'Flip-over' Assembly Fixtures? (2 Messages)
.DSN files and OrCAD ViewDraw reader (5 Messages)
0201 Report available; proceeds to charity (1 Message)
0402 technology (2 Messages)
40871-2 transistors (2 Messages)
4101 / Sheets (6 Messages)
4101A & 4103 & L-125 (1 Message)
5DX vs. ICT (5 Messages)
5DX vs. ICT Responses (1 Message)
: electronic waste (1 Message)
<No subject> (6 Messages)
Accumulative tolerance for sub-panel (1 Message)
Adhesive (2 Messages)
Adhesive Recommendations? (17 Messages)
Adhesive Recommendations? Silicon?? (8 Messages)
Alox 2028D (6 Messages)
Anodize part washing (2 Messages)
Antw: [TN] Environmental Testing - parallel vs. sequential (2 Messages)
Antw: [TN] Intermetallic thickness (6 Messages)
Antw: [TN] Reliability Testing of PTH (2 Messages)
Antw: [TN] Solder (1 Message)
Antw: [TN] Vapor Phase Soldering ReVisited! (13 Messages)
Antw: [TN] Wave Solder/NoPb Question (1 Message)
APEX reflow oven claims (3 Messages)
Assembled Backplane Testing Definitions / Specifications (1 Message)
Assembly repair - Through hole (2 Messages)
Assessments (2 Messages)
attachments?? (1 Message)
Baking Boards (2 Messages)
Baking MSP components on Tape and Reel (4 Messages)
BETWEEN A ROCK AND MY CAVE (4 Messages)
BGA Rework Using Paste vs. No Paste (10 Messages)
bga's (2 Messages)
BGAs on alternative finishes (10 Messages)
Black Nickle IN ENIG Article (1 Message)
CAD Database file v/s Netlist file (4 Messages)
Cap with a termination issue (4 Messages)
Ceramic CSP's and BGA's in general (4 Messages)
Charcoal filters on ovens (5 Messages)
Circuit Test (7 Messages)
Class 1 to 3 (4 Messages)
Component Join Shear Test (2 Messages)
Conformal coat over Low solids flux (6 Messages)
connectors and hole diameters (12 Messages)
Covercoat Application Challenge (3 Messages)
Crystal Lead (3 Messages)
decapping molded tantalum caps (1 Message)
Defects terminology (7 Messages)
Delamination (3 Messages)
Dendritic growth or what? (4 Messages)
Dendritic Growth... (24 Messages)
Dendritic Growth...here's the link... (3 Messages)
Depanalizing mouse bite (3 Messages)
DFM Checklist for SMT product (1 Message)
Different CTE materials, what is the safe tolerance ? (17 Messages)
Doped Eutectic Solder Paste (1 Message)
Draft of Interview Questions (5 Messages)
Dupont CB100 VIA Plug and Delamination (2 Messages)
EARL ROCK MOON (1 Message)
Electroless nickel to electroplated copper separation (7 Messages)
ENIG black pad issues (8 Messages)
Environmental Testing - parallel vs. sequential (6 Messages)
ESD safe solder sucker (3 Messages)
Flipfet devices (3 Messages)
Flux Testing using Titration (5 Messages)
FR-04 questions (2 Messages)
HALT AND THE J LEAD IMAGE (3 Messages)
Here is the board buyers opportunity (7 Messages)
High Frequency Effects (2 Messages)
High temperature solder wire (7 Messages)
hole not to spec for compliant pins (1 Message)
How old is old? (8 Messages)
how old is too old? (1 Message)
Importance of good solder joint (1 Message)
INDEPENDENT TEST LABS FOR HALT/HAST (2 Messages)
Industry Standards (2 Messages)
input on pressing cPCI connectors (6 Messages)
Inspecting Wavesoldered bottom-side SMD joints (2 Messages)
Intermetallic thickness (1 Message)
IPC Expo 2002 - Plating Subcommittee 4-14 (1 Message)
IPC ISSUES CALL FOR PARTICIPATION FORLEAD-FREE ELECTRONIC ASSEMBLIES CONFERENCE (1 Message)
IPC News Release--IPC FILES COMMENTS ON EPA'S RCRA VISIONPAPER (1 Message)
IPC News Release--IPC UNVEILS WIRE HARNESS ACCEPTANCE STANDARD AT APEX® 2002 (1 Message)
IPC Printed Circuits Expo 2002 - Mark Your Calendar! (1 Message)
IPC/WHMA-A-620 cable/wire harness standard released! (1 Message)
Is this you guys? (3 Messages)
Joe Slanina/ASFMT is out of the office. (1 Message)
Just a note of interest concerning the DSP/CSP devices from TI (1 Message)
Just In Time deliveries (14 Messages)
Looking for Estimated price difference between 2 & 4 lay ers (Roger's) (1 Message)
Looking for Estimated price difference between 2 & 4 layers (Roger's) (1 Message)
Management forum? (4 Messages)
