LISTSERV mailing list manager LISTSERV 16.0

Help for TECHNET Archives


TECHNET Archives

TECHNET Archives


August 2001


View:

Show Author | Hide Author
Show Table of Contents | Hide Table of Contents

 

Table of Contents:

Cc'M(1kJ;'98e OC~qD;<; z (1 message)
"b" stage epoxy (3 messages)
''Encapsulating/Potting PCB Assemblies" (8 messages)
0.5 mm pitch components and soldermask relief (5 messages)
0201 chip process questions (2 messages)
0603 land pattern debate (4 messages)
6-pin DIP Optocoupler problem... (10 messages)
<No subject given> (1 message)
<No subject> (6 messages)
Additive Trace Repair (2 messages)
Administrator Test Msg--pls delete (2 messages)
Alkaline etchant source (3 messages)
Any DEK 288 users? (1 message)
Any MELF experts? (2 messages)
AOI equipment (6 messages)
Application of Thermal Grease (6 messages)
Assemblies using ceramic substrates... (3 messages)
Assembly Inspection/verification. (7 messages)
ATG Tester - Help (2 messages)
Atotech (1 message)
AW: [TN] Connector tilt, acceptable or not? (1 message)
AW: [TN] Interesting Coplanarity ? (2 messages)
AW: [TN] Misplace component (4 messages)
AW: [TN] P&P can't locate fiducials (1 message)
AW: [TN] Package consultants with electronics background (1 message)
AW: [TN] phenomenon with Ni/Au plating (2 messages)
AW: [TN] SMD Assembly Problems (1 message)
AW: [TN] Solder Shorts in PBGA (1 message)
Back-side Device Metallization (2 messages)
Bench REL equipments (4 messages)
Bench top spray etcher (1 message)
BGA and X-ray (9 messages)
BGA Bow (4 messages)
BGA DFM Guidelines? (2 messages)
BGA Inspection (4 messages)
BGA PCB mounting material thickness (4 messages)
BGA Re-balling services in Asia (3 messages)
Bisumth Solder (Sn43Pb43Bi14) (2 messages)
Board assm. shops doing BGA/CSPs and small volumes (2 messages)
Board layout service (2 messages)
Breathers in sealed automotive products (1 message)
Call for Paper - IPC Printed Circuits Expo 2002 (1 message)
Capacitor 0603 vs 0402 (5 messages)
Capacitor 0603 vs 0402...why not networks and arrays? (12 messages)
cc: MAIL Reminder (1 message)
cCc'M(1{wkJ;'xx98e%ue OC~qgD;n<;{ {z (1 message)
Cleaning under BGAs (3 messages)
Cleanliness evaluation! (8 messages)
Cleanliness evaluation! Definition of an Expert (Xspurt) (6 messages)
Component skew after reflow (4 messages)
Connector tilt, acceptable or not? (7 messages)
consideration the results of any (1 message)
Contamination Concern after Strip (5 messages)
Cooling rates for solder reflow processes (8 messages)
Cost effective Standard via size. (3 messages)
Delta Tg of IC substrate (1 message)
Design Certification (1 message)
Design Certification - Correction (1 message)
design pads for chip resistors and capacitors (8 messages)
Determining the Inner metallic bond on a surface mount c onnector (1 message)
Determining the Inner metallic bond on a surface mount connector (2 messages)
Dewetting (2 messages)
DPMO calculations (2 messages)
Easy Thursday Question! (7 messages)
Electroless nickel/Immersion Gold Thickness (1 message)
Electronic Circuits World Convention 9 Call for papers (1 message)
Encoder with contamination.Soldering or Supplier process . (2 messages)
Encoder with contamination.Soldering or Supplier process. (4 messages)
ERROR (1 message)
ESD smocks in high temperature and humidity level (4 messages)
Expiration date for soft gold surface plating (2 messages)
Expiry date for soft Ni/Au finished BGA (1 message)
Fab thickness Measurement (2 messages)
FAB. Cleaning stainless steel multilayer bonding shims. (1 message)
Fallout (12 messages)
FDA approval (3 messages)
Fiducials (6 messages)
Flatness measure & solder mask registration. (1 message)
Flip Chip flex circuit (3 messages)
Flowsolder pallet manufacture (1 message)
FMA Labs in Northeast US (2 messages)
Fuji IP3 feeders (2 messages)
FW: IPC Class 2 vs Class 3 Price Considerations (1 message)
FW: [TN] lightspeed adhesive (1 message)
Gel time test & thermalmeter (1 message)
Gold Tin Solder (2 messages)
Gold/Paste (5 messages)
Gold/Paste and Immersion Gold (1 message)
HAL contaminant levels (2 messages)
HASL (2 messages)
HASL Thickness (5 messages)
Heinz Mader/NMADEH/CH/Ascom ist auer Haus. (1 message)
HELP !! horizontal lines for flex innerlayers- oxide substitution (1 message)
HELP !! horizontal lines for flex innerlayers- oxidesubstitution (1 message)
Hermeticity and Cleanliness (4 messages)
Hi-pot test (2 messages)
High aspect ratio via qualification (1 message)
High Flow Laminating Resin (1 message)
horizontal lines for flex innerlayers- oxide substitution (1 message)
Howefill and Howefilm (2 messages)
HP TEST CREDIT BUTTONS (1 message)
Immersion gold with hard gold fingers (1 message)
Info required on thick Jedec Trays (2 messages)
Information regarding the various types of gold deposits (1 message)
Interesting Coplanarity ? (2 messages)
Ionics again. (4 messages)
IPC 600 (7 messages)
IPC Class 2 vs Class 3 Price Considerations (2 messages)
IPC HDI types (2 messages)
IPC-D-356 (2 messages)
IPC/EIA J-STD-006 Released (1 message)
Labeling of bottles in statis safe area (5 messages)
Labelling of bottles in statis safe area (1 message)
Laser Drilling (2 messages)
Leading Edge Supplier Search (4 messages)
lightspeed adhesive (2 messages)
Lisa Greenleaf/NNH/Teradyne is out of the office. (1 message)
Longtime storage conditions for assemblies (1 message)
Looking for board level failure analysis (1 message)
Looking for Jerry Hartman & John Garcia... (1 message)
Looking for short movie of a BGA self-centering (6 messages)
Material specification (3 messages)
Material specification (7781 E-glass) (1 message)
Mfg Capability (3 messages)
Microvia in BGA pad (2 messages)
Misplace component (2 messages)
Moisture Sensitive Component Handling & Identification (7 messages)
MONSTER board!!! (5 messages)
New Zealand Chapter Formation Meeting Notice (1 message)
New Zealand now has a new DC chapter! (2 messages)
Ni/Au Plating Question (14 messages)
Ni/Au Plating Question--Returns (3 messages)
Nitrogen Purity for SMT IR Reflow (2 messages)
No-clean solder wire (3 messages)
NTC: Just a thanks about BGA/ X-ray question posted earlier (1 message)
Off-Topic - coatings for airplane-home (13 messages)
Out of office (1 message)
out of the office. (1 message)
P&P can't locate fiducials (6 messages)
Package consultants with electronics background (1 message)
Packaging Instructions for finished Electronic Assemblies (2 messages)
pad geometry (2 messages)
Panelized Boards (4 messages)
PCB Moisture Absorption (4 messages)
phenomenon with Ni/Au plating (3 messages)
photoplotting service (2 messages)
Pin Grid Pin Allignment (1 message)
plastic fingers (2 messages)
plastic fingers for wave solder (1 message)
PRCL RDSon Fallouts (1 message)
Pre assembly conditioning (2 messages)
Pre-preg and Core Material Thicknesses (2 messages)
Process Problem vs Board Problem (7 messages)
PWB supplier search (1 message)
Questions (1 message)
Re: [TN] ãCc'M( 1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz (1 message)
Reliability of reflowed solder to dissipate heat via RF IC heat s lug (2 messages)
Reminder - IPC ENIG standard review deadline (1 message)
REQUEST IPC-4552 (1 message)
Rework (4 messages)
Rework of SMA connector (1 message)
Rework Specification (2 messages)
Rod Smith/Endicott/IBM is out of the office. (1 message)
RTV and weight requirements... (5 messages)
Searching for reflow oven manufacturer or user (3 messages)
self-centering SMT (9 messages)
Sheet Adhesive Suppliers (7 messages)
SMD Assembly Problems (4 messages)
SMT adhesive (1 message)
SMT Epoxies? (1 message)
SMT Pads (3 messages)
Solder analysis results (15 messages)
solder balls (7 messages)
Solder Beads (not solder balls) (9 messages)
Solder conditions (6 messages)
Solder mask Clerance ...who should do it? (1 message)
Solder Paste Measurements (4 messages)
solder paste with 2% silver (1 message)
Solder Shorts in PBGA (1 message)
Solder Testing (4 messages)
Solder vs Gold Pads on SMT (13 messages)
Soldering 36 pins LCD by flat tip soldering iron (2 messages)
Soldering SMT components (1 message)
Soldering to palladium silver (3 messages)
soldr balls (3 messages)
SPC software for Lab (2 messages)
Spray Fluxer (5 messages)
Stepped Stencil (6 messages)
SV: [TN] Immersion gold with hard gold fingers (1 message)
T/H Capacitor Removal- IPC standards? (8 messages)
Teflon board price (1 message)
Tenting of vias (6 messages)
The effective test method of the expired prepreg. (2 messages)
Thermal Compound considerations (4 messages)
Thermal Grease (4 messages)
thermal interface material (11 messages)
Tin Plating bath (not clear anymore) (9 messages)
Tin/Silver plating (1 message)
To wave or not to wave, that is the question... (15 messages)
Tombstoning (3 messages)
total PWB production (1 message)
Tropicalisation (8 messages)
Uralite (3 messages)
UV and Flex (3 messages)
VIAS in pads... (11 messages)
virus (1 message)
VME Spec and press fit DIN connector (3 messages)
Wavesoldering SOIC's (9 messages)
Wetting Agents (7 messages)
White Tin (10 messages)
White Tin/MSA ? (1 message)
Your survey support is requested (moisture sensitive component testing) (1 message)
[LF] Eutectic alloys????? (3 messages)
[TN] ãCc'M(1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz (1 message)
[TN] Re: [TN] ãCc'M( 1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz (1 message)
[TN] Re: [TN] ãCc'M(1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz (1 message)
[TN] RE: [TN] Re: [TN] ãCc'M( 1û ÷kJ;'øø98å¥õe OC~qçD;î<;û ûz (1 message)
[TN] RE: [TN] Re: [TN] ãCc'M(1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz (1 message)
[TN] RE: [TN] [TN]RE: [TN] Re: [TN] ãCc'M( 1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz (1 message)
[TN] [TN]RE: [TN] Re: [TN] ãCc'M( 1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz (1 message)
[TN]RE: [TN] Re: [TN] ãCc'M( 1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz (1 message)
[TN]RE: [TN] Re: [TN] ãCc'M( 1û÷kJ;'øø98å¥õe OC~qçD; (2 messages)

LISTSERV Archives

LISTSERV Archives

TECHNET Home

TECHNET Home

Subject Sorted by Subject, Chronologically

From

Date

Size

New Thread

Cc'M(1kJ;'98e OC~qD;<; z

Cc'M(1kJ;'98e OC~qD;<; z

<[log in to unmask]>

Wed, 29 Aug 2001 07:46:47 -0500

23 lines

New Thread

Re:

Mike Fenner <[log in to unmask]>

Tue, 7 Aug 2001 14:00:22 +0100

102 lines

Re:

Brian Ellis <[log in to unmask]>

Wed, 15 Aug 2001 13:28:35 +0300

71 lines

Re:

Grant Emandien <[log in to unmask]>

Wed, 15 Aug 2001 13:52:06 +0200

148 lines

Re:

Brian Ellis <[log in to unmask]>

Wed, 15 Aug 2001 15:39:38 +0300

155 lines

Re:

[log in to unmask]

Wed, 15 Aug 2001 08:47:14 -0500

55 lines

Re:

Crepeau, Phil <[log in to unmask]>

Wed, 15 Aug 2001 07:36:22 -0700

138 lines

Re:

Brian Ellis <[log in to unmask]>

Wed, 15 Aug 2001 19:02:31 +0300

111 lines

Re:

David Douthit <[log in to unmask]>

Wed, 15 Aug 2001 09:09:58 -0700

154 lines

Re:

Brian Ellis <[log in to unmask]>

Sat, 25 Aug 2001 10:18:59 +0300

85 lines

Re:

Jack Crawford <[log in to unmask]>

Mon, 27 Aug 2001 16:03:27 -0500

192 lines

New Thread

"b" stage epoxy

"b" stage epoxy

James W. High <[log in to unmask]>

Fri, 3 Aug 2001 14:52:41 -0400

32 lines

Re: "b" stage epoxy

Mike Fenner <[log in to unmask]>

Tue, 7 Aug 2001 13:26:38 +0100

74 lines

Re: "b" stage epoxy

Jeff Ferry <[log in to unmask]>

Tue, 7 Aug 2001 08:37:21 -0500

77 lines

New Thread

''Encapsulating/Potting PCB Assemblies"

''Encapsulating/Potting PCB Assemblies"

John Fahey <[log in to unmask]>

Thu, 16 Aug 2001 09:56:32 -0500

29 lines

Re: ''Encapsulating/Potting PCB Assemblies"

Nale, Tim <[log in to unmask]>

Thu, 16 Aug 2001 10:33:12 -0500

173 lines

Re: ''Encapsulating/Potting PCB Assemblies"

Phil Nutting <[log in to unmask]>

Thu, 16 Aug 2001 12:07:10 -0400

121 lines

Re: ''Encapsulating/Potting PCB Assemblies"

David Douthit <[log in to unmask]>

Thu, 16 Aug 2001 09:47:54 -0700

57 lines

Re: ''Encapsulating/Potting PCB Assemblies"

Mike Di Giacomo <[log in to unmask]>

Thu, 16 Aug 2001 13:15:21 -0400

73 lines

Re: ''Encapsulating/Potting PCB Assemblies"

Crepeau, Phil <[log in to unmask]>

Thu, 16 Aug 2001 13:28:17 -0700

54 lines

Re: ''Encapsulating/Potting PCB Assemblies"

Phil Nutting <[log in to unmask]>

Thu, 16 Aug 2001 17:04:32 -0400

108 lines

Re: ''Encapsulating/Potting PCB Assemblies"

John Fahey <[log in to unmask]>

Thu, 16 Aug 2001 14:09:56 -0700

165 lines

New Thread

0.5 mm pitch components and soldermask relief

0.5 mm pitch components and soldermask relief

phil bavaro <[log in to unmask]>

Wed, 1 Aug 2001 09:15:43 -0700

87 lines

Re: 0.5 mm pitch components and soldermask relief

Tony Steinke <[log in to unmask]>

Wed, 1 Aug 2001 15:49:24 -0400

120 lines

Re: 0.5 mm pitch components and soldermask relief

Thomas Bauer <[log in to unmask]>

Wed, 1 Aug 2001 13:30:16 -0700

147 lines

Re: 0.5 mm pitch components and soldermask relief

Erickson, Gary <[log in to unmask]>

Wed, 1 Aug 2001 16:43:08 -0400

362 lines

Re: 0.5 mm pitch components and soldermask relief

Thomas Bauer <[log in to unmask]>

Wed, 1 Aug 2001 14:01:36 -0700

210 lines

New Thread

0201 chip process questions

0201 chip process questions

phil bavaro <[log in to unmask]>

Wed, 29 Aug 2001 13:00:20 -0700

41 lines

Re: 0201 chip process questions

pratap singh <[log in to unmask]>

Wed, 29 Aug 2001 15:29:16 -0500

65 lines

New Thread

0603 land pattern debate

0603 land pattern debate

Braime, Justin <[log in to unmask]>

Fri, 31 Aug 2001 10:13:35 +0100

63 lines

Re: 0603 land pattern debate

Safavi-Bayat Shahed <[log in to unmask]>

Fri, 31 Aug 2001 07:34:46 -0400

110 lines

Re: 0603 land pattern debate

Roger M. Stoops <[log in to unmask]>

Fri, 31 Aug 2001 09:06:36 -0400

143 lines

Re: 0603 land pattern debate

Greg Scott <[log in to unmask]>

Fri, 31 Aug 2001 08:14:34 -0700

138 lines

New Thread

6-pin DIP Optocoupler problem...

6-pin DIP Optocoupler problem...

Stephen R. Gregory <[log in to unmask]>

Mon, 13 Aug 2001 14:40:14 EDT

96 lines

Re: 6-pin DIP Optocoupler problem...

