LISTSERV - TECHNET Archives - LISTSERV.IPC.ORG

Wed, 15 Aug 2001 08:47:14 -0500

Mon, 13 Aug 2001 15:49:59 -0500

Wed, 8 Aug 2001 15:02:02 -0500

Wed, 8 Aug 2001 17:17:45 -0500

Tue, 14 Aug 2001 13:28:06 -0500

Tue, 14 Aug 2001 14:23:19 -0500

Wed, 15 Aug 2001 08:35:07 -0500

Re: Cleanliness evaluation! Definition of an Expert (Xspurt)

Wed, 15 Aug 2001 10:07:28 -0500

Fri, 17 Aug 2001 07:56:28 -0500

Thu, 2 Aug 2001 17:29:14 EDT

Re: Moisture Sensitive Component Handling & Identification

Mon, 6 Aug 2001 16:58:52 -0500

Thu, 16 Aug 2001 13:16:23 -0500

Re: No-clean solder wire

Wed, 29 Aug 2001 13:38:09 -0500

Thermal Grease

Wed, 22 Aug 2001 07:55:43 -0500

Wed, 15 Aug 2001 08:37:38 -0500

Thu, 16 Aug 2001 13:19:35 -0500

Re: [TN]RE: [TN] Re: [TN] ãCc'M( 1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz

Tue, 21 Aug 2001 00:40:19 EDT

Wed, 29 Aug 2001 14:05:36 -0400

Re: AW: [TN] Misplace component

Fri, 17 Aug 2001 10:49:33 +0800

Misplace component

Wed, 15 Aug 2001 08:33:32 +0800

Re: BGA Re-balling services in Asia

Wed, 29 Aug 2001 16:46:33 +0800

Fri, 17 Aug 2001 10:17:48 +0800

Fri, 17 Aug 2001 08:12:58 +0800

Re: Leading Edge Supplier Search

Fri, 17 Aug 2001 08:48:12 +0800

Wed, 8 Aug 2001 10:36:56 +0800

Re: Moisture Sensitive Component Handling & Identification

Fri, 17 Aug 2001 10:49:23 +0800

Thu, 23 Aug 2001 13:09:37 +0800

Re: PCB Moisture Absorption

Thu, 23 Aug 2001 13:31:10 +0800

Mon, 13 Aug 2001 08:57:51 +0800

Pre-preg and Core Material Thicknesses

Tue, 28 Aug 2001 11:52:26 +0800

Wed, 29 Aug 2001 10:09:53 +0800

Tue, 21 Aug 2001 09:40:08 +0800

Re: Soldering 36 pins LCD by flat tip soldering iron

Wed, 22 Aug 2001 11:09:51 +0800

Wed, 22 Aug 2001 16:31:51 +0800

Re: soldr balls

Wed, 15 Aug 2001 16:30:42 +0800

Thu, 23 Aug 2001 13:55:51 +0800

Tue, 21 Aug 2001 09:16:49 +0800

Re: Thermal Compound considerations

Tue, 21 Aug 2001 09:20:44 +0800

Tue, 21 Aug 2001 08:57:32 +0800

Wed, 22 Aug 2001 11:29:46 +0800

Wed, 22 Aug 2001 11:46:53 +0800

Wed, 22 Aug 2001 12:17:20 +0800

Thu, 23 Aug 2001 12:21:27 +0800

Re: VME Spec and press fit DIN connector

Thu, 23 Aug 2001 13:23:28 +0800

Wed, 22 Aug 2001 12:28:41 +0800

Re: VME Spec and press fit DIN connector

Wed, 22 Aug 2001 12:31:41 +0800

Tue, 21 Aug 2001 09:23:32 +0800

Wed, 22 Aug 2001 11:50:01 EDT

Re: Alkaline etchant source

Wed, 29 Aug 2001 01:17:09 EDT

Thu, 23 Aug 2001 18:54:40 EDT

Re: Flip Chip flex circuit

Mon, 13 Aug 2001 21:16:51 EDT

Wed, 22 Aug 2001 10:39:37 EDT

Re: Ni/Au Plating Question--Returns

Wed, 22 Aug 2001 13:39:05 EDT

Wed, 22 Aug 2001 16:51:03 EDT

Mon, 27 Aug 2001 17:26:53 EDT

White Tin/MSA ?

Thu, 23 Aug 2001 09:41:46 EDT

Adrian Irwin

Adrian Irwin

Wed, 22 Aug 2001 07:19:15 +0100

Wavesoldering SOIC's

Adrian Irwin

Tue, 14 Aug 2001 06:09:38 -0500

Soldering 36 pins LCD by flat tip soldering iron

Adrian Irwin

Wed, 15 Aug 2001 19:06:54 +0100

Ajit Jain

Ajit Jain

Wed, 22 Aug 2001 10:20:25 +0530

Alan Kreplick

Alan Kreplick

Mon, 20 Aug 2001 16:32:41 -0400

Albin, David

Albin, David

Tue, 14 Aug 2001 11:42:45 +0100

Alcorn, Brent

Anderson, Greg (IndSys, GEFanuc, NA)

Alcorn, Brent

Thu, 16 Aug 2001 13:01:20 -0400

Re: Searching for reflow oven manufacturer or user

Anderson, Greg (IndSys, GEFanuc, NA)

Mon, 13 Aug 2001 14:21:42 -0400

Andrew Hoggan

Andrew Hoggan

Tue, 7 Aug 2001 18:04:28 +0100

Re: Determining the Inner metallic bond on a surface mount connector

Andrew Hoggan

Fri, 24 Aug 2001 21:27:10 +0100

Andrew Hoggan

Fri, 24 Aug 2001 21:51:06 +0100

Re: ESD smocks in high temperature and humidity level

Andrew Hoggan

Fri, 10 Aug 2001 01:17:44 +0100

Re: Labelling of bottles in statis safe area

Andrew Hoggan

Thu, 9 Aug 2001 23:21:05 +0100

Andrew Hoggan

Mon, 6 Aug 2001 23:23:33 +0100

Re: No-clean solder wire

Andrew Hoggan

Thu, 30 Aug 2001 09:37:25 +0100

Re: phenomenon with Ni/Au plating

Andrew Hoggan

Mon, 27 Aug 2001 10:09:09 +0100

Andrew Hoggan

Fri, 3 Aug 2001 11:09:11 +0100

Andrew Hoggan

Thu, 16 Aug 2001 11:45:40 +0100

Andrew Hoggan

Tue, 21 Aug 2001 22:32:17 +0100

Andrew Hoggan

Fri, 10 Aug 2001 01:17:31 +0100

Andrew Hoggan

Thu, 16 Aug 2001 20:21:48 +0100

Armando Saldana

Questions

Armando Saldana

Tue, 7 Aug 2001 09:34:58 -0700

Arnold D. Andrade

Re: BGA PCB mounting material thickness

Arnold D. Andrade

Thu, 9 Aug 2001 22:36:41 -0700

Barbara Burcham

Barbara Burcham

Thu, 2 Aug 2001 08:38:34 -0500

Barmuta, Mike

Barmuta, Mike

Tue, 28 Aug 2001 09:56:54 -0700

Barry Gallegos

Re: SPC software for Lab

Barry Gallegos

Thu, 23 Aug 2001 09:40:08 -0600

Barry Gallegos

Mon, 20 Aug 2001 14:59:13 -0600

Bartkowaik Christine

Bartkowaik Christine

Tue, 21 Aug 2001 15:34:39 -0400

Re: To wave or not to wave, that is the question...

Bartkowaik Christine

Thu, 23 Aug 2001 06:44:10 -0400

Bartkowaik Christine

Fri, 17 Aug 2001 06:55:38 -0400

Re: Moisture Sensitive Component Handling & Identification

Bartkowaik Christine

Mon, 20 Aug 2001 14:43:03 -0400

bbarr

bbarr

Thu, 16 Aug 2001 11:59:04 -0400

Panelized Boards

bbarr

Wed, 15 Aug 2001 13:46:28 -0400

Becerra Alejandro

Solder Shorts in PBGA

Becerra Alejandro

Mon, 27 Aug 2001 16:15:34 -0500

Betsy Towle

Re: Determining the Inner metallic bond on a surface mount c onnector

Betsy Towle

Mon, 27 Aug 2001 13:54:45 -0500

Bev Christian

Bev Christian

Fri, 24 Aug 2001 15:47:17 -0400

Re: FMA Labs in Northeast US

Bev Christian

Wed, 15 Aug 2001 15:02:03 -0400

Re: Looking for short movie of a BGA self-centering

Bev Christian

Mon, 27 Aug 2001 08:26:11 -0400

Bill Butman

Bill Butman

Thu, 16 Aug 2001 10:57:55 -0700

Bill Christoffel

Contamination Concern after Strip

Bill Christoffel

Tue, 7 Aug 2001 08:04:12 -0500

Ni/Au Plating Question

Bill Christoffel

Wed, 22 Aug 2001 09:03:40 -0500

Bill Christoffel

Wed, 22 Aug 2001 13:06:37 -0500

Bill Davis

BGA Inspection

Bill Davis

Thu, 2 Aug 2001 13:22:51 EDT

Bill Decray

Bissonnette, Jean-Francois

Bill Decray

Mon, 20 Aug 2001 14:23:17 -0400

ESD smocks in high temperature and humidity level

Bissonnette, Jean-Francois

Thu, 9 Aug 2001 11:28:54 -0400

Tropicalisation

Bissonnette, Jean-Francois

Wed, 22 Aug 2001 13:47:57 -0400

RE: [TN] Re: [TN] ãCc'M(1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz

Bissonnette, Jean-Francois

Wed, 29 Aug 2001 10:04:52 -0400

RE: [TN] RE: [TN] [TN]RE: [TN] Re: [TN] ãCc'M( 1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz

Bissonnette, Jean-Francois

Wed, 29 Aug 2001 15:54:37 -0400

Brad Saunders

Re: BGA Bow

Brad Saunders

Wed, 29 Aug 2001 18:37:31 EDT

Re: BGA PCB mounting material thickness

Brad Saunders

Thu, 2 Aug 2001 09:42:36 EDT

Re: Howefill and Howefilm

Brad Saunders

Sat, 25 Aug 2001 10:06:19 EDT

Re: Mfg Capability

Brad Saunders

Thu, 30 Aug 2001 19:54:16 EDT

Re: Pre-preg and Core Material Thicknesses

Brad Saunders

Tue, 28 Aug 2001 09:04:33 EDT

Re: Reliability of reflowed solder to dissipate heat via RF IC heat s lug

Brad Saunders

Tue, 28 Aug 2001 09:29:05 EDT

Brad Saunders

Wed, 29 Aug 2001 18:30:57 EDT

Braime, Justin

0603 land pattern debate

Braime, Justin

Fri, 31 Aug 2001 10:13:35 +0100

Braime, Justin

Tue, 21 Aug 2001 13:24:09 +0100

Brian Ellis

Brian Ellis

Wed, 15 Aug 2001 13:28:35 +0300

Brian Ellis

Wed, 15 Aug 2001 15:39:38 +0300

Brian Ellis

Wed, 15 Aug 2001 19:02:31 +0300

Brian Ellis

Sat, 25 Aug 2001 10:18:59 +0300

Re: Cleaning under BGAs

Brian Ellis

Fri, 24 Aug 2001 12:40:23 +0300

Re: Encoder with contamination.Soldering or Supplier process.

Brian Ellis

Wed, 15 Aug 2001 17:18:02 +0300

Re: Dewetting

Brian Ellis

Wed, 15 Aug 2001 18:59:44 +0300

Brian Ellis

Sat, 4 Aug 2001 11:09:29 +0300

Re: ESD smocks in high temperature and humidity level

Brian Ellis

Fri, 10 Aug 2001 12:54:11 +0300

Re: HAL contaminant levels

Brian Ellis

Thu, 30 Aug 2001 09:40:10 +0300

Re: Hermeticity and Cleanliness

Brian Ellis

Tue, 7 Aug 2001 17:41:49 +0300

Re: Ionics again.

Brian Ellis

Wed, 8 Aug 2001 18:30:02 +0300

Brian Ellis

Tue, 7 Aug 2001 14:20:01 +0300

Brian Ellis

Tue, 14 Aug 2001 11:44:05 +0300

Brian Ellis

Fri, 17 Aug 2001 11:58:56 +0300

Re: Re: [TN] ãCc'M( 1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz

Brian Ellis

Fri, 17 Aug 2001 19:27:08 +0300

Brian Ellis

Wed, 29 Aug 2001 17:04:20 +0300

Brian L. Guidi

Uralite

Brian L. Guidi

Mon, 13 Aug 2001 14:21:03 -0400

Brian Vascukynas

ATG Tester - Help

Brian Vascukynas

Wed, 22 Aug 2001 16:24:10 -0400

Brooks,Bill

Re: New Zealand now has a new DC chapter!

Brooks,Bill

Fri, 24 Aug 2001 13:16:42 -0700

AW: [TN] Connector tilt, acceptable or not?

Brooks,Bill

Wed, 22 Aug 2001 12:35:05 -0700

Busko, Wolfgang

Busko, Wolfgang

Wed, 15 Aug 2001 11:57:15 +0200

AW: [TN] Interesting Coplanarity ?

Busko, Wolfgang

Wed, 15 Aug 2001 13:39:07 +0200

AW: [TN] Misplace component

Busko, Wolfgang

Wed, 15 Aug 2001 13:22:27 +0200

AW: [TN] Misplace component

Busko, Wolfgang

Thu, 16 Aug 2001 10:33:53 +0200

AW: [TN] P&P can't locate fiducials

Busko, Wolfgang

Tue, 21 Aug 2001 14:40:59 +0200

AW: [TN] Package consultants with electronics background

Busko, Wolfgang

Thu, 23 Aug 2001 13:57:43 +0200

AW: [TN] phenomenon with Ni/Au plating

Busko, Wolfgang

Mon, 27 Aug 2001 11:17:34 +0200

AW: [TN] phenomenon with Ni/Au plating

Busko, Wolfgang

Mon, 27 Aug 2001 17:41:43 +0200

AW: [TN] SMD Assembly Problems

Busko, Wolfgang

Tue, 28 Aug 2001 10:06:48 +0200

AW: [TN] Solder Shorts in PBGA

Busko, Wolfgang

Tue, 28 Aug 2001 13:43:48 +0200

Connector tilt, acceptable or not?

Busko, Wolfgang

Tue, 14 Aug 2001 17:48:29 +0200

Longtime storage conditions for assemblies

Busko, Wolfgang

Wed, 22 Aug 2001 17:47:53 +0200

phenomenon with Ni/Au plating

Busko, Wolfgang

Mon, 27 Aug 2001 10:18:27 +0200

Caldon W. Driscoll

Campbell, William (wcampbel)

Caldon W. Driscoll

Tue, 21 Aug 2001 08:36:07 -0400

Campbell, William (wcampbel)

Tue, 21 Aug 2001 09:08:21 -0400

Campbell, William (wcampbel)

Wed, 15 Aug 2001 16:53:59 -0400

Off-Topic - coatings for airplane-home

Campbell, William (wcampbel)

Tue, 21 Aug 2001 16:31:41 -0400

Carl VanWormer

Carl VanWormer

Mon, 13 Aug 2001 14:59:17 -0700

Cathy Killen

Ionics again.

Cathy Killen

Wed, 8 Aug 2001 14:51:15 +0100

SMT Pads

Cathy Killen

Fri, 10 Aug 2001 13:48:24 +0100

Chafin, Ken G.

Solder vs Gold Pads on SMT

Chafin, Ken G.

Mon, 20 Aug 2001 14:30:37 -0400

Chafin, Ken G.

Mon, 20 Aug 2001 16:39:09 -0400

Chafin, Ken G.

Tue, 21 Aug 2001 13:45:10 -0400

Charles Caswell

Charles Caswell

Mon, 13 Aug 2001 16:03:38 -0500

Re: Any MELF experts?

Charles Caswell

Thu, 30 Aug 2001 09:27:58 -0500

Charles Caswell

Mon, 20 Aug 2001 12:27:39 -0500

Charles Caswell

Mon, 20 Aug 2001 13:09:28 -0500

Charles E. McMahon

Charles E. McMahon

Fri, 24 Aug 2001 15:23:34 -0400

Chris Gifford

Chris Gifford

Tue, 21 Aug 2001 17:58:54 -0400

Chris Murphy

Re: Flip Chip flex circuit

Chris Murphy

Thu, 9 Aug 2001 12:06:53 +1200

Chuck Brummer

Chuck Brummer

Tue, 14 Aug 2001 07:49:14 -0700

Re: HELP !! horizontal lines for flex innerlayers- oxidesubstitution

Chuck Brummer

Wed, 15 Aug 2001 15:25:19 -0700

Claude Tremblay

HASL

Claude Tremblay

Wed, 29 Aug 2001 15:55:45 -0500

Colin W.T. McVean

consideration the results of any

Colin W.T. McVean

Sat, 11 Aug 2001 17:14:54 +0100

Colin Weber

Re: Looking for short movie of a BGA self-centering

Colin Weber

Fri, 17 Aug 2001 08:31:46 +1000

COWEN,MARC (A-Scotland,ex1)

Re: Leading Edge Supplier Search

COWEN,MARC (A-Scotland,ex1)

Wed, 8 Aug 2001 08:30:15 +0200

COWEN,MARC (A-Scotland,ex1)

Mon, 27 Aug 2001 09:52:14 +0200

Craig Hillman

Re: PCB Moisture Absorption

Craig Hillman

Wed, 8 Aug 2001 16:34:25 -0400

Howefill and Howefilm

Craig Hillman

Fri, 24 Aug 2001 17:28:20 -0400

Craig Hillman

Wed, 8 Aug 2001 16:34:25 -0400

Rework

Craig Hillman

Wed, 1 Aug 2001 18:48:58 -0400

Re: To wave or not to wave, that is the question...

