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August 1997

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Subject:
Re: micro bga
From:
Robert Schetty <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Fri, 8 Aug 1997 20:01:17 UT
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Yes, published data indicates that even at a gold thickness of 10 microinches
you'd have much less than 1% Au in the solder joint.

Rob Schetty
LeaRonal Inc.

----------
From:  TechNet Mail Forum on behalf of
[log in to unmask]
Sent:  Friday, August 08, 1997 2:50 PM
To:  [log in to unmask]
Subject:  Re: [TECHNET] micro bga

     Isn't it true that with gold flash your thickness of gold, usually
     less than 10 microinches, is such a small amount of gold that you
     would never get a 3% to 5% gold concentration in your solderjoint thus
     making gold embrittlement not an issue.


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Subject: Re: [TECHNET] micro bga
Author:  Non-HP-bwhite ([log in to unmask]) at HP-Vancouver,mimegw10

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