Creswick, Steven <[log in to unmask]>

Mon, 13 Aug 2001 16:04:00 -0400

165 lines

Re: 6-pin DIP Optocoupler problem...

[log in to unmask]

Mon, 13 Aug 2001 15:49:59 -0500

31 lines

Re: 6-pin DIP Optocoupler problem...

Stephen R. Gregory <[log in to unmask]>

Mon, 13 Aug 2001 17:03:31 EDT

99 lines

Re: 6-pin DIP Optocoupler problem...

Charles Caswell <[log in to unmask]>

Mon, 13 Aug 2001 16:03:38 -0500

189 lines

Re: 6-pin DIP Optocoupler problem...

Guy Ramsey <[log in to unmask]>

Mon, 13 Aug 2001 17:02:33 -0400

180 lines

Re: 6-pin DIP Optocoupler problem...

Mark Ross <[log in to unmask]>

Tue, 14 Aug 2001 00:54:38 -0400

221 lines

Re: 6-pin DIP Optocoupler problem...

John Brewer <[log in to unmask]>

Tue, 14 Aug 2001 08:30:09 -0400

37 lines

Re: 6-pin DIP Optocoupler problem...

Kathy Kuhlow <[log in to unmask]>

Tue, 14 Aug 2001 09:44:31 -0500

69 lines

Re: 6-pin DIP Optocoupler problem...

Dean Lillibridge <[log in to unmask]>

Wed, 15 Aug 2001 10:50:21 -0400

235 lines

New Thread

<No subject given>

Re: <No subject given>

Neil Atkinson <[log in to unmask]>

Wed, 15 Aug 2001 13:18:52 +0100

102 lines

New Thread

<No subject>

<No subject>

Grant Emandien <[log in to unmask]>

Fri, 3 Aug 2001 17:06:57 +0200

38 lines

<No subject>

Grant Emandien <[log in to unmask]>

Wed, 15 Aug 2001 11:33:02 +0200

43 lines

<No subject>

lab <[log in to unmask]>

Thu, 16 Aug 2001 06:27:57 -0700

32 lines

<No subject>

Ken Mc Gowan <[log in to unmask]>

Wed, 22 Aug 2001 20:20:43 -0100

43 lines

<No subject>

richard wiltron <[log in to unmask]>

Fri, 24 Aug 2001 14:41:32 -0700

34 lines

<No subject>

Grant Emandien <[log in to unmask]>

Mon, 27 Aug 2001 09:59:11 +0200

39 lines

New Thread

Additive Trace Repair

Additive Trace Repair

JinSee Goh <[log in to unmask]>

Tue, 14 Aug 2001 08:55:19 +0800

69 lines

Re: Additive Trace Repair

Furrow, Robert Gordon (Bob) <[log in to unmask]>

Tue, 14 Aug 2001 08:41:02 -0400

117 lines

New Thread

Administrator Test Msg--pls delete

Administrator Test Msg--pls delete

Jack Crawford <[log in to unmask]>

Mon, 6 Aug 2001 17:02:06 -0500

53 lines

Re: Administrator Test Msg--pls delete

Edwards, Ted A (AZ75) <[log in to unmask]>

Tue, 7 Aug 2001 06:35:15 -0700

33 lines

New Thread

Alkaline etchant source

Alkaline etchant source

Dan Brandler <[log in to unmask]>

Thu, 23 Aug 2001 15:15:08 -0700

31 lines

Re: Alkaline etchant source

<Rudy Sedlak> <[log in to unmask]>

Thu, 23 Aug 2001 18:54:40 EDT

38 lines

Re: Alkaline etchant source

Dennis Fritz <[log in to unmask]>

Thu, 23 Aug 2001 23:07:07 EDT

40 lines

New Thread

Any DEK 288 users?

Any DEK 288 users?

Stephen R. Gregory <[log in to unmask]>

Tue, 28 Aug 2001 14:00:53 EDT

48 lines

New Thread

Any MELF experts?

Any MELF experts?

Howard Watson <[log in to unmask]>

Thu, 30 Aug 2001 09:58:18 -0400

55 lines

Re: Any MELF experts?

Charles Caswell <[log in to unmask]>

Thu, 30 Aug 2001 09:27:58 -0500

108 lines

New Thread

AOI equipment

AOI equipment

praveen kumar manjeshwar <[log in to unmask]>

Fri, 31 Aug 2001 00:18:31 +0000

34 lines

Re: AOI equipment

Richard Hamilton <[log in to unmask]>

Thu, 30 Aug 2001 18:08:02 -0700

63 lines

Re: AOI equipment

Larry Koens <[log in to unmask]>

Fri, 31 Aug 2001 07:11:14 -0500

113 lines

Re: AOI equipment

Stephen Brown <[log in to unmask]>

Fri, 31 Aug 2001 13:53:38 +0100

64 lines

Re: AOI equipment

Glenn Woodhouse <[log in to unmask]>

Fri, 31 Aug 2001 17:33:29 -0600

170 lines

Re: AOI equipment

Stephen R. Gregory <[log in to unmask]>

Fri, 31 Aug 2001 20:34:17 EDT

70 lines

New Thread

Application of Thermal Grease

Application of Thermal Grease

Phil Nutting <[log in to unmask]>

Tue, 14 Aug 2001 11:42:09 -0400

32 lines

Re: Application of Thermal Grease

Jim Gleason <[log in to unmask]>

Tue, 14 Aug 2001 12:25:36 -0700

60 lines

Re: Application of Thermal Grease

Creswick, Steven <[log in to unmask]>

Tue, 14 Aug 2001 13:30:27 -0400

75 lines

Re: Application of Thermal Grease

Hann Pang <[log in to unmask]>

Tue, 14 Aug 2001 13:12:49 -0500

73 lines

Re: Application of Thermal Grease

Dorothy M. Lush <[log in to unmask]>

Tue, 14 Aug 2001 11:38:56 -0700

63 lines

Re: Application of Thermal Grease

Mike Fenner <[log in to unmask]>

Wed, 15 Aug 2001 15:29:45 +0100

77 lines

New Thread

Assemblies using ceramic substrates...

Assemblies using ceramic substrates...

Stephen R. Gregory <[log in to unmask]>

Fri, 17 Aug 2001 19:56:30 EDT

78 lines

Re: Assemblies using ceramic substrates...

Mike Di Giacomo <[log in to unmask]>

Fri, 17 Aug 2001 20:12:27 -0400

134 lines

Re: Assemblies using ceramic substrates...

Mike Fenner <[log in to unmask]>

Mon, 20 Aug 2001 08:59:38 +0100

218 lines

New Thread

Assembly Inspection/verification.

Assembly Inspection/verification.

Jack Bryant <[log in to unmask]>

Fri, 10 Aug 2001 22:21:15 -0400

68 lines

Re: Assembly Inspection/verification.

Richard Hamilton <[log in to unmask]>

Sat, 11 Aug 2001 09:05:00 -0700

79 lines

Re: Assembly Inspection/verification.

Marsico, James <[log in to unmask]>

Mon, 13 Aug 2001 07:06:58 -0400

52 lines

Re: Assembly Inspection/verification.

Jim Gleason <[log in to unmask]>

Mon, 13 Aug 2001 10:06:10 -0700

112 lines

Re: Assembly Inspection/verification.

Rick Thompson <[log in to unmask]>

Mon, 13 Aug 2001 08:06:00 -0700

113 lines

Re: Assembly Inspection/verification.

Vanderhoof, Brad <[log in to unmask]>

Mon, 13 Aug 2001 09:11:01 -0700

48 lines

Re: Assembly Inspection/verification.

Jason Gregory <[log in to unmask]>

Mon, 13 Aug 2001 12:32:25 -0500

75 lines

New Thread

ATG Tester - Help

ATG Tester - Help

Brian Vascukynas <[log in to unmask]>

Wed, 22 Aug 2001 16:24:10 -0400

32 lines

Re: ATG Tester - Help

Erat, Wolfgang <[log in to unmask]>

Thu, 23 Aug 2001 10:12:07 -0400

165 lines

New Thread

Atotech

Atotech

Dan Brandler <[log in to unmask]>

Mon, 13 Aug 2001 09:46:17 -0700

28 lines

New Thread

AW: [TN] Connector tilt, acceptable or not?

AW: [TN] Connector tilt, acceptable or not?

Busko, Wolfgang <[log in to unmask]>

Wed, 15 Aug 2001 11:57:15 +0200

89 lines

New Thread

AW: [TN] Interesting Coplanarity ?

AW: [TN] Interesting Coplanarity ?

Busko, Wolfgang <[log in to unmask]>

Wed, 15 Aug 2001 13:39:07 +0200

70 lines

Re: AW: [TN] Interesting Coplanarity ?

LI YUAN <[log in to unmask]>

Wed, 15 Aug 2001 11:30:23 -0600

96 lines

New Thread

AW: [TN] Misplace component

AW: [TN] Misplace component

Busko, Wolfgang <[log in to unmask]>

Wed, 15 Aug 2001 13:22:27 +0200

47 lines

AW: [TN] Misplace component

Busko, Wolfgang <[log in to unmask]>

Thu, 16 Aug 2001 10:33:53 +0200

137 lines

Re: AW: [TN] Misplace component

<Leonel Jay J. Manuel> <[log in to unmask]>

Fri, 17 Aug 2001 10:49:33 +0800

198 lines

Re: AW: [TN] Misplace component

Lush, Dorothy <[log in to unmask]>

Fri, 17 Aug 2001 08:49:34 -0700

274 lines

New Thread

AW: [TN] P&P can't locate fiducials

AW: [TN] P&P can't locate fiducials

Busko, Wolfgang <[log in to unmask]>

Tue, 21 Aug 2001 14:40:59 +0200

105 lines

New Thread

AW: [TN] Package consultants with electronics background

AW: [TN] Package consultants with electronics background

Busko, Wolfgang <[log in to unmask]>

Thu, 23 Aug 2001 13:57:43 +0200

43 lines

New Thread

AW: [TN] phenomenon with Ni/Au plating

AW: [TN] phenomenon with Ni/Au plating

Busko, Wolfgang <[log in to unmask]>

Mon, 27 Aug 2001 11:17:34 +0200

110 lines

AW: [TN] phenomenon with Ni/Au plating

Busko, Wolfgang <[log in to unmask]>

Mon, 27 Aug 2001 17:41:43 +0200

107 lines

New Thread

AW: [TN] SMD Assembly Problems

AW: [TN] SMD Assembly Problems

Busko, Wolfgang <[log in to unmask]>

Tue, 28 Aug 2001 10:06:48 +0200

109 lines

New Thread

AW: [TN] Solder Shorts in PBGA

AW: [TN] Solder Shorts in PBGA

Busko, Wolfgang <[log in to unmask]>

Tue, 28 Aug 2001 13:43:48 +0200

85 lines

New Thread

Back-side Device Metallization

Back-side Device Metallization

Creswick, Steven <[log in to unmask]>

Mon, 13 Aug 2001 16:20:40 -0400

46 lines

Re: Back-side Device Metallization

Mike Fenner <[log in to unmask]>

Tue, 14 Aug 2001 09:11:49 +0100

91 lines

New Thread

Bench REL equipments

Bench REL equipments

Jonathan A Noquil <[log in to unmask]>

Thu, 23 Aug 2001 19:52:02 +0800

23 lines

Re: Bench REL equipments

David Douthit <[log in to unmask]>

Thu, 23 Aug 2001 13:54:58 -0700

46 lines

Re: Bench REL equipments

Jonathan A Noquil <[log in to unmask]>

Fri, 24 Aug 2001 07:34:42 +0800

95 lines

Re: Bench REL equipments

Pelkey, Glenn <[log in to unmask]>

Fri, 24 Aug 2001 08:19:04 -0700

380 lines

New Thread

Bench top spray etcher

Bench top spray etcher

Dan Brandler <[log in to unmask]>

Mon, 20 Aug 2001 17:09:55 -0700

29 lines

New Thread

BGA and X-ray

BGA and X-ray

Kathy Kuhlow <[log in to unmask]>

Wed, 8 Aug 2001 13:42:40 -0500

57 lines

Re: BGA and X-ray

Tom Parkinson - Quality System Manager <[log in to unmask]>

Wed, 8 Aug 2001 15:13:12 -0400

44 lines

Re: BGA and X-ray

Jeff Ferry <[log in to unmask]>

Wed, 8 Aug 2001 15:18:36 -0400

53 lines

Re: BGA and X-ray

Misner, Bruce <[log in to unmask]>

Wed, 8 Aug 2001 13:44:34 -0600

45 lines

Re: BGA and X-ray

[log in to unmask]

Wed, 8 Aug 2001 15:02:02 -0500

85 lines

Re: BGA and X-ray

Larry Koens <[log in to unmask]>

Wed, 8 Aug 2001 15:06:59 -0500

84 lines

Re: BGA and X-ray

Mark Ross <[log in to unmask]>

Wed, 8 Aug 2001 16:58:27 -0400

115 lines

Re: BGA and X-ray

McFaddin, Wade <[log in to unmask]>

Wed, 8 Aug 2001 18:38:07 -0500

80 lines

Re: BGA and X-ray

JinSee Goh <[log in to unmask]>

Thu, 9 Aug 2001 08:01:32 +0800

358 lines

New Thread

BGA Bow

BGA Bow

Rick Howieson <[log in to unmask]>

Tue, 28 Aug 2001 09:36:00 -0600

23 lines

Re: BGA Bow

Brad Saunders <[log in to unmask]>

Wed, 29 Aug 2001 18:37:31 EDT

50 lines

Re: BGA Bow

Gregorio M. Antonio <[log in to unmask]>

Thu, 30 Aug 2001 13:56:51 +0800

56 lines

Re: BGA Bow

Rick Howieson <[log in to unmask]>

Thu, 30 Aug 2001 08:13:26 -0600

84 lines

New Thread

BGA DFM Guidelines?

BGA DFM Guidelines?

Rick Thompson <[log in to unmask]>

Wed, 29 Aug 2001 09:20:15 -0700

38 lines

Re: BGA DFM Guidelines?

Mel Parrish <[log in to unmask]>

Wed, 29 Aug 2001 12:39:29 -0700

73 lines

New Thread

BGA Inspection

BGA Inspection

Bill Davis <[log in to unmask]>

Thu, 2 Aug 2001 13:22:51 EDT

26 lines

Re: BGA Inspection

Lee Whiteman <[log in to unmask]>

Thu, 2 Aug 2001 14:26:08 -0400

75 lines

Re: BGA Inspection

Jason Gregory <[log in to unmask]>

Thu, 2 Aug 2001 13:42:21 -0500

103 lines

Re: BGA Inspection

Jon Moore <[log in to unmask]>

Fri, 3 Aug 2001 17:47:20 EDT

27 lines

New Thread

BGA PCB mounting material thickness

BGA PCB mounting material thickness

Malewicz Wesley <[log in to unmask]>

Wed, 1 Aug 2001 22:36:20 -0400

27 lines

Re: BGA PCB mounting material thickness

Stephen R. Gregory <[log in to unmask]>

Thu, 2 Aug 2001 08:59:54 EDT

79 lines

Re: BGA PCB mounting material thickness

Barbara Burcham <[log in to unmask]>

Thu, 2 Aug 2001 08:38:34 -0500

56 lines

Re: BGA PCB mounting material thickness

Brad Saunders <[log in to unmask]>

Thu, 2 Aug 2001 09:42:36 EDT

26 lines

New Thread

BGA Re-balling services in Asia

BGA Re-balling services in Asia

Stephen Brown <[log in to unmask]>

Wed, 29 Aug 2001 09:27:32 +0100

29 lines

Re: BGA Re-balling services in Asia

<Peter George Duncan> <[log in to unmask]>

Wed, 29 Aug 2001 16:46:33 +0800

83 lines

Re: BGA Re-balling services in Asia

Karim Benallal <[log in to unmask]>

Wed, 29 Aug 2001 09:48:21 +0100

61 lines

New Thread

Bisumth Solder (Sn43Pb43Bi14)

Bisumth Solder (Sn43Pb43Bi14)

Gary Bremer <[log in to unmask]>

Sat, 25 Aug 2001 20:27:25 -0500

41 lines

Re: Bisumth Solder (Sn43Pb43Bi14)

Roger Bilham <[log in to unmask]>

Mon, 27 Aug 2001 12:04:09 +0100

73 lines

New Thread

Board assm. shops doing BGA/CSPs and small volumes

Board assm. shops doing BGA/CSPs and small volumes

Houston, Terri <[log in to unmask]>

Thu, 23 Aug 2001 10:21:43 -0500

27 lines

Re: Board assm. shops doing BGA/CSPs and small volumes

Lush, Dorothy <[log in to unmask]>

Thu, 23 Aug 2001 09:40:42 -0700

61 lines

New Thread

Board layout service

Board layout service

West, Jim <[log in to unmask]>

Wed, 1 Aug 2001 10:30:43 -0400

28 lines

Re: Board layout service

Woelfel, Tim <[log in to unmask]>

Wed, 1 Aug 2001 09:40:21 -0500

53 lines

New Thread

Breathers in sealed automotive products

Breathers in sealed automotive products

Kevin Stokes <[log in to unmask]>

Tue, 14 Aug 2001 15:01:03 -0500

78 lines

New Thread

Call for Paper - IPC Printed Circuits Expo 2002

Call for Paper - IPC Printed Circuits Expo 2002

Jane Koh <[log in to unmask]>

Thu, 2 Aug 2001 10:15:41 -0500

54 lines

New Thread

Capacitor 0603 vs 0402

Capacitor 0603 vs 0402

Pelkey, Glenn <[log in to unmask]>

Wed, 8 Aug 2001 12:55:31 -0700

112 lines

Re: Capacitor 0603 vs 0402

Craig Hillman <[log in to unmask]>

Wed, 8 Aug 2001 16:34:25 -0400

159 lines

Re: Capacitor 0603 vs 0402

Dean Lillibridge <[log in to unmask]>

Wed, 8 Aug 2001 16:34:14 -0400

177 lines

Re: Capacitor 0603 vs 0402

[log in to unmask]

Wed, 8 Aug 2001 17:17:45 -0500

88 lines

Re: Capacitor 0603 vs 0402

Chris Murphy <[log in to unmask]>

Thu, 9 Aug 2001 12:06:53 +1200

122 lines

New Thread

Capacitor 0603 vs 0402...why not networks and arrays?