Craig Hillman

Fri, 17 Aug 2001 09:06:28 -0400

Wetting Agents

Craig Hillman

Thu, 16 Aug 2001 11:59:02 -0400

Craig Hillman

Thu, 16 Aug 2001 15:29:37 -0400

Craig Hillman

Fri, 17 Aug 2001 08:56:26 -0400

Crepeau, Phil

Crepeau, Phil

Wed, 15 Aug 2001 07:36:22 -0700

Crepeau, Phil

Thu, 16 Aug 2001 13:28:17 -0700

Crepeau, Phil

Tue, 14 Aug 2001 16:52:35 -0700

Re: Expiration date for soft gold surface plating

Crepeau, Phil

Tue, 7 Aug 2001 07:30:11 -0700

Crepeau, Phil

Mon, 13 Aug 2001 11:56:16 -0700

Re: Info required on thick Jedec Trays

Crepeau, Phil

Fri, 31 Aug 2001 07:55:46 -0700

Crepeau, Phil

Mon, 13 Aug 2001 15:32:34 -0700

Crepeau, Phil

Wed, 15 Aug 2001 07:39:25 -0700

Crepeau, Phil

Wed, 22 Aug 2001 11:20:49 -0700

Creswick, Steven

Creswick, Steven

Mon, 13 Aug 2001 16:04:00 -0400

Back-side Device Metallization

Creswick, Steven

Tue, 14 Aug 2001 13:30:27 -0400

Creswick, Steven

Mon, 13 Aug 2001 16:20:40 -0400

Re: Hermeticity and Cleanliness

Creswick, Steven

Tue, 7 Aug 2001 20:54:04 -0400

Creswick, Steven

Wed, 22 Aug 2001 10:37:22 -0400

Creswick, Steven

Wed, 22 Aug 2001 06:38:35 -0400

cscholbe

ERROR

cscholbe

Sat, 4 Aug 2001 00:09:33 -0500

d. terstegge

d. terstegge

Mon, 27 Aug 2001 13:14:05 +0200

Re: Rework

d. terstegge

Thu, 2 Aug 2001 09:18:18 +0200

d. terstegge

Wed, 1 Aug 2001 11:50:07 +0200

d. terstegge

Thu, 9 Aug 2001 08:22:19 +0200

Dan Brandler

Alkaline etchant source

Dan Brandler

Thu, 23 Aug 2001 15:15:08 -0700

Atotech

Dan Brandler

Mon, 13 Aug 2001 09:46:17 -0700

Bench top spray etcher

Dan Brandler

Mon, 20 Aug 2001 17:09:55 -0700

Re: photoplotting service

Dan Brandler

Wed, 22 Aug 2001 11:55:23 -0700

Darrel Therriault

Mfg Capability

Darrel Therriault

Wed, 29 Aug 2001 12:14:08 -0700

Dave Roesler

Dave Roesler

Wed, 15 Aug 2001 11:52:34 -0500

David Bergman

Electronic Circuits World Convention 9 Call for papers

David Bergman

Mon, 27 Aug 2001 15:52:20 -0500

David Douthit

David Douthit

Wed, 15 Aug 2001 09:09:58 -0700

David Douthit

Thu, 16 Aug 2001 09:47:54 -0700

Re: Bench REL equipments

David Douthit

Thu, 23 Aug 2001 13:54:58 -0700

Re: Encoder with contamination.Soldering or Supplier process.

David Douthit

Tue, 14 Aug 2001 14:06:02 -0700

David Douthit

Fri, 3 Aug 2001 11:01:29 -0700

Re: Hermeticity and Cleanliness

David Douthit

Tue, 7 Aug 2001 08:18:46 -0700

Re: PCB Moisture Absorption

David Douthit

Mon, 6 Aug 2001 19:17:00 -0700

David Douthit

Wed, 8 Aug 2001 13:56:50 -0700

Re: Rework

David Douthit

Wed, 1 Aug 2001 22:30:49 -0700

David Douthit

Wed, 22 Aug 2001 18:41:28 -0700

Re: UV and Flex

David Douthit

Fri, 3 Aug 2001 09:26:11 -0700

David Fish

David Fish

Tue, 14 Aug 2001 21:31:59 -0700

David Schaefer

Rework Specification

David Schaefer

Wed, 29 Aug 2001 11:51:38 -0400

David Simmons

Stepped Stencil

David Simmons

Thu, 23 Aug 2001 12:53:50 +1200

Re: Looking for short movie of a BGA self-centering

David Simmons

Fri, 24 Aug 2001 08:04:53 +1200

Deakin, Roger

Deakin, Roger

Mon, 20 Aug 2001 09:00:24 +0100

Dean Lillibridge

Dean Lillibridge

Wed, 15 Aug 2001 10:50:21 -0400

Dean Lillibridge

Wed, 8 Aug 2001 16:34:14 -0400

Dean Lillibridge

Tue, 21 Aug 2001 12:07:00 -0400

Dean Lillibridge

Wed, 15 Aug 2001 11:33:01 -0400

Dean Lillibridge

Wed, 15 Aug 2001 14:57:32 -0400

Re: Moisture Sensitive Component Handling & Identification

Dean Lillibridge

Thu, 16 Aug 2001 12:52:13 -0400

HP TEST CREDIT BUTTONS

Dean Lillibridge

Wed, 29 Aug 2001 12:28:36 -0400

Dean Lillibridge

Thu, 16 Aug 2001 12:47:13 -0400

Re: pad geometry

Dean Lillibridge

Fri, 24 Aug 2001 16:44:42 -0400

Re: Panelized Boards

Dean Lillibridge

Wed, 15 Aug 2001 14:45:18 -0400

Re: To wave or not to wave, that is the question...

Dean Lillibridge

Thu, 16 Aug 2001 17:16:14 -0400

Re: To wave or not to wave, that is the question...

Dean Lillibridge

Fri, 17 Aug 2001 10:40:16 -0400

Debbie Goodwin

Debbie Goodwin

Tue, 21 Aug 2001 09:22:14 -0700

Dee Stover

Re: Alkaline etchant source

Dee Stover

Fri, 24 Aug 2001 11:55:53 -0700

Dennis Fritz

Dennis Fritz

Thu, 23 Aug 2001 23:07:07 EDT

Re: Gold/Paste and Immersion Gold

Dennis Fritz

Thu, 16 Aug 2001 23:34:04 EDT

Dennis Fritz

Fri, 10 Aug 2001 09:12:57 EDT

Re: Laser Drilling

Dennis Fritz

Thu, 2 Aug 2001 18:37:04 EDT

Dennis Fritz

Wed, 22 Aug 2001 11:20:17 EDT

Re: phenomenon with Ni/Au plating

Dennis Fritz

Wed, 22 Aug 2001 13:42:20 EDT

Dennis Fritz

Mon, 27 Aug 2001 11:16:52 EDT

Dieselberg, Ron

RE: [TN] Re: [TN] ãCc'M( 1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz

Dieselberg, Ron

Wed, 29 Aug 2001 13:27:40 -0400

Don Vischulis

Re: To wave or not to wave, that is the question...

Don Vischulis

Thu, 2 Aug 2001 11:25:38 -0600

Don Vischulis

Thu, 16 Aug 2001 16:32:12 -0600

Re: UV and Flex

Don Vischulis

Fri, 3 Aug 2001 11:03:23 -0600

Dorothy M. Lush

Re: Capacitor 0603 vs 0402...why not networks and arrays?

Dorothy M. Lush

Tue, 14 Aug 2001 11:38:56 -0700

Dorothy M. Lush

Thu, 9 Aug 2001 10:38:56 -0700

Dorothy M. Lush

Tue, 21 Aug 2001 10:11:21 -0700

Re: Fuji IP3 feeders

Dorothy M. Lush

Tue, 7 Aug 2001 13:52:02 -0700

Dorothy M. Lush

Thu, 9 Aug 2001 15:59:05 -0700

Re: Misplace component

Dorothy M. Lush

Wed, 15 Aug 2001 10:46:15 -0700

Re: Rework

Dorothy M. Lush

Wed, 1 Aug 2001 16:05:17 -0700

Dorothy M. Lush

Tue, 21 Aug 2001 13:23:56 -0700

Dorothy M. Lush

Fri, 10 Aug 2001 11:12:17 -0700

Dorothy M. Lush

Thu, 23 Aug 2001 09:22:21 -0700

Re: To wave or not to wave, that is the question...

Dorothy M. Lush

Fri, 17 Aug 2001 09:19:10 -0700

Dorothy M. Lush

Thu, 16 Aug 2001 14:12:59 -0700

Douglas McCall

Flowsolder pallet manufacture

Douglas McCall

Thu, 16 Aug 2001 16:16:12 +0100

Duncan Ingemar

SPC software for Lab

Duncan Ingemar

Thu, 23 Aug 2001 10:04:46 -0500

Dwayne Dunn

Dwayne Dunn

Fri, 24 Aug 2001 14:21:07 -0500

Ed Tordahl

Ed Tordahl

Wed, 15 Aug 2001 09:31:07 -0400

Edward Szpruch

HELP !! horizontal lines for flex innerlayers- oxide substitution

Edward Szpruch

Wed, 8 Aug 2001 07:30:19 +0200

Edward Szpruch

Wed, 15 Aug 2001 12:54:19 +0200

horizontal lines for flex innerlayers- oxide substitution

Edward Szpruch

Mon, 13 Aug 2001 08:05:18 +0200

Edward Szpruch

Fri, 3 Aug 2001 12:41:06 +0200

Edward Szpruch

Tue, 14 Aug 2001 18:35:14 +0200

Re: Administrator Test Msg--pls delete

Edward Szpruch

Wed, 15 Aug 2001 09:24:43 +0200

Edwards, Ted A (AZ75)

Edwards, Ted A (AZ75)

Tue, 7 Aug 2001 06:35:15 -0700

Enigma P.

Delta Tg of IC substrate

Enigma P.

Mon, 20 Aug 2001 01:46:37 -0500

Erat, Wolfgang

Re: ATG Tester - Help

Erat, Wolfgang

Thu, 23 Aug 2001 10:12:07 -0400

Eric Christison

Info required on thick Jedec Trays

Eric Christison

Fri, 31 Aug 2001 09:34:25 -0500

Eric Dawson

Eric Dawson

Tue, 14 Aug 2001 08:22:33 +0100

Re: SMT Pads

Eric Dawson

Fri, 10 Aug 2001 14:59:59 +0100

Erickson, Gary

Erickson, Gary

Wed, 1 Aug 2001 16:43:08 -0400

Erickson, Gary

Thu, 9 Aug 2001 09:33:52 -0400

Moisture Sensitive Component Handling & Identification

Erickson, Gary

Thu, 9 Aug 2001 16:11:25 -0400

Francois Monette

Francois Monette

Thu, 16 Aug 2001 13:25:05 -0400

Frank Kimmey

HASL Thickness

Frank Kimmey

Wed, 22 Aug 2001 07:13:19 -0700

Re: To wave or not to wave, that is the question...

