Hi Lee,
I cannot concur with your advice.


Vibration: JESD22-B103-A Vibration, Variable Frequency

                MIL-STD 883; Test Methods 2005.2, 2006.1, 2007.2
IMHO: these can make an excellent screening process for poorly soldered SJs,
but are not tests that either will prove or disprove product reliability.


Thermal Cycling: JESD22-A104-A Temperature Cycling

                          MIL-STD 883; Test Method 1010.7
IMHO: the latter document has never served the military very well as far as
SJ reliability is concerned--it is for this reason that programs like AVIP
were developed; the former is on a better track but has some technical
deficiencies, that is why IPC-9701 was developed.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com

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