Re: Capacitor 0603 vs 0402...why not networks and arrays?

Stephen R. Gregory <[log in to unmask]>

Wed, 8 Aug 2001 20:46:02 EDT

117 lines

Re: Capacitor 0603 vs 0402...why not networks and arrays?

Jean-Luc Lehmann <[log in to unmask]>

Thu, 9 Aug 2001 08:56:29 +0200

116 lines

Re: Capacitor 0603 vs 0402...why not networks and arrays?

Matthew Lamkin <[log in to unmask]>

Thu, 9 Aug 2001 10:39:45 +0100

33 lines

Re: Capacitor 0603 vs 0402...why not networks and arrays?

Pelkey, Glenn <[log in to unmask]>

Thu, 9 Aug 2001 08:41:50 -0700

120 lines

Re: Capacitor 0603 vs 0402...why not networks and arrays?

Greg Scott <[log in to unmask]>

Thu, 9 Aug 2001 08:45:54 -0700

172 lines

Re: Capacitor 0603 vs 0402...why not networks and arrays?

Joyce Koo <[log in to unmask]>

Thu, 9 Aug 2001 12:30:23 -0400

265 lines

Re: Capacitor 0603 vs 0402...why not networks and arrays?

Dorothy M. Lush <[log in to unmask]>

Thu, 9 Aug 2001 10:38:56 -0700

65 lines

Re: Capacitor 0603 vs 0402...why not networks and arrays?

Susana Anaya <[log in to unmask]>

Thu, 9 Aug 2001 12:31:57 -0700

155 lines

Re: Capacitor 0603 vs 0402...why not networks and arrays?

Roger M. Stoops <[log in to unmask]>

Thu, 9 Aug 2001 16:18:31 -0400

141 lines

Re: Capacitor 0603 vs 0402...why not networks and arrays?

Mark Ross <[log in to unmask]>

Thu, 9 Aug 2001 22:21:54 -0400

253 lines

Capacitor 0603 vs 0402...why not networks and arrays?

John Brewer <[log in to unmask]>

Fri, 10 Aug 2001 07:59:11 -0400

23 lines

Re: Capacitor 0603 vs 0402...why not networks and arrays?

Joyce Koo <[log in to unmask]>

Fri, 10 Aug 2001 08:45:17 -0400

310 lines

New Thread

cc: MAIL Reminder

cc: MAIL Reminder

Scott Stewart <[log in to unmask]>

Thu, 30 Aug 2001 10:13:58 -0500

58 lines

New Thread

cCc'M(1{wkJ;'xx98e%ue OC~qgD;n<;{ {z

Re: cCc'M(1{wkJ;'xx98e%ue OC~qgD;n<;{ {z

Kasprzak, Bill (sys) USX <[log in to unmask]>

Wed, 29 Aug 2001 15:04:09 -0400

94 lines

New Thread

Cleaning under BGAs

Cleaning under BGAs

Lambert, Katherine A. <[log in to unmask]>

Thu, 23 Aug 2001 11:59:38 -0400

38 lines

Re: Cleaning under BGAs

Guy Ramsey <[log in to unmask]>

Thu, 23 Aug 2001 13:45:44 -0400

86 lines

Re: Cleaning under BGAs

Brian Ellis <[log in to unmask]>

Fri, 24 Aug 2001 12:40:23 +0300

129 lines

New Thread

Cleanliness evaluation!

Cleanliness evaluation!

Iain Braddock <[log in to unmask]>

Tue, 14 Aug 2001 14:54:16 +0100

49 lines

Re: Cleanliness evaluation!

[log in to unmask]

Tue, 14 Aug 2001 13:28:06 -0500

50 lines

Re: Cleanliness evaluation!

[log in to unmask]

Tue, 14 Aug 2001 14:23:19 -0500

49 lines

Re: Cleanliness evaluation!

Graham Naisbitt <[log in to unmask]>

Wed, 15 Aug 2001 10:41:35 +0100

114 lines

Re: Cleanliness evaluation!

[log in to unmask]

Wed, 15 Aug 2001 08:35:07 -0500

112 lines

Re: Cleanliness evaluation!

Brian Ellis <[log in to unmask]>

Wed, 15 Aug 2001 17:18:02 +0300

63 lines

Re: Cleanliness evaluation!

Iain Braddock <[log in to unmask]>

Wed, 15 Aug 2001 15:05:47 +0100

193 lines

Re: Cleanliness evaluation!

[log in to unmask]

Wed, 15 Aug 2001 10:07:28 -0500

23 lines

New Thread

Cleanliness evaluation! Definition of an Expert (Xspurt)

Re: Cleanliness evaluation! Definition of an Expert (Xspurt)

Graham Naisbitt <[log in to unmask]>

Fri, 17 Aug 2001 11:55:55 +0100

199 lines

Re: Cleanliness evaluation! Definition of an Expert (Xspurt)

[log in to unmask]

Fri, 17 Aug 2001 07:56:28 -0500

70 lines

Re: Cleanliness evaluation! Definition of an Expert (Xspurt)

Lambert, Katherine A. <[log in to unmask]>

Fri, 17 Aug 2001 10:28:27 -0400

33 lines

Re: Cleanliness evaluation! Definition of an Expert (Xspurt)

Joyce Koo <[log in to unmask]>

Thu, 23 Aug 2001 15:07:19 -0400

814 lines

Re: Cleanliness evaluation! Definition of an Expert (Xspurt)

Graham Naisbitt <[log in to unmask]>

Sat, 25 Aug 2001 11:22:30 +0100

749 lines

Re: Cleanliness evaluation! Definition of an Expert (Xspurt)

Jack Crawford <[log in to unmask]>

Mon, 27 Aug 2001 15:57:46 -0500

102 lines

New Thread

Component skew after reflow

Component skew after reflow

Tempea, Ioan <[log in to unmask]>

Thu, 30 Aug 2001 10:50:43 -0400

50 lines

Re: Component skew after reflow

Grant Emandien <[log in to unmask]>

Thu, 30 Aug 2001 17:01:51 +0200

98 lines

Re: Component skew after reflow

Tempea, Ioan <[log in to unmask]>

Thu, 30 Aug 2001 11:16:49 -0400

157 lines

Re: Component skew after reflow

Grant Emandien <[log in to unmask]>

Thu, 30 Aug 2001 18:03:16 +0200

216 lines

New Thread

Connector tilt, acceptable or not?

Connector tilt, acceptable or not?

Busko, Wolfgang <[log in to unmask]>

Tue, 14 Aug 2001 17:48:29 +0200

71 lines

Re: Connector tilt, acceptable or not?

Kathy Kuhlow <[log in to unmask]>

Tue, 14 Aug 2001 12:13:55 -0500

78 lines

Re: Connector tilt, acceptable or not?

Lush, Dorothy <[log in to unmask]>

Tue, 14 Aug 2001 11:20:32 -0700

134 lines

Re: Connector tilt, acceptable or not?

Roger M. Stoops <[log in to unmask]>

Tue, 14 Aug 2001 14:35:19 -0400

172 lines

Re: Connector tilt, acceptable or not?

David Douthit <[log in to unmask]>

Tue, 14 Aug 2001 14:06:02 -0700

38 lines

Re: Connector tilt, acceptable or not?

Crepeau, Phil <[log in to unmask]>

Tue, 14 Aug 2001 16:52:35 -0700

104 lines

Re: Connector tilt, acceptable or not?

Stephen R. Gregory <[log in to unmask]>

Tue, 14 Aug 2001 20:40:15 EDT

114 lines

New Thread

consideration the results of any

consideration the results of any

Colin W.T. McVean <[log in to unmask]>

Sat, 11 Aug 2001 17:14:54 +0100

21 lines

New Thread

Contamination Concern after Strip

Contamination Concern after Strip

Bill Christoffel <[log in to unmask]>

Tue, 7 Aug 2001 08:04:12 -0500

35 lines

Re: Contamination Concern after Strip

Crepeau, Phil <[log in to unmask]>

Tue, 7 Aug 2001 07:30:11 -0700

58 lines

Re: Contamination Concern after Strip

Andrew Hoggan <[log in to unmask]>

Tue, 7 Aug 2001 18:04:28 +0100

75 lines

Re: Contamination Concern after Strip

Edward Szpruch <[log in to unmask]>

Wed, 8 Aug 2001 07:30:19 +0200

140 lines

Re: Contamination Concern after Strip

Mike Fenner <[log in to unmask]>

Wed, 8 Aug 2001 09:05:23 +0100

85 lines

New Thread

Cooling rates for solder reflow processes

Cooling rates for solder reflow processes

Ochenas, Tom <[log in to unmask]>

Fri, 24 Aug 2001 09:52:04 -0700

89 lines

Re: Cooling rates for solder reflow processes

Andrew Hoggan <[log in to unmask]>

Fri, 24 Aug 2001 21:27:10 +0100

189 lines

Re: Cooling rates for solder reflow processes

Guy Ramsey <[log in to unmask]>

Fri, 24 Aug 2001 17:45:06 -0400

194 lines

Re: Cooling rates for solder reflow processes

Steve Abrahamson <[log in to unmask]>

Fri, 24 Aug 2001 16:25:21 -0600

73 lines

Re: Cooling rates for solder reflow processes

Ochenas, Tom <[log in to unmask]>

Fri, 24 Aug 2001 15:52:29 -0700

273 lines

Re: Cooling rates for solder reflow processes

Werner Engelmaier <[log in to unmask]>

Sat, 25 Aug 2001 06:23:02 EDT

31 lines

Re: Cooling rates for solder reflow processes

Betsy Towle <[log in to unmask]>

Mon, 27 Aug 2001 13:54:45 -0500

26 lines

Re: Cooling rates for solder reflow processes

Mike Fenner <[log in to unmask]>

Wed, 29 Aug 2001 16:13:36 +0100

171 lines

New Thread

Cost effective Standard via size.

Cost effective Standard via size.

Ken Patel <[log in to unmask]>

Tue, 14 Aug 2001 15:41:16 -0700

27 lines

Re: Cost effective Standard via size.

Jean-Luc Lehmann <[log in to unmask]>

Wed, 15 Aug 2001 11:59:45 +0200

71 lines

Re: Cost effective Standard via size.

Johnny Kim <[log in to unmask]>

Thu, 16 Aug 2001 08:56:39 +0900

106 lines

New Thread

Delta Tg of IC substrate

Delta Tg of IC substrate

Enigma P. <[log in to unmask]>

Mon, 20 Aug 2001 01:46:37 -0500

40 lines

New Thread

Design Certification

Design Certification

Stephannie Caliendo <[log in to unmask]>

Tue, 21 Aug 2001 17:59:14 -0500

37 lines

New Thread

Design Certification - Correction

Design Certification - Correction

Stephannie Caliendo <[log in to unmask]>

Wed, 22 Aug 2001 09:24:58 -0500

40 lines

New Thread

design pads for chip resistors and capacitors

design pads for chip resistors and capacitors

Stewart, Dougal <[log in to unmask]>

Tue, 21 Aug 2001 15:14:55 +0100

25 lines

Re: design pads for chip resistors and capacitors

Greg Scott <[log in to unmask]>

Tue, 21 Aug 2001 08:58:04 -0700

60 lines

Re: design pads for chip resistors and capacitors

Dean Lillibridge <[log in to unmask]>

Tue, 21 Aug 2001 12:07:00 -0400

63 lines

Re: design pads for chip resistors and capacitors

Debbie Goodwin <[log in to unmask]>

Tue, 21 Aug 2001 09:22:14 -0700

72 lines

Re: design pads for chip resistors and capacitors

Dorothy M. Lush <[log in to unmask]>

Tue, 21 Aug 2001 10:11:21 -0700

62 lines

Re: design pads for chip resistors and capacitors

Stewart, Dougal <[log in to unmask]>

Wed, 22 Aug 2001 09:01:32 +0100

95 lines

Re: design pads for chip resistors and capacitors

Dan Brandler <[log in to unmask]>

Wed, 22 Aug 2001 11:55:23 -0700

29 lines

Re: design pads for chip resistors and capacitors

Richard W Hinebaugh <[log in to unmask]>

Wed, 22 Aug 2001 14:09:25 -0500

29 lines

New Thread

Determining the Inner metallic bond on a surface mount c onnector

Re: Determining the Inner metallic bond on a surface mount c onnector

Bev Christian <[log in to unmask]>

Fri, 24 Aug 2001 15:47:17 -0400

123 lines

New Thread

Determining the Inner metallic bond on a surface mount connector

Determining the Inner metallic bond on a surface mount connector

West, Jim <[log in to unmask]>

Fri, 24 Aug 2001 15:09:15 -0400

55 lines

Re: Determining the Inner metallic bond on a surface mount connector

Andrew Hoggan <[log in to unmask]>

Fri, 24 Aug 2001 21:51:06 +0100

113 lines

New Thread

Dewetting

Dewetting

Grant Emandien <[log in to unmask]>

Wed, 15 Aug 2001 16:05:17 +0200

55 lines

Re: Dewetting

Brian Ellis <[log in to unmask]>

Wed, 15 Aug 2001 18:59:44 +0300

65 lines

New Thread

DPMO calculations

DPMO calculations

praveen kumar manjeshwar <[log in to unmask]>

Fri, 31 Aug 2001 19:04:01 +0000

38 lines

Re: DPMO calculations

Jack Crawford <[log in to unmask]>

Fri, 31 Aug 2001 21:08:45 -0500

68 lines

New Thread

Easy Thursday Question!

Easy Thursday Question!

Jana L. Carraway <[log in to unmask]>

Thu, 16 Aug 2001 09:19:40 -0700

36 lines

Re: Easy Thursday Question!

Alcorn, Brent <[log in to unmask]>

Thu, 16 Aug 2001 13:01:20 -0400

66 lines

Re: Easy Thursday Question!

Jana L. Carraway <[log in to unmask]>

Thu, 16 Aug 2001 11:06:10 -0700

110 lines

Re: Easy Thursday Question!

Wenger, George M (George) <[log in to unmask]>

Thu, 16 Aug 2001 14:44:49 -0400

103 lines

Re: Easy Thursday Question!

Jana L. Carraway <[log in to unmask]>

Thu, 16 Aug 2001 14:22:28 -0700

44 lines

Re: Easy Thursday Question!

<Peter George Duncan> <[log in to unmask]>

Fri, 17 Aug 2001 10:17:48 +0800

172 lines

Re: Easy Thursday Question!

Dennis Fritz <[log in to unmask]>

Thu, 16 Aug 2001 23:34:04 EDT

69 lines

New Thread

Electroless nickel/Immersion Gold Thickness

Electroless nickel/Immersion Gold Thickness

George Milad <[log in to unmask]>

Fri, 17 Aug 2001 07:06:27 EDT

52 lines

New Thread

Electronic Circuits World Convention 9 Call for papers

Electronic Circuits World Convention 9 Call for papers

David Bergman <[log in to unmask]>

Mon, 27 Aug 2001 15:52:20 -0500

136 lines

New Thread

Encoder with contamination.Soldering or Supplier process .

