Agree with your points - in general the best wire bondable Ni/Au surface is
clean, rough but not too rough, and uncontaminated.  I have no quantitative
"roughness" information, unfortunately.

Rob Schetty
LeaRonal, Inc.

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From:  TechNet Mail Forum on behalf of Paul Stolar
Sent:  Thursday, August 14, 1997 6:10 PM
To:  [log in to unmask]
Subject:  [TECHNET] Re[2]: [TECHNET] Finish for wirebond

     One more problem is the quality of the gold. I had more problems with
     'shiny' gold. It is shiny because they add Hg to it. This plays havoc
     with wire bonding.

     I generally did not have problems bonding to smooth surfaces, assuming
     the gold was bonded to the nickel. That brings up another point,
     sometimes we saw contamination at the Ni-Au interface.


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Subject: Re: [TECHNET] Finish for wirebond
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