Frank Kimmey

Thu, 16 Aug 2001 15:02:29 -0700

FUN GUY

plastic fingers for wave solder

FUN GUY

Fri, 10 Aug 2001 12:59:03 -0700

Furrow, Robert Gordon (Bob)

Re: Additive Trace Repair

Furrow, Robert Gordon (Bob)

Tue, 14 Aug 2001 08:41:02 -0400

FMA Labs in Northeast US

Furrow, Robert Gordon (Bob)

Wed, 15 Aug 2001 14:31:13 -0400

Furrow, Robert Gordon (Bob)

Wed, 22 Aug 2001 11:04:42 -0400

Information regarding the various types of gold deposits

Furrow, Robert Gordon (Bob)

Wed, 15 Aug 2001 10:08:22 -0400

Gagnon, Gerald G.

Gagnon, Gerald G.

Thu, 23 Aug 2001 10:47:06 -0400

Gary Bremer

Bisumth Solder (Sn43Pb43Bi14)

Gary Bremer

Sat, 25 Aug 2001 20:27:25 -0500

Gary Camac

Gary Camac

Wed, 15 Aug 2001 15:10:02 -0500

Gary McCauley

Re: Mfg Capability

Gary McCauley

Wed, 29 Aug 2001 17:02:33 -0500

Gary McCauley

Mon, 27 Aug 2001 16:36:53 -0500

Gary McCauley

Mon, 27 Aug 2001 16:41:21 -0500

thermal interface material

Gary McCauley

Wed, 22 Aug 2001 13:27:25 -0500

Genny Gibbard

Genny Gibbard

Tue, 21 Aug 2001 11:54:32 -0600

Electroless nickel/Immersion Gold Thickness

Genny Gibbard

Tue, 21 Aug 2001 15:00:16 -0600

George Milad

George Milad

Fri, 17 Aug 2001 07:06:27 EDT

Gerry Savard

Flatness measure & solder mask registration.

Gerry Savard

Thu, 16 Aug 2001 09:45:21 -0400

Gilbert Min

Gilbert Min

Thu, 30 Aug 2001 23:39:30 +0900

Glenn Woodhouse

Re: Nitrogen Purity for SMT IR Reflow

Glenn Woodhouse

Fri, 31 Aug 2001 17:33:29 -0600

Graham Collins

Graham Collins

Fri, 31 Aug 2001 12:33:56 -0400

Re: SMT adhesive

Graham Collins

Tue, 7 Aug 2001 07:40:08 -0400

Re: SMT Pads

Graham Collins

Fri, 10 Aug 2001 09:14:57 -0400

Graham Collins

Mon, 20 Aug 2001 14:04:58 -0400

Graham Collins

Tue, 21 Aug 2001 14:13:55 -0400

Graham Collins

Wed, 22 Aug 2001 08:01:10 -0400

Graham Naisbitt

Re: Cleanliness evaluation! Definition of an Expert (Xspurt)

Graham Naisbitt

Wed, 15 Aug 2001 10:41:35 +0100

Graham Naisbitt

Fri, 17 Aug 2001 11:55:55 +0100

Re: Cleanliness evaluation! Definition of an Expert (Xspurt)

Graham Naisbitt

Sat, 25 Aug 2001 11:22:30 +0100

Re: Ionics again.

Graham Naisbitt

Wed, 8 Aug 2001 16:15:02 +0100

Graham Naisbitt

Sat, 25 Aug 2001 11:29:20 +0100

Graham Naisbitt

Thu, 23 Aug 2001 12:03:11 +0100

Grant Emandien

Re: Component skew after reflow

Grant Emandien

Wed, 15 Aug 2001 13:52:06 +0200

Grant Emandien

Fri, 3 Aug 2001 17:06:57 +0200

Grant Emandien

Wed, 15 Aug 2001 11:33:02 +0200

Grant Emandien

Mon, 27 Aug 2001 09:59:11 +0200

Grant Emandien

Thu, 30 Aug 2001 17:01:51 +0200

Re: Component skew after reflow

Grant Emandien

Thu, 30 Aug 2001 18:03:16 +0200

Dewetting

Grant Emandien

Wed, 15 Aug 2001 16:05:17 +0200

Reliability of reflowed solder to dissipate heat via RF IC heat s lug

Grant Emandien

Tue, 28 Aug 2001 14:05:50 +0200

Re: SMD Assembly Problems

Grant Emandien

Tue, 28 Aug 2001 14:30:32 +0200

RE: [TN] RE: [TN] Re: [TN] ãCc'M(1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz

Grant Emandien

Wed, 29 Aug 2001 16:16:05 +0200

Greg Scott

Re: 0603 land pattern debate

Greg Scott

Fri, 31 Aug 2001 08:14:34 -0700

Re: Capacitor 0603 vs 0402...why not networks and arrays?

Greg Scott

Thu, 9 Aug 2001 08:45:54 -0700

Greg Scott

Tue, 21 Aug 2001 08:58:04 -0700

Re: FDA approval

Greg Scott

Mon, 13 Aug 2001 12:21:53 -0700

Greg Scott

Wed, 29 Aug 2001 08:05:42 -0700

Greg Scott

Wed, 29 Aug 2001 13:34:58 -0700

Greg Scott

Tue, 21 Aug 2001 08:26:23 -0700

Greg Scott

Thu, 9 Aug 2001 08:41:40 -0700

Greg Scott

Fri, 10 Aug 2001 10:24:05 -0700

Gregorio M. Antonio

Re: BGA Bow

Gregorio M. Antonio

Thu, 30 Aug 2001 13:56:51 +0800

Guy Ramsey

Guy Ramsey

Mon, 13 Aug 2001 17:02:33 -0400

Re: Cleaning under BGAs

Guy Ramsey

Thu, 23 Aug 2001 13:45:44 -0400

Re: Encoder with contamination.Soldering or Supplier process.

Guy Ramsey

Fri, 24 Aug 2001 17:45:06 -0400

Guy Ramsey

Fri, 3 Aug 2001 14:23:39 -0400

Re: Fab thickness Measurement

Guy Ramsey

Wed, 22 Aug 2001 07:56:57 -0400

Gold Tin Solder

Guy Ramsey

Wed, 22 Aug 2001 17:02:55 -0400

Re: IPC Class 2 vs Class 3 Price Considerations

Guy Ramsey

Mon, 13 Aug 2001 08:49:15 -0400

Re: IPC HDI types

Guy Ramsey

Wed, 22 Aug 2001 11:05:34 -0400

Guy Ramsey

Tue, 14 Aug 2001 11:44:01 -0400

Guy Ramsey

Tue, 21 Aug 2001 15:31:32 -0400

Re: Thermal Compound considerations

Guy Ramsey

Fri, 10 Aug 2001 17:09:24 -0400

Re: Solder Testing

Guy Ramsey

Mon, 20 Aug 2001 12:41:36 -0400

Re: Solder Testing

Guy Ramsey

Tue, 21 Aug 2001 07:58:33 -0400

Guy Ramsey

Mon, 20 Aug 2001 10:09:57 -0400

Re: Thermal Grease

Guy Ramsey

Wed, 22 Aug 2001 09:18:32 -0400

Re: Tombstoning

Guy Ramsey

Mon, 27 Aug 2001 08:09:17 -0400

Guy Ramsey

Fri, 17 Aug 2001 08:29:19 -0400

Guy Ramsey

Tue, 21 Aug 2001 16:03:55 -0400

Hann Pang

Heinz Mader/NMADEH/CH/Ascom ist außer Haus.

Hann Pang

Tue, 14 Aug 2001 13:12:49 -0500

Heinz Mader

Heinz Mader

Thu, 2 Aug 2001 01:01:11 +0200

Houston, Terri

Board assm. shops doing BGA/CSPs and small volumes

Houston, Terri

Thu, 23 Aug 2001 10:21:43 -0500

Howard Watson

Any MELF experts?

Howard Watson

Thu, 30 Aug 2001 09:58:18 -0400

Howard Watson

Wed, 1 Aug 2001 15:51:44 -0400

Iain Braddock

Cleanliness evaluation!

Iain Braddock

Tue, 14 Aug 2001 14:54:16 +0100

Assembly Inspection/verification.

Iain Braddock

Wed, 15 Aug 2001 15:05:47 +0100

Jack Bryant

Jack Bryant

Fri, 10 Aug 2001 22:21:15 -0400

Jack Crawford

Administrator Test Msg--pls delete

Jack Crawford

Mon, 27 Aug 2001 16:03:27 -0500

Jack Crawford

Mon, 6 Aug 2001 17:02:06 -0500

Re: Cleanliness evaluation! Definition of an Expert (Xspurt)

Jack Crawford

Mon, 27 Aug 2001 15:57:46 -0500

Re: DPMO calculations

Jack Crawford

Fri, 31 Aug 2001 21:08:45 -0500

Re: Pre assembly conditioning

Jack Crawford

Fri, 31 Aug 2001 21:10:56 -0500

Your survey support is requested (moisture sensitive component testing)

Jack Crawford

Thu, 30 Aug 2001 18:35:09 -0500

James W. High

"b" stage epoxy

James W. High

Fri, 3 Aug 2001 14:52:41 -0400

photoplotting service

James W. High

Wed, 15 Aug 2001 11:45:39 -0400

James Yohe

New Zealand Chapter Formation Meeting Notice

James Yohe

Fri, 10 Aug 2001 05:48:54 +1200

New Zealand now has a new DC chapter!