Re: Encoder with contamination.Soldering or Supplier process .

Valdez, Raul (R.) <[log in to unmask]>

Fri, 3 Aug 2001 14:49:39 -0400

104 lines

Re: Encoder with contamination.Soldering or Supplier process .

Valdez, Raul (R.) <[log in to unmask]>

Wed, 8 Aug 2001 19:58:11 -0400

110 lines

New Thread

Encoder with contamination.Soldering or Supplier process.

Encoder with contamination.Soldering or Supplier process.

Valdez, Raul (R.) <[log in to unmask]>

Fri, 3 Aug 2001 13:29:52 -0400

43 lines

Re: Encoder with contamination.Soldering or Supplier process.

David Douthit <[log in to unmask]>

Fri, 3 Aug 2001 11:01:29 -0700

59 lines

Re: Encoder with contamination.Soldering or Supplier process.

Guy Ramsey <[log in to unmask]>

Fri, 3 Aug 2001 14:23:39 -0400

76 lines

Re: Encoder with contamination.Soldering or Supplier process.

Brian Ellis <[log in to unmask]>

Sat, 4 Aug 2001 11:09:29 +0300

66 lines

New Thread

ERROR

ERROR

cscholbe <[log in to unmask]>

Sat, 4 Aug 2001 00:09:33 -0500

21 lines

New Thread

ESD smocks in high temperature and humidity level

ESD smocks in high temperature and humidity level

Bissonnette, Jean-Francois <[log in to unmask]>

Thu, 9 Aug 2001 11:28:54 -0400

120 lines

Re: ESD smocks in high temperature and humidity level

Marsico, James <[log in to unmask]>

Thu, 9 Aug 2001 16:05:24 -0400

75 lines

Re: ESD smocks in high temperature and humidity level

Andrew Hoggan <[log in to unmask]>

Fri, 10 Aug 2001 01:17:44 +0100

187 lines

Re: ESD smocks in high temperature and humidity level

Brian Ellis <[log in to unmask]>

Fri, 10 Aug 2001 12:54:11 +0300

64 lines

New Thread

Expiration date for soft gold surface plating

Expiration date for soft gold surface plating

Young Hwan Ju <[log in to unmask]>

Fri, 10 Aug 2001 12:01:09 +0900

29 lines

Re: Expiration date for soft gold surface plating

Crepeau, Phil <[log in to unmask]>

Mon, 13 Aug 2001 11:56:16 -0700

61 lines

New Thread

Expiry date for soft Ni/Au finished BGA

Expiry date for soft Ni/Au finished BGA

Young Hwan Ju <[log in to unmask]>

Thu, 9 Aug 2001 16:20:40 +0900

26 lines

New Thread

Fab thickness Measurement

Fab thickness Measurement

Ken Patel <[log in to unmask]>

Tue, 21 Aug 2001 15:17:45 -0700

27 lines

Re: Fab thickness Measurement

Guy Ramsey <[log in to unmask]>

Wed, 22 Aug 2001 07:56:57 -0400

70 lines

New Thread

FAB. Cleaning stainless steel multilayer bonding shims.

FAB. Cleaning stainless steel multilayer bonding shims.

Roger Hammond <[log in to unmask]>

Tue, 14 Aug 2001 22:34:14 +0100

36 lines

New Thread

Fallout

Fallout

Rick Howieson <[log in to unmask]>

Wed, 15 Aug 2001 07:20:37 -0600

24 lines

Re: Fallout

Ed Tordahl <[log in to unmask]>

Wed, 15 Aug 2001 09:31:07 -0400

63 lines

Re: Fallout

Dean Lillibridge <[log in to unmask]>

Wed, 15 Aug 2001 11:33:01 -0400

74 lines

Re: Fallout

John Brewer <[log in to unmask]>

Wed, 15 Aug 2001 14:04:32 -0400

41 lines

Re: Fallout

Richard Hamilton <[log in to unmask]>

Wed, 15 Aug 2001 11:27:33 -0700

64 lines

Re: Fallout

Dean Lillibridge <[log in to unmask]>

Wed, 15 Aug 2001 14:57:32 -0400

77 lines

Re: Fallout

Lush, Dorothy <[log in to unmask]>

Wed, 15 Aug 2001 12:04:01 -0700

105 lines

Re: Fallout

Nancy Reynolds/MKT/HQ/KEMET/US <[log in to unmask]>

Thu, 16 Aug 2001 11:49:09 -0400

117 lines

Re: Fallout

Dean Lillibridge <[log in to unmask]>

Thu, 16 Aug 2001 12:52:13 -0400

150 lines

Fallout

John Brewer <[log in to unmask]>

Thu, 16 Aug 2001 14:40:13 -0400

39 lines

Re: Fallout

<Peter George Duncan> <[log in to unmask]>

Fri, 17 Aug 2001 08:12:58 +0800

75 lines

Re: Fallout

<Peter George Duncan> <[log in to unmask]>

Fri, 17 Aug 2001 08:48:12 +0800

94 lines

New Thread

FDA approval

FDA approval

Roger Hammond <[log in to unmask]>

Mon, 13 Aug 2001 12:26:47 +0100

31 lines

Re: FDA approval

Rick Howieson <[log in to unmask]>

Mon, 13 Aug 2001 12:40:40 -0600

62 lines

Re: FDA approval

Greg Scott <[log in to unmask]>

Mon, 13 Aug 2001 12:21:53 -0700

68 lines

New Thread

Fiducials

Fiducials

Larry Koens <[log in to unmask]>

Fri, 24 Aug 2001 13:17:32 -0500

35 lines

Re: Fiducials

Stephen R. Gregory <[log in to unmask]>

Fri, 24 Aug 2001 14:45:52 EDT

114 lines

Re: Fiducials

Dee Stover <[log in to unmask]>

Fri, 24 Aug 2001 11:55:53 -0700

65 lines

Re: Fiducials

Charles E. McMahon <[log in to unmask]>

Fri, 24 Aug 2001 15:23:34 -0400

63 lines

Re: Fiducials

Dwayne Dunn <[log in to unmask]>

Fri, 24 Aug 2001 14:21:07 -0500

24 lines

Re: Fiducials

Timothy Reeves <[log in to unmask]>

Fri, 24 Aug 2001 15:25:07 -0700

36 lines

New Thread

Flatness measure & solder mask registration.

Flatness measure & solder mask registration.

Gilbert Min <[log in to unmask]>

Thu, 30 Aug 2001 23:39:30 +0900

30 lines

New Thread

Flip Chip flex circuit

Flip Chip flex circuit

Steve Kelly <[log in to unmask]>

Mon, 13 Aug 2001 15:53:11 -0400

40 lines

Re: Flip Chip flex circuit

<Rudy Sedlak> <[log in to unmask]>

Mon, 13 Aug 2001 21:16:51 EDT

27 lines

Re: Flip Chip flex circuit

Chuck Brummer <[log in to unmask]>

Tue, 14 Aug 2001 07:49:14 -0700

46 lines

New Thread

Flowsolder pallet manufacture

Flowsolder pallet manufacture

Douglas McCall <[log in to unmask]>

Thu, 16 Aug 2001 16:16:12 +0100

41 lines

New Thread

FMA Labs in Northeast US

FMA Labs in Northeast US

Furrow, Robert Gordon (Bob) <[log in to unmask]>

Wed, 15 Aug 2001 14:31:13 -0400

44 lines

Re: FMA Labs in Northeast US

Bev Christian <[log in to unmask]>

Wed, 15 Aug 2001 15:02:03 -0400

88 lines

New Thread

Fuji IP3 feeders

Fuji IP3 feeders

Tempea, Ioan <[log in to unmask]>

Tue, 7 Aug 2001 15:08:54 -0400

34 lines

Re: Fuji IP3 feeders

Dorothy M. Lush <[log in to unmask]>

Tue, 7 Aug 2001 13:52:02 -0700

67 lines

New Thread

FW: IPC Class 2 vs Class 3 Price Considerations

FW: IPC Class 2 vs Class 3 Price Considerations

Rich Lasko <[log in to unmask]>

Mon, 13 Aug 2001 07:29:07 -0500

43 lines

New Thread

FW: [TN] lightspeed adhesive

FW: [TN] lightspeed adhesive

Joyce Koo <[log in to unmask]>

Mon, 20 Aug 2001 08:39:45 -0400

251 lines

New Thread

Gel time test & thermalmeter

Re: Gel time test & thermalmeter

Michael Flett <[log in to unmask]>

Sun, 19 Aug 2001 13:27:48 -0500

70 lines

New Thread

Gold Tin Solder

Gold Tin Solder

Guy Ramsey <[log in to unmask]>

Wed, 22 Aug 2001 17:02:55 -0400

71 lines

Re: Gold Tin Solder

Joyce Koo <[log in to unmask]>

Wed, 22 Aug 2001 17:26:50 -0400

95 lines

New Thread

Gold/Paste

Gold/Paste

Rick Howieson <[log in to unmask]>

Thu, 9 Aug 2001 14:53:19 -0600

23 lines

Re: Gold/Paste

Andrew Hoggan <[log in to unmask]>

Thu, 9 Aug 2001 23:21:05 +0100

73 lines

Re: Gold/Paste

Dorothy M. Lush <[log in to unmask]>

Thu, 9 Aug 2001 15:59:05 -0700

108 lines

Re: Gold/Paste

Rick Thompson <[log in to unmask]>

Thu, 9 Aug 2001 17:17:16 -0700

70 lines

Re: Gold/Paste

Rick Howieson <[log in to unmask]>

Fri, 10 Aug 2001 11:21:51 -0600

136 lines

New Thread

Gold/Paste and Immersion Gold

Re: Gold/Paste and Immersion Gold

Dennis Fritz <[log in to unmask]>

Fri, 10 Aug 2001 09:12:57 EDT

38 lines

New Thread

HAL contaminant levels

HAL contaminant levels

Mark Hargreaves <[log in to unmask]>

Wed, 29 Aug 2001 15:52:11 -0400

27 lines

Re: HAL contaminant levels

Brian Ellis <[log in to unmask]>

Thu, 30 Aug 2001 09:40:10 +0300

48 lines

New Thread

HASL

HASL

Claude Tremblay <[log in to unmask]>

Wed, 29 Aug 2001 15:55:45 -0500

37 lines

Re: HASL

Safavi-Bayat Shahed <[log in to unmask]>

Thu, 30 Aug 2001 07:44:29 -0400

81 lines

New Thread

HASL Thickness

HASL Thickness

Frank Kimmey <[log in to unmask]>

Wed, 22 Aug 2001 07:13:19 -0700

46 lines

Re: HASL Thickness

Werner Engelmaier <[log in to unmask]>

Wed, 22 Aug 2001 10:47:35 EDT

27 lines

Re: HASL Thickness

Tony Steinke <[log in to unmask]>

Wed, 22 Aug 2001 11:06:58 -0400

88 lines

Re: HASL Thickness

Furrow, Robert Gordon (Bob) <[log in to unmask]>

Wed, 22 Aug 2001 11:04:42 -0400

102 lines

Re: HASL Thickness

d. terstegge <[log in to unmask]>

Mon, 27 Aug 2001 13:14:05 +0200

82 lines

New Thread

Heinz Mader/NMADEH/CH/Ascom ist auer Haus.

Heinz Mader/NMADEH/CH/Ascom ist auer Haus.

Heinz Mader <[log in to unmask]>

Thu, 2 Aug 2001 01:01:11 +0200

24 lines

New Thread

HELP !! horizontal lines for flex innerlayers- oxide substitution

HELP !! horizontal lines for flex innerlayers- oxide substitution

Edward Szpruch <[log in to unmask]>

Wed, 15 Aug 2001 12:54:19 +0200

37 lines

New Thread

HELP !! horizontal lines for flex innerlayers- oxidesubstitution

Re: HELP !! horizontal lines for flex innerlayers- oxidesubstitution

Chuck Brummer <[log in to unmask]>

Wed, 15 Aug 2001 15:25:19 -0700

61 lines

New Thread

Hermeticity and Cleanliness

Hermeticity and Cleanliness

Stillings, Kathy <[log in to unmask]>

Tue, 7 Aug 2001 09:46:26 -0400

64 lines

Re: Hermeticity and Cleanliness

Brian Ellis <[log in to unmask]>

Tue, 7 Aug 2001 17:41:49 +0300

39 lines

Re: Hermeticity and Cleanliness

David Douthit <[log in to unmask]>

Tue, 7 Aug 2001 08:18:46 -0700

88 lines

Re: Hermeticity and Cleanliness

Creswick, Steven <[log in to unmask]>

Tue, 7 Aug 2001 20:54:04 -0400

187 lines

New Thread

Hi-pot test

Re: Hi-pot test

PL <[log in to unmask]>

Fri, 31 Aug 2001 10:47:56 -0700

39 lines

Re: Hi-pot test

Richard Hamilton <[log in to unmask]>

Fri, 31 Aug 2001 14:16:43 -0700

58 lines

New Thread

High aspect ratio via qualification

Re: High aspect ratio via qualification

Ken Mc Gowan <[log in to unmask]>

Thu, 2 Aug 2001 13:59:43 -0100

172 lines

New Thread

High Flow Laminating Resin

High Flow Laminating Resin

Jeff Wallace <[log in to unmask]>

Tue, 21 Aug 2001 16:40:13 -0700

24 lines

New Thread

horizontal lines for flex innerlayers- oxide substitution

horizontal lines for flex innerlayers- oxide substitution

Edward Szpruch <[log in to unmask]>

Mon, 13 Aug 2001 08:05:18 +0200

35 lines

New Thread

Howefill and Howefilm

Howefill and Howefilm

Craig Hillman <[log in to unmask]>

Fri, 24 Aug 2001 17:28:20 -0400

34 lines

Re: Howefill and Howefilm

Brad Saunders <[log in to unmask]>

Sat, 25 Aug 2001 10:06:19 EDT

78 lines

New Thread

HP TEST CREDIT BUTTONS

HP TEST CREDIT BUTTONS

Dean Lillibridge <[log in to unmask]>

Wed, 29 Aug 2001 12:28:36 -0400

27 lines

New Thread

Immersion gold with hard gold fingers

Immersion gold with hard gold fingers

tech <[log in to unmask]>

Fri, 24 Aug 2001 13:26:42 -0400

29 lines

New Thread

Info required on thick Jedec Trays

Info required on thick Jedec Trays

Eric Christison <[log in to unmask]>

Fri, 31 Aug 2001 09:34:25 -0500

30 lines

Re: Info required on thick Jedec Trays

Crepeau, Phil <[log in to unmask]>

Fri, 31 Aug 2001 07:55:46 -0700

50 lines

New Thread

Information regarding the various types of gold deposits

Information regarding the various types of gold deposits

Gagnon, Gerald G. <[log in to unmask]>

Thu, 23 Aug 2001 10:47:06 -0400

43 lines

New Thread

Interesting Coplanarity ?

Interesting Coplanarity ?

LI YUAN <[log in to unmask]>

Tue, 14 Aug 2001 16:37:11 -0600

25 lines

Re: Interesting Coplanarity ?

Stephen R. Gregory <[log in to unmask]>

Tue, 14 Aug 2001 19:18:49 EDT

114 lines

New Thread

Ionics again.

Ionics again.

Cathy Killen <[log in to unmask]>

Wed, 8 Aug 2001 14:51:15 +0100

50 lines

Re: Ionics again.

Mike Fenner <[log in to unmask]>

Wed, 8 Aug 2001 15:19:56 +0100

85 lines

Re: Ionics again.

Graham Naisbitt <[log in to unmask]>

Wed, 8 Aug 2001 16:15:02 +0100

110 lines

Re: Ionics again.

