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August 1997

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Subject:
From:
Jim Marsico 516-595-5879 <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Fri, 8 Aug 1997 11:01:00 -0400
Content-Type:
TEXT/PLAIN
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TEXT/PLAIN (20 lines)
Can anyone provide a basic rule of thumb for bare board cost savings when using
OSPs vs. HASL? (polyimide 8 layers)

Also, what benefits are realized in the assembly process?

Thanks,Jim Marsico
(516) 595-5879
[log in to unmask]

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