James Yohe

Sat, 25 Aug 2001 08:09:59 +1200

Jan Thuesen

SV: [TN] Immersion gold with hard gold fingers

Jan Thuesen

Mon, 27 Aug 2001 08:27:20 +0200

Jana L. Carraway

Easy Thursday Question!

Jana L. Carraway

Thu, 16 Aug 2001 09:19:40 -0700

Jana L. Carraway

Thu, 16 Aug 2001 11:06:10 -0700

Jana L. Carraway

Thu, 16 Aug 2001 14:22:28 -0700

Call for Paper - IPC Printed Circuits Expo 2002

Jana L. Carraway

Mon, 13 Aug 2001 16:08:28 -0700

Jane Koh

Jane Koh

Thu, 2 Aug 2001 10:15:41 -0500

Reminder - IPC ENIG standard review deadline

Jane Koh

Wed, 15 Aug 2001 18:45:37 -0500

Jason Gregory

Re: [TN] ãCc'M(1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz

Jason Gregory

Mon, 13 Aug 2001 12:32:25 -0500

Re: BGA Inspection

Jason Gregory

Thu, 2 Aug 2001 13:42:21 -0500

Jason Gregory

Wed, 29 Aug 2001 08:52:58 -0500

Jean-Luc Lehmann

Re: Capacitor 0603 vs 0402...why not networks and arrays?

Jean-Luc Lehmann

Thu, 9 Aug 2001 08:56:29 +0200

Re: Cost effective Standard via size.

Jean-Luc Lehmann

Wed, 15 Aug 2001 11:59:45 +0200

Re: Soldering to palladium silver

Jean-Luc Lehmann

Wed, 15 Aug 2001 11:28:43 +0200

Jeff Ferry

Re: "b" stage epoxy

Jeff Ferry

Tue, 7 Aug 2001 08:37:21 -0500

High Flow Laminating Resin

Jeff Ferry

Wed, 8 Aug 2001 15:18:36 -0400

Re: Rework Specification

Jeff Ferry

Wed, 29 Aug 2001 15:35:03 -0400

Jeff Wallace

Jeff Wallace

Tue, 21 Aug 2001 16:40:13 -0700

Jim Gleason

Jim Gleason

Tue, 14 Aug 2001 12:25:36 -0700

Jim Gleason

Mon, 13 Aug 2001 10:06:10 -0700

pad geometry

Jim Gleason

Fri, 24 Aug 2001 15:37:04 -0700

JinSee Goh

Additive Trace Repair

JinSee Goh

Tue, 14 Aug 2001 08:55:19 +0800

JinSee Goh

Thu, 9 Aug 2001 08:01:32 +0800

Joe Thoman

Laser Drilling

Joe Thoman

Thu, 2 Aug 2001 13:58:07 -0400

John Brewer

Capacitor 0603 vs 0402...why not networks and arrays?

John Brewer

Tue, 14 Aug 2001 08:30:09 -0400

John Brewer

Fri, 10 Aug 2001 07:59:11 -0400

''Encapsulating/Potting PCB Assemblies"

John Brewer

Wed, 15 Aug 2001 14:04:32 -0400

Fallout

John Brewer

Thu, 16 Aug 2001 14:40:13 -0400

Thermal Grease

John Brewer

Tue, 14 Aug 2001 15:02:55 -0400

John Fahey

John Fahey

Thu, 16 Aug 2001 09:56:32 -0500

T/H Capacitor Removal- IPC standards?

John Fahey

Thu, 16 Aug 2001 14:09:56 -0700

John Fahey

Mon, 20 Aug 2001 12:16:32 -0500

John Fahey

Mon, 20 Aug 2001 10:47:02 -0700

John Fischbach

John Fischbach

Tue, 21 Aug 2001 12:52:27 -0500

Re: To wave or not to wave, that is the question...

John Fischbach

Wed, 22 Aug 2001 07:32:47 -0500

Tin/Silver plating

John Fischbach

Tue, 28 Aug 2001 13:39:27 -0500

John Maxwell

John Maxwell

Fri, 17 Aug 2001 09:13:47 -0300

Re: To wave or not to wave, that is the question...

John Maxwell

Fri, 17 Aug 2001 09:15:26 -0300

Re: To wave or not to wave, that is the question...

John Maxwell

Fri, 17 Aug 2001 12:48:48 -0300

John Nelson

John Nelson

Thu, 16 Aug 2001 15:57:55 -0400

John Perry

Re: Cost effective Standard via size.

John Perry

Tue, 7 Aug 2001 19:01:19 -0500

Johnny Kim

Johnny Kim

Thu, 16 Aug 2001 08:56:39 +0900

Re: Leading Edge Supplier Search

Johnny Kim

Wed, 8 Aug 2001 12:13:10 +0900

Jon Moore

Re: BGA Inspection

Jon Moore

Fri, 3 Aug 2001 17:47:20 EDT

Re: To wave or not to wave, that is the question...

Jon Moore

Fri, 10 Aug 2001 17:54:31 EDT

Jon Moore

Fri, 17 Aug 2001 16:52:37 EDT

Solder Beads (not solder balls)

Jon Moore

Fri, 17 Aug 2001 15:48:57 EDT

Jonathan A Noquil

Bench REL equipments

Jonathan A Noquil

Thu, 23 Aug 2001 19:52:02 +0800

Re: Bench REL equipments

Jonathan A Noquil

Fri, 24 Aug 2001 07:34:42 +0800

PRCL RDSon Fallouts

Jonathan A Noquil

Sat, 1 Sep 2001 10:36:29 +0800

Jorge Rodriguez

Jorge Rodriguez

Tue, 21 Aug 2001 11:57:00 -0700

Joyce Koo

Re: Capacitor 0603 vs 0402...why not networks and arrays?

Joyce Koo

Thu, 9 Aug 2001 12:30:23 -0400

Re: Capacitor 0603 vs 0402...why not networks and arrays?

Joyce Koo

Fri, 10 Aug 2001 08:45:17 -0400

Re: Cleanliness evaluation! Definition of an Expert (Xspurt)

Joyce Koo

Thu, 23 Aug 2001 15:07:19 -0400

Re: Gold Tin Solder

Joyce Koo

Wed, 22 Aug 2001 17:26:50 -0400

lightspeed adhesive

Joyce Koo

Tue, 14 Aug 2001 16:36:25 -0400

Re: To wave or not to wave, that is the question...

Joyce Koo

Tue, 14 Aug 2001 08:50:18 -0400

Joyce Koo

Fri, 17 Aug 2001 09:55:23 -0400

FW: [TN] lightspeed adhesive

Joyce Koo

Mon, 20 Aug 2001 08:39:45 -0400

Julien Bouchard

Looking for short movie of a BGA self-centering

Julien Bouchard

Thu, 16 Aug 2001 10:03:13 -0400

Kane, Joseph

Sheet Adhesive Suppliers

Kane, Joseph

Tue, 28 Aug 2001 11:53:02 -0400

Re: BGA Re-balling services in Asia

Kane, Joseph

Wed, 29 Aug 2001 11:55:49 -0400

Karen Walters

PCB Moisture Absorption

Karen Walters

Wed, 8 Aug 2001 14:39:59 -0400

Karim Benallal

Karim Benallal

Wed, 29 Aug 2001 09:48:21 +0100

Kasprzak, Bill (sys) USX

Re: cCc'M(1{wkJ;'xx98e%ue OC~qgD;n<;{ {z

Kasprzak, Bill (sys) USX

Wed, 29 Aug 2001 15:04:09 -0400

Process Problem vs Board Problem

Kasprzak, Bill (sys) USX

Wed, 1 Aug 2001 08:34:47 -0400

Re: SMD Assembly Problems

Kasprzak, Bill (sys) USX

Sat, 4 Aug 2001 07:14:22 -0400

Kasprzak, Bill (sys) USX

Tue, 28 Aug 2001 07:12:31 -0400

Spray Fluxer

Kasprzak, Bill (sys) USX

Mon, 20 Aug 2001 16:06:29 -0400

Re: Uralite

Kasprzak, Bill (sys) USX

Mon, 13 Aug 2001 14:59:48 -0400

Kathy Bergman

Pre assembly conditioning

Kathy Bergman

Fri, 31 Aug 2001 11:35:56 -0700

Solder conditions

Kathy Bergman

Fri, 10 Aug 2001 12:59:35 -0500

Kathy Bergman

Fri, 10 Aug 2001 12:58:01 -0700

Kathy Kuhlow

Kathy Kuhlow

Tue, 14 Aug 2001 09:44:31 -0500

BGA and X-ray

Kathy Kuhlow

Wed, 8 Aug 2001 13:42:40 -0500

Kathy Kuhlow

Tue, 14 Aug 2001 12:13:55 -0500

NTC: Just a thanks about BGA/ X-ray question posted earlier

Kathy Kuhlow

Thu, 2 Aug 2001 16:40:48 -0500

Kathy Kuhlow

Fri, 10 Aug 2001 13:31:09 -0500

Kathy Kuhlow

Tue, 14 Aug 2001 10:35:50 -0500

Re: SMD Assembly Problems

Kathy Kuhlow

Wed, 1 Aug 2001 13:01:22 -0500

Kathy Kuhlow

Mon, 27 Aug 2001 16:18:49 -0500

Kathy Kuhlow

Fri, 10 Aug 2001 13:24:50 -0500

Kathy Kuhlow

Fri, 24 Aug 2001 10:53:26 -0500

[TN]RE: [TN] Re: [TN] ãCc'M( 1û÷kJ;'øø98å¥õe OC~qçD;

Kathy Kuhlow

Thu, 16 Aug 2001 14:04:29 -0500

Re: Tombstoning

Kathy Kuhlow

Mon, 27 Aug 2001 09:06:18 -0500

Kathy Kuhlow

Wed, 29 Aug 2001 12:33:29 -0500

Keel, Mike

Re: High aspect ratio via qualification

Keel, Mike

Tue, 14 Aug 2001 14:04:43 -0700

Ken Mc Gowan

Ken Mc Gowan

Wed, 22 Aug 2001 20:20:43 -0100

Ken Mc Gowan

Thu, 2 Aug 2001 13:59:43 -0100

Cost effective Standard via size.