Brian Ellis <[log in to unmask]>

Wed, 8 Aug 2001 18:30:02 +0300

71 lines

New Thread

IPC 600

IPC 600

Rick Howieson <[log in to unmask]>

Thu, 2 Aug 2001 13:44:51 -0600

27 lines

Re: IPC 600

[log in to unmask]

Thu, 2 Aug 2001 17:29:14 EDT

77 lines

Re: IPC 600

Rick Howieson <[log in to unmask]>

Thu, 2 Aug 2001 15:37:19 -0600

108 lines

Re: IPC 600

Kathy Kuhlow <[log in to unmask]>

Thu, 2 Aug 2001 16:40:48 -0500

46 lines

Re: IPC 600

Richard Hamilton <[log in to unmask]>

Thu, 2 Aug 2001 15:13:02 -0700

59 lines

Re: IPC 600

John Perry <[log in to unmask]>

Tue, 7 Aug 2001 19:01:19 -0500

119 lines

Re: IPC 600

Arnold D. Andrade <[log in to unmask]>

Thu, 9 Aug 2001 22:36:41 -0700

168 lines

New Thread

IPC Class 2 vs Class 3 Price Considerations

IPC Class 2 vs Class 3 Price Considerations

Rich Lasko <[log in to unmask]>

Fri, 10 Aug 2001 10:17:43 -0500

34 lines

Re: IPC Class 2 vs Class 3 Price Considerations

Guy Ramsey <[log in to unmask]>

Mon, 13 Aug 2001 08:49:15 -0400

79 lines

New Thread

IPC HDI types

IPC HDI types

michael <[log in to unmask]>

Tue, 21 Aug 2001 21:04:58 +0800

28 lines

Re: IPC HDI types

Guy Ramsey <[log in to unmask]>

Wed, 22 Aug 2001 11:05:34 -0400

69 lines

New Thread

IPC-D-356

IPC-D-356

Ken Patel <[log in to unmask]>

Mon, 6 Aug 2001 14:37:30 -0700

30 lines

Re: IPC-D-356

McGlaughlin, Jeffrey A <[log in to unmask]>

Tue, 7 Aug 2001 07:28:25 -0400

71 lines

New Thread

IPC/EIA J-STD-006 Released

IPC/EIA J-STD-006 Released

Nick Ban <[log in to unmask]>

Thu, 2 Aug 2001 08:46:01 -0500

41 lines

New Thread

Labeling of bottles in statis safe area

Labeling of bottles in statis safe area

Lou Hart <[log in to unmask]>

Mon, 6 Aug 2001 17:05:58 -0400

27 lines

Re: Labeling of bottles in statis safe area

[log in to unmask]

Mon, 6 Aug 2001 16:58:52 -0500

29 lines

Re: Labeling of bottles in statis safe area

Stephen R. Gregory <[log in to unmask]>

Mon, 6 Aug 2001 19:24:56 EDT

79 lines

Re: Labeling of bottles in statis safe area

David Douthit <[log in to unmask]>

Mon, 6 Aug 2001 19:17:00 -0700

51 lines

Re: Labeling of bottles in statis safe area

Brian Ellis <[log in to unmask]>

Tue, 7 Aug 2001 14:20:01 +0300

55 lines

New Thread

Labelling of bottles in statis safe area

Re: Labelling of bottles in statis safe area

Andrew Hoggan <[log in to unmask]>

Mon, 6 Aug 2001 23:23:33 +0100

74 lines

New Thread

Laser Drilling

Laser Drilling

Joe Thoman <[log in to unmask]>

Thu, 2 Aug 2001 13:58:07 -0400

28 lines

Re: Laser Drilling

Dennis Fritz <[log in to unmask]>

Thu, 2 Aug 2001 18:37:04 EDT

37 lines

New Thread

Leading Edge Supplier Search

Leading Edge Supplier Search

S. Miller <[log in to unmask]>

Tue, 7 Aug 2001 14:05:51 EDT

60 lines

Re: Leading Edge Supplier Search

<Peter George Duncan> <[log in to unmask]>

Wed, 8 Aug 2001 10:36:56 +0800

88 lines

Re: Leading Edge Supplier Search

Johnny Kim <[log in to unmask]>

Wed, 8 Aug 2001 12:13:10 +0900

71 lines

Re: Leading Edge Supplier Search

COWEN,MARC (A-Scotland,ex1) <[log in to unmask]>

Wed, 8 Aug 2001 08:30:15 +0200

127 lines

New Thread

lightspeed adhesive

lightspeed adhesive

Joyce Koo <[log in to unmask]>

Tue, 14 Aug 2001 16:36:25 -0400

94 lines

Re: lightspeed adhesive

Peter Swanson <[log in to unmask]>

Mon, 20 Aug 2001 02:57:30 +0100

173 lines

New Thread

Lisa Greenleaf/NNH/Teradyne is out of the office.

Lisa Greenleaf/NNH/Teradyne is out of the office.

Lisa Greenleaf <[log in to unmask]>

Wed, 8 Aug 2001 01:01:17 -0400

22 lines

New Thread

Longtime storage conditions for assemblies

Longtime storage conditions for assemblies

Busko, Wolfgang <[log in to unmask]>

Wed, 22 Aug 2001 17:47:53 +0200

42 lines

New Thread

Looking for board level failure analysis

Looking for board level failure analysis

Steve DiLeo <[log in to unmask]>

Tue, 21 Aug 2001 17:09:24 -0400

93 lines

New Thread

Looking for Jerry Hartman & John Garcia...

Looking for Jerry Hartman & John Garcia...

Ken Patel <[log in to unmask]>

Wed, 29 Aug 2001 14:07:51 -0700

29 lines

New Thread

Looking for short movie of a BGA self-centering

Looking for short movie of a BGA self-centering

Julien Bouchard <[log in to unmask]>

Thu, 16 Aug 2001 10:03:13 -0400

29 lines

Re: Looking for short movie of a BGA self-centering

Bill Butman <[log in to unmask]>

Thu, 16 Aug 2001 10:57:55 -0700

79 lines

Re: Looking for short movie of a BGA self-centering

Tenison Stone <[log in to unmask]>

Thu, 16 Aug 2001 15:44:57 -0500

85 lines

Re: Looking for short movie of a BGA self-centering

Colin Weber <[log in to unmask]>

Fri, 17 Aug 2001 08:31:46 +1000

64 lines

Re: Looking for short movie of a BGA self-centering

Mike Fenner <[log in to unmask]>

Mon, 20 Aug 2001 08:37:51 +0100

115 lines

Re: Looking for short movie of a BGA self-centering

Deakin, Roger <[log in to unmask]>

Mon, 20 Aug 2001 09:00:24 +0100

189 lines

New Thread

Material specification

Material specification

Steve Telgen <[log in to unmask]>

Fri, 10 Aug 2001 11:52:29 -0400

26 lines

Re: Material specification

Timothy Reeves <[log in to unmask]>

Fri, 10 Aug 2001 12:05:45 -0700

45 lines

Re: Material specification

Timothy Reeves <[log in to unmask]>

Fri, 10 Aug 2001 12:28:58 -0700

36 lines

New Thread

Material specification (7781 E-glass)

Re: Material specification (7781 E-glass)

Susana Anaya <[log in to unmask]>

Fri, 10 Aug 2001 15:25:23 -0700

48 lines

New Thread

Mfg Capability

Mfg Capability

Darrel Therriault <[log in to unmask]>

Wed, 29 Aug 2001 12:14:08 -0700

42 lines

Re: Mfg Capability

Gary McCauley <[log in to unmask]>

Wed, 29 Aug 2001 17:02:33 -0500

67 lines

Re: Mfg Capability

Brad Saunders <[log in to unmask]>

Thu, 30 Aug 2001 19:54:16 EDT

66 lines

New Thread

Microvia in BGA pad

Microvia in BGA pad

Peter Barton <[log in to unmask]>

Thu, 9 Aug 2001 15:58:00 +0100

35 lines

Re: Microvia in BGA pad

Mason Hu <[log in to unmask]>

Thu, 9 Aug 2001 16:12:32 -0500

20 lines

New Thread

Misplace component

Misplace component

<Leonel Jay J. Manuel> <[log in to unmask]>

Wed, 15 Aug 2001 08:33:32 +0800

32 lines

Re: Misplace component

Dorothy M. Lush <[log in to unmask]>

Wed, 15 Aug 2001 10:46:15 -0700

94 lines

New Thread

Moisture Sensitive Component Handling & Identification

Moisture Sensitive Component Handling & Identification

Nancy Reynolds/MKT/HQ/KEMET/US <[log in to unmask]>

Thu, 16 Aug 2001 10:40:43 -0400

41 lines

Re: Moisture Sensitive Component Handling & Identification

Tom Parkinson - Quality System Manager <[log in to unmask]>

Thu, 16 Aug 2001 11:39:03 -0400

66 lines

Re: Moisture Sensitive Component Handling & Identification

bbarr <[log in to unmask]>

Thu, 16 Aug 2001 11:59:04 -0400

86 lines

Re: Moisture Sensitive Component Handling & Identification

Dean Lillibridge <[log in to unmask]>

Thu, 16 Aug 2001 12:47:13 -0400

124 lines

Moisture Sensitive Component Handling & Identification

Francois Monette <[log in to unmask]>

Thu, 16 Aug 2001 13:25:05 -0400

90 lines

Re: Moisture Sensitive Component Handling & Identification

[log in to unmask]

Thu, 16 Aug 2001 13:16:23 -0500

22 lines

Re: Moisture Sensitive Component Handling & Identification

<Peter George Duncan> <[log in to unmask]>

Fri, 17 Aug 2001 10:49:23 +0800

104 lines

New Thread

MONSTER board!!!

MONSTER board!!!

Stephen R. Gregory <[log in to unmask]>

Fri, 24 Aug 2001 19:23:11 EDT

108 lines

Re: MONSTER board!!!

Graham Naisbitt <[log in to unmask]>

Sat, 25 Aug 2001 11:29:20 +0100

202 lines

Re: MONSTER board!!!

Phil Zarrow <[log in to unmask]>

Sat, 25 Aug 2001 23:40:14 EDT

52 lines

Re: MONSTER board!!!

COWEN,MARC (A-Scotland,ex1) <[log in to unmask]>

Mon, 27 Aug 2001 09:52:14 +0200

72 lines

Re: MONSTER board!!!

Bev Christian <[log in to unmask]>

Mon, 27 Aug 2001 08:26:11 -0400

142 lines

New Thread

New Zealand Chapter Formation Meeting Notice

New Zealand Chapter Formation Meeting Notice

James Yohe <[log in to unmask]>

Fri, 10 Aug 2001 05:48:54 +1200

49 lines

New Thread

New Zealand now has a new DC chapter!

New Zealand now has a new DC chapter!

James Yohe <[log in to unmask]>

Sat, 25 Aug 2001 08:09:59 +1200

59 lines

Re: New Zealand now has a new DC chapter!

Brooks,Bill <[log in to unmask]>

Fri, 24 Aug 2001 13:16:42 -0700

94 lines

New Thread

Ni/Au Plating Question

Ni/Au Plating Question

Bill Christoffel <[log in to unmask]>

Wed, 22 Aug 2001 09:03:40 -0500

32 lines

Re: Ni/Au Plating Question

Creswick, Steven <[log in to unmask]>

Wed, 22 Aug 2001 10:37:22 -0400

72 lines

Re: Ni/Au Plating Question

<Rudy Sedlak> <[log in to unmask]>

Wed, 22 Aug 2001 10:39:37 EDT

38 lines

Re: Ni/Au Plating Question

Dennis Fritz <[log in to unmask]>

Wed, 22 Aug 2001 11:20:17 EDT

39 lines

Re: Ni/Au Plating Question

<Roger Mouton> <[log in to unmask]>

Wed, 22 Aug 2001 11:50:01 EDT

58 lines

Re: Ni/Au Plating Question

<Rudy Sedlak> <[log in to unmask]>

Wed, 22 Aug 2001 13:39:05 EDT

36 lines

Re: Ni/Au Plating Question

Dennis Fritz <[log in to unmask]>

Wed, 22 Aug 2001 13:42:20 EDT

43 lines

Re: Ni/Au Plating Question

Richard W Hinebaugh <[log in to unmask]>

Wed, 22 Aug 2001 09:35:53 -0500

30 lines

Re: Ni/Au Plating Question

Mordechai Holtzman <[log in to unmask]>

Wed, 22 Aug 2001 14:10:31 EDT

72 lines

Re: Ni/Au Plating Question

Bill Christoffel <[log in to unmask]>

Wed, 22 Aug 2001 13:06:37 -0500

82 lines

Re: Ni/Au Plating Question

Mordechai Holtzman <[log in to unmask]>

Wed, 22 Aug 2001 15:11:52 EDT

64 lines

Re: Ni/Au Plating Question

Richard W Hinebaugh <[log in to unmask]>

Wed, 22 Aug 2001 14:39:42 -0500

29 lines

Re: Ni/Au Plating Question

<Peter George Duncan> <[log in to unmask]>

Thu, 23 Aug 2001 13:09:37 +0800

58 lines

Re: Ni/Au Plating Question

<Peter George Duncan> <[log in to unmask]>

Thu, 23 Aug 2001 13:31:10 +0800

83 lines

New Thread

Ni/Au Plating Question--Returns

Re: Ni/Au Plating Question--Returns

<Rudy Sedlak> <[log in to unmask]>

Wed, 22 Aug 2001 16:51:03 EDT

64 lines

Re: Ni/Au Plating Question--Returns

Richard W Hinebaugh <[log in to unmask]>

Wed, 22 Aug 2001 16:35:40 -0500

29 lines

Re: Ni/Au Plating Question--Returns

Kirk Kosel <[log in to unmask]>

Wed, 22 Aug 2001 17:16:55 -0500

217 lines

New Thread

Nitrogen Purity for SMT IR Reflow

Nitrogen Purity for SMT IR Reflow

Shoda, Steve <[log in to unmask]>

Fri, 31 Aug 2001 11:51:17 -0400

29 lines

Re: Nitrogen Purity for SMT IR Reflow

Graham Collins <[log in to unmask]>

Fri, 31 Aug 2001 12:33:56 -0400

80 lines

New Thread

No-clean solder wire

No-clean solder wire

peter lee <[log in to unmask]>

Wed, 29 Aug 2001 09:41:22 -0700

39 lines

Re: No-clean solder wire

[log in to unmask]

Wed, 29 Aug 2001 13:38:09 -0500

50 lines

Re: No-clean solder wire

Andrew Hoggan <[log in to unmask]>

Thu, 30 Aug 2001 09:37:25 +0100

95 lines

New Thread

NTC: Just a thanks about BGA/ X-ray question posted earlier

NTC: Just a thanks about BGA/ X-ray question posted earlier

Kathy Kuhlow <[log in to unmask]>

Fri, 10 Aug 2001 13:31:09 -0500

56 lines

New Thread

Off-Topic - coatings for airplane-home

Off-Topic - coatings for airplane-home

Carl VanWormer <[log in to unmask]>

Mon, 13 Aug 2001 14:59:17 -0700

75 lines

Re: Off-Topic - coatings for airplane-home

Crepeau, Phil <[log in to unmask]>

Mon, 13 Aug 2001 15:32:34 -0700

103 lines

Re: Off-Topic - coatings for airplane-home

Jana L. Carraway <[log in to unmask]>

Mon, 13 Aug 2001 16:08:28 -0700

39 lines

Re: Off-Topic - coatings for airplane-home

Stephen R. Gregory <[log in to unmask]>

Mon, 13 Aug 2001 20:57:38 EDT

165 lines

Re: Off-Topic - coatings for airplane-home

Mark Ross <[log in to unmask]>

Tue, 14 Aug 2001 00:56:50 -0400

120 lines

Re: Off-Topic - coatings for airplane-home

Mark Ross <[log in to unmask]>

Tue, 14 Aug 2001 01:01:19 -0400

273 lines

Re: Off-Topic - coatings for airplane-home

Eric Dawson <[log in to unmask]>

Tue, 14 Aug 2001 08:22:33 +0100

149 lines

Re: Off-Topic - coatings for airplane-home

Mike Fenner <[log in to unmask]>

Tue, 14 Aug 2001 09:11:06 +0100

181 lines

Re: Off-Topic - coatings for airplane-home

Brian Ellis <[log in to unmask]>

Tue, 14 Aug 2001 11:44:05 +0300

93 lines

Re: Off-Topic - coatings for airplane-home

Joyce Koo <[log in to unmask]>

Tue, 14 Aug 2001 08:50:18 -0400

624 lines

Re: Off-Topic - coatings for airplane-home

Kathy Kuhlow <[log in to unmask]>

Tue, 14 Aug 2001 10:35:50 -0500

48 lines

Re: Off-Topic - coatings for airplane-home

Albin, David <[log in to unmask]>

Tue, 14 Aug 2001 11:42:45 +0100

209 lines

Re: Off-Topic - coatings for airplane-home

Keel, Mike <[log in to unmask]>

Tue, 14 Aug 2001 14:04:43 -0700

316 lines

New Thread

Out of office

Out of office

Scott Rebman <[log in to unmask]>

Fri, 24 Aug 2001 07:14:00 -0700

30 lines

New Thread

out of the office.

out of the office.

