lines

Classroom Demo's

Nachbor, Suzanne (MN51)

Thu, 28 Aug 1997 10:06:00 PDT

32 lines

New Thread

Cleaning Baked Flux

Re: Cleaning Baked Flux

<>

Tue, 12 Aug 1997 20:56:55 -0400

28 lines

Re: Cleaning Baked Flux

Graham Naisbitt

Tue, 12 Aug 1997 23:37:34 UT

52 lines

Re: Cleaning Baked Flux

Tezak Tim

Tue, 12 Aug 1997 14:56:00 -0400

38 lines

Cleaning Baked Flux

Lainie Loveless

Tue, 12 Aug 1997 10:40:08 -0500

23 lines

New Thread

Cleaning Baked Flux -Reply

Re: Cleaning Baked Flux -Reply

Darrell Bonzo

Tue, 26 Aug 1997 07:53:07 -0700

100 lines

Re: Cleaning Baked Flux -Reply

Karen Tellefsen

Mon, 25 Aug 1997 20:41:54 -0700

81 lines

Re: Cleaning Baked Flux -Reply

Rick Taormino

Mon, 25 Aug 1997 17:42:06 -0700

75 lines

Re: Cleaning Baked Flux -Reply

<>

Mon, 25 Aug 1997 14:45:54 -0500

70 lines

Re: Cleaning Baked Flux -Reply

Eric Bromley

Mon, 25 Aug 1997 11:31:02 -0400

51 lines

New Thread

Compositech, CL200+

Compositech, CL200+

Mirka Halas

Thu, 28 Aug 1997 09:27:46 -0400

27 lines

New Thread

copper vias

copper vias

Eric Henning

Wed, 13 Aug 1997 10:09:19 -0400

18 lines

New Thread

Creating a interconnect with hard gold

Re: Creating a interconnect with hard gold

Nachbor, Suzanne (MN51)

Mon, 11 Aug 1997 11:05:00 PDT

9 lines

New Thread

Creating an interconnect of hard to access gol

Re: Creating an interconnect of hard to access gol

MCHAN

Fri, 8 Aug 1997 11:04:35 -0400

17 lines

Re: Creating an interconnect of hard to access gol

Aric J Parr

Fri, 8 Aug 1997 10:09:58 -0500

31 lines

New Thread

Creating an interconnect of hard to access gold pads

Re: Creating an interconnect of hard to access gold pads

Denis Meloche

Fri, 8 Aug 1997 11:06:32 -0400

43 lines

Creating an interconnect of hard to access gold pads

<>

Fri, 8 Aug 1997 10:22:57 -0400

23 lines

New Thread

CTE with CIC

Re: CTE with CIC

Edwards, Ted A (AZ75)

Thu, 14 Aug 1997 14:08:51 -0500

18 lines

CTE with CIC

<>

Thu, 14 Aug 1997 11:16:18 -0400

16 lines

New Thread

CuCl2 etchant

Re: CuCl2 etchant

<>

Thu, 21 Aug 1997 10:48:23 -0400

16 lines

CuCl2 etchant

Suixin Zhang

Thu, 21 Aug 1997 14:54:54 +0100

30 lines

New Thread

CuMo

CuMo

<>

Tue, 5 Aug 1997 16:07:12 +0200

18 lines

New Thread

Cut and clinch systems

Re: Cut and clinch systems

DeCantillon, Marc

Wed, 20 Aug 1997 14:30:09 -0500

41 lines

Cut and clinch systems

Challoner, Scott

Mon, 18 Aug 1997 10:16:00 CDT

18 lines

New Thread

DES, FAB: X-Outs

Re: DES, FAB: X-Outs

<>

Thu, 28 Aug 1997 23:29:53 -0400

19 lines

DES, FAB: X-Outs

Jim Herard

Tue, 26 Aug 1997 18:28:08 -0400

77 lines

Re: DES, FAB: X-Outs

Paul Gould

Mon, 25 Aug 1997 20:47:16 +0100

30 lines

Re: DES, FAB: X-Outs

<>

Mon, 25 Aug 1997 06:28:19 -0400

22 lines

Re: DES, FAB: X-Outs

Frank Hinojos

Sun, 24 Aug 1997 10:51:27 -0700

29 lines

Re: DES, FAB: X-Outs

Joel Mearig

Thu, 21 Aug 1997 11:16:11 -0700

69 lines

DES, FAB: X-Outs

Steve Collins

Thu, 21 Aug 1997 11:22:19 -0600

48 lines

New Thread

DES: Electrical Test Inf.

Re: DES: Electrical Test Inf.

<>

Fri, 15 Aug 1997 07:34:54 -0400

15 lines

Re: DES: Electrical Test Inf.

<>

Thu, 14 Aug 1997 14:19:12 -0400

32 lines

Re: DES: Electrical Test Inf.

<>

Thu, 14 Aug 1997 13:50:30 -0400

9 lines

Re: DES: Electrical Test Inf.

Nancy Nelson

Thu, 14 Aug 1997 12:18:00 CDT

45 lines

Re: DES: Electrical Test Inf.

Delsen Testing Laboratories

Thu, 14 Aug 1997 09:03:52 -0700

28 lines

Re: DES: Electrical Test Inf.

Lisa Williams

Thu, 14 Aug 1997 10:41:23 -0500

40 lines

DES: Electrical Test Inf.

Steve Collins

Thu, 14 Aug 1997 09:22:23 -0600

30 lines

New Thread

DES: Pads

Re: DES: Pads

Frank Hinojos

Mon, 28 Jul 1997 16:57:55 -0700

32 lines

Re[2]: DES: Pads

<>

Mon, 4 Aug 1997 09:34:41 -0400

27 lines

New Thread

Design: Half Oz Copper

Re: Design: Half Oz Copper

D. Rooke

Mon, 18 Aug 1997 18:57:50 -0400

49 lines

Re: Design: Half Oz Copper

<>

Sun, 17 Aug 1997 17:43:47 -0400

36 lines

Re: Design: Half Oz Copper

Andrew J. Scholand

Fri, 15 Aug 1997 02:00:53 -0400

58 lines

Design: Half Oz Copper

GeoFranck

Thu, 14 Aug 1997 17:09:48 -0400

20 lines

New Thread

DFM and DFT about BGAs

Re: DFM and DFT about BGAs

Khalid Kidari

Thu, 14 Aug 1997 17:33:44 -0400

16 lines

New Thread

Die Attach

Re: Die Attach

Roback, Tim

Fri, 22 Aug 1997 13:09:00 -0600

22 lines

Die Attach

Denis Meloche

Fri, 22 Aug 1997 11:21:02 -0400

21 lines

New Thread

Direct Plating Technologies

Re: Direct Plating Technologies

Don Vischulis

Fri, 15 Aug 1997 20:19:52 -0500

30 lines

Re: Direct Plating Technologies

Eugene Watkins

Thu, 14 Aug 1997 09:27:53 -0700

35 lines

Re: Direct Plating Technologies

Eugene Watkins

Thu, 14 Aug 1997 07:54:52 -0700

35 lines

Direct Plating Technologies

Cristian Bomboe

Thu, 14 Aug 1997 11:07:35 +-300

18 lines

New Thread

disregard this message

disregard this message

<>

Fri, 1 Aug 1997 15:13:08 PST

9 lines

New Thread

Drumside Treated Foil

Re: Drumside Treated Foil

Wolfgang Erat

Tue, 12 Aug 1997 11:38:22 -0400

47 lines

Re: Drumside Treated Foil

yisrael leshman

Tue, 12 Aug 1997 15:08:13 +0300

33 lines

Re: Drumside Treated Foil

<>

Mon, 11 Aug 1997 12:21:46 -0400

11 lines

Re: Drumside Treated Foil

Steves

Mon, 11 Aug 1997 11:24:25 +0000

14 lines

Re: Drumside Treated Foil

Aric J Parr

Mon, 11 Aug 1997 10:34:04 -0500

19 lines

Drumside Treated Foil

Paula Ryan

Mon, 11 Aug 1997 11:00:46 EDT

18 lines

New Thread

EIC Viscometer and Others

EIC Viscometer and Others

CSS Asia Co., Ltd.

