ãCc'M(1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz (1 Message)
"b" stage epoxy (3 Messages)
''Encapsulating/Potting PCB Assemblies" (8 Messages)
0.5 mm pitch components and soldermask relief (5 Messages)
0201 chip process questions (2 Messages)
0603 land pattern debate (4 Messages)
6-pin DIP Optocoupler problem... (10 Messages)
<No subject given> (1 Message)
<No subject> (6 Messages)
Additive Trace Repair (2 Messages)
Administrator Test Msg--pls delete (2 Messages)
Alkaline etchant source (3 Messages)
Any DEK 288 users? (1 Message)
Any MELF experts? (2 Messages)
AOI equipment (6 Messages)
Application of Thermal Grease (6 Messages)
Assemblies using ceramic substrates... (3 Messages)
Assembly Inspection/verification. (7 Messages)
ATG Tester - Help (2 Messages)
Atotech (1 Message)
AW: [TN] Connector tilt, acceptable or not? (1 Message)
AW: [TN] Interesting Coplanarity ? (2 Messages)
AW: [TN] Misplace component (4 Messages)
AW: [TN] P&P can't locate fiducials (1 Message)
AW: [TN] Package consultants with electronics background (1 Message)
AW: [TN] phenomenon with Ni/Au plating (2 Messages)
AW: [TN] SMD Assembly Problems (1 Message)
AW: [TN] Solder Shorts in PBGA (1 Message)
Back-side Device Metallization (2 Messages)
Bench REL equipments (4 Messages)
Bench top spray etcher (1 Message)
BGA and X-ray (9 Messages)
BGA Bow (4 Messages)
BGA DFM Guidelines? (2 Messages)
BGA Inspection (4 Messages)
BGA PCB mounting material thickness (4 Messages)
BGA Re-balling services in Asia (3 Messages)
Bisumth Solder (Sn43Pb43Bi14) (2 Messages)
Board assm. shops doing BGA/CSPs and small volumes (2 Messages)
Board layout service (2 Messages)
Breathers in sealed automotive products (1 Message)
Call for Paper - IPC Printed Circuits Expo 2002 (1 Message)
Capacitor 0603 vs 0402 (5 Messages)
Capacitor 0603 vs 0402...why not networks and arrays? (12 Messages)
cc: MAIL Reminder (1 Message)
cCc'M(1{wkJ;'xx98e%ue OC~qgD;n<;{ {z (1 Message)
Cleaning under BGAs (3 Messages)
Cleanliness evaluation! (8 Messages)
Cleanliness evaluation! Definition of an Expert (Xspurt) (6 Messages)
Component skew after reflow (4 Messages)
Connector tilt, acceptable or not? (7 Messages)
consideration the results of any (1 Message)
Contamination Concern after Strip (5 Messages)
Cooling rates for solder reflow processes (8 Messages)
Cost effective Standard via size. (3 Messages)
Delta Tg of IC substrate (1 Message)
Design Certification (1 Message)
Design Certification - Correction (1 Message)
design pads for chip resistors and capacitors (8 Messages)
Determining the Inner metallic bond on a surface mount c onnector (1 Message)
Determining the Inner metallic bond on a surface mount connector (2 Messages)
Dewetting (2 Messages)
DPMO calculations (2 Messages)
Easy Thursday Question! (7 Messages)
Electroless nickel/Immersion Gold Thickness (1 Message)
Electronic Circuits World Convention 9 Call for papers (1 Message)
Encoder with contamination.Soldering or Supplier process . (2 Messages)
Encoder with contamination.Soldering or Supplier process. (4 Messages)
ERROR (1 Message)
ESD smocks in high temperature and humidity level (4 Messages)
Expiration date for soft gold surface plating (2 Messages)
Expiry date for soft Ni/Au finished BGA (1 Message)
Fab thickness Measurement (2 Messages)
FAB. Cleaning stainless steel multilayer bonding shims. (1 Message)
Fallout (12 Messages)
FDA approval (3 Messages)
Fiducials (6 Messages)
Flatness measure & solder mask registration. (1 Message)
Flip Chip flex circuit (3 Messages)
Flowsolder pallet manufacture (1 Message)
FMA Labs in Northeast US (2 Messages)
Fuji IP3 feeders (2 Messages)
Gel time test & thermalmeter (1 Message)
Gold Tin Solder (2 Messages)
Gold/Paste (5 Messages)
Gold/Paste and Immersion Gold (1 Message)
HAL contaminant levels (2 Messages)
HASL (2 Messages)
HASL Thickness (5 Messages)
Heinz Mader/NMADEH/CH/Ascom ist außer Haus. (1 Message)
HELP !! horizontal lines for flex innerlayers- oxide substitution (1 Message)
HELP !! horizontal lines for flex innerlayers- oxidesubstitution (1 Message)
Hermeticity and Cleanliness (4 Messages)
Hi-pot test (2 Messages)
High aspect ratio via qualification (1 Message)
High Flow Laminating Resin (1 Message)
horizontal lines for flex innerlayers- oxide substitution (1 Message)
Howefill and Howefilm (2 Messages)
HP TEST CREDIT BUTTONS (1 Message)
Immersion gold with hard gold fingers (1 Message)
Info required on thick Jedec Trays (2 Messages)
Information regarding the various types of gold deposits (1 Message)
Interesting Coplanarity ? (2 Messages)
Ionics again. (4 Messages)
IPC 600 (7 Messages)
IPC Class 2 vs Class 3 Price Considerations (3 Messages)
IPC HDI types (2 Messages)
IPC-D-356 (2 Messages)
IPC/EIA J-STD-006 Released (1 Message)
Labeling of bottles in statis safe area (5 Messages)
Labelling of bottles in statis safe area (1 Message)
Laser Drilling (2 Messages)