Patrick J. O'Connor <[log in to unmask]>

Thu, 9 Aug 2001 11:54:42 -0500

23 lines

New Thread

P&P can't locate fiducials

P&P can't locate fiducials

Mark Hargreaves <[log in to unmask]>

Tue, 21 Aug 2001 07:57:13 -0400

33 lines

Re: P&P can't locate fiducials

Caldon W. Driscoll <[log in to unmask]>

Tue, 21 Aug 2001 08:36:07 -0400

86 lines

Re: P&P can't locate fiducials

Braime, Justin <[log in to unmask]>

Tue, 21 Aug 2001 13:24:09 +0100

81 lines

Re: P&P can't locate fiducials

Campbell, William (wcampbel) <[log in to unmask]>

Tue, 21 Aug 2001 09:08:21 -0400

117 lines

Re: P&P can't locate fiducials

Tempea, Ioan <[log in to unmask]>

Tue, 21 Aug 2001 09:13:00 -0400

140 lines

Re: P&P can't locate fiducials

Adrian Irwin <[log in to unmask]>

Wed, 22 Aug 2001 07:19:15 +0100

140 lines

New Thread

Package consultants with electronics background

Package consultants with electronics background

Kevin Stokes <[log in to unmask]>

Thu, 23 Aug 2001 06:53:31 -0500

80 lines

New Thread

Packaging Instructions for finished Electronic Assemblies

Packaging Instructions for finished Electronic Assemblies

Rich Lasko <[log in to unmask]>

Tue, 21 Aug 2001 12:25:30 -0500

50 lines

Re: Packaging Instructions for finished Electronic Assemblies

Peter Gallant <[log in to unmask]>

Tue, 21 Aug 2001 13:53:23 -0400

100 lines

New Thread

pad geometry

pad geometry

Jim Gleason <[log in to unmask]>

Fri, 24 Aug 2001 15:37:04 -0700

47 lines

Re: pad geometry

Dean Lillibridge <[log in to unmask]>

Fri, 24 Aug 2001 16:44:42 -0400

97 lines

New Thread

Panelized Boards

Panelized Boards

bbarr <[log in to unmask]>

Wed, 15 Aug 2001 13:46:28 -0400

36 lines

Re: Panelized Boards

Phil Nutting <[log in to unmask]>

Wed, 15 Aug 2001 14:32:08 -0400

95 lines

Re: Panelized Boards

Dean Lillibridge <[log in to unmask]>

Wed, 15 Aug 2001 14:45:18 -0400

66 lines

Re: Panelized Boards

Sauer, Steven T. <[log in to unmask]>

Wed, 15 Aug 2001 14:59:56 -0400

64 lines

New Thread

PCB Moisture Absorption

PCB Moisture Absorption

Karen Walters <[log in to unmask]>

Wed, 8 Aug 2001 14:39:59 -0400

41 lines

Re: PCB Moisture Absorption

Craig Hillman <[log in to unmask]>

Wed, 8 Aug 2001 16:34:25 -0400

75 lines

Re: PCB Moisture Absorption

David Douthit <[log in to unmask]>

Wed, 8 Aug 2001 13:56:50 -0700

83 lines

Re: PCB Moisture Absorption

<Peter George Duncan> <[log in to unmask]>

Mon, 13 Aug 2001 08:57:51 +0800

107 lines

New Thread

phenomenon with Ni/Au plating

phenomenon with Ni/Au plating

Busko, Wolfgang <[log in to unmask]>

Mon, 27 Aug 2001 10:18:27 +0200

43 lines

Re: phenomenon with Ni/Au plating

Andrew Hoggan <[log in to unmask]>

Mon, 27 Aug 2001 10:09:09 +0100

66 lines

Re: phenomenon with Ni/Au plating

Dennis Fritz <[log in to unmask]>

Mon, 27 Aug 2001 11:16:52 EDT

41 lines

New Thread

photoplotting service

photoplotting service

James W. High <[log in to unmask]>

Wed, 15 Aug 2001 11:45:39 -0400

35 lines

Re: photoplotting service

Dave Roesler <[log in to unmask]>

Wed, 15 Aug 2001 11:52:34 -0500

70 lines

New Thread

Pin Grid Pin Allignment

Pin Grid Pin Allignment

mark simmons <[log in to unmask]>

Wed, 1 Aug 2001 08:45:50 -0700

27 lines

New Thread

plastic fingers

plastic fingers

lab <[log in to unmask]>

Tue, 14 Aug 2001 05:55:21 -0700

33 lines

Re: plastic fingers

Larry Koens <[log in to unmask]>

Tue, 14 Aug 2001 11:52:33 -0500

51 lines

New Thread

plastic fingers for wave solder

plastic fingers for wave solder

FUN GUY <[log in to unmask]>

Fri, 10 Aug 2001 12:59:03 -0700

33 lines

New Thread

PRCL RDSon Fallouts

PRCL RDSon Fallouts

Jonathan A Noquil <[log in to unmask]>

Sat, 1 Sep 2001 10:36:29 +0800

36 lines

New Thread

Pre assembly conditioning

Pre assembly conditioning

Kathy Bergman <[log in to unmask]>

Fri, 31 Aug 2001 11:35:56 -0700

28 lines

Re: Pre assembly conditioning

Jack Crawford <[log in to unmask]>

Fri, 31 Aug 2001 21:10:56 -0500

55 lines

New Thread

Pre-preg and Core Material Thicknesses

Pre-preg and Core Material Thicknesses

<Peter George Duncan> <[log in to unmask]>

Tue, 28 Aug 2001 11:52:26 +0800

49 lines

Re: Pre-preg and Core Material Thicknesses

Brad Saunders <[log in to unmask]>

Tue, 28 Aug 2001 09:04:33 EDT

108 lines

New Thread

Process Problem vs Board Problem

Process Problem vs Board Problem

Kasprzak, Bill (sys) USX <[log in to unmask]>

Wed, 1 Aug 2001 08:34:47 -0400

62 lines

Re: Process Problem vs Board Problem

Kathy Kuhlow <[log in to unmask]>

Wed, 1 Aug 2001 13:01:22 -0500

64 lines

Re: Process Problem vs Board Problem

Stephen R. Gregory <[log in to unmask]>

Thu, 2 Aug 2001 11:44:50 EDT

153 lines

Re: Process Problem vs Board Problem

Don Vischulis <[log in to unmask]>

Thu, 2 Aug 2001 11:25:38 -0600

35 lines

Re: Process Problem vs Board Problem

Edward Szpruch <[log in to unmask]>

Fri, 3 Aug 2001 12:41:06 +0200

147 lines

Re: Process Problem vs Board Problem

Andrew Hoggan <[log in to unmask]>

Fri, 3 Aug 2001 11:09:11 +0100

106 lines

Re: Process Problem vs Board Problem

Kasprzak, Bill (sys) USX <[log in to unmask]>

Sat, 4 Aug 2001 07:14:22 -0400

95 lines

New Thread

PWB supplier search

PWB supplier search

Scott Kauling <[log in to unmask]>

Fri, 17 Aug 2001 17:08:33 -0500

45 lines

New Thread

Questions

Questions

Armando Saldana <[log in to unmask]>

Tue, 7 Aug 2001 09:34:58 -0700

104 lines

New Thread

Re: [TN] ãCc'M( 1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz

Re: Re: [TN] ãCc'M( 1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz

Brian Ellis <[log in to unmask]>

Wed, 29 Aug 2001 17:04:20 +0300

54 lines

New Thread

Reliability of reflowed solder to dissipate heat via RF IC heat s lug

Reliability of reflowed solder to dissipate heat via RF IC heat s lug

Grant Emandien <[log in to unmask]>

Tue, 28 Aug 2001 14:05:50 +0200

50 lines

Re: Reliability of reflowed solder to dissipate heat via RF IC heat s lug

Brad Saunders <[log in to unmask]>

Tue, 28 Aug 2001 09:29:05 EDT

75 lines

New Thread

Reminder - IPC ENIG standard review deadline

Reminder - IPC ENIG standard review deadline

Jane Koh <[log in to unmask]>

Wed, 15 Aug 2001 18:45:37 -0500

51 lines

New Thread

REQUEST IPC-4552

REQUEST IPC-4552

Tom Burek <[log in to unmask]>

Thu, 16 Aug 2001 11:30:09 -0400

28 lines

New Thread

Rework

Rework

Craig Hillman <[log in to unmask]>

Wed, 1 Aug 2001 18:48:58 -0400

27 lines

Re: Rework

Dorothy M. Lush <[log in to unmask]>

Wed, 1 Aug 2001 16:05:17 -0700

54 lines

Re: Rework

David Douthit <[log in to unmask]>

Wed, 1 Aug 2001 22:30:49 -0700

48 lines

Re: Rework

d. terstegge <[log in to unmask]>

Thu, 2 Aug 2001 09:18:18 +0200

59 lines

New Thread

Rework of SMA connector

Rework of SMA connector

Ken Patel <[log in to unmask]>

Tue, 7 Aug 2001 18:47:47 -0700

27 lines

New Thread

Rework Specification

Rework Specification

David Schaefer <[log in to unmask]>

Wed, 29 Aug 2001 11:51:38 -0400

81 lines

Re: Rework Specification

Jeff Ferry <[log in to unmask]>

Wed, 29 Aug 2001 15:35:03 -0400

148 lines

New Thread

Rod Smith/Endicott/IBM is out of the office.

Rod Smith/Endicott/IBM is out of the office.

Rod Smith <[log in to unmask]>

Sat, 25 Aug 2001 04:14:34 -0400

22 lines

New Thread

RTV and weight requirements...

RTV and weight requirements...

Ken Patel <[log in to unmask]>

Tue, 28 Aug 2001 15:40:42 -0700

25 lines

Re: RTV and weight requirements...

Greg Scott <[log in to unmask]>

Wed, 29 Aug 2001 08:05:42 -0700

45 lines

Re: RTV and weight requirements...

Mel Parrish <[log in to unmask]>

Wed, 29 Aug 2001 12:32:54 -0700

80 lines

Re: RTV and weight requirements...

Ken Patel <[log in to unmask]>

Wed, 29 Aug 2001 10:56:55 -0700

62 lines

Re: RTV and weight requirements...

Greg Scott <[log in to unmask]>

Wed, 29 Aug 2001 13:34:58 -0700

85 lines

New Thread

Searching for reflow oven manufacturer or user

Searching for reflow oven manufacturer or user

West, Jim <[log in to unmask]>

Mon, 13 Aug 2001 11:44:20 -0400

38 lines

Re: Searching for reflow oven manufacturer or user

Stephen R. Gregory <[log in to unmask]>

Mon, 13 Aug 2001 13:41:42 EDT

99 lines

Re: Searching for reflow oven manufacturer or user

Anderson, Greg (IndSys, GEFanuc, NA) <[log in to unmask]>

Mon, 13 Aug 2001 14:21:42 -0400

76 lines

New Thread

self-centering SMT

self-centering SMT

Miguel Vallejo <[log in to unmask]>

Tue, 21 Aug 2001 09:17:51 -0700

27 lines

Re: self-centering SMT

Rick Thompson <[log in to unmask]>

Tue, 21 Aug 2001 10:28:19 -0700

70 lines

Re: self-centering SMT

John Fischbach <[log in to unmask]>

Tue, 21 Aug 2001 12:52:27 -0500

119 lines

Re: self-centering SMT

Phil Zarrow <[log in to unmask]>

Tue, 21 Aug 2001 14:16:53 EDT

82 lines

Re: self-centering SMT

Steve Abrahamson <[log in to unmask]>

Tue, 21 Aug 2001 13:59:00 -0600

73 lines

Re: self-centering SMT

Phil Zarrow <[log in to unmask]>

Tue, 21 Aug 2001 18:12:38 EDT

78 lines

Re: self-centering SMT

Rick Thompson <[log in to unmask]>

Tue, 21 Aug 2001 16:58:52 -0700

109 lines

Re: self-centering SMT

Stephen R. Gregory <[log in to unmask]>

Tue, 21 Aug 2001 21:01:21 EDT

232 lines

Re: self-centering SMT

Mike Fenner <[log in to unmask]>

Wed, 22 Aug 2001 10:11:38 +0100

341 lines

New Thread

Sheet Adhesive Suppliers

Sheet Adhesive Suppliers

Kane, Joseph <[log in to unmask]>

Tue, 28 Aug 2001 11:53:02 -0400

35 lines

Re: Sheet Adhesive Suppliers

<Peter George Duncan> <[log in to unmask]>

Wed, 29 Aug 2001 10:09:53 +0800

95 lines

Re: Sheet Adhesive Suppliers

Stephen R. Gregory <[log in to unmask]>

Tue, 28 Aug 2001 22:32:44 EDT

106 lines

Re: Sheet Adhesive Suppliers

Neil Atkinson <[log in to unmask]>

Wed, 29 Aug 2001 08:03:10 +0100

72 lines

Re: Sheet Adhesive Suppliers

Kane, Joseph <[log in to unmask]>

Wed, 29 Aug 2001 11:55:49 -0400

83 lines

Re: Sheet Adhesive Suppliers

Thomas Bauer <[log in to unmask]>

Wed, 29 Aug 2001 09:28:44 -0700

110 lines

Re: Sheet Adhesive Suppliers

Brad Saunders <[log in to unmask]>

Wed, 29 Aug 2001 18:30:57 EDT

54 lines

New Thread

SMD Assembly Problems

SMD Assembly Problems

Roger M. Stoops <[log in to unmask]>

Mon, 27 Aug 2001 16:38:15 -0400

48 lines

Re: SMD Assembly Problems

Kathy Kuhlow <[log in to unmask]>

Mon, 27 Aug 2001 16:18:49 -0500

196 lines

Re: SMD Assembly Problems

Kasprzak, Bill (sys) USX <[log in to unmask]>

Tue, 28 Aug 2001 07:12:31 -0400

70 lines

Re: SMD Assembly Problems

Grant Emandien <[log in to unmask]>

Tue, 28 Aug 2001 14:30:32 +0200

100 lines

New Thread

SMT adhesive

Re: SMT adhesive

Graham Collins <[log in to unmask]>

Tue, 7 Aug 2001 07:40:08 -0400

87 lines

New Thread

SMT Epoxies?

SMT Epoxies?

Rick Thompson <[log in to unmask]>

Mon, 27 Aug 2001 11:25:50 -0700

37 lines

New Thread

SMT Pads

SMT Pads

Cathy Killen <[log in to unmask]>

Fri, 10 Aug 2001 13:48:24 +0100

27 lines

Re: SMT Pads

Graham Collins <[log in to unmask]>

Fri, 10 Aug 2001 09:14:57 -0400

71 lines

Re: SMT Pads

Eric Dawson <[log in to unmask]>

Fri, 10 Aug 2001 14:59:59 +0100

69 lines

New Thread

Solder analysis results

Solder analysis results

Phil Nutting <[log in to unmask]>

Tue, 14 Aug 2001 08:48:05 -0400

38 lines

Re: Solder analysis results

Edward Szpruch <[log in to unmask]>

Tue, 14 Aug 2001 18:35:14 +0200

91 lines

Re: Solder analysis results

Guy Ramsey <[log in to unmask]>

Tue, 14 Aug 2001 11:44:01 -0400

77 lines

Re: Solder analysis results

Stephen S. Schiera <[log in to unmask]>

Tue, 14 Aug 2001 11:45:53 -0500

85 lines

Re: Solder analysis results

Ken Mc Gowan <[log in to unmask]>

Tue, 14 Aug 2001 19:52:13 -0100

71 lines

Re: Solder analysis results

Scott Mcanall <[log in to unmask]>

Tue, 14 Aug 2001 19:33:59 EDT

25 lines

Re: Solder analysis results

David Fish <[log in to unmask]>

Tue, 14 Aug 2001 21:31:59 -0700

67 lines

Re: Solder analysis results

Stephen R. Gregory <[log in to unmask]>

Tue, 14 Aug 2001 22:04:15 EDT

100 lines

Re: Solder analysis results

Edward Szpruch <[log in to unmask]>

Wed, 15 Aug 2001 09:24:43 +0200

158 lines

Re: Solder analysis results

Lou Hart <[log in to unmask]>

Wed, 15 Aug 2001 09:21:12 -0400

60 lines

Re: Solder analysis results

Furrow, Robert Gordon (Bob) <[log in to unmask]>

Wed, 15 Aug 2001 10:08:22 -0400

107 lines

Re: Solder analysis results

Phil Nutting <[log in to unmask]>

Wed, 15 Aug 2001 10:17:40 -0400

108 lines

Re: Solder analysis results

Mike Fenner <[log in to unmask]>

Wed, 15 Aug 2001 15:58:46 +0100

149 lines

Re: Solder analysis results

Neil Atkinson <[log in to unmask]>

Wed, 15 Aug 2001 17:26:24 +0100

192 lines

Re: Solder analysis results

Gary Camac <[log in to unmask]>

Wed, 15 Aug 2001 15:10:02 -0500

195 lines

New Thread

solder balls

Re: solder balls

Lush, Dorothy <[log in to unmask]>

Tue, 14 Aug 2001 14:05:38 -0700

71 lines

Re: solder balls

Marsico, James <[log in to unmask]>

Wed, 15 Aug 2001 06:52:39 -0400

113 lines

Re: solder balls

Sauer, Steven T. <[log in to unmask]>

Wed, 15 Aug 2001 07:43:45 -0400

38 lines

Re: solder balls

Neil Atkinson <[log in to unmask]>

Wed, 15 Aug 2001 13:16:44 +0100

187 lines

Re: solder balls

Crepeau, Phil <[log in to unmask]>

Wed, 15 Aug 2001 07:39:25 -0700

136 lines

Re: solder balls

Campbell, William (wcampbel) <[log in to unmask]>

Wed, 15 Aug 2001 16:53:59 -0400

140 lines

Re: solder balls

Andrew Hoggan <[log in to unmask]>

Thu, 16 Aug 2001 11:45:40 +0100

84 lines

New Thread

Solder Beads (not solder balls)

