"Leslie O. Connally" <[log in to unmask]>: re: [TECHNET] Micro-organisms in rinses (3 Messages)
(Fab) IPC "B" Coupon (3 Messages)
(TechNet): Assy: Dewetting (1 Message)
(TECHNET)Temp peak (1 Message)
0.35 mm Drill Bits (2 Messages)
0603's on vias (2 Messages)
<No subject> (9 Messages)
? (1 Message)
A bit off topic (1 Message)
Accurate Gold Efficiency Test (1 Message)
Adhesive Printing (2 Messages)
ADMIN: ChipNet Moved to the new mailsystem. (1 Message)
ADMIN: ComplianceNet Moved to the new mail system. (1 Message)
ADMIN: IPCsm840 Moved to the new mailsystem. (1 Message)
ADMIN: Roadmap Moved to the new mailsystem. (1 Message)
ADMIN: TechNet Moved to the new mailsystem. (3 Messages)
ADMIN: Test Message - please disregard. (2 Messages)
ADMIN: Where are the archives? (1 Message)
ADVICE (1 Message)
Aluminium substrates (4 Messages)
Annular Ring Limits (8 Messages)
Annular ring relief and wave solder (1 Message)
Aqueous In-line Cleaner (4 Messages)
Artwork (1 Message)
Asm Shock/Vib. Specs. (4 Messages)
Asm: Shock and Vibration Specs (1 Message)
ASS/FAB Plating racks for Flexible circuit (2 Messages)
ASSEM: flux alone or flux with solder (2 Messages)
ASSEM: flux alone or flux with solder -Reply (2 Messages)
ASSEM: Installing RF Shielding Cans (2 Messages)
Assem: Procurement Manager and Component Engineer (2 Messages)
Assy & Design SMT (3 Messages)
ASSY: BENCH (HAND) CLEANING SURVEY (5 Messages)
ASSY: BENCH (HAND) CLEANING SURVEY -Reply (1 Message)
ASSY: Blowholes (1 Message)
Assy: bridges (1 Message)
Assy: bridges at wave soldereing (6 Messages)
Assy: bridges at wave soldering (1 Message)
Assy: Component Date Codes For solderability (4 Messages)
ASSY: Component Name (2 Messages)
ASSY: Component Name -Reply (1 Message)
Assy: Component Solder vs Assy Solder (3 Messages)
ASSY: Crest clean line AXAREL/Nickel incompatibility (2 Messages)
Assy: Mass Lead Trimmers (2 Messages)
assy: Micro BGA (1 Message)
Assy: Overtime efficiency studies (4 Messages)
Assy: Pad Design For Wave Solder (1 Message)
Assy: Pad Design For Wave Solder -Reply (1 Message)
Assy: Panasonic 8mm & 12 mm Feeder Problems (1 Message)
Assy: Rework Gold finger/Tab.. (2 Messages)
ASSY: screenprint doe/test board (3 Messages)
Assy: Solder usage statistics f/Wave Solder (2 Messages)
ASSY: Soldering to Nickel Plate (1 Message)
Assy: SPC for PCB assembly (5 Messages)
Assy: Various Questions on J-Std-001 (4 Messages)
ASSY:Blowholes, nonconforming defect or nonconforming process ind icator? (3 Messages)
ASSY:Solder mask staining (1 Message)
Automated Inspection for PCA's (2 Messages)
Automated Vision Equipment (2 Messages)
Bellcore TR-NWT-000078 (1 Message)
Best protection for gold plated edge connector (2 Messages)
BGA DFM (3 Messages)
BGA Reclamation (1 Message)
BGA Solder Ball Merge (1 Message)
BGA Solder Ball Migration (3 Messages)
BGA's peds reconstruction (2 Messages)
Buried Resistor (6 Messages)
cc:Mail Link to SMTP Undeliverable Message (1 Message)
CCA - Active? (2 Messages)
Chemicals for electroplating (1 Message)
Classroom Demo's (2 Messages)
Cleaning Baked Flux (4 Messages)
Cleaning Baked Flux -Reply (5 Messages)
Compositech, CL200+ (1 Message)
copper vias (1 Message)
Creating a interconnect with hard gold (1 Message)
Creating an interconnect of hard to access gol (2 Messages)
Creating an interconnect of hard to access gold pads (2 Messages)
CTE with CIC (2 Messages)
CuCl2 etchant (2 Messages)
CuMo (1 Message)
Cut and clinch systems (2 Messages)
DES, FAB: X-Outs (7 Messages)
DES: Electrical Test Inf. (7 Messages)
DES: Pads (2 Messages)
Design: Half Oz Copper (4 Messages)
DFM and DFT about BGAs (1 Message)
Die Attach (2 Messages)
Direct Plating Technologies (4 Messages)
disregard this message (1 Message)
Drumside Treated Foil (6 Messages)
EIC Viscometer and Others (1 Message)
EIC Viscometer and Others (fwd) (1 Message)
EIFCO DRILLING MACHINE (1 Message)
Electroless vs. electrolytic platings (1 Message)
Electrostatic dissipative (3 Messages)