Fri, 29 Aug 1997 17:14:30 +0900

31 lines

New Thread

EIC Viscometer and Others (fwd)

Re: EIC Viscometer and Others (fwd)

Michael Barmuta

Fri, 29 Aug 1997 08:19:24 -0700

11 lines

New Thread

EIFCO DRILLING MACHINE

EIFCO DRILLING MACHINE

H.N.Muralidhara

Fri, 8 Aug 1997 13:29:53 +0530

44 lines

New Thread

Electroless vs. electrolytic platings

Electroless vs. electrolytic platings

<>

Tue, 12 Aug 1997 03:32:37 -0400

31 lines

New Thread

Electrostatic dissipative

Re: Electrostatic dissipative

Bob West

Tue, 5 Aug 1997 10:06:28 -0700

103 lines

Re: Electrostatic dissipative

Bob West

Tue, 5 Aug 1997 10:05:20 -0700

143 lines

Re: Electrostatic dissipative

Phil Bavaro

Sat, 2 Aug 1997 11:22:37 -0700

95 lines

New Thread

entek

Re: entek

Michael Forrester

Tue, 5 Aug 1997 13:36:40 -0400

23 lines

Re: entek

Kenny, James

Tue, 5 Aug 1997 09:51:32 -0700

28 lines

entek

Gloria Ebert

Tue, 5 Aug 1997 10:43:00 -0700

15 lines

New Thread

Etch cuts and drilling of finished raw boards

Re: Etch cuts and drilling of finished raw boards

Tucker, Steve (KS)

Thu, 7 Aug 1997 11:29:10 -0700

55 lines

Re: Etch cuts and drilling of finished raw boards

Furrow, Robert Gordon (Robert)

Thu, 7 Aug 1997 13:05:08 -0400

61 lines

Etch cuts and drilling of finished raw boards

Thomas Phelps

Thu, 7 Aug 1997 12:11:14 -0400

42 lines

New Thread

Etchant / Chemical Usage

Etchant / Chemical Usage

Keith Birchfield

Wed, 13 Aug 1997 15:39:35 +0000

34 lines

New Thread

Exactra Autoroll

Exactra Autoroll

SCOTT BALLER

Wed, 6 Aug 1997 10:15:24 PST

15 lines

New Thread

EXCEPTIONS TO J-STD-001

EXCEPTIONS TO J-STD-001

David Girard

Thu, 7 Aug 1997 13:50:56 -0400

27 lines

New Thread

Exposed Copper on Gold Fingers Reliability

Exposed Copper on Gold Fingers Reliability

Anne Marie Trujillo

Wed, 6 Aug 1997 10:51:00 PDT

15 lines

New Thread

Exposed Copper on Gold Fingers Reliability: REPLY

Exposed Copper on Gold Fingers Reliability: REPLY

Jim Herard

Wed, 6 Aug 1997 19:12:54 -0400

71 lines

New Thread

FAB

Re: FAB

Larry J. Fisher

Fri, 29 Aug 1997 21:11:20 -0400

48 lines

FAB

<>

Tue, 26 Aug 1997 15:03:51 -0400

20 lines

New Thread

FAB - IPC response to report

Re: FAB - IPC response to report

David Bergman

Thu, 28 Aug 1997 14:47:54 -0500

76 lines

Re: FAB - IPC response to report

Ed Cosper

Fri, 22 Aug 1997 16:28:56 -0500

57 lines

New Thread

FAB- Post plasma Cleaning

Re: FAB- Post plasma Cleaning

Thomas, Kevin

Tue, 19 Aug 1997 16:04:00 -0700

48 lines

FAB- Post plasma Cleaning

Bill Chou

Tue, 19 Aug 1997 13:17:15 -0800

27 lines

New Thread

Fab/Assy: IST Test Method

Fab/Assy: IST Test Method

Reed, Randy

Fri, 8 Aug 1997 14:37:04 -0700

49 lines

New Thread

FAB/ASSY: Thermal Vias

Re: FAB/ASSY: Thermal Vias

John Laur

Mon, 11 Aug 1997 08:23:18 -0500

25 lines

Re: FAB/ASSY: Thermal Vias

CSS Asia Co., Ltd.

Fri, 8 Aug 1997 17:37:50 +0900

46 lines

Re: Fab/Assy: Thermal Vias

David Tyler

Thu, 7 Aug 1997 07:07:12 -0400

57 lines

Re: Fab/Assy: Thermal Vias

Afri Singh

Wed, 6 Aug 1997 16:01:38 -0400

44 lines

Re: FAB/ASSY: Thermal Vias

John Laur

Fri, 1 Aug 1997 12:04:41 -0500

19 lines

Re: FAB/ASSY: Thermal Vias

Dejan

Fri, 1 Aug 1997 09:41:32 -0700

23 lines

New Thread

Fab/Assy: Thermal Vias-more info

Re: Fab/Assy: Thermal Vias-more info

LES CONNALLY

Fri, 1 Aug 1997 13:09:18 -0700

54 lines

Fab/Assy: Thermal Vias-more info

<>

Fri, 1 Aug 1997 10:45:23 PDT

27 lines

New Thread

FAB/DES:Molded Plastic Conductive Circuits?

Re: FAB/DES:Molded Plastic Conductive Circuits?

Pratap Singh

Fri, 29 Aug 1997 12:31:39 -0700

13 lines

Re: FAB/DES:Molded Plastic Conductive Circuits?

Edwards, Ted A (AZ75)

Fri, 29 Aug 1997 08:46:11 -0500

20 lines

Re: FAB/DES:Molded Plastic Conductive Circuits?

David Bergman

Fri, 29 Aug 1997 07:12:09 -0500

66 lines

FAB/DES:Molded Plastic Conductive Circuits?

Greg Finlay

Wed, 27 Aug 1997 11:14:54 -0400

26 lines

New Thread

FAB: .006" PCB Fabricators Required.

Re: FAB: .006" PCB Fabricators Required.

mark leasure

Fri, 15 Aug 1997 09:27:42 -0700

24 lines

FAB: .006" PCB Fabricators Required.