Solder Beads (not solder balls)

Jorge Rodriguez <[log in to unmask]>

Tue, 21 Aug 2001 11:57:00 -0700

37 lines

Re: Solder Beads (not solder balls)

Guy Ramsey <[log in to unmask]>

Tue, 21 Aug 2001 15:31:32 -0400

73 lines

Re: Solder Beads (not solder balls)

Bartkowaik Christine <[log in to unmask]>

Tue, 21 Aug 2001 15:34:39 -0400

78 lines

Re: Solder Beads (not solder balls)

Dorothy M. Lush <[log in to unmask]>

Tue, 21 Aug 2001 13:23:56 -0700

71 lines

Re: Solder Beads (not solder balls)

Campbell, William (wcampbel) <[log in to unmask]>

Tue, 21 Aug 2001 16:31:41 -0400

63 lines

Re: Solder Beads (not solder balls)

Andrew Hoggan <[log in to unmask]>

Tue, 21 Aug 2001 22:32:17 +0100

94 lines

Re: Solder Beads (not solder balls)

Chris Gifford <[log in to unmask]>

Tue, 21 Aug 2001 17:58:54 -0400

74 lines

Re: Solder Beads (not solder balls)

Mike Fenner <[log in to unmask]>

Wed, 22 Aug 2001 10:50:16 +0100

86 lines

Re: Solder Beads (not solder balls)

John Fischbach <[log in to unmask]>

Wed, 22 Aug 2001 07:32:47 -0500

198 lines

New Thread

Solder conditions

Solder conditions

Kathy Bergman <[log in to unmask]>

Fri, 10 Aug 2001 12:59:35 -0500

31 lines

Re: Solder conditions

Dorothy M. Lush <[log in to unmask]>

Fri, 10 Aug 2001 11:12:17 -0700

69 lines

Re: Solder conditions

Kathy Kuhlow <[log in to unmask]>

Fri, 10 Aug 2001 13:24:50 -0500

76 lines

Re: Solder conditions

Kathy Bergman <[log in to unmask]>

Fri, 10 Aug 2001 12:58:01 -0700

38 lines

Re: Solder conditions

Guy Ramsey <[log in to unmask]>

Fri, 10 Aug 2001 17:09:24 -0400

73 lines

Re: Solder conditions

Jon Moore <[log in to unmask]>

Fri, 10 Aug 2001 17:54:31 EDT

36 lines

New Thread

Solder mask Clerance ...who should do it?

Solder mask Clerance ...who should do it?

Ken Patel <[log in to unmask]>

Mon, 20 Aug 2001 16:02:39 -0700

33 lines

New Thread

Solder Paste Measurements

Re: Solder Paste Measurements

d. terstegge <[log in to unmask]>

Wed, 1 Aug 2001 11:50:07 +0200

171 lines

Re: Solder Paste Measurements

Neil Atkinson <[log in to unmask]>

Wed, 1 Aug 2001 13:17:58 +0100

183 lines

Re: Solder Paste Measurements

Lush, Dorothy <[log in to unmask]>

Wed, 1 Aug 2001 09:09:19 -0700

166 lines

Re: Solder Paste Measurements

Howard Watson <[log in to unmask]>

Wed, 1 Aug 2001 15:51:44 -0400

327 lines

New Thread

solder paste with 2% silver

Re: solder paste with 2% silver

Misner, Bruce <[log in to unmask]>

Tue, 7 Aug 2001 08:35:07 -0500

62 lines

New Thread

Solder Shorts in PBGA

Solder Shorts in PBGA

Becerra Alejandro <[log in to unmask]>

Mon, 27 Aug 2001 16:15:34 -0500

109 lines

New Thread

Solder Testing

Solder Testing

Michael Lester <[log in to unmask]>

Mon, 20 Aug 2001 11:04:52 EDT

39 lines

Re: Solder Testing

Guy Ramsey <[log in to unmask]>

Mon, 20 Aug 2001 12:41:36 -0400

109 lines

Re: Solder Testing

Timothy Reeves <[log in to unmask]>

Mon, 20 Aug 2001 11:36:20 -0700

141 lines

Re: Solder Testing

Guy Ramsey <[log in to unmask]>

Tue, 21 Aug 2001 07:58:33 -0400

181 lines

New Thread

Solder vs Gold Pads on SMT

Solder vs Gold Pads on SMT

Chafin, Ken G. <[log in to unmask]>

Mon, 20 Aug 2001 14:30:37 -0400

31 lines

Re: Solder vs Gold Pads on SMT

Roger M. Stoops <[log in to unmask]>

Mon, 20 Aug 2001 15:13:50 -0400

103 lines

Re: Solder vs Gold Pads on SMT

Chafin, Ken G. <[log in to unmask]>

Mon, 20 Aug 2001 16:39:09 -0400

138 lines

Re: Solder vs Gold Pads on SMT

<Peter George Duncan> <[log in to unmask]>

Tue, 21 Aug 2001 09:40:08 +0800

92 lines

Re: Solder vs Gold Pads on SMT

Ryan Grant <[log in to unmask]>

Mon, 20 Aug 2001 20:49:10 -0600

80 lines

Re: Solder vs Gold Pads on SMT

Greg Scott <[log in to unmask]>

Tue, 21 Aug 2001 08:26:23 -0700

104 lines

Re: Solder vs Gold Pads on SMT

Steve Abrahamson <[log in to unmask]>

Tue, 21 Aug 2001 10:02:17 -0600

120 lines

Re: Solder vs Gold Pads on SMT

Roger M. Stoops <[log in to unmask]>

Tue, 21 Aug 2001 12:33:49 -0400

202 lines

Re: Solder vs Gold Pads on SMT

Pelkey, Glenn <[log in to unmask]>

Tue, 21 Aug 2001 09:59:07 -0700

301 lines

Re: Solder vs Gold Pads on SMT

Chafin, Ken G. <[log in to unmask]>

Tue, 21 Aug 2001 13:45:10 -0400

46 lines

Solder vs Gold Pads on SMT

Rick Thompson <[log in to unmask]>

Tue, 21 Aug 2001 10:52:47 -0700

35 lines

Re: Solder vs Gold Pads on SMT

<Peter George Duncan> <[log in to unmask]>

Wed, 22 Aug 2001 11:09:51 +0800

93 lines

Re: Solder vs Gold Pads on SMT

Kathy Kuhlow <[log in to unmask]>

Fri, 24 Aug 2001 10:53:26 -0500

57 lines

New Thread

Soldering 36 pins LCD by flat tip soldering iron

Soldering 36 pins LCD by flat tip soldering iron

Ajit Jain <[log in to unmask]>

Wed, 22 Aug 2001 10:20:25 +0530

39 lines

Re: Soldering 36 pins LCD by flat tip soldering iron

<Peter George Duncan> <[log in to unmask]>

Wed, 22 Aug 2001 16:31:51 +0800

106 lines

New Thread

Soldering SMT components

Soldering SMT components

Peter Gallant <[log in to unmask]>

Tue, 21 Aug 2001 09:16:16 -0500

19 lines

New Thread

Soldering to palladium silver

Soldering to palladium silver

Marsico, James <[log in to unmask]>

Mon, 13 Aug 2001 06:56:38 -0400

34 lines

Re: Soldering to palladium silver

Jean-Luc Lehmann <[log in to unmask]>

Wed, 15 Aug 2001 11:28:43 +0200

69 lines

Re: Soldering to palladium silver

Mike Fenner <[log in to unmask]>

Wed, 15 Aug 2001 15:39:00 +0100

112 lines

New Thread

soldr balls

soldr balls

Marsico, James <[log in to unmask]>

Tue, 14 Aug 2001 15:34:14 -0400

29 lines

Re: soldr balls

Tempea, Ioan <[log in to unmask]>

Tue, 14 Aug 2001 16:12:19 -0400

62 lines

Re: soldr balls

<Peter George Duncan> <[log in to unmask]>

Wed, 15 Aug 2001 16:30:42 +0800

80 lines

New Thread

SPC software for Lab

SPC software for Lab

Duncan Ingemar <[log in to unmask]>

Thu, 23 Aug 2001 10:04:46 -0500

27 lines

Re: SPC software for Lab

Barry Gallegos <[log in to unmask]>

Thu, 23 Aug 2001 09:40:08 -0600

63 lines

New Thread

Spray Fluxer

Spray Fluxer

Kasprzak, Bill (sys) USX <[log in to unmask]>

Mon, 20 Aug 2001 16:06:29 -0400

30 lines

Re: Spray Fluxer

Alan Kreplick <[log in to unmask]>

Mon, 20 Aug 2001 16:32:41 -0400

78 lines

Re: Spray Fluxer

Barry Gallegos <[log in to unmask]>

Mon, 20 Aug 2001 14:59:13 -0600

64 lines

Re: Spray Fluxer

Steve Abrahamson <[log in to unmask]>

Mon, 20 Aug 2001 15:49:12 -0600

61 lines

Re: Spray Fluxer

Paul Truit <[log in to unmask]>

Tue, 21 Aug 2001 08:54:04 -0400

61 lines

New Thread

Stepped Stencil

Stepped Stencil

David Simmons <[log in to unmask]>

Thu, 23 Aug 2001 12:53:50 +1200

31 lines

Re: Stepped Stencil

<Peter George Duncan> <[log in to unmask]>

Thu, 23 Aug 2001 13:55:51 +0800

92 lines

Re: Stepped Stencil

Bartkowaik Christine <[log in to unmask]>

Thu, 23 Aug 2001 06:44:10 -0400

151 lines

Re: Stepped Stencil

Dorothy M. Lush <[log in to unmask]>

Thu, 23 Aug 2001 09:22:21 -0700

64 lines

Re: Stepped Stencil

Towle, Betsy <[log in to unmask]>

Thu, 23 Aug 2001 09:54:20 -0700

252 lines

Re: Stepped Stencil

David Simmons <[log in to unmask]>

Fri, 24 Aug 2001 08:04:53 +1200

108 lines

New Thread

SV: [TN] Immersion gold with hard gold fingers

SV: [TN] Immersion gold with hard gold fingers

Jan Thuesen <[log in to unmask]>

Mon, 27 Aug 2001 08:27:20 +0200

66 lines

New Thread

T/H Capacitor Removal- IPC standards?

T/H Capacitor Removal- IPC standards?

John Fahey <[log in to unmask]>

Mon, 20 Aug 2001 12:16:32 -0500

33 lines

Re: T/H Capacitor Removal- IPC standards?

Charles Caswell <[log in to unmask]>

Mon, 20 Aug 2001 12:27:39 -0500

68 lines

Re: T/H Capacitor Removal- IPC standards?

Phil Nutting <[log in to unmask]>

Mon, 20 Aug 2001 13:36:09 -0400

100 lines

Re: T/H Capacitor Removal- IPC standards?

John Fahey <[log in to unmask]>

Mon, 20 Aug 2001 10:47:02 -0700

147 lines

Re: T/H Capacitor Removal- IPC standards?

Graham Collins <[log in to unmask]>

Mon, 20 Aug 2001 14:04:58 -0400

196 lines

Re: T/H Capacitor Removal- IPC standards?

Charles Caswell <[log in to unmask]>

Mon, 20 Aug 2001 13:09:28 -0500

193 lines

Re: T/H Capacitor Removal- IPC standards?

<Peter George Duncan> <[log in to unmask]>

Tue, 21 Aug 2001 09:16:49 +0800

107 lines

Re: T/H Capacitor Removal- IPC standards?

<Peter George Duncan> <[log in to unmask]>

Tue, 21 Aug 2001 09:20:44 +0800

205 lines

New Thread

Teflon board price

Teflon board price

michael <[log in to unmask]>

Fri, 24 Aug 2001 20:06:14 +0800

27 lines

New Thread

Tenting of vias

Tenting of vias

Richard Todd <[log in to unmask]>

Thu, 16 Aug 2001 12:16:06 -0500

41 lines

Re: Tenting of vias

Kathy Kuhlow <[log in to unmask]>

Thu, 16 Aug 2001 14:04:29 -0500

45 lines

Re: Tenting of vias

John Nelson <[log in to unmask]>

Thu, 16 Aug 2001 15:57:55 -0400

78 lines

Re: Tenting of vias

Todd, Rick <[log in to unmask]>

Thu, 16 Aug 2001 16:07:28 -0400

91 lines

Re: Tenting of vias

Todd, Rick <[log in to unmask]>

Thu, 16 Aug 2001 16:24:33 -0400

293 lines

Re: Tenting of vias

Dorothy M. Lush <[log in to unmask]>

Fri, 17 Aug 2001 09:19:10 -0700

74 lines

New Thread

The effective test method of the expired prepreg.

The effective test method of the expired prepreg.

Young Hwan Ju <[log in to unmask]>

Sat, 18 Aug 2001 11:39:04 +0900

33 lines

Re: The effective test method of the expired prepreg.

Pelkey, Glenn <[log in to unmask]>

Tue, 21 Aug 2001 09:28:42 -0700

169 lines

New Thread

Thermal Compound considerations

Thermal Compound considerations

Phil Nutting <[log in to unmask]>

Mon, 20 Aug 2001 09:42:51 -0400

54 lines

Re: Thermal Compound considerations

Guy Ramsey <[log in to unmask]>

Mon, 20 Aug 2001 10:09:57 -0400

96 lines

Re: Thermal Compound considerations

Phil Nutting <[log in to unmask]>

Mon, 20 Aug 2001 10:27:54 -0400

141 lines

Re: Thermal Compound considerations

<Peter George Duncan> <[log in to unmask]>

Tue, 21 Aug 2001 08:57:32 +0800

110 lines

New Thread

Thermal Grease

Thermal Grease

John Brewer <[log in to unmask]>

Tue, 14 Aug 2001 15:02:55 -0400

22 lines

Thermal Grease

[log in to unmask]

Wed, 22 Aug 2001 07:55:43 -0500

36 lines

Re: Thermal Grease

Guy Ramsey <[log in to unmask]>

Wed, 22 Aug 2001 09:18:32 -0400

83 lines

Re: Thermal Grease

Phil Nutting <[log in to unmask]>

Wed, 22 Aug 2001 15:21:25 -0400

70 lines

New Thread

thermal interface material

thermal interface material

Genny Gibbard <[log in to unmask]>

Tue, 21 Aug 2001 11:54:32 -0600

39 lines

Re: thermal interface material

Lush, Dorothy <[log in to unmask]>

Tue, 21 Aug 2001 11:09:36 -0700

76 lines

Re: thermal interface material

Graham Collins <[log in to unmask]>

Tue, 21 Aug 2001 14:13:55 -0400

82 lines

Re: thermal interface material

Genny Gibbard <[log in to unmask]>

Tue, 21 Aug 2001 15:00:16 -0600

119 lines

Re: thermal interface material

<Peter George Duncan> <[log in to unmask]>

Wed, 22 Aug 2001 11:29:46 +0800

112 lines

Re: thermal interface material

<Peter George Duncan> <[log in to unmask]>

Wed, 22 Aug 2001 11:46:53 +0800

152 lines

Re: thermal interface material

<Peter George Duncan> <[log in to unmask]>

Wed, 22 Aug 2001 12:17:20 +0800

210 lines

Re: thermal interface material

Creswick, Steven <[log in to unmask]>

Wed, 22 Aug 2001 06:38:35 -0400

249 lines

Re: thermal interface material

Michael Kuczynski <[log in to unmask]>

Wed, 22 Aug 2001 06:42:35 -0500

29 lines

Re: thermal interface material

Graham Collins <[log in to unmask]>

Wed, 22 Aug 2001 08:01:10 -0400

66 lines

Re: thermal interface material

<Peter George Duncan> <[log in to unmask]>

Thu, 23 Aug 2001 12:21:27 +0800

309 lines

New Thread

Tin Plating bath (not clear anymore)

Tin Plating bath (not clear anymore)

Sean Clinton <[log in to unmask]>

Mon, 27 Aug 2001 12:48:15 -0700

45 lines

Re: Tin Plating bath (not clear anymore)

<Rudy Sedlak> <[log in to unmask]>

Mon, 27 Aug 2001 17:26:53 EDT

53 lines

Re: Tin Plating bath (not clear anymore)

Gary McCauley <[log in to unmask]>

Mon, 27 Aug 2001 16:36:53 -0500

87 lines

Re: Tin Plating bath (not clear anymore)

Gary McCauley <[log in to unmask]>

Mon, 27 Aug 2001 16:41:21 -0500

44 lines

Re: Tin Plating bath (not clear anymore)

Timothy Reeves <[log in to unmask]>

Mon, 27 Aug 2001 15:23:47 -0700

57 lines

Re: Tin Plating bath (not clear anymore)

Sean Clinton <[log in to unmask]>

Mon, 27 Aug 2001 15:14:21 -0700

92 lines

Re: Tin Plating bath (not clear anymore)

Barmuta, Mike <[log in to unmask]>

Tue, 28 Aug 2001 09:56:54 -0700

97 lines

Re: Tin Plating bath (not clear anymore)

peter blokhuis <[log in to unmask]>

Tue, 28 Aug 2001 14:00:53 -0700

106 lines

Re: Tin Plating bath (not clear anymore)

<Roger Mouton> <[log in to unmask]>

Wed, 29 Aug 2001 01:17:09 EDT

46 lines

New Thread

Tin/Silver plating

Tin/Silver plating

John Fischbach <[log in to unmask]>

Tue, 28 Aug 2001 13:39:27 -0500

59 lines

New Thread

To wave or not to wave, that is the question...