Leading Edge Supplier Search (4 Messages)
lightspeed adhesive (2 Messages)
Lisa Greenleaf/NNH/Teradyne is out of the office. (1 Message)
Longtime storage conditions for assemblies (1 Message)
Looking for board level failure analysis (1 Message)
Looking for Jerry Hartman & John Garcia... (1 Message)
Looking for short movie of a BGA self-centering (6 Messages)
Material specification (3 Messages)
Material specification (7781 E-glass) (1 Message)
Mfg Capability (3 Messages)
Microvia in BGA pad (2 Messages)
Misplace component (2 Messages)
Moisture Sensitive Component Handling & Identification (7 Messages)
MONSTER board!!! (5 Messages)
New Zealand Chapter Formation Meeting Notice (1 Message)
New Zealand now has a new DC chapter! (2 Messages)
Ni/Au Plating Question (14 Messages)
Ni/Au Plating Question--Returns (3 Messages)
Nitrogen Purity for SMT IR Reflow (2 Messages)
No-clean solder wire (3 Messages)
NTC: Just a thanks about BGA/ X-ray question posted earlier (1 Message)
Off-Topic - coatings for airplane-home (13 Messages)
Out of office (1 Message)
out of the office. (1 Message)
P&P can't locate fiducials (6 Messages)
Package consultants with electronics background (1 Message)
Packaging Instructions for finished Electronic Assemblies (2 Messages)
pad geometry (2 Messages)
Panelized Boards (4 Messages)
PCB Moisture Absorption (4 Messages)
phenomenon with Ni/Au plating (3 Messages)
photoplotting service (2 Messages)
Pin Grid Pin Allignment (1 Message)
plastic fingers (2 Messages)
plastic fingers for wave solder (1 Message)
PRCL RDSon Fallouts (1 Message)
Pre assembly conditioning (2 Messages)
Pre-preg and Core Material Thicknesses (2 Messages)
Process Problem vs Board Problem (7 Messages)
PWB supplier search (1 Message)
Questions (1 Message)
Reliability of reflowed solder to dissipate heat via RF IC heat s lug (2 Messages)
Reminder - IPC ENIG standard review deadline (1 Message)
REQUEST IPC-4552 (1 Message)
Rework (4 Messages)
Rework of SMA connector (1 Message)
Rework Specification (2 Messages)
Rod Smith/Endicott/IBM is out of the office. (1 Message)
RTV and weight requirements... (5 Messages)
Searching for reflow oven manufacturer or user (3 Messages)
self-centering SMT (9 Messages)
Sheet Adhesive Suppliers (7 Messages)
SMD Assembly Problems (4 Messages)
SMT adhesive (1 Message)
SMT Epoxies? (1 Message)
SMT Pads (3 Messages)
Solder analysis results (15 Messages)
solder balls (7 Messages)
Solder Beads (not solder balls) (9 Messages)
Solder conditions (6 Messages)
Solder mask Clerance ...who should do it? (1 Message)
Solder Paste Measurements (4 Messages)
solder paste with 2% silver (1 Message)
Solder Shorts in PBGA (1 Message)
Solder Testing (4 Messages)
Solder vs Gold Pads on SMT (13 Messages)
Soldering 36 pins LCD by flat tip soldering iron (2 Messages)
Soldering SMT components (1 Message)
Soldering to palladium silver (3 Messages)
soldr balls (3 Messages)
SPC software for Lab (2 Messages)
Spray Fluxer (5 Messages)
Stepped Stencil (6 Messages)
SV: [TN] Immersion gold with hard gold fingers (1 Message)
T/H Capacitor Removal- IPC standards? (8 Messages)
Teflon board price (1 Message)
Tenting of vias (6 Messages)
The effective test method of the expired prepreg. (2 Messages)
Thermal Compound considerations (4 Messages)
Thermal Grease (4 Messages)
thermal interface material (11 Messages)
Tin Plating bath (not clear anymore) (9 Messages)
Tin/Silver plating (1 Message)
To wave or not to wave, that is the question... (15 Messages)
Tombstoning (3 Messages)
total PWB production (1 Message)
Tropicalisation (8 Messages)
Uralite (3 Messages)
UV and Flex (3 Messages)
VIAS in pads... (11 Messages)
virus (1 Message)
VME Spec and press fit DIN connector (3 Messages)
Wavesoldering SOIC's (9 Messages)
Wetting Agents (7 Messages)
White Tin (10 Messages)
White Tin/MSA ? (1 Message)
Your survey support is requested (moisture sensitive component testing) (1 Message)
[LF] Eutectic alloys????? (3 Messages)
[TN] ãCc'M( 1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz (1 Message)
[TN] ãCc'M(1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz (1 Message)
[TN] lightspeed adhesive (1 Message)
[TN] Re: [TN] ãCc'M( 1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz (1 Message)
[TN] Re: [TN] ãCc'M(1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz (1 Message)
[TN] RE: [TN] Re: [TN] ãCc'M( 1û ÷kJ;'øø98å¥õe OC~qçD;î<;û ûz (1 Message)
[TN] RE: [TN] Re: [TN] ãCc'M(1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz (1 Message)
[TN] RE: [TN] [TN]RE: [TN] Re: [TN] ãCc'M( 1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz (1 Message)
[TN] [TN]RE: [TN] Re: [TN] ãCc'M( 1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz (1 Message)
[TN]RE: [TN] Re: [TN] ãCc'M( 1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz (1 Message)
[TN]RE: [TN] Re: [TN] ãCc'M( 1û÷kJ;'øø98å¥õe OC~qçD; (2 Messages)