Greg Finlay

Fri, 15 Aug 1997 11:59:50 -0400

15 lines

New Thread

FAB: Board Material

Re: FAB: Board Material

markl

Thu, 28 Aug 1997 17:06:42 -0700

37 lines

Re: FAB: Board Material

Keith Larson

Wed, 27 Aug 1997 10:43:19 -0500

56 lines

FAB: Board Material

Pucket, Larry Lee

Wed, 27 Aug 1997 09:06:59 -0600

28 lines

New Thread

FAB: Clean Room environments

FAB: Clean Room environments

Eltek Ltd. - Process Engineering

Wed, 13 Aug 1997 09:11:37 +0300

28 lines

Re: FAB: Clean Room environments

<>

Tue, 12 Aug 1997 13:05:58 -0400

26 lines

Re: FAB: Clean Room environments

Leslie O. Connally

Tue, 12 Aug 1997 11:31:29 -0700

83 lines

Re: FAB: Clean Room environments

<>

Tue, 12 Aug 1997 07:32:51 PST

29 lines

Re: FAB: Clean Room environments

<>

Mon, 11 Aug 1997 19:55:46 -0400

16 lines

FAB: Clean Room environments

Ed Cosper

Mon, 11 Aug 1997 15:48:21 -0500

48 lines

New Thread

FAB: Coefficients of Thermal Expansion

Re: FAB: Coefficients of Thermal Expansion

<>

Sat, 2 Aug 1997 16:48:57 -0400

33 lines

New Thread

FAB: Copper-Invar-Copper

Re: FAB: Copper-Invar-Copper

Leslie O. Connally

Wed, 13 Aug 1997 08:21:25 -0700

54 lines

FAB: Copper-Invar-Copper

Luis Rivera

Tue, 12 Aug 1997 06:00:00 CDT

34 lines

New Thread

FAB: Flexible circuit suppliers wanted

Re: FAB: Flexible circuit suppliers wanted

mark leasure

Tue, 12 Aug 1997 09:13:37 -0700

28 lines

Re: FAB: Flexible circuit suppliers wanted

Joel Yocom

Wed, 6 Aug 1997 11:20:42 +0000

26 lines

Re: FAB: Flexible circuit suppliers wanted

Larry Crane

Wed, 6 Aug 1997 10:55:12 -0400

66 lines

Re: FAB: Flexible circuit suppliers wanted

Denis Meloche

Wed, 6 Aug 1997 10:10:44 -0400

42 lines

Re: FAB: Flexible circuit suppliers wanted

<>

Tue, 5 Aug 1997 20:02:57 -0400

13 lines

Re: FAB: Flexible circuit suppliers wanted

Joel Yocom

Tue, 5 Aug 1997 18:09:01 +0000

23 lines

Re: FAB: Flexible circuit suppliers wanted

Florencio Eiranova

Tue, 5 Aug 1997 12:53:17 -0500

55 lines

Re: FAB: Flexible circuit suppliers wanted

Brian Nelson - General Manager

Tue, 5 Aug 1997 07:49:24 +0000

80 lines

FAB: Flexible circuit suppliers wanted

YAP CHOW LAN

Tue, 5 Aug 1997 18:17:10 +0800

25 lines

New Thread

FAB: IPC-6012 & Lifted Lands

Re: FAB: IPC-6012 & Lifted Lands

Ed Cosper

Tue, 5 Aug 1997 17:05:30 -0500

66 lines

Re: FAB: IPC-6012 & Lifted Lands

Lisa Williams

Tue, 5 Aug 1997 16:43:06 -0500

49 lines

FAB: IPC-6012 & Lifted Lands

Thad McMillan

Tue, 5 Aug 1997 14:01:00 CDT

36 lines

New Thread

FAB: IST

Re: FAB: IST

Gabriela Bogdan

Fri, 8 Aug 1997 17:57:28 +0000

45 lines

Re: FAB: IST

<>

Fri, 8 Aug 1997 09:43:44 -0400

27 lines

Re: FAB: IST

D. Rooke

Thu, 7 Aug 1997 19:30:49 -0400

48 lines

Re: FAB: IST

Delsen Testing Laboratories

Thu, 7 Aug 1997 16:30:16 -0700

74 lines

FAB: IST

Orna and Yehuda

Fri, 8 Aug 1997 00:28:45 +0300

33 lines

New Thread

FAB: OSP COATINGS

Re: FAB: OSP COATINGS

Greg Bartlett

Wed, 13 Aug 1997 08:43:11 +0000

110 lines

Re: FAB: OSP COATINGS

Michael Barmuta

Tue, 12 Aug 1997 11:16:17 -0700

45 lines

Re: FAB: OSP COATINGS

<>

Sat, 9 Aug 1997 08:32:45 -0400

14 lines

Re: FAB: OSP COATINGS

<>

Fri, 8 Aug 1997 15:32:05 -0500

41 lines

FAB: OSP COATINGS

Jim Marsico 516-595-5879

Fri, 8 Aug 1997 11:01:00 -0400

28 lines

New Thread

FAB: Reliability tests through ageing

FAB: Reliability tests through ageing

Orna and Yehuda

Mon, 1 Sep 1997 00:14:58 +0300

34 lines

New Thread

FAB: Vacrel dryfilm laminator needed

Re: FAB: Vacrel dryfilm laminator needed

Anil K Singh

Sat, 23 Aug 1997 19:38:36 +0530

34 lines

Re: FAB: Vacrel dryfilm laminator needed

<>

Fri, 22 Aug 1997 22:21:50 -0400

13 lines

FAB: Vacrel dryfilm laminator needed

Jan Thuesen

Thu, 21 Aug 1997 12:07:58 +0200

24 lines

New Thread

FAB: VIA FILL IN A CAVITY

FAB: VIA FILL IN A CAVITY

<>

Mon, 25 Aug 1997 17:22:26 -0400

22 lines

New Thread

FAB: Wire Bondable Au/Ni Etch Resist

FAB: Wire Bondable Au/Ni Etch Resist

Andy Magee

Fri, 29 Aug 1997 08:27:36 -0500

15 lines

New Thread

FAB:Copper/Tin Build-up on Plating Racks

Re: FAB:Copper/Tin Build-up on Plating Racks

David Hoover

Wed, 13 Aug 1997 22:43:27 -0700

40 lines

FAB:Copper/Tin Build-up on Plating Racks

Hans Rohr

Wed, 13 Aug 1997 21:45:41 -0400

37 lines

New Thread

Fabrication-RS274X

Fabrication-RS274X

Brian Nelson - General Manager

Tue, 5 Aug 1997 10:13:00 +0000

81 lines

New Thread

Failure Analysis, RF power FETs

Re: Failure Analysis, RF power FETs

Lyle Gold (MSMail)

Tue, 5 Aug 1997 13:29:00 -0700

16 lines

Re: Failure Analysis, RF power FETs

Denis Meloche

Tue, 5 Aug 1997 09:24:52 -0400

34 lines

Failure Analysis, RF power FETs

Sheila Smith

Mon, 4 Aug 1997 16:11:41 -0400

19 lines

New Thread

faraday cup

faraday cup

Lim Teong Kheng

Wed, 13 Aug 1997 21:24:03 +0800

12 lines

New Thread

Finish for wirebond

Re: Finish for wirebond

David Anderson

Thu, 14 Aug 1997 20:19:15 -0500

42 lines

Re: Finish for wirebond

Warren Szkolnicki

Thu, 14 Aug 1997 14:38:43 -0700

87 lines

Re: Finish for wirebond

Robert Schetty

Thu, 14 Aug 1997 18:32:27 UT

28 lines

Finish for wirebond

<>

Thu, 14 Aug 1997 11:15:51 -0400

14 lines

New Thread

Flex PWB in SMT International 97

Flex PWB in SMT International 97

KoizumiT

Fri, 22 Aug 1997 23:37:22 JST

15 lines

New Thread

Flexible Circuit Technology Book

Re: Flexible Circuit Technology Book

Phil Culpovich

Fri, 29 Aug 1997 10:48:38 -0700

21 lines

New Thread

Forums

Re: Forums

Karen Mitall

Fri, 1 Aug 1997 11:40:50 -0400

115 lines

New Thread

Fusible Links

Re: Fusible Links

CSS Asia Co., Ltd.

Wed, 20 Aug 1997 15:39:30 +0900

49 lines

Re: Fusible Links

Fred Pescitelli

Sun, 17 Aug 1997 14:45:59 -0400

48 lines

Fusible Links

Kimmey, Frank

Fri, 15 Aug 1997 13:34:59 -0700

38 lines

New Thread

Fusible Links -Reply

Re: Fusible Links -Reply

MIKE J. LOPEZ

Mon, 18 Aug 1997 11:07:31 -0400

9 lines

New Thread

FW: BGA Reclamation

FW: BGA Reclamation

Signorelli, Paul

Tue, 5 Aug 1997 10:49:48 -0600

18 lines

New Thread

GDS 2

Re: GDS 2

<>

Thu, 28 Aug 1997 10:56:44 -0400

18 lines

GDS 2

<>

Wed, 27 Aug 1997 14:32:08 +0100

16 lines

New Thread

GEN: CAM Operator seeks your opinion.

Re: GEN: CAM Operator seeks your opinion.

Dick Desrosiers

Fri, 22 Aug 1997 10:18:44 EDT

21 lines

GEN: CAM Operator seeks your opinion.

Mark R. Steele

Fri, 22 Aug 1997 00:17:33 -0700

36 lines

New Thread

GEN: MATERIAL SOURCES

GEN: MATERIAL SOURCES

Jim Marsico 516-595-5879

Wed, 13 Aug 1997 12:54:00 -0400

38 lines

New Thread

GEN: Where to Buy Bellcore Specs...

GEN: Where to Buy Bellcore Specs...

Doug McKean

Mon, 4 Aug 1997 13:27:43 -0400

24 lines

New Thread

Getek

Re: Getek

Frank Hinojos

Fri, 22 Aug 1997 08:56:07 -0700

29 lines

Getek

Paul Stolar

Fri, 22 Aug 1997 09:49:22 -0600

13 lines

New Thread

GLASS BODY DIODES

Re: GLASS BODY DIODES

Bogdan Gaby

Thu, 7 Aug 1997 09:02:15 -0700

34 lines

Re: GLASS BODY DIODES

<>

Wed, 6 Aug 1997 13:04:20 +0000

29 lines

GLASS BODY DIODES

Gabriela Bogdan

Wed, 6 Aug 1997 19:21:45 +0000

23 lines

New Thread

Gold / Silver Incompatibility for Adhesives

Re: Gold / Silver Incompatibility for Adhesives

<>

Thu, 7 Aug 1997 15:25:00 +0200

22 lines

Re: Gold / Silver Incompatibility for Adhesives

David Anderson

Thu, 7 Aug 1997 09:47:15 -0500

68 lines

Re: Gold / Silver Incompatibility for Adhesives

Jan Bokhove

Thu, 7 Aug 1997 16:44:18 +0200

33 lines

Re: Gold / Silver Incompatibility for Adhesives

David Anderson

Thu, 7 Aug 1997 09:24:47 -0500

48 lines

Re: Gold / Silver Incompatibility for Adhesives

Sheila Smith

Thu, 7 Aug 1997 08:20:28 -0400

48 lines

Re: Gold / Silver Incompatibility for Adhesives

Jan Bokhove

Thu, 7 Aug 1997 11:10:27 +0200

30 lines

New Thread

gold ball bonding

Re: gold ball bonding

Paul Stolar

Fri, 15 Aug 1997 15:20:03 -0600

21 lines

Re: gold ball bonding

Warren Szkolnicki

Fri, 15 Aug 1997 13:40:45 -0700

93 lines

gold ball bonding

<>

Fri, 15 Aug 1997 13:54:52 -0400

19 lines

New Thread

gold ball bonding -Reply

gold ball bonding -Reply

David Anderson

Fri, 15 Aug 1997 16:17:41 -0500

43 lines

New Thread

Gold Connector Thickness

Gold Connector Thickness

<>

Wed, 20 Aug 1997 14:53:12 +0200

27 lines

Gold Connector Thickness

Quality Dept. - Eltek Ltd.

Wed, 20 Aug 1997 13:33:11 +0300

29 lines

New Thread

Gold Flash

Gold Flash

Barbara Burcham

Tue, 19 Aug 1997 13:04:32 -0700

15 lines

New Thread

Gold/Tin Mystery

Gold/Tin Mystery

<>

Tue, 12 Aug 1997 16:03:22 +0200

27 lines

New Thread

HASL Equipment plus & minuses

Re: HASL Equipment plus & minuses

<>

Mon, 11 Aug 1997 17:31:12 -0400

14 lines

HASL Equipment plus & minuses

Steve Collins

Mon, 11 Aug 1997 13:14:33 -0600

24 lines

New Thread

Help

Re: Help

fgolisan

Mon, 18 Aug 1997 09:47:08 PST

24 lines

Re: Help

Ted Stern

Mon, 18 Aug 1997 09:50:57 -0700

36 lines

Help

Eltek Ltd. - Process Engineering

Mon, 18 Aug 1997 10:09:45 +0300

19 lines

New Thread

HELP HELP HELP

Re: HELP HELP HELP

<>

Mon, 4 Aug 1997 13:33:12 -0400

14 lines

Re: HELP HELP HELP

LES CONNALLY

Mon, 4 Aug 1997 09:08:14 -0700

42 lines

Re: HELP HELP HELP

Robby Dunnagan

Mon, 4 Aug 1997 08:06:21 -0400

32 lines

HELP HELP HELP

Alan Butler

Mon, 4 Aug 1997 05:10:35 -0400

22 lines

New Thread

High PIN Density PCB Design

High PIN Density PCB Design

Varadaraj.K

Fri, 29 Aug 1997 08:22:40 +0530

31 lines

New Thread

Hole Filler

Re: Hole Filler

Scott B. Westheimer

Wed, 20 Aug 1997 21:23:10 +0800

13 lines

Hole Filler

Sok-Peng Lim-CTUA145

Wed, 20 Aug 1997 00:26:49 -0500

26 lines

New Thread

how to pin gauge holes?