Many thanks (1 Message)
Micro lead frames (5 Messages)
Mil spec translation to IPC needed (2 Messages)
MIL-P-50884 and MIL-STD-2118 (10 Messages)
MILITARY STYLE ALMOST LCCC PARTS (10 Messages)
MLB - spotwelding (5 Messages)
mmDiameter, mmNumber of tubes in (1 Message)
Moisture Sensitive Devices (2 Messages)
MoonMan operating in an incompetent mode (1 Message)
MoonMan still incompetent but recovering (1 Message)
MOONMAN'S FREE PROCEDURES ARE IN THE FTP (3 Messages)
Nickel Passivation (3 Messages)
Nitrogen atmosphere reflow soldering: Costs & Benefits (3 Messages)
Nitrogen Reflow (3 Messages)
No Clean Process (6 Messages)
No No-clean? (20 Messages)
No Technical Content Whatsoever (12 Messages)
Not a new message - trying to answer the solder paste mixing question (1 Message)
ODB++ (4 Messages)
pads for so package and sop package? (3 Messages)
PCB Cross-sectional analysis service (2 Messages)
PCB Question (8 Messages)
PCB Question - Final Analysis is complete (3 Messages)
Plating Audit Template (4 Messages)
PLCC Sockets and Insertion Criteria (1 Message)
Porosity testing (2 Messages)
Preferred Probes for No Clean Processes (3 Messages)
PRESENTING POSSIBLE GOOD NEWS (1 Message)
PRESENTING THE BAD NEWS (1 Message)
Proving the reliability of a solder joint (10 Messages)
Pull strength on soldered clip (2 Messages)
Quality Engineer Interviews (11 Messages)
REALLY EXCITING STUFF AND A BUG IN MY CAVE (9 Messages)
Recall: [TN] Adhesive Recommendations? (1 Message)
Recycling of electronic waste (2 Messages)
Reference Designations (5 Messages)
Reflow heater zones, how many? (3 Messages)
Reflow Process (5 Messages)
RELIABILITY DATA/INFORMATION CORRELATED TO DESIG (1 Message)
RELIABILITY DATA/INFORMATION CORRELATED TO DESIGN RULES (9 Messages)
Reliability Testing of PTH (5 Messages)
requalification of expired flux-core solder (8 Messages)
Request for ENIG finish primer (2 Messages)
Safe processing window (8 Messages)
SCORE (3 Messages)
Semi Aqueous developers (3 Messages)
SET TechNet MAIL (1 Message)
Sign Off (1 Message)
Small Parts washer (2 Messages)
SMT COMPONENTS (2 Messages)
SNEC Meeting (2 Messages)
Solder (3 Messages)
Solder coating on terminations (2 Messages)
Solder Paste - When is Ambient Temperature Reached? (1 Message)
Solder Paste in through hole (1 Message)
solder pot (5 Messages)
Solder Preform Source (5 Messages)
Solder Projections (5 Messages)
Solder Spatter (3 Messages)
Solder spikes in wave soldering (2 Messages)
Soldering Defects (3 Messages)
Soldering Process (3 Messages)
Soldermask photo? (1 Message)
Some more free stuff on Seth's ftp site (3 Messages)
SOME MORE TI STUFF AND PICS TOO (1 Message)
SOME VERY INTERESTING STUFF AND REFLOW PROFILES TOO (3 Messages)
SOME VOIDING PICS (2 Messages)
Source for color dye to test BGA solder joints (2 Messages)
Source for solder (3 Messages)
Standards for testing (2 Messages)
Static conducive solder sucker (2 Messages)
Stencil Design and Documentation (4 Messages)
stripping insulation from polyu-nylon coated magnet wire (4 Messages)
Temporary delay at my web page... (1 Message)
Tests (1 Message)
thanks (1 Message)
The board looks funny... (14 Messages)
Thermal vias (2 Messages)
thermocouple (6 Messages)
timeline-Gantt chart (2 Messages)
Tolerance on padwidth (7 Messages)
Torque requirement (5 Messages)
Upper and lower specification limits (1 Message)
Upside down chip resistors (7 Messages)
Vacuolar porosity under leads (5 Messages)
Vapor Phase Soldering ReVisited! (6 Messages)
Via in Pad (2 Messages)
Via plug reliability impacts (1 Message)
Via size (2 Messages)
warranty (5 Messages)
Water soluble w/BGA (4 Messages)
What is GinselC1/C1? (2 Messages)
What is the going price companies buy your tugnsten carb ide scrap? (1 Message)
Where's Brian? (4 Messages)
Where's your cleaning equipment? (6 Messages)
[IPC_NR] IPC New Releases (1 Message)
[TN] Re: IPC News Release--IPC UNVEILS WIRE HARNESS ACCEPTANCE STANDARD AT APEX® 2002 (1 Message)
[TN] The board looks funny... (2 Messages)
[TN] Tolerance on padwidth (1 Message)