Ken Mc Gowan

Tue, 14 Aug 2001 19:52:13 -0100

Ken Patel

Ken Patel

Tue, 14 Aug 2001 15:41:16 -0700

Fab thickness Measurement

Ken Patel

Tue, 21 Aug 2001 15:17:45 -0700

IPC-D-356

Ken Patel

Mon, 6 Aug 2001 14:37:30 -0700

Looking for Jerry Hartman & John Garcia...

Ken Patel

Wed, 29 Aug 2001 14:07:51 -0700

Rework of SMA connector

Ken Patel

Tue, 7 Aug 2001 18:47:47 -0700

RTV and weight requirements...

Ken Patel

Tue, 28 Aug 2001 15:40:42 -0700

Solder mask Clerance ...who should do it?

Ken Patel

Wed, 29 Aug 2001 10:56:55 -0700

Ken Patel

Mon, 20 Aug 2001 16:02:39 -0700

VIAS in pads...

Ken Patel

Wed, 8 Aug 2001 11:52:35 -0700

Ken Patel

Thu, 9 Aug 2001 13:55:26 -0700

VME Spec and press fit DIN connector

Ken Patel

Thu, 9 Aug 2001 16:27:35 -0700

Ken Patel

Tue, 21 Aug 2001 15:38:57 -0700

Kevin Stokes

Breathers in sealed automotive products

Kevin Stokes

Tue, 14 Aug 2001 15:01:03 -0500

Package consultants with electronics background

Kevin Stokes

Thu, 23 Aug 2001 06:53:31 -0500

To wave or not to wave, that is the question...

Kevin Stokes

Thu, 16 Aug 2001 15:26:06 -0500

Kirk Kosel

Re: Ni/Au Plating Question--Returns

Kirk Kosel

Wed, 22 Aug 2001 17:16:55 -0500

[TN]RE: [TN] Re: [TN] ãCc'M( 1û÷kJ;'øø98å¥õe OC~qçD;

Kirk Kosel

Wed, 29 Aug 2001 12:47:00 -0500

lab

lab

Thu, 16 Aug 2001 06:27:57 -0700

plastic fingers

lab

Tue, 14 Aug 2001 05:55:21 -0700

Lambert, Katherine A.

Cleaning under BGAs

Lambert, Katherine A.

Thu, 23 Aug 2001 11:59:38 -0400

Re: Cleanliness evaluation! Definition of an Expert (Xspurt)

Lambert, Katherine A.

Fri, 17 Aug 2001 10:28:27 -0400

Larry Koens

Larry Koens

Fri, 31 Aug 2001 07:11:14 -0500

Re: AW: [TN] Interesting Coplanarity ?

Larry Koens

Wed, 8 Aug 2001 15:06:59 -0500

Fiducials

Larry Koens

Fri, 24 Aug 2001 13:17:32 -0500

Re: plastic fingers

Larry Koens

Tue, 14 Aug 2001 11:52:33 -0500

Lee Whiteman

Re: BGA Inspection

Lee Whiteman

Thu, 2 Aug 2001 14:26:08 -0400

LI YUAN

LI YUAN

Wed, 15 Aug 2001 11:30:23 -0600

Interesting Coplanarity ?

LI YUAN

Tue, 14 Aug 2001 16:37:11 -0600

Lisa Greenleaf

Lisa Greenleaf/NNH/Teradyne is out of the office.

Lisa Greenleaf

Wed, 8 Aug 2001 01:01:17 -0400

Lou Hart

Labeling of bottles in statis safe area

Lou Hart

Mon, 6 Aug 2001 17:05:58 -0400

Re: AW: [TN] Misplace component

Lou Hart

Wed, 15 Aug 2001 09:21:12 -0400

Lush, Dorothy

Lush, Dorothy

Fri, 17 Aug 2001 08:49:34 -0700

Re: Board assm. shops doing BGA/CSPs and small volumes

Lush, Dorothy

Thu, 23 Aug 2001 09:40:42 -0700

Lush, Dorothy

Tue, 14 Aug 2001 11:20:32 -0700

Lush, Dorothy

Wed, 15 Aug 2001 12:04:01 -0700

Lush, Dorothy

Tue, 14 Aug 2001 14:05:38 -0700

Lush, Dorothy

Wed, 1 Aug 2001 09:09:19 -0700

BGA PCB mounting material thickness

Lush, Dorothy

Tue, 21 Aug 2001 11:09:36 -0700

Malewicz Wesley

Malewicz Wesley

Wed, 1 Aug 2001 22:36:20 -0400

Mark Hargreaves

HAL contaminant levels

Mark Hargreaves

Wed, 29 Aug 2001 15:52:11 -0400

P&P can't locate fiducials

Mark Hargreaves

Tue, 21 Aug 2001 07:57:13 -0400

Mark Ross

Mark Ross

Tue, 14 Aug 2001 00:54:38 -0400

Re: Capacitor 0603 vs 0402...why not networks and arrays?

Mark Ross

Wed, 8 Aug 2001 16:58:27 -0400

Mark Ross

Thu, 9 Aug 2001 22:21:54 -0400

Mark Ross

Tue, 14 Aug 2001 00:56:50 -0400

Mark Ross

Tue, 14 Aug 2001 01:01:19 -0400

mark simmons

Pin Grid Pin Allignment

mark simmons

Wed, 1 Aug 2001 08:45:50 -0700

Marsico, James

Re: ESD smocks in high temperature and humidity level

Marsico, James

Mon, 13 Aug 2001 07:06:58 -0400

Marsico, James

Thu, 9 Aug 2001 16:05:24 -0400

Soldering to palladium silver

Marsico, James

Wed, 15 Aug 2001 06:52:39 -0400

Marsico, James

Mon, 13 Aug 2001 06:56:38 -0400

soldr balls

Marsico, James

Tue, 14 Aug 2001 15:34:14 -0400

virus

Marsico, James

Mon, 27 Aug 2001 07:06:16 -0400

Mason Hu

Re: Microvia in BGA pad

Mason Hu

Thu, 9 Aug 2001 16:12:32 -0500

Matthew Lamkin

Re: Capacitor 0603 vs 0402...why not networks and arrays?

Matthew Lamkin

Thu, 9 Aug 2001 10:39:45 +0100

McFaddin, Wade

McFaddin, Wade

Wed, 8 Aug 2001 18:38:07 -0500

McGlaughlin, Jeffrey A

Re: IPC-D-356

McGlaughlin, Jeffrey A

Tue, 7 Aug 2001 07:28:25 -0400

Mel Parrish

Re: BGA DFM Guidelines?

Mel Parrish

Wed, 29 Aug 2001 12:39:29 -0700

Re: To wave or not to wave, that is the question...

Mel Parrish

Wed, 29 Aug 2001 12:32:54 -0700

Mel Parrish

Fri, 17 Aug 2001 16:34:49 -0700

Michael Flett

Re: Gel time test & thermalmeter

Michael Flett

Sun, 19 Aug 2001 13:27:48 -0500

Michael Kuczynski

Michael Kuczynski

Wed, 22 Aug 2001 06:42:35 -0500

Michael Lester

Solder Testing

Michael Lester

Mon, 20 Aug 2001 11:04:52 EDT

michael

IPC HDI types

michael

Tue, 21 Aug 2001 21:04:58 +0800

Teflon board price

michael

Fri, 24 Aug 2001 20:06:14 +0800

Miguel Vallejo

self-centering SMT

Miguel Vallejo

Tue, 21 Aug 2001 09:17:51 -0700

Mike Di Giacomo

Re: Assemblies using ceramic substrates...

Mike Di Giacomo

Thu, 16 Aug 2001 13:15:21 -0400

Mike Di Giacomo

Fri, 17 Aug 2001 20:12:27 -0400

Mike Fenner

Mike Fenner

Tue, 7 Aug 2001 14:00:22 +0100

Re: "b" stage epoxy

Mike Fenner

Tue, 7 Aug 2001 13:26:38 +0100

Re: Assemblies using ceramic substrates...

Mike Fenner

Wed, 15 Aug 2001 15:29:45 +0100

Mike Fenner

Mon, 20 Aug 2001 08:59:38 +0100

Re: Back-side Device Metallization

Mike Fenner

Tue, 14 Aug 2001 09:11:49 +0100

Mike Fenner

Wed, 8 Aug 2001 09:05:23 +0100

Re: Looking for short movie of a BGA self-centering

Mike Fenner

Wed, 29 Aug 2001 16:13:36 +0100

Re: Ionics again.