Re: how to pin gauge holes?

Ed Cosper

Wed, 13 Aug 1997 10:06:50 -0500

67 lines

Re: how to pin gauge holes?

Hans Rohr

Tue, 12 Aug 1997 21:00:57 -0400

40 lines

Re: how to pin gauge holes?

drilbert

Tue, 12 Aug 1997 16:29:11 -0700

48 lines

how to pin gauge holes?

<>

Tue, 12 Aug 1997 14:21:47 MST

30 lines

New Thread

how to remove silk screen

Re: how to remove silk screen

Larry J. Fisher

Mon, 18 Aug 1997 22:07:33 -0400

35 lines

Re: how to remove silk screen

mel moschler

Thu, 14 Aug 1997 08:37:32 -0700

28 lines

Re: how to remove silk screen

sbryan

Wed, 13 Aug 1997 16:50:11 PST

13 lines

how to remove silk screen

Raymond Klein

Wed, 13 Aug 1997 15:51:47 -0700

19 lines

New Thread

how to remove silk screen -Reply

how to remove silk screen -Reply

MIKE J. LOPEZ

Thu, 14 Aug 1997 07:15:32 -0400

10 lines

New Thread

Idents before or after HASL-- Reply

Re: Idents before or after HASL-- Reply

<>

Mon, 4 Aug 1997 09:35:35 -0400

40 lines

New Thread

Immersion Golde over Nickel for edge connectors

Immersion Golde over Nickel for edge connectors

Galetsky Franz

Sat, 16 Aug 1997 13:20:12 +-400

22 lines

New Thread

Information on Feed & Bleed systems

Re: Information on Feed & Bleed systems

Ted Stern

Mon, 25 Aug 1997 08:09:51 -0700

36 lines

Re: Information on Feed & Bleed systems

<>

Sun, 24 Aug 1997 06:56:19 -0400

17 lines

Information on Feed & Bleed systems

System Administrator

Sat, 23 Aug 1997 16:47:18 +0530

23 lines

New Thread

Information on LT90 Specifications

Re: Information on LT90 Specifications

David Bergman

Tue, 5 Aug 1997 10:45:18 -0500

48 lines

Information on LT90 Specifications

Anthony Balraj

Tue, 5 Aug 1997 19:33:25 +0530

19 lines

New Thread

InnerLayers treatment

Re: InnerLayers treatment

D. Rooke

Mon, 18 Aug 1997 19:08:57 -0400

36 lines

Re: InnerLayers treatment

<>

Fri, 15 Aug 1997 21:50:21 -0400

23 lines

InnerLayers treatment

Cristian Bomboe

Fri, 15 Aug 1997 09:00:26 +-300

20 lines

New Thread

Intermetallic of Cu-Ni-Sn/Pb

Re: Intermetallic of Cu-Ni-Sn/Pb

Martin Farrell

Fri, 15 Aug 1997 12:21:50 +0000

21 lines

New Thread

IPC "B" Coupon

IPC "B" Coupon

David Tyler

Wed, 6 Aug 1997 09:26:01 -0400

96 lines

New Thread

IPC Printed Circuits Expo '98

IPC Printed Circuits Expo '98

Kim Behr

Mon, 18 Aug 1997 10:17:37 -0500

237 lines

New Thread

IPC-D-317A Crosstalk Equation Question

Re: IPC-D-317A Crosstalk Equation Question

John Nieznanski

Thu, 14 Aug 1997 09:03:36 -0400

32 lines

IPC-D-317A Crosstalk Equation Question

Scott Gurst

Tue, 12 Aug 1997 12:45:10 -0600

34 lines

New Thread

IPCchat session announcement

IPCchat session announcement

<>

Mon, 4 Aug 1997 14:22:17 -0700

35 lines

New Thread

IPCWorks '97

IPCWorks '97

Lisa Williams

Mon, 25 Aug 1997 14:54:06 -0500

37 lines

New Thread

J/STD Changes

Re: J/STD Changes

<>

Fri, 8 Aug 1997 20:33:58 -0400

24 lines

New Thread

Job listing

Job listing

Luis Rivera

Thu, 7 Aug 1997 06:00:00 CDT

20 lines

Re: Job listing

OMNI High Tech Industries Ltd. (OHTIL)

Thu, 7 Aug 1997 10:39:25 +0600

41 lines

Job listing

Luis Rivera

Wed, 6 Aug 1997 06:00:00 CDT

26 lines

Job listing

<>

Tue, 5 Aug 1997 22:42:39 -0400

21 lines

New Thread

JOHN OSULLIVAN <[log in to unmask]>: [TECHNET] Solder mask material

Re: JOHN OSULLIVAN <[log in to unmask]>: [TECHNET] Solder mask material

Andy RJ McKean

Thu, 14 Aug 1997 14:38:03 GMT

31 lines

New Thread

Just a Test, Please ignore.

Just a Test, Please ignore.

KoizumiT

Wed, 20 Aug 1997 17:00:44 JST

10 lines

New Thread

Law suit & breast implants!

Re: Law suit & breast implants!

Anil K Singh

Wed, 20 Aug 1997 06:55:50 +0530

34 lines

Re: Law suit & breast implants!

David Bergman

Tue, 19 Aug 1997 17:15:42 -0500

26 lines

Re: Law suit & breast implants!

<>

Tue, 19 Aug 1997 17:53:36 -0400

18 lines

New Thread

Long Term Failures in Multilayer PCBs

Re: Long Term Failures in Multilayer PCBs

Aric J Parr

Thu, 21 Aug 1997 07:49:35 -0500

20 lines

Long Term Failures in Multilayer PCBs

LANE, Stephen (Collroad)

Thu, 21 Aug 1997 07:03:00 +0000

47 lines

Re: Long Term Failures in Multilayer PCBs

Gary Woodford

Mon, 4 Aug 1997 15:40:05 +0100

29 lines

Re: Long Term Failures in Multilayer PCBs

Nachbor, Suzanne (MN51)

Mon, 4 Aug 1997 14:25:00 PDT

17 lines

Long Term Failures in Multilayer PCBs

LANE, Stephen (Collroad)

Mon, 4 Aug 1997 08:25:00 +0000

42 lines

New Thread

Looking for Literature

Looking for Literature

Denis Meloche

Tue, 26 Aug 1997 11:31:40 -0400

36 lines

New Thread

Metal finishing

Re: Metal finishing

Bob Mesick

Sat, 16 Aug 1997 08:56:21 -0700

29 lines

Metal finishing

tonghh

Sat, 16 Aug 1997 21:44:02 +0800

19 lines

New Thread

micro bga

Re: micro bga

mark leasure

Tue, 12 Aug 1997 08:46:45 -0700

32 lines

Re: micro bga

Robert Schetty

Fri, 8 Aug 1997 20:01:17 UT

32 lines

Re: micro bga

<>

Fri, 8 Aug 1997 11:49:30 -0700

22 lines

Re: micro bga

Butch White

Fri, 8 Aug 1997 11:13:31 -0700

33 lines

Re: micro bga

<>

Fri, 8 Aug 1997 10:15:27 -0400

19 lines

Re: micro bga

Guenter Grossmann

Fri, 8 Aug 1997 11:54:44 +0200

29 lines

Re: micro bga

MCHAN

Thu, 7 Aug 1997 16:51:16 -0400

23 lines

micro bga

Vertefeuille, Russ (AZ77)

Thu, 7 Aug 1997 15:30:16 -0500

19 lines

New Thread

Micro-organisms in rinses

Re: Micro-organisms in rinses

Edwards, Ted A (AZ75)