entek (3 Messages)
Etch cuts and drilling of finished raw boards (3 Messages)
Etchant / Chemical Usage (1 Message)
Exactra Autoroll (1 Message)
EXCEPTIONS TO J-STD-001 (1 Message)
Exposed Copper on Gold Fingers Reliability (1 Message)
Exposed Copper on Gold Fingers Reliability: REPLY (1 Message)
FAB (2 Messages)
FAB - IPC response to report (2 Messages)
FAB- Post plasma Cleaning (2 Messages)
Fab/Assy: IST Test Method (1 Message)
FAB/ASSY: Thermal Vias (6 Messages)
Fab/Assy: Thermal Vias-more info (2 Messages)
FAB/DES:Molded Plastic Conductive Circuits? (4 Messages)
FAB: .006" PCB Fabricators Required. (2 Messages)
FAB: Board Material (3 Messages)
FAB: Clean Room environments (6 Messages)
FAB: Coefficients of Thermal Expansion (1 Message)
FAB: Copper-Invar-Copper (2 Messages)
FAB: Flexible circuit suppliers wanted (9 Messages)
FAB: IPC-6012 & Lifted Lands (3 Messages)
FAB: IST (5 Messages)
FAB: OSP COATINGS (5 Messages)
FAB: Reliability tests through ageing (1 Message)
FAB: Vacrel dryfilm laminator needed (3 Messages)
FAB: VIA FILL IN A CAVITY (1 Message)
FAB: Wire Bondable Au/Ni Etch Resist (1 Message)
FAB:Copper/Tin Build-up on Plating Racks (2 Messages)
Fabrication-RS274X (1 Message)
Failure Analysis, RF power FETs (3 Messages)
faraday cup (1 Message)
Finish for wirebond (4 Messages)
Flex PWB in SMT International 97 (1 Message)
Flexible Circuit Technology Book (1 Message)
Forums (1 Message)
Fusible Links (3 Messages)
Fusible Links -Reply (1 Message)
GDS 2 (2 Messages)
GEN: CAM Operator seeks your opinion. (2 Messages)
GEN: MATERIAL SOURCES (1 Message)
GEN: Where to Buy Bellcore Specs... (1 Message)
Getek (2 Messages)
GLASS BODY DIODES (3 Messages)
Gold / Silver Incompatibility for Adhesives (6 Messages)
gold ball bonding (3 Messages)
gold ball bonding -Reply (1 Message)
Gold Connector Thickness (2 Messages)
Gold Flash (1 Message)
Gold/Tin Mystery (1 Message)
HASL Equipment plus & minuses (2 Messages)
Help (3 Messages)
HELP HELP HELP (4 Messages)
High PIN Density PCB Design (1 Message)
Hole Filler (2 Messages)
how to pin gauge holes? (4 Messages)
how to remove silk screen (4 Messages)
how to remove silk screen -Reply (1 Message)
Idents before or after HASL-- Reply (1 Message)
Immersion Golde over Nickel for edge connectors (1 Message)
Information on Feed & Bleed systems (3 Messages)
Information on LT90 Specifications (2 Messages)
InnerLayers treatment (3 Messages)
Intermetallic of Cu-Ni-Sn/Pb (1 Message)
IPC "B" Coupon (1 Message)
IPC Printed Circuits Expo '98 (1 Message)
IPC-D-317A Crosstalk Equation Question (2 Messages)
IPCchat session announcement (1 Message)
IPCWorks '97 (1 Message)
J/STD Changes (1 Message)
Job listing (4 Messages)
JOHN OSULLIVAN <[log in to unmask]>: [TECHNET] Solder mask material (1 Message)
Just a Test, Please ignore. (1 Message)
Law suit & breast implants! (3 Messages)
Long Term Failures in Multilayer PCBs (5 Messages)
Looking for Literature (1 Message)
Metal finishing (2 Messages)
micro bga (8 Messages)
Micro-organisms in rinses (4 Messages)
MIL Standard 202 and 208 (1 Message)
MIL STD for Flex (2 Messages)
MIL-STD-2118 (1 Message)
Milliscopes / Boroscopes (1 Message)
Misregistration/Annular Ring (7 Messages)
Moisture in Liquid Nitrogen (2 Messages)
Moisture Sensative Components (2 Messages)
Moisture Sensitive Products (5 Messages)
Molded Plastic Circuits (2 Messages)
Nickel palladium (1 Message)
No Subject (1 Message)
No-clean (1 Message)
No-clean and OSP (1 Message)
No-clean flux query (7 Messages)
No-clean rework qualification (5 Messages)
No-clean VS Water soluable soldering (2 Messages)
no-clean wire solder and flux pen question (1 Message)
Np-clean flux (1 Message)
Optimum via size for test point use (1 Message)
Original C4 paper from IBM Journal (1969) (1 Message)
OSP coating (1 Message)
PCB baking (2 Messages)
PCB baking & Thermal cycles (2 Messages)
PCB Failures (3 Messages)
PCB Industry in Japan (3 Messages)
PCB Layout Services (1 Message)