Mike Fenner

Wed, 8 Aug 2001 15:19:56 +0100

Mike Fenner

Mon, 20 Aug 2001 08:37:51 +0100

Mike Fenner

Tue, 14 Aug 2001 09:11:06 +0100

Mike Fenner

Wed, 22 Aug 2001 10:11:38 +0100

Mike Fenner

Wed, 15 Aug 2001 15:58:46 +0100

Re: Soldering to palladium silver

Mike Fenner

Wed, 22 Aug 2001 10:50:16 +0100

Mike Fenner

Wed, 15 Aug 2001 15:39:00 +0100

Mike Sewell

Mike Sewell

Wed, 22 Aug 2001 14:08:06 EDT

Misner, Bruce

Re: solder paste with 2% silver

Misner, Bruce

Wed, 8 Aug 2001 13:44:34 -0600

Misner, Bruce

Tue, 7 Aug 2001 08:35:07 -0500

Mordechai Holtzman

Mordechai Holtzman

Wed, 22 Aug 2001 14:10:31 EDT

Mordechai Holtzman

Wed, 22 Aug 2001 15:11:52 EDT

Nale, Tim

Nancy Reynolds/MKT/HQ/KEMET/US

Nale, Tim

Thu, 16 Aug 2001 10:33:12 -0500

Moisture Sensitive Component Handling & Identification

Nancy Reynolds/MKT/HQ/KEMET/US

Thu, 16 Aug 2001 11:49:09 -0400

Nancy Reynolds/MKT/HQ/KEMET/US

Thu, 16 Aug 2001 10:40:43 -0400

Neil Atkinson

Re: <No subject given>

Neil Atkinson

Wed, 15 Aug 2001 13:18:52 +0100

Neil Atkinson

Wed, 29 Aug 2001 08:03:10 +0100

Neil Atkinson

Wed, 15 Aug 2001 17:26:24 +0100

Neil Atkinson

Wed, 15 Aug 2001 13:16:44 +0100

Neil Atkinson

Wed, 1 Aug 2001 13:17:58 +0100

Neil Atkinson

Wed, 15 Aug 2001 13:47:05 +0100

Neil Atkinson

Thu, 16 Aug 2001 17:56:48 +0100

IPC/EIA J-STD-006 Released

Neil Atkinson

Tue, 21 Aug 2001 09:07:52 +0100

Nick Ban

Nick Ban

Thu, 2 Aug 2001 08:46:01 -0500

Ochenas, Tom

Cooling rates for solder reflow processes

Ochenas, Tom

Fri, 24 Aug 2001 09:52:04 -0700

Ochenas, Tom

Fri, 24 Aug 2001 15:52:29 -0700

Patrick J. O'Connor

out of the office.

Patrick J. O'Connor

Thu, 9 Aug 2001 11:54:42 -0500

Paul Truit

Re: Capacitor 0603 vs 0402...why not networks and arrays?

Paul Truit

Tue, 21 Aug 2001 08:54:04 -0400

Pelkey, Glenn

Re: Bench REL equipments

Pelkey, Glenn

Fri, 24 Aug 2001 08:19:04 -0700

Capacitor 0603 vs 0402

Pelkey, Glenn

Wed, 8 Aug 2001 12:55:31 -0700

Pelkey, Glenn

Thu, 9 Aug 2001 08:41:50 -0700

Re: The effective test method of the expired prepreg.

Pelkey, Glenn

Tue, 21 Aug 2001 09:59:07 -0700

Pelkey, Glenn

Tue, 21 Aug 2001 09:28:42 -0700

Pete Codella

RE: [TN] [TN]RE: [TN] Re: [TN] ãCc'M( 1û÷kJ;'øø98å¥õe OC~qçD;î<;û ûz

Pete Codella

Wed, 29 Aug 2001 15:39:48 -0400

Peter Barton

Microvia in BGA pad

Peter Barton

Thu, 9 Aug 2001 15:58:00 +0100

peter blokhuis

Re: Packaging Instructions for finished Electronic Assemblies

peter blokhuis

Tue, 28 Aug 2001 14:00:53 -0700

Peter Gallant

Peter Gallant

Tue, 21 Aug 2001 13:53:23 -0400

Soldering SMT components

Peter Gallant

Tue, 21 Aug 2001 09:16:16 -0500

peter lee

No-clean solder wire

peter lee

Wed, 29 Aug 2001 09:41:22 -0700

Peter Swanson

Re: lightspeed adhesive

Peter Swanson

Mon, 20 Aug 2001 02:57:30 +0100

phil bavaro

0.5 mm pitch components and soldermask relief

phil bavaro

Wed, 1 Aug 2001 09:15:43 -0700

0201 chip process questions

phil bavaro

Wed, 29 Aug 2001 13:00:20 -0700

Phil Nutting

Phil Nutting

Thu, 16 Aug 2001 12:07:10 -0400

Application of Thermal Grease

Phil Nutting

Thu, 16 Aug 2001 17:04:32 -0400

Phil Nutting

Tue, 14 Aug 2001 11:42:09 -0400

Re: Panelized Boards

Phil Nutting

Wed, 15 Aug 2001 14:32:08 -0400

Solder analysis results

Phil Nutting

Tue, 14 Aug 2001 08:48:05 -0400

Phil Nutting

Wed, 15 Aug 2001 10:17:40 -0400

Thermal Compound considerations

Phil Nutting

Mon, 20 Aug 2001 13:36:09 -0400

Phil Nutting

Mon, 20 Aug 2001 09:42:51 -0400

Re: Thermal Compound considerations

Phil Nutting

Mon, 20 Aug 2001 10:27:54 -0400

Re: Thermal Grease

Phil Nutting

Wed, 22 Aug 2001 15:21:25 -0400

Phil Zarrow

Phil Zarrow

Sat, 25 Aug 2001 23:40:14 EDT

Phil Zarrow

Tue, 21 Aug 2001 14:16:53 EDT

Re: 0201 chip process questions

Phil Zarrow

Tue, 21 Aug 2001 18:12:38 EDT

Re: Hi-pot test

Fri, 31 Aug 2001 10:47:56 -0700

pratap singh

pratap singh

Wed, 29 Aug 2001 15:29:16 -0500

praveen kumar manjeshwar

AOI equipment

praveen kumar manjeshwar

Fri, 31 Aug 2001 00:18:31 +0000

DPMO calculations

praveen kumar manjeshwar

Fri, 31 Aug 2001 19:04:01 +0000

Rich Lasko

IPC Class 2 vs Class 3 Price Considerations

Rich Lasko

Fri, 10 Aug 2001 10:17:43 -0500

FW: IPC Class 2 vs Class 3 Price Considerations

Rich Lasko

Mon, 13 Aug 2001 07:29:07 -0500

Packaging Instructions for finished Electronic Assemblies

Rich Lasko

Tue, 21 Aug 2001 12:25:30 -0500

Richard A. Sperandio

Re: Uralite

Richard A. Sperandio

Mon, 20 Aug 2001 15:42:42 -0700

Richard Hamilton

Richard Hamilton

Thu, 30 Aug 2001 18:08:02 -0700

Richard Hamilton

Sat, 11 Aug 2001 09:05:00 -0700

Richard Hamilton

Wed, 15 Aug 2001 11:27:33 -0700

Re: Hi-pot test

Richard Hamilton

Fri, 31 Aug 2001 14:16:43 -0700

Richard Hamilton

Thu, 2 Aug 2001 15:13:02 -0700

Richard Todd

Tenting of vias

Richard Todd

Thu, 16 Aug 2001 12:16:06 -0500

Richard W Hinebaugh

Richard W Hinebaugh

Wed, 22 Aug 2001 14:09:25 -0500

Richard W Hinebaugh

Wed, 22 Aug 2001 09:35:53 -0500

Re: Ni/Au Plating Question--Returns

Richard W Hinebaugh

Wed, 22 Aug 2001 14:39:42 -0500

Richard W Hinebaugh

Wed, 22 Aug 2001 16:35:40 -0500

richard wiltron

richard wiltron

Fri, 24 Aug 2001 14:41:32 -0700

White Tin

richard wiltron

Mon, 20 Aug 2001 11:02:48 -0700

Rick Howieson

BGA Bow

Rick Howieson

Tue, 28 Aug 2001 09:36:00 -0600

Re: BGA Bow

Rick Howieson

Thu, 30 Aug 2001 08:13:26 -0600

Fallout

Rick Howieson

Wed, 15 Aug 2001 07:20:37 -0600

Re: FDA approval

Rick Howieson

Mon, 13 Aug 2001 12:40:40 -0600

Gold/Paste

Rick Howieson

Thu, 9 Aug 2001 14:53:19 -0600

Rick Howieson

Fri, 10 Aug 2001 11:21:51 -0600

IPC 600

Rick Howieson

Thu, 2 Aug 2001 13:44:51 -0600

Rick Howieson

Thu, 2 Aug 2001 15:37:19 -0600

Rick Thompson

Rick Thompson

Mon, 13 Aug 2001 08:06:00 -0700

BGA DFM Guidelines?

Rick Thompson

Wed, 29 Aug 2001 09:20:15 -0700

Rick Thompson

Thu, 9 Aug 2001 17:17:16 -0700

Rick Thompson

Tue, 21 Aug 2001 10:28:19 -0700

Solder vs Gold Pads on SMT

Rick Thompson

Tue, 21 Aug 2001 16:58:52 -0700

SMT Epoxies?

Rick Thompson

Mon, 27 Aug 2001 11:25:50 -0700

Rick Thompson

Tue, 21 Aug 2001 10:52:47 -0700

Rod Smith

Rod Smith/Endicott/IBM is out of the office.

Rod Smith

Sat, 25 Aug 2001 04:14:34 -0400

Roger Bilham

Re: Bisumth Solder (Sn43Pb43Bi14)

Roger Bilham

Mon, 27 Aug 2001 12:04:09 +0100

Roger Hammond

FAB. Cleaning stainless steel multilayer bonding shims.

Roger Hammond

Tue, 14 Aug 2001 22:34:14 +0100

FDA approval

Roger Hammond

Mon, 13 Aug 2001 12:26:47 +0100

Roger M. Stoops

Re: 0603 land pattern debate

Roger M. Stoops

Fri, 31 Aug 2001 09:06:36 -0400

Re: Capacitor 0603 vs 0402...why not networks and arrays?