Thu, 14 Aug 1997 13:11:08 -0500

17 lines

Re: Micro-organisms in rinses

Ted Stern

Thu, 14 Aug 1997 09:33:54 -0700

33 lines

Re: Micro-organisms in rinses

Leslie O. Connally

Thu, 14 Aug 1997 08:15:21 -0700

31 lines

Micro-organisms in rinses

Andy RJ McKean

Thu, 14 Aug 1997 09:05:01 GMT

10 lines

New Thread

MIL Standard 202 and 208

MIL Standard 202 and 208

K.Varadaraj

Fri, 15 Aug 1997 08:10:54 +0530

20 lines

New Thread

MIL STD for Flex

Re: MIL STD for Flex

Jon Holmen

Tue, 19 Aug 1997 12:13:53 -0500

28 lines

MIL STD for Flex

KoizumiT

Thu, 7 Aug 1997 18:41:42 JST

17 lines

New Thread

MIL-STD-2118

MIL-STD-2118

KoizumiT

Sat, 2 Aug 1997 15:23:12 JST

17 lines

New Thread

Milliscopes / Boroscopes

Milliscopes / Boroscopes

Whitehouse, Jim

Fri, 22 Aug 1997 09:26:00 CDT

10 lines

New Thread

Misregistration/Annular Ring

Re: Misregistration/Annular Ring

Richard MacCutcheon

Fri, 29 Aug 1997 08:33:00 -0600

102 lines

Re: Misregistration/Annular Ring

Mark R Ford

Fri, 29 Aug 1997 09:02:07 EDT

78 lines

Re: Misregistration/Annular Ring

drilbert

Thu, 28 Aug 1997 18:12:24 -0700

58 lines

Re: Misregistration/Annular Ring

Paul Gould

Thu, 28 Aug 1997 23:14:30 +0100

67 lines

Re: Misregistration/Annular Ring

<>

Thu, 28 Aug 1997 12:29:34 PDT

46 lines

Re: Misregistration/Annular Ring

Dick Desrosiers

Thu, 28 Aug 1997 15:17:03 EDT

18 lines

Misregistration/Annular Ring

Richard MacCutcheon

Thu, 28 Aug 1997 08:48:00 -0600

28 lines

New Thread

Moisture in Liquid Nitrogen

Re: Moisture in Liquid Nitrogen

<>

Wed, 20 Aug 1997 16:56:28 -0500

50 lines

Moisture in Liquid Nitrogen

Ostertag Tom

Wed, 20 Aug 1997 12:50:11 U

25 lines

New Thread

Moisture Sensative Components

Moisture Sensative Components

John Vivari

Fri, 29 Aug 1997 13:57:38 -0400

18 lines

Moisture Sensative Components

John Vivari

Fri, 29 Aug 1997 12:22:23 -0400

15 lines

New Thread

Moisture Sensitive Products

Re: Moisture Sensitive Products

<>

Thu, 28 Aug 1997 11:26:22 -0500

47 lines

Re: Moisture Sensitive Products

Lolmaugh, Scott (AZ15)

Thu, 28 Aug 1997 10:30:59 -0500

15 lines

Re: Moisture Sensitive Products

Bob West

Thu, 28 Aug 1997 07:18:15 -0700

27 lines

Re: Moisture Sensitive Products

Bob West

Mon, 25 Aug 1997 09:35:03 -0700

28 lines

Moisture Sensitive Products

MIKE J. LOPEZ

Wed, 20 Aug 1997 07:14:51 -0400

11 lines

New Thread

Molded Plastic Circuits

Re: Molded Plastic Circuits

<>

Fri, 29 Aug 1997 13:35:42 -0500

22 lines

Molded Plastic Circuits

MR GEORGE D GREGOIRE

Fri, 29 Aug 1997 01:06:01 -0500

23 lines

New Thread

Nickel palladium

Nickel palladium

tonghh

Sun, 31 Aug 1997 14:27:58 +0800

17 lines

New Thread

No Subject

No Subject

<>

Wed, 27 Aug 1997 11:42:02 -0400

15 lines

New Thread

No-clean

No-clean

<>

Thu, 14 Aug 1997 16:51:51 MDT

22 lines

New Thread

No-clean and OSP

No-clean and OSP

<>

Thu, 21 Aug 1997 16:57:19 MDT

20 lines

New Thread

No-clean flux query

Re: No-clean flux query

Graham Naisbitt

Wed, 6 Aug 1997 15:05:42 UT

190 lines

Re: No-clean flux query

Denis Meloche

Tue, 5 Aug 1997 09:30:48 -0400

167 lines

Re: No-clean flux query

Denis Meloche

Tue, 5 Aug 1997 09:11:27 -0400

46 lines

Re: No-clean flux query

Graham Naisbitt

Mon, 4 Aug 1997 22:28:27 UT

145 lines

Re: No-clean flux query

Lepsche, Thomas G (NM75)

Mon, 4 Aug 1997 07:45:47 -0600

85 lines

Re: No-clean flux query

Graham Naisbitt

Sun, 3 Aug 1997 23:21:02 UT

64 lines

No-clean flux query

<>

Fri, 1 Aug 1997 10:31:09 MDT

28 lines

New Thread

No-clean rework qualification

Re: No-clean rework qualification

Denis Meloche

Thu, 21 Aug 1997 10:14:25 -0400

87 lines

Re: No-clean rework qualification

Karen Tellefsen

Wed, 20 Aug 1997 18:05:23 -0700

69 lines

Re: No-clean rework qualification

Denis Meloche

Tue, 19 Aug 1997 08:59:06 -0400

66 lines

Re: No-clean rework qualification

Graham Naisbitt

Mon, 18 Aug 1997 23:57:28 UT

86 lines

No-clean rework qualification

<>

Mon, 18 Aug 1997 15:31:48 MDT

37 lines

New Thread

No-clean VS Water soluable soldering

Re: No-clean VS Water soluable soldering

<>

Wed, 27 Aug 1997 20:17:26 -0400

15 lines

No-clean VS Water soluable soldering

<>

Tue, 26 Aug 1997 09:24:34 MDT

18 lines

New Thread

no-clean wire solder and flux pen question

no-clean wire solder and flux pen question

<>

Mon, 11 Aug 1997 15:06:08 MDT

26 lines

New Thread

Np-clean flux

Np-clean flux

<>

Wed, 13 Aug 1997 08:08:19 MDT

24 lines

New Thread

Optimum via size for test point use

Optimum via size for test point use

LLOYD TOFTE

Mon, 25 Aug 1997 18:08:40 -0500

18 lines

New Thread

Original C4 paper from IBM Journal (1969)

Original C4 paper from IBM Journal (1969)

tana

Tue, 26 Aug 1997 10:00:21 +0100

37 lines

New Thread

OSP coating

Re: OSP coating

<>

Mon, 1 Sep 1997 00:32:08 -0500

41 lines

New Thread

PCB baking

Re: PCB baking

Leslie O. Connally

Wed, 13 Aug 1997 12:46:38 -0700

48 lines

PCB baking

<>

Wed, 13 Aug 1997 12:46:12 EDT

21 lines

New Thread

PCB baking & Thermal cycles

Re: PCB baking & Thermal cycles

Leslie O. Connally

Thu, 14 Aug 1997 08:09:15 -0700

45 lines

PCB baking & Thermal cycles

<>

Thu, 14 Aug 1997 10:49:52 +0200

28 lines

New Thread

PCB Failures

Re: PCB Failures

Joe Dickson

Fri, 29 Aug 1997 10:25:37 PST

52 lines

PCB Failures

Richard MacCutcheon

Fri, 29 Aug 1997 10:34:00 -0600

36 lines

PCB Failures

Rosario D. Salvo

Fri, 29 Aug 1997 12:03:46 -0400

22 lines

New Thread

PCB Industry in Japan

Re: PCB Industry in Japan

<>

Wed, 13 Aug 1997 09:59:56 -0500

38 lines

Re: PCB Industry in Japan

Kuwako, Fujio(MMS)

Wed, 13 Aug 1997 11:31:57 +0900

89 lines

PCB Industry in Japan

Omni High Tech Industries Ltd. (OHTIL)

Tue, 12 Aug 1997 20:05:18 +0600

42 lines

New Thread

PCB Layout Services

PCB Layout Services

Daniel Doherty

Mon, 4 Aug 1997 13:40:20 -0700

24 lines

New Thread

PCB related questions

Re: PCB related questions

Barry Allen

Tue, 26 Aug 1997 07:53:15 -0400

36 lines

Re: PCB related questions

Kimmey, Frank

Mon, 25 Aug 1997 11:19:28 -0700

39 lines

PCB related questions

Robert Moss

Mon, 25 Aug 1997 13:51:01 -0400

22 lines

New Thread

Peel strength value Cu tracks

Peel strength value Cu tracks

peter dahlen

Wed, 6 Aug 1997 12:08:32 +0000

39 lines

New Thread

Photoplotter Information...

Photoplotter Information...