PCB related questions (3 Messages)
Peel strength value Cu tracks (1 Message)
Photoplotter Information... (1 Message)
Photoresist Applications (1 Message)
Pin gage reference (3 Messages)
Please remove my name (1 Message)
PMC Bezels (1 Message)
Positive Etchback vs De-smear (1 Message)
Printable, Peelable Solder Masks (3 Messages)
Printable, Peelable Solder Masks (fwd) (1 Message)
PTH Troubleshooting- Search for Authors (2 Messages)
Pull test (2 Messages)
PWB Questions (2 Messages)
R Test Mesage (1 Message)
RE : OSP (1 Message)
Reduced oxide (2 Messages)
reflow standards for leaded devices (1 Message)
Reliability of reworked PCB's (1 Message)
repair of circuit traces (2 Messages)
Reply to press pin equipment query (1 Message)
Request (1 Message)
REVIEW Technet (1 Message)
Rework Cooling Rate (6 Messages)
RMA FLUX CORROSION ON PLASTIC PARTS (2 Messages)
Roku-Roku Sangyo, Ltd. (2 Messages)
rs274x (1 Message)
Sales Engineer position (1 Message)
Sales Position/Tech Service (2 Messages)
Saponifier - Armakleen (1 Message)
SELV Specification (1 Message)
Sequential Build Multilayer (1 Message)
SHADOW PROCESS (5 Messages)
Silver Cond. Ink (1 Message)
SIR test coupo (1 Message)
SIR test coupons (2 Messages)
SMOBC (1 Message)
SMT Plus Inc. (1 Message)
SNEC mtg (1 Message)
Solder joint design (2 Messages)
SOLDER JOINT PULL STRENGTH (2 Messages)
Solder mask m (1 Message)
Solder mask material (10 Messages)
Solder mask material -Reply (3 Messages)
solderability after baking (1 Message)
SSD technology (3 Messages)
Strip tin-lead (1 Message)
Subj: Alternative CCA Marking Labels (2 Messages)
SUBSCRIBE (5 Messages)
Subscription (1 Message)
SUPPLIER INFO --FLEX PLUS (1 Message)
Surface prep prior to solder mask (2 Messages)
Survey Input (1 Message)
Systronic Stencil Cleaner (1 Message)
telephone number (2 Messages)
telephone number -Reply (1 Message)
telephone number SMT PLUS (3 Messages)
Test Die and Substrate (1 Message)
Test, Please ignore (1 Message)
Test, please ignore, 970811-1 (1 Message)
test, please ignore. (1 Message)
Test,please ignore. (1 Message)
Testing only (1 Message)
Testing only -Reply (1 Message)
Testing Services (2 Messages)
Thermal Ties (1 Message)
Thermal ties aka spokes (2 Messages)
To Job Posters (2 Messages)
Training materials (1 Message)
TSOP susceptibility to temperature (1 Message)
UL Testing (2 Messages)
UNSUBSCRIBE (28 Messages)
unsubscribe try # 2 (1 Message)
Unsubscribe... (1 Message)
unsubskrive (1 Message)
Use of SMD shields for shielding pre reflow (ASSEM) (2 Messages)
used smt equipment (2 Messages)
Vendors for oxide treatment on copper laminates (1 Message)
Via hole/Pad size (13 Messages)
Via Inductance (4 Messages)
Vibration and Shock Summary (1 Message)
Virus warning (4 Messages)
Virus Warning Hoaxes (1 Message)
Water borne conformal coat (1 Message)
Water soluble paste slump (1 Message)
wave profile needed (2 Messages)
Wave Solder Books/Article Recommendations (1 Message)
Weld Repair of cores (2 Messages)
Welding Stamps? (2 Messages)
wet mask thickness gauge (5 Messages)
Wire Harness Tool (1 Message)
X-RAY DAMAGE TO COMPONENTS (3 Messages)
X-RAY DAMAGE TO COMPONENTS -Reply (2 Messages)
[2]SSD technology (1 Message)
[FAB] IST WWW link (1 Message)
[TECHNET UNSUBSCRIBE] (1 Message)
[TECHNET] Adhesive Printing (2 Messages)
[TECHNET] FAB/ASSY: Thermal Vias (1 Message)
[TECHNET] Finish for wirebond (2 Messages)
[TECHNET] Gold / Silver Incompatibility for Adhesives (4 Messages)
[TECHNET] PTH Troubleshooting- Search for Authors (1 Message)
[TECHNET] Rework cooling rate (1 Message)
[TECHNET] Solder mask material -Reply (1 Message)
[TechNet] Unsubscribe (1 Message)
[T] Annular Ring Limits (2 Messages)
[T] Annular Ring/Non-Functional Lands/Misregistration (1 Message)
[T] Assy & Design SMT (1 Message)
[T] Design: Half Oz Copper (1 Message)
[T] Long Term Failures in Multilayer PCBs (1 Message)
[T] PCB Failures (1 Message)
[T] Rework cooling rate (1 Message)
[T] Solder joint design (1 Message)