To wave or not to wave, that is the question...

Kevin Stokes <[log in to unmask]>

Thu, 16 Aug 2001 15:26:06 -0500

88 lines

Re: To wave or not to wave, that is the question...

Dean Lillibridge <[log in to unmask]>

Thu, 16 Aug 2001 17:16:14 -0400

142 lines

Re: To wave or not to wave, that is the question...

Dorothy M. Lush <[log in to unmask]>

Thu, 16 Aug 2001 14:12:59 -0700

63 lines

Re: To wave or not to wave, that is the question...

Don Vischulis <[log in to unmask]>

Thu, 16 Aug 2001 16:32:12 -0600

130 lines

Re: To wave or not to wave, that is the question...

Frank Kimmey <[log in to unmask]>

Thu, 16 Aug 2001 15:02:29 -0700

66 lines

Re: To wave or not to wave, that is the question...

Bartkowaik Christine <[log in to unmask]>

Fri, 17 Aug 2001 06:55:38 -0400

53 lines

Re: To wave or not to wave, that is the question...

Craig Hillman <[log in to unmask]>

Fri, 17 Aug 2001 09:06:28 -0400

93 lines

Re: To wave or not to wave, that is the question...

Joyce Koo <[log in to unmask]>

Fri, 17 Aug 2001 09:55:23 -0400

422 lines

Re: To wave or not to wave, that is the question...

Dean Lillibridge <[log in to unmask]>

Fri, 17 Aug 2001 10:40:16 -0400

160 lines

Re: To wave or not to wave, that is the question...

John Maxwell <[log in to unmask]>

Fri, 17 Aug 2001 09:13:47 -0300

102 lines

Re: To wave or not to wave, that is the question...

John Maxwell <[log in to unmask]>

Fri, 17 Aug 2001 09:15:26 -0300

114 lines

Re: To wave or not to wave, that is the question...

Werner Engelmaier <[log in to unmask]>

Fri, 17 Aug 2001 14:26:30 EDT

26 lines

Re: To wave or not to wave, that is the question...

John Maxwell <[log in to unmask]>

Fri, 17 Aug 2001 12:48:48 -0300

54 lines

Re: To wave or not to wave, that is the question...

Jon Moore <[log in to unmask]>

Fri, 17 Aug 2001 16:52:37 EDT

30 lines

Re: To wave or not to wave, that is the question...

Mel Parrish <[log in to unmask]>

Fri, 17 Aug 2001 16:34:49 -0700

65 lines

New Thread

Tombstoning

Tombstoning

Vinit Verma <[log in to unmask]>

Mon, 27 Aug 2001 16:47:15 +0530

40 lines

Re: Tombstoning

Guy Ramsey <[log in to unmask]>

Mon, 27 Aug 2001 08:09:17 -0400

86 lines

Re: Tombstoning

Kathy Kuhlow <[log in to unmask]>

Mon, 27 Aug 2001 09:06:18 -0500

47 lines

New Thread

total PWB production

total PWB production

Weiner Mickey <[log in to unmask]>

Tue, 7 Aug 2001 07:56:08 +0300

64 lines

New Thread

Tropicalisation

Tropicalisation

Bissonnette, Jean-Francois <[log in to unmask]>

Wed, 22 Aug 2001 13:47:57 -0400

88 lines

Re: Tropicalisation

Mike Sewell <[log in to unmask]>

Wed, 22 Aug 2001 14:08:06 EDT

38 lines

Re: Tropicalisation

Gary McCauley <[log in to unmask]>

Wed, 22 Aug 2001 13:27:25 -0500

129 lines

Re: Tropicalisation

Crepeau, Phil <[log in to unmask]>

Wed, 22 Aug 2001 11:20:49 -0700

156 lines

Re: Tropicalisation

Brooks,Bill <[log in to unmask]>

Wed, 22 Aug 2001 12:35:05 -0700

210 lines

Re: Tropicalisation

David Douthit <[log in to unmask]>

Wed, 22 Aug 2001 18:41:28 -0700

195 lines

Re: Tropicalisation

<Peter George Duncan> <[log in to unmask]>

Thu, 23 Aug 2001 13:23:28 +0800

111 lines

Re: Tropicalisation

Graham Naisbitt <[log in to unmask]>

Thu, 23 Aug 2001 12:03:11 +0100

233 lines

New Thread

Uralite

Uralite

Brian L. Guidi <[log in to unmask]>

Mon, 13 Aug 2001 14:21:03 -0400

33 lines

Re: Uralite

Kasprzak, Bill (sys) USX <[log in to unmask]>

Mon, 13 Aug 2001 14:59:48 -0400

67 lines

Re: Uralite

Richard A. Sperandio <[log in to unmask]>

Mon, 20 Aug 2001 15:42:42 -0700

51 lines

New Thread

UV and Flex

UV and Flex

Ted Tontis <[log in to unmask]>

Fri, 3 Aug 2001 10:30:37 -0500

34 lines

Re: UV and Flex

Don Vischulis <[log in to unmask]>

Fri, 3 Aug 2001 11:03:23 -0600

33 lines

Re: UV and Flex

David Douthit <[log in to unmask]>

Fri, 3 Aug 2001 09:26:11 -0700

58 lines

New Thread

VIAS in pads...

VIAS in pads...

Ken Patel <[log in to unmask]>

Wed, 8 Aug 2001 11:52:35 -0700

29 lines

Re: VIAS in pads...

Sklenar Vit (RBAU-BK/MGE4) <[log in to unmask]>

Thu, 9 Aug 2001 09:30:19 +1000

69 lines

Re: VIAS in pads...

d. terstegge <[log in to unmask]>

Thu, 9 Aug 2001 08:22:19 +0200

77 lines

Re: VIAS in pads...

Erickson, Gary <[log in to unmask]>

Thu, 9 Aug 2001 09:33:52 -0400

140 lines

Re: VIAS in pads...

Greg Scott <[log in to unmask]>

Thu, 9 Aug 2001 08:41:40 -0700

96 lines

Re: VIAS in pads...

Tim Jensen <[log in to unmask]>

Thu, 9 Aug 2001 14:15:06 -0400

302 lines

Re: VIAS in pads...

Erickson, Gary <[log in to unmask]>

Thu, 9 Aug 2001 16:11:25 -0400

297 lines

Re: VIAS in pads...

Ken Patel <[log in to unmask]>

Thu, 9 Aug 2001 13:55:26 -0700

31 lines

Re: VIAS in pads...

Ken Patel <[log in to unmask]>

Thu, 9 Aug 2001 16:27:35 -0700

118 lines

Re: VIAS in pads...

Andrew Hoggan <[log in to unmask]>

Fri, 10 Aug 2001 01:17:31 +0100

498 lines

Re: VIAS in pads...

Greg Scott <[log in to unmask]>

Fri, 10 Aug 2001 10:24:05 -0700

140 lines

New Thread

virus

virus

Marsico, James <[log in to unmask]>

Mon, 27 Aug 2001 07:06:16 -0400

30 lines

New Thread

VME Spec and press fit DIN connector

VME Spec and press fit DIN connector

Ken Patel <[log in to unmask]>

Tue, 21 Aug 2001 15:38:57 -0700

26 lines

Re: VME Spec and press fit DIN connector

<Peter George Duncan> <[log in to unmask]>

Wed, 22 Aug 2001 12:28:41 +0800

73 lines

Re: VME Spec and press fit DIN connector

<Peter George Duncan> <[log in to unmask]>

Wed, 22 Aug 2001 12:31:41 +0800

74 lines

New Thread

Wavesoldering SOIC's

Wavesoldering SOIC's

Adrian Irwin <[log in to unmask]>

Tue, 14 Aug 2001 06:09:38 -0500

34 lines

Re: Wavesoldering SOIC's

Scott Mcanall <[log in to unmask]>

Tue, 14 Aug 2001 19:30:54 EDT

27 lines

Re: Wavesoldering SOIC's

Neil Atkinson <[log in to unmask]>

Wed, 15 Aug 2001 13:47:05 +0100

98 lines

Re: Wavesoldering SOIC's

[log in to unmask]

Wed, 15 Aug 2001 08:37:38 -0500

26 lines

Re: Wavesoldering SOIC's

Adrian Irwin <[log in to unmask]>

Wed, 15 Aug 2001 19:06:54 +0100

159 lines

Re: Wavesoldering SOIC's

Gerry Savard <[log in to unmask]>

Thu, 16 Aug 2001 09:45:21 -0400

152 lines

Re: Wavesoldering SOIC's

Neil Atkinson <[log in to unmask]>

Thu, 16 Aug 2001 17:56:48 +0100

250 lines

Re: Wavesoldering SOIC's

Guy Ramsey <[log in to unmask]>

Fri, 17 Aug 2001 08:29:19 -0400

199 lines

Re: Wavesoldering SOIC's

Jon Moore <[log in to unmask]>

Fri, 17 Aug 2001 15:48:57 EDT

29 lines

New Thread

Wetting Agents

Wetting Agents

Craig Hillman <[log in to unmask]>

Thu, 16 Aug 2001 11:59:02 -0400

80 lines

Re: Wetting Agents

[log in to unmask]

Thu, 16 Aug 2001 13:19:35 -0500

27 lines

Re: Wetting Agents

Andrew Hoggan <[log in to unmask]>

Thu, 16 Aug 2001 20:21:48 +0100

128 lines

Re: Wetting Agents

Craig Hillman <[log in to unmask]>

Thu, 16 Aug 2001 15:29:37 -0400

56 lines

Re: Wetting Agents

Brian Ellis <[log in to unmask]>

Fri, 17 Aug 2001 11:58:56 +0300

101 lines

Re: Wetting Agents

Craig Hillman <[log in to unmask]>

Fri, 17 Aug 2001 08:56:26 -0400

157 lines

Re: Wetting Agents

Brian Ellis <[log in to unmask]>

Fri, 17 Aug 2001 19:27:08 +0300

182 lines

New Thread

White Tin

White Tin

richard wiltron <[log in to unmask]>

Mon, 20 Aug 2001 11:02:48 -0700

34 lines

Re: White Tin

Bill Decray <[log in to unmask]>

Mon, 20 Aug 2001 14:23:17 -0400

73 lines

Re: White Tin

Bartkowaik Christine <[log in to unmask]>

Mon, 20 Aug 2001 14:43:03 -0400

69 lines

Re: White Tin

<Peter George Duncan> <[log in to unmask]>

Tue, 21 Aug 2001 09:23:32 +0800

121 lines

Re: White Tin

[log in to unmask]

Tue, 21 Aug 2001 00:40:19 EDT

49 lines

Re: White Tin

Neil Atkinson <[log in to unmask]>

Tue, 21 Aug 2001 09:07:52 +0100

106 lines

Re: White Tin

Guy Ramsey <[log in to unmask]>

Tue, 21 Aug 2001 16:03:55 -0400

91 lines

Re: White Tin

Seth Goodman <[log in to unmask]>

Wed, 22 Aug 2001 23:23:04 -0500

65 lines

Re: White Tin

Stewart, Dougal <[log in to unmask]>

Thu, 23 Aug 2001 09:51:38 +0100

110 lines

Re: White Tin

Seth Goodman <[log in to unmask]>

Thu, 23 Aug 2001 12:39:59 -0500

65 lines

New Thread

White Tin/MSA ?

White Tin/MSA ?

<Rudy Sedlak> <[log in to unmask]>

Thu, 23 Aug 2001 09:41:46 EDT

30 lines

New Thread

Your survey support is requested (moisture sensitive component testing)

Your survey support is requested (moisture sensitive component testing)

Jack Crawford <[log in to unmask]>

Thu, 30 Aug 2001 18:35:09 -0500

247 lines

New Thread

[LF] Eutectic alloys?????

Re: [LF] Eutectic alloys?????

Werner Engelmaier <[log in to unmask]>

Wed, 1 Aug 2001 16:17:42 EDT

29 lines

Re: [LF] Eutectic alloys?????

Werner Engelmaier <[log in to unmask]>

Thu, 2 Aug 2001 10:49:12 EDT

51 lines

Re: [LF] Eutectic alloys?????

Werner Engelmaier <[log in to unmask]>

Thu, 9 Aug 2001 22:02:21 EDT

40 lines

New Thread

[TN] ãCc'M(1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz

Re: [TN] ãCc'M(1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz

Jason Gregory <[log in to unmask]>

Wed, 29 Aug 2001 08:52:58 -0500

51 lines

New Thread

[TN] Re: [TN] ãCc'M( 1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz

RE: [TN] Re: [TN] ãCc'M( 1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz

Dieselberg, Ron <[log in to unmask]>

Wed, 29 Aug 2001 13:27:40 -0400

130 lines

New Thread

[TN] Re: [TN] ãCc'M(1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz

RE: [TN] Re: [TN] ãCc'M(1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz

Bissonnette, Jean-Francois <[log in to unmask]>

Wed, 29 Aug 2001 10:04:52 -0400

108 lines

New Thread

[TN] RE: [TN] Re: [TN] ãCc'M( 1û ÷kJ;'øø98å¥õe OC~qçD;î<;û ûz

Re: [TN] RE: [TN] Re: [TN] ãCc'M( 1û ÷kJ;'øø98å¥õe OC~qçD;î<;û ûz

Steve Joy <[log in to unmask]>

Wed, 29 Aug 2001 10:43:47 -0700

157 lines

New Thread

[TN] RE: [TN] Re: [TN] ãCc'M(1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz

RE: [TN] RE: [TN] Re: [TN] ãCc'M(1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz

Grant Emandien <[log in to unmask]>

Wed, 29 Aug 2001 16:16:05 +0200

159 lines

New Thread

[TN] RE: [TN] [TN]RE: [TN] Re: [TN] ãCc'M( 1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz

RE: [TN] RE: [TN] [TN]RE: [TN] Re: [TN] ãCc'M( 1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz

Bissonnette, Jean-Francois <[log in to unmask]>

Wed, 29 Aug 2001 15:54:37 -0400

192 lines

New Thread

[TN] [TN]RE: [TN] Re: [TN] ãCc'M( 1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz

RE: [TN] [TN]RE: [TN] Re: [TN] ãCc'M( 1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz

Pete Codella <[log in to unmask]>

Wed, 29 Aug 2001 15:39:48 -0400

126 lines

New Thread

[TN]RE: [TN] Re: [TN] ãCc'M( 1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz

Re: [TN]RE: [TN] Re: [TN] ãCc'M( 1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz

<Dan Cavaliere> <[log in to unmask]>

Wed, 29 Aug 2001 14:05:36 -0400

89 lines

New Thread

[TN]RE: [TN] Re: [TN] ãCc'M( 1û÷kJ;'øø98å¥õe OC~qçD;