Nelson Calimquim

Thu, 21 Aug 1997 09:04:55 -0700

22 lines

New Thread

Photoresist Applications

Photoresist Applications

Marcello Stanco

Thu, 14 Aug 1997 22:05:39 -0700

21 lines

New Thread

Pin gage reference

Re: Pin gage reference

Don Vischulis

Fri, 15 Aug 1997 19:47:48 -0500

62 lines

Re: Pin gage reference

<>

Thu, 14 Aug 1997 13:47:22 -0400

13 lines

Pin gage reference

<>

Thu, 14 Aug 1997 11:18:05 -0400

13 lines

New Thread

Please remove my name

Re: Please remove my name

<>

Tue, 5 Aug 1997 11:32:16 +0800

12 lines

New Thread

PMC Bezels

PMC Bezels

Andrew Buonviri

Fri, 15 Aug 1997 10:14:41 -0400

19 lines

New Thread

Positive Etchback vs De-smear

Positive Etchback vs De-smear

Ferrell-2 Bobby

Mon, 4 Aug 1997 08:31:33 -0400

22 lines

New Thread

Printable, Peelable Solder Masks

Re: Printable, Peelable Solder Masks

Karen Tellefsen

Wed, 20 Aug 1997 17:43:18 -0700

20 lines

Re: Printable, Peelable Solder Masks

Larry J. Fisher

Tue, 19 Aug 1997 17:03:02 -0400

25 lines

Printable, Peelable Solder Masks

Whitehouse, Jim

Tue, 19 Aug 1997 07:43:00 CDT

11 lines

New Thread

Printable, Peelable Solder Masks (fwd)

Re: Printable, Peelable Solder Masks (fwd)

Michael Barmuta

Thu, 21 Aug 1997 09:29:58 -0700

11 lines

New Thread

PTH Troubleshooting- Search for Authors

Re: PTH Troubleshooting- Search for Authors

Leslie O. Connally

Mon, 25 Aug 1997 08:11:37 -0700

36 lines

PTH Troubleshooting- Search for Authors

Ted F Myers

Fri, 22 Aug 1997 23:35:44 +0100

19 lines

New Thread

Pull test

Re: Pull test

Ted Stern

Tue, 19 Aug 1997 13:40:15 -0700

43 lines

Pull test

John XIE

Tue, 19 Aug 1997 09:43:00 -0700

25 lines

New Thread

PWB Questions

Re: PWB Questions

Sheila Smith

Thu, 7 Aug 1997 14:19:55 -0400

38 lines

PWB Questions

rob

Thu, 7 Aug 1997 10:05:08 -0700

28 lines

New Thread

R Test Mesage

R Test Mesage

VOLPE, RAY

Thu, 14 Aug 1997 12:41:51 -0400

12 lines

New Thread

RE : OSP

RE : OSP

Eltek Ltd. - Process Engineering

Wed, 13 Aug 1997 09:11:39 +0300

43 lines

New Thread

Reduced oxide

Re: Reduced oxide

<>

Mon, 25 Aug 1997 09:20:21 -0400

51 lines

Reduced oxide

Eltek Ltd. - Process Engineering

Mon, 25 Aug 1997 12:52:30 +0300

22 lines

New Thread

reflow standards for leaded devices

reflow standards for leaded devices

Stephen L. Mead

Wed, 27 Aug 1997 11:41:06 -0400

27 lines

New Thread

Reliability of reworked PCB's

Reliability of reworked PCB's

Guenter Grossmann

Tue, 26 Aug 1997 09:14:31 +0200

19 lines

New Thread

repair of circuit traces

Re: repair of circuit traces

Art Shuler

Tue, 12 Aug 1997 10:35:04 -0400

22 lines

repair of circuit traces

OBRIEN GERARD

Tue, 12 Aug 1997 08:15:49 -0400

18 lines

New Thread

Reply to press pin equipment query

Reply to press pin equipment query

Natalie Sharp

Fri, 8 Aug 1997 12:23:26 U

35 lines

New Thread

Request

Request

<>

Wed, 20 Aug 1997 22:27:19 -0400

8 lines

New Thread

REVIEW Technet

REVIEW Technet

Jen Hatton

Mon, 25 Aug 1997 07:46:26 CDT

15 lines

New Thread

Rework Cooling Rate

Re: Rework Cooling Rate

<>

Wed, 13 Aug 1997 15:48:16 -0400

36 lines

Re: Rework cooling rate

John Guy

Wed, 13 Aug 1997 11:23:31 -0500

165 lines

Re: Rework cooling rate

Guenter Grossmann

Wed, 13 Aug 1997 16:48:25 +0200

52 lines

Re: Rework cooling rate

John Guy

Wed, 13 Aug 1997 08:41:06 -0500

121 lines

Re: Rework cooling rate

Gary D. Peterson

Wed, 6 Aug 1997 09:36:13 -0600

59 lines

Rework cooling rate

<>

Tue, 5 Aug 1997 15:13:28 MDT

18 lines

New Thread

Re[2]: [TECHNET] Adhesive Printing

Re: Re[2]: [TECHNET] Adhesive Printing

<>

Tue, 26 Aug 1997 17:13:18 +0000

67 lines

New Thread

Re[2]: [TECHNET] Finish for wirebond

Re: Re[2]: [TECHNET] Finish for wirebond

Robert Schetty

Fri, 15 Aug 1997 22:31:38 UT

35 lines

New Thread

Re[2]: [TECHNET] Gold / Silver Incompatibility for Adhesives

Re: Re[2]: [TECHNET] Gold / Silver Incompatibility for Adhesives

Jan Bokhove

Mon, 11 Aug 1997 15:26:12 +0200

43 lines

Re: Re[2]: [TECHNET] Gold / Silver Incompatibility for Adhesives

Luc Boschmans

Fri, 8 Aug 1997 17:54:13 +0200

77 lines

Re: Re[2]: [TECHNET] Gold / Silver Incompatibility for Adhesives

Paul Stavrides

Thu, 7 Aug 1997 11:46:38 -0400

20 lines

New Thread

RMA FLUX CORROSION ON PLASTIC PARTS

Re: RMA FLUX CORROSION ON PLASTIC PARTS

<>

Fri, 22 Aug 1997 10:58:12 +0000

50 lines

RMA FLUX CORROSION ON PLASTIC PARTS

David T. Novick

Fri, 22 Aug 1997 07:23:12 PST

26 lines

New Thread

Roku-Roku Sangyo, Ltd.

Re: Roku-Roku Sangyo, Ltd.

Kuwako, Fujio(MMS)

Thu, 28 Aug 1997 14:27:08 +0900

25 lines

Roku-Roku Sangyo, Ltd.

William Johnson

Thu, 28 Aug 1997 00:49:11 UT

10 lines

New Thread

rs274x

rs274x

<>

Tue, 05 Aug 97 08:21:35 -0500

37 lines

New Thread

Sales Engineer position

Sales Engineer position

<>

Mon, 11 Aug 1997 15:57:37 -0400

15 lines

New Thread

Sales Position/Tech Service

Re: Sales Position/Tech Service

Scott B. Westheimer

Sat, 23 Aug 1997 11:36:03 +0800

19 lines

Sales Position/Tech Service

DAVID MANDER

Fri, 22 Aug 1997 23:12:31 -0500

13 lines

New Thread

Saponifier - Armakleen

Saponifier - Armakleen

Wesley Samples

Tue, 12 Aug 1997 15:50:10 +0000

33 lines

New Thread

SELV Specification

SELV Specification

<>

Thu, 21 Aug 1997 09:41:37 +0400

19 lines

New Thread

Sequential Build Multilayer

Sequential Build Multilayer

D. Rooke

Thu, 7 Aug 1997 21:09:17 -0400

31 lines

New Thread

SHADOW PROCESS

Re: SHADOW PROCESS

<>

Fri, 15 Aug 1997 22:06:44 -0400

18 lines

Re: SHADOW PROCESS

<>

Fri, 15 Aug 1997 18:34:55 -0400

8 lines

Re: SHADOW PROCESS

Carroll, George (MIS, GEFanuc, NA)

Fri, 15 Aug 1997 16:32:08 -0400

40 lines

Re: SHADOW PROCESS

Cristian Bomboe

Fri, 15 Aug 1997 19:39:26 +-300

65 lines

SHADOW PROCESS

Luis Hernandez

Thu, 14 Aug 1997 15:32:28 -0700

17 lines

New Thread

Silver Cond. Ink

Silver Cond. Ink

Fred Pescitelli

Wed, 6 Aug 1997 12:02:21 -0400

18 lines

New Thread

SIR test coupo

Re: SIR test coupo

Rex Breunsbach

Thu, 21 Aug 1997 08:32:08 -0800

12 lines

New Thread

SIR test coupons

Re: SIR test coupons

Karen Tellefsen

Wed, 20 Aug 1997 17:38:03 -0700

40 lines

SIR test coupons

<>

Wed, 20 Aug 1997 15:37:14 MDT

26 lines

New Thread

SMOBC

SMOBC

annie laberge

Fri, 15 Aug 1997 12:09:45 -0400

21 lines

New Thread

SMT Plus Inc.

SMT Plus Inc.

Alderete, Michael (MS Mail)

Thu, 21 Aug 1997 14:52:54 -0700

25 lines

New Thread

SNEC mtg

SNEC mtg

<>

Tue, 5 Aug 1997 16:49:53 -0400

11 lines

New Thread

Solder joint design

Re: Solder joint design

John Guy

Fri, 29 Aug 1997 08:23:37 -0500

44 lines

Solder joint design

<>

Fri, 29 Aug 1997 10:11:35 +0200

24 lines

New Thread

SOLDER JOINT PULL STRENGTH

Re: SOLDER JOINT PULL STRENGTH

Bogdan Gaby

Wed, 20 Aug 1997 11:19:00 -0700

31 lines

SOLDER JOINT PULL STRENGTH

<>

Tue, 19 Aug 1997 11:37:33 -0400

19 lines

New Thread

Solder mask m

Re: Solder mask m

JOHN OSULLIVAN

Fri, 15 Aug 1997 16:47:52 -0400

24 lines

New Thread

Solder mask material

Re: Solder mask material

Larry J. Fisher

Mon, 18 Aug 1997 22:22:02 -0400

31 lines

Re: Solder mask material

Don Vischulis

Fri, 15 Aug 1997 20:27:56 -0500

31 lines

Re: Solder mask material

<>

Fri, 15 Aug 1997 15:37:05 -0400

8 lines

Re: Solder mask material

roberto tulman

Fri, 15 Aug 1997 21:04:08 +0300

25 lines

Re: Solder mask material

<>

Thu, 14 Aug 1997 23:38:33 -0400

15 lines

Re: Solder mask material

<>

Thu, 14 Aug 1997 18:15:50 -0400

16 lines

Re: Solder mask material

<>

Thu, 14 Aug 1997 17:44:32 -0400

11 lines

Re: Solder mask material

jdeking

Thu, 14 Aug 1997 17:33:25 -0400

40 lines

Re: Solder mask material

Aric J Parr

Thu, 14 Aug 1997 13:50:40 -0500

26 lines

Solder mask material

JOHN OSULLIVAN

Thu, 14 Aug 1997 17:49:25 -0400

20 lines

New Thread

Solder mask material -Reply

Re: Solder mask material -Reply

Afri Singh

Fri, 15 Aug 1997 15:27:58 -0400

64 lines

Re: Solder mask material -Reply

annie laberge

Thu, 14 Aug 1997 16:49:39 -0400

55 lines

Solder mask material -Reply

Dennis Ostendorf

Thu, 14 Aug 1997 14:03:17 -0500

37 lines

New Thread

solderability after baking

Re: solderability after baking

Leslie O. Connally

Thu, 14 Aug 1997 11:32:59 -0700

20 lines

New Thread

SSD technology

Re: SSD technology

Cristian Bomboe

Tue, 19 Aug 1997 09:23:23 +-300

99 lines

SSD technology

MR GEORGE D GREGOIRE

Sat, 16 Aug 1997 00:05:10 -0500

30 lines

SSD technology

Cristian Bomboe

Thu, 14 Aug 1997 11:01:10 +-300

17 lines

New Thread

Strip tin-lead

Re: Strip tin-lead

<>

Mon, 11 Aug 1997 23:51:56 -0400

16 lines

New Thread

Subj: Alternative CCA Marking Labels

Re: Subj: Alternative CCA Marking Labels

Aric J Parr

Tue, 19 Aug 1997 15:58:57 -0500

22 lines

Subj: Alternative CCA Marking Labels

Ron Hollandsworth

Tue, 19 Aug 1997 15:14:48 -0500

22 lines

New Thread

SUBSCRIBE

SUBSCRIBE

<>

Tue, 26 Aug 1997 09:17:43 CST

10 lines

subscribe

Jan Thuesen

Tue, 19 Aug 1997 11:26:09 +0200

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Dmitriy Sklyar

Wed, 13 Aug 1997 09:38:10 -0500

47 lines

Subscribe

<>

Tue, 12 Aug 1997 00:15:42 -0400

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Tevels, John R (RFC MS-Mail)

Thu, 7 Aug 1997 13:22:00 -0400

14 lines

New Thread

Subscription

Subscription

<>

Fri, 15 Aug 1997 12:20:36 -0500

15 lines

New Thread

SUPPLIER INFO --FLEX PLUS

SUPPLIER INFO --FLEX PLUS

Bernard Kessler & Associates LTD

Wed, 6 Aug 1997 12:42:54 -0400

23 lines

New Thread

Surface prep prior to solder mask

Re: Surface prep prior to solder mask

Jim Douglas

Sat, 2 Aug 1997 12:02:41 +-100

72 lines

Surface prep prior to solder mask

<>

Fri, 1 Aug 1997 19:49:25 -0400

13 lines

New Thread

Survey Input

Survey Input

Kasprzak, Bill (esd) US

Fri, 22 Aug 1997 07:59:00 PDT

43 lines

New Thread

Systronic Stencil Cleaner

Systronic Stencil Cleaner

<>

Tue, 26 Aug 1997 17:17:06 +0000

15 lines

New Thread

telephone number

telephone number

OBRIEN GERARD

Thu, 14 Aug 1997 09:50:17 -0400

54 lines

telephone number

OBRIEN GERARD

Thu, 14 Aug 1997 09:50:17 -0400

18 lines

New Thread

telephone number -Reply

telephone number -Reply

Marshall Canaday

Thu, 14 Aug 1997 11:04:59 -0400

12 lines

New Thread

telephone number SMT PLUS

Re: telephone number SMT PLUS

David Hoover

Thu, 14 Aug 1997 20:42:09 -0700

36 lines

Re: telephone number SMT PLUS

mark leasure

Thu, 14 Aug 1997 08:33:56 -0700

39 lines

Re: telephone number SMT PLUS

<>

Thu, 14 Aug 1997 08:09:41 -0700

24 lines

New Thread

Test Die and Substrate

Test Die and Substrate

Larry Crane

Fri, 29 Aug 1997 11:20:44 -0400

20 lines

New Thread

Test, Please ignore

Test, Please ignore

Alderete, Michael

Mon, 4 Aug 1997 12:25:09 -0700

12 lines

New Thread

Test, please ignore, 970811-1

Test, please ignore, 970811-1

Alderete, Michael

Mon, 11 Aug 1997 09:54:51 -0700

11 lines

New Thread

test, please ignore.

test, please ignore.

Alderete, Michael

Thu, 7 Aug 1997 16:42:27 -0700

11 lines

New Thread

Test,please ignore.

Test,please ignore.

Motoyo Wajima

Tue, 5 Aug 1997 10:35:18 +0900

20 lines

New Thread

Testing only

Testing only

Melinda Robinson

Fri, 1 Aug 1997 18:37:32 -0500

11 lines

New Thread

Testing only -Reply

Testing only -Reply

MIKE J. LOPEZ

Sat, 2 Aug 1997 10:36:25 -0400

9 lines

New Thread

Testing Services

Re: Testing Services

Ted Stern

Wed, 20 Aug 1997 08:35:40 -0700

39 lines

Re: Testing Services

Sheila Smith

Wed, 20 Aug 1997 09:01:19 -0400

16 lines

New Thread

Thermal Ties

Re: Thermal Ties

Urry, John @ SLG

Mon, 4 Aug 1997 17:12:00 MDT

80 lines

New Thread

Thermal ties aka spokes

Re: Thermal ties aka spokes

<>

Sun, 3 Aug 1997 01:00:43 -0400

78 lines

Thermal ties aka spokes

Jay DeKing (EMA)

Fri, 1 Aug 1997 16:13:55 -0400

21 lines

New Thread

To Job Posters

Re: To Job Posters

David Bergman

Fri, 29 Aug 1997 07:05:29 -0500

37 lines

To Job Posters

Steve Underwood

Wed, 27 Aug 1997 06:19:12 -0600

35 lines

New Thread

Training materials

Training materials

Jim Herard

Wed, 27 Aug 1997 19:20:51 -0400

37 lines

New Thread

TSOP susceptibility to temperature

TSOP susceptibility to temperature

Joel Mearig

Tue, 19 Aug 1997 15:38:53 -0700

14 lines

New Thread

UL Testing

Re: UL Testing

Delsen Testing Laboratories

Mon, 18 Aug 1997 16:50:16 -0700

46 lines

UL Testing

<>

Mon, 18 Aug 1997 11:39:04 MST

23 lines

New Thread

UNSUBSCRIBE

Re: UNSUBSCRIBE

JoAnn Amerson

Thu, 28 Aug 1997 08:09:26 +0000

64 lines

Re: UNSUBSCRIBE

Baruch Schifman

Thu, 28 Aug 1997 12:04:27 +0300

19 lines

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Wed, 27 Aug 1997 08:26:48 -0700

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Mon, 25 Aug 1997 19:41:51 -0500

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Rick Taormino

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58 lines

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JoAnn Amerson

Mon, 25 Aug 1997 13:47:42 +0000

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Dmitriy Sklyar

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Dmitriy Sklyar

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<>

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<>

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JoAnn Amerson

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<>

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IR Harty

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unsubscribe try # 2

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unsubskrive

unsubskrive

<>

Wed, 13 Aug 1997 08:55:43 +0200

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Use of SMD shields for shielding pre reflow (ASSEM)

Re: Use of SMD shields for shielding pre reflow (ASSEM)

<>

Thu, 28 Aug 1997 14:45:00 EDT

77 lines

RE: Use of SMD shields for shielding pre reflow (ASSEM)

<>

Thu, 28 Aug 1997 14:45:00 EDT

44 lines

New Thread

used smt equipment

Re: used smt equipment

<>

Thu, 14 Aug 1997 07:07:34 EDT

45 lines

used smt equipment

Tucker, Steve (KS)

Tue, 12 Aug 1997 11:08:37 -0700

81 lines

New Thread

Vendors for oxide treatment on copper laminates

Re: Vendors for oxide treatment on copper laminates

LES CONNALLY

Mon, 4 Aug 1997 11:14:14 -0700

51 lines

New Thread

Via hole/Pad size

Via hole/Pad size

Paul Gould

Wed, 6 Aug 1997 16:06:50 +0100

81 lines

Re: Via hole/pad size

<>

Wed, 6 Aug 1997 10:32:18 -0400

17 lines

Re: Via hole/pad size

peter dahlen

Wed, 6 Aug 1997 08:24:54 +0000

59 lines

Re: Via hole/pad size

Paul Gould

Tue, 5 Aug 1997 23:39:05 +0100

88 lines

Re: Via hole/pad size

roberto tulman

Tue, 5 Aug 1997 20:11:38 +0300

43 lines

Re: Via hole/pad size

<>

Tue, 5 Aug 1997 09:30:36 -0400

32 lines

Re: Via hole/pad size

peter dahlen

Tue, 5 Aug 1997 08:57:57 +0000

54 lines

Re: Via hole/pad size

Shaub, John, E (PA62)

Mon, 4 Aug 1997 16:39:44 -0400

76 lines

Re: Via hole/pad size

Paul Gould

Mon, 4 Aug 1997 21:10:13 +0100

48 lines

Re: Via hole/pad size

Mitch Morey

Mon, 4 Aug 1997 10:19:57 -0700

67 lines

Re: Via hole/pad size

Jay DeKing (EMA)

Mon, 4 Aug 1997 11:32:10 -0400

104 lines

Re: Via hole/pad size

<>

Mon, 4 Aug 1997 07:26:37 -0400

20 lines

Re: Via hole/pad size

Shaub, John, E (PA62)

Fri, 1 Aug 1997 13:00:30 -0400

68 lines

New Thread

Via Inductance

Re: Via Inductance

JoAnn Amerson

Tue, 5 Aug 1997 12:30:16 +0000

27 lines

Re: Via Inductance

Doug McKean

Tue, 5 Aug 1997 11:58:09 -0400

45 lines

Re: Via Inductance

Jack Olson

Tue, 5 Aug 1997 08:38:05 -0700

26 lines

Re: Via Inductance

Doug McKean

Tue, 5 Aug 1997 09:05:21 -0400

65 lines

New Thread

Vibration and Shock Summary

Vibration and Shock Summary

GeoFranck

Thu, 14 Aug 1997 17:16:37 -0400

22 lines

New Thread

Virus warning

Re: Virus warning

Peter Lymn

Thu, 28 Aug 1997 14:35:13 +0100

88 lines

Re: Virus warning

Erik Ievins

Wed, 27 Aug 1997 22:24:18 +0000

25 lines

Re: Virus warning

Warren Szkolnicki

Wed, 27 Aug 1997 16:46:42 -0700

63 lines

Virus warning

Karen Mitall

Wed, 27 Aug 1997 15:51:35 -0400

66 lines

New Thread

Virus Warning Hoaxes

Virus Warning Hoaxes

Mark Ross

Wed, 27 Aug 1997 22:59:55 -0400

17 lines

New Thread

Water borne conformal coat

Re: Water borne conformal coat

<>

Wed, 27 Aug 1997 13:03:16 -0500

29 lines

New Thread

Water soluble paste slump

Water soluble paste slump

Graham Naisbitt

Tue, 12 Aug 1997 13:51:06 UT

42 lines

New Thread

wave profile needed

Re: wave profile needed

Aric J Parr

Tue, 5 Aug 1997 15:03:49 -0500

19 lines

wave profile needed

MIKE J. LOPEZ

Tue, 5 Aug 1997 12:18:56 -0400

18 lines

New Thread

Wave Solder Books/Article Recommendations

Wave Solder Books/Article Recommendations

<>

Wed, 27 Aug 1997 07:11:38 -0500

19 lines

New Thread

Weld Repair of cores

Re: Weld Repair of cores

Wolfgang Erat

Wed, 13 Aug 1997 15:15:54 -0400

29 lines

Weld Repair of cores

Darren J. Mertens

Wed, 13 Aug 1997 14:53:05 EST

13 lines

New Thread

Welding Stamps?

Welding Stamps?

Darren J. Mertens

Mon, 11 Aug 1997 14:44:04 EST

15 lines

Welding Stamps?

Darren J. Mertens

Wed, 6 Aug 1997 14:57:04 EST

15 lines

New Thread

wet mask thickness gauge

Re: wet mask thickness gauge

Larry J. Fisher

Fri, 29 Aug 1997 20:40:53 -0400

23 lines

Re: wet mask thickness gauge

Afri Singh

Tue, 26 Aug 1997 19:56:39 -0400

27 lines

Re: wet mask thickness gauge

<>

Tue, 26 Aug 1997 13:37:15 -0400

13 lines

Re: wet mask thickness gauge

Aric J Parr

Tue, 26 Aug 1997 07:24:29 -0500

20 lines

wet mask thickness gauge

Radhakrishna N

Tue, 26 Aug 1997 13:08:14 -0700

16 lines

New Thread

Wire Harness Tool

Re: Wire Harness Tool

Bob West

Thu, 14 Aug 1997 07:18:52 -0700

29 lines

New Thread

X-RAY DAMAGE TO COMPONENTS

Re: X-RAY DAMAGE TO COMPONENTS

Love, David (MS Mail)

Wed, 27 Aug 1997 11:43:45 -0700

123 lines

Re: X-RAY DAMAGE TO COMPONENTS

Lepsche, Thomas G (NM75)

Wed, 27 Aug 1997 12:16:11 -0600

35 lines

X-RAY DAMAGE TO COMPONENTS

Gabriela Bogdan

Wed, 27 Aug 1997 20:39:57 +0000

25 lines

New Thread

X-RAY DAMAGE TO COMPONENTS -Reply

Re: X-RAY DAMAGE TO COMPONENTS -Reply

Gabriela Bogdan

Thu, 28 Aug 1997 19:23:23 +0000

44 lines

X-RAY DAMAGE TO COMPONENTS -Reply

John Swinehart

Wed, 27 Aug 1997 13:48:08 -0400

36 lines

New Thread

[2]SSD technology

Re: [2]SSD technology

Yuen, Mike

Tue, 19 Aug 1997 09:42:00 CDT

13 lines

New Thread

[FAB] IST WWW link

[FAB] IST WWW link

D. Rooke

Sat, 9 Aug 1997 15:29:30 -0400

18 lines

New Thread

[TECHNET UNSUBSCRIBE]

[TECHNET UNSUBSCRIBE]

Eileen Ong

Fri, 8 Aug 1997 09:30:01 +0800

12 lines

New Thread

[TECHNET] Adhesive Printing

Re[2]: [TECHNET] Adhesive Printing

MCHAN

Tue, 26 Aug 1997 09:55:33 -0400

20 lines

New Thread

[TECHNET] FAB/ASSY: Thermal Vias

RE(2): [TECHNET] FAB/ASSY: Thermal Vias

<>

Fri, 8 Aug 1997 08:27:56 +0100

15 lines

New Thread

[TECHNET] Finish for wirebond

Re[2]: [TECHNET] Finish for wirebond

Paul Stolar

Thu, 14 Aug 1997 16:09:35 -0600

24 lines

New Thread

[TECHNET] Gold / Silver Incompatibility for Adhesives

Re[2]: [TECHNET] Gold / Silver Incompatibility for Adhesives

MCHAN

Thu, 7 Aug 1997 11:16:08 -0400

26 lines

New Thread

[TECHNET] PTH Troubleshooting- Search for Authors

Re[2]: [TECHNET] PTH Troubleshooting- Search for Authors

pcfab

Tue, 26 Aug 1997 13:27:34 -0800

20 lines

New Thread

[TECHNET] Rework cooling rate

Re[2]: [TECHNET] Rework cooling rate

MCHAN

Wed, 13 Aug 1997 11:47:25 -0400

24 lines

New Thread

[TECHNET] Solder mask material -Reply

Re[2]: [TECHNET] Solder mask material -Reply

TOM BRESNAN

Thu, 14 Aug 1997 17:42:41 PST

18 lines

New Thread

[TechNet] Unsubscribe

[TechNet] Unsubscribe

Terry Pearo

Fri, 22 Aug 1997 07:29:58 -0700

11 lines

New Thread

[T] Annular Ring Limits

Re: [T] Annular Ring Limits

Devitt, Ken

Thu, 28 Aug 1997 10:46:16 -0400

68 lines

Re: [T] Annular Ring Limits

<>

Wed, 27 Aug 1997 20:30:51 -0400

42 lines

New Thread

[T] Annular Ring/Non-Functional Lands/Misregistration

Re: [T] Annular Ring/Non-Functional Lands/Misregistration

<>

Fri, 29 Aug 1997 08:39:34 -0400

51 lines

New Thread

[T] Assy & Design SMT

Re: [T] Assy & Design SMT

<>

Thu, 21 Aug 1997 10:05:58 -0400

22 lines

New Thread

[T] Design: Half Oz Copper

Re: [T] Design: Half Oz Copper

<>

Tue, 19 Aug 1997 06:33:49 -0400

23 lines

New Thread

[T] Long Term Failures in Multilayer PCBs

Re: [T] Long Term Failures in Multilayer PCBs

<>

Thu, 21 Aug 1997 10:05:45 -0400

26 lines

New Thread

[T] PCB Failures

Re: [T] PCB Failures

<>

Fri, 29 Aug 1997 18:06:18 -0400

29 lines

New Thread

[T] Rework cooling rate

Re: [T] Rework cooling rate

<>

Sun, 17 Aug 1997 17:43:32 -0400

33 lines

New Thread

[T] Solder joint design

Re: [T] Solder joint design

<>

Fri, 29 Aug 1997 18:05:16 -0400

25 lines

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