Roger M. Stoops

Thu, 9 Aug 2001 16:18:31 -0400

Roger M. Stoops

Tue, 14 Aug 2001 14:35:19 -0400

SMD Assembly Problems

Roger M. Stoops

Mon, 27 Aug 2001 16:38:15 -0400

Roger M. Stoops

Mon, 20 Aug 2001 15:13:50 -0400

Roger M. Stoops

Tue, 21 Aug 2001 12:33:49 -0400

Ryan Grant

Leading Edge Supplier Search

Ryan Grant

Mon, 20 Aug 2001 20:49:10 -0600

S. Miller

S. Miller

Tue, 7 Aug 2001 14:05:51 EDT

Safavi-Bayat Shahed

Re: 0603 land pattern debate

Safavi-Bayat Shahed

Fri, 31 Aug 2001 07:34:46 -0400

Re: HASL

Safavi-Bayat Shahed

Thu, 30 Aug 2001 07:44:29 -0400

Sauer, Steven T.

Re: Panelized Boards

Sauer, Steven T.

Wed, 15 Aug 2001 14:59:56 -0400

Sauer, Steven T.

Wed, 15 Aug 2001 07:43:45 -0400

Scott Kauling

PWB supplier search

Scott Kauling

Fri, 17 Aug 2001 17:08:33 -0500

Scott Mcanall

Scott Mcanall

Tue, 14 Aug 2001 19:33:59 EDT

Tin Plating bath (not clear anymore)

Scott Mcanall

Tue, 14 Aug 2001 19:30:54 EDT

Scott Rebman

Out of office

Scott Rebman

Fri, 24 Aug 2001 07:14:00 -0700

Scott Stewart

cc: MAIL Reminder

Scott Stewart

Thu, 30 Aug 2001 10:13:58 -0500

Sean Clinton

Sean Clinton

Mon, 27 Aug 2001 12:48:15 -0700

Sean Clinton

Mon, 27 Aug 2001 15:14:21 -0700

Seth Goodman

Seth Goodman

Wed, 22 Aug 2001 23:23:04 -0500

Nitrogen Purity for SMT IR Reflow

Seth Goodman

Thu, 23 Aug 2001 12:39:59 -0500

Shoda, Steve

Shoda, Steve

Fri, 31 Aug 2001 11:51:17 -0400

Sklenar Vit (RBAU-BK/MGE4)

Design Certification - Correction

Sklenar Vit (RBAU-BK/MGE4)

Thu, 9 Aug 2001 09:30:19 +1000

Stephannie Caliendo

Design Certification

Stephannie Caliendo

Tue, 21 Aug 2001 17:59:14 -0500

Stephannie Caliendo

Wed, 22 Aug 2001 09:24:58 -0500

Stephen Brown

BGA Re-balling services in Asia

Stephen Brown

Fri, 31 Aug 2001 13:53:38 +0100

Stephen Brown

Wed, 29 Aug 2001 09:27:32 +0100

Stephen R. Gregory

6-pin DIP Optocoupler problem...

Stephen R. Gregory

Mon, 13 Aug 2001 14:40:14 EDT

Stephen R. Gregory

Mon, 13 Aug 2001 17:03:31 EDT

Any DEK 288 users?

Stephen R. Gregory

Tue, 28 Aug 2001 14:00:53 EDT

Assemblies using ceramic substrates...

Stephen R. Gregory

Fri, 31 Aug 2001 20:34:17 EDT

Stephen R. Gregory

Fri, 17 Aug 2001 19:56:30 EDT

Re: BGA PCB mounting material thickness

Stephen R. Gregory

Thu, 2 Aug 2001 08:59:54 EDT

Re: Capacitor 0603 vs 0402...why not networks and arrays?

Stephen R. Gregory

Wed, 8 Aug 2001 20:46:02 EDT

Stephen R. Gregory

Tue, 14 Aug 2001 20:40:15 EDT

Re: Interesting Coplanarity ?

Stephen R. Gregory

Fri, 24 Aug 2001 14:45:52 EDT

Stephen R. Gregory

Tue, 14 Aug 2001 19:18:49 EDT

Stephen R. Gregory

Mon, 6 Aug 2001 19:24:56 EDT

MONSTER board!!!

Stephen R. Gregory

Fri, 24 Aug 2001 19:23:11 EDT

Stephen R. Gregory

Mon, 13 Aug 2001 20:57:38 EDT

Re: Searching for reflow oven manufacturer or user

Stephen R. Gregory

Thu, 2 Aug 2001 11:44:50 EDT

Stephen R. Gregory

Mon, 13 Aug 2001 13:41:42 EDT

Stephen R. Gregory

Tue, 21 Aug 2001 21:01:21 EDT

Stephen R. Gregory

Tue, 28 Aug 2001 22:32:44 EDT

Stephen R. Gregory

Tue, 14 Aug 2001 22:04:15 EDT

Stephen S. Schiera

Stephen S. Schiera

Tue, 14 Aug 2001 11:45:53 -0500

Steve Abrahamson

Steve Abrahamson

Fri, 24 Aug 2001 16:25:21 -0600

Steve Abrahamson

Tue, 21 Aug 2001 13:59:00 -0600

Steve Abrahamson

Tue, 21 Aug 2001 10:02:17 -0600

Looking for board level failure analysis

Steve Abrahamson

Mon, 20 Aug 2001 15:49:12 -0600

Steve DiLeo

Steve DiLeo

Tue, 21 Aug 2001 17:09:24 -0400

Steve Joy

Re: [TN] RE: [TN] Re: [TN] ãCc'M( 1û ÷kJ;'øø98å¥õe OC~qçD;î<;û ûz

Steve Joy

Wed, 29 Aug 2001 10:43:47 -0700

Steve Kelly

Flip Chip flex circuit

Steve Kelly

Mon, 13 Aug 2001 15:53:11 -0400

Steve Telgen

Material specification

Steve Telgen

Fri, 10 Aug 2001 11:52:29 -0400

Stewart, Dougal

design pads for chip resistors and capacitors

Stewart, Dougal

Tue, 21 Aug 2001 15:14:55 +0100

Stewart, Dougal

Wed, 22 Aug 2001 09:01:32 +0100

Hermeticity and Cleanliness

Stewart, Dougal

Thu, 23 Aug 2001 09:51:38 +0100

Stillings, Kathy

Stillings, Kathy

Tue, 7 Aug 2001 09:46:26 -0400

Susana Anaya

Re: Capacitor 0603 vs 0402...why not networks and arrays?

Susana Anaya

Thu, 9 Aug 2001 12:31:57 -0700

Re: Material specification (7781 E-glass)

Susana Anaya

Fri, 10 Aug 2001 15:25:23 -0700

tech

Immersion gold with hard gold fingers

tech

Fri, 24 Aug 2001 13:26:42 -0400

Ted Tontis

UV and Flex

Ted Tontis

Fri, 3 Aug 2001 10:30:37 -0500

Tempea, Ioan

Component skew after reflow

Tempea, Ioan

Thu, 30 Aug 2001 10:50:43 -0400

Re: Component skew after reflow

Tempea, Ioan

Thu, 30 Aug 2001 11:16:49 -0400

Fuji IP3 feeders

Tempea, Ioan

Tue, 7 Aug 2001 15:08:54 -0400

Re: Looking for short movie of a BGA self-centering

Tempea, Ioan

Tue, 21 Aug 2001 09:13:00 -0400

Re: soldr balls

Tempea, Ioan

Tue, 14 Aug 2001 16:12:19 -0400

Tenison Stone

Tenison Stone

Thu, 16 Aug 2001 15:44:57 -0500

Thomas Bauer

Thomas Bauer

Wed, 1 Aug 2001 13:30:16 -0700

Thomas Bauer

Wed, 1 Aug 2001 14:01:36 -0700

Thomas Bauer

Wed, 29 Aug 2001 09:28:44 -0700

Tim Jensen

Tim Jensen

Thu, 9 Aug 2001 14:15:06 -0400

Timothy Reeves

Re: Material specification

Timothy Reeves

Fri, 24 Aug 2001 15:25:07 -0700

Timothy Reeves

Fri, 10 Aug 2001 12:05:45 -0700

Re: Material specification

Timothy Reeves

Fri, 10 Aug 2001 12:28:58 -0700

Re: Solder Testing

Timothy Reeves

Mon, 20 Aug 2001 11:36:20 -0700

Timothy Reeves

Mon, 27 Aug 2001 15:23:47 -0700

Todd, Rick

Todd, Rick

Thu, 16 Aug 2001 16:07:28 -0400

Tom Parkinson - Quality System Manager

Todd, Rick

Thu, 16 Aug 2001 16:24:33 -0400

Tom Burek

REQUEST IPC-4552

Tom Burek

Thu, 16 Aug 2001 11:30:09 -0400

Re: Moisture Sensitive Component Handling & Identification

Tom Parkinson - Quality System Manager

Wed, 8 Aug 2001 15:13:12 -0400

Tom Parkinson - Quality System Manager

Thu, 16 Aug 2001 11:39:03 -0400

Tony Steinke

Tony Steinke

Wed, 1 Aug 2001 15:49:24 -0400

Tony Steinke

Wed, 22 Aug 2001 11:06:58 -0400

Towle, Betsy

Re: Encoder with contamination.Soldering or Supplier process .

Towle, Betsy

Thu, 23 Aug 2001 09:54:20 -0700

Valdez, Raul (R.)

Valdez, Raul (R.)

Fri, 3 Aug 2001 14:49:39 -0400

Re: Encoder with contamination.Soldering or Supplier process .

Valdez, Raul (R.)

Wed, 8 Aug 2001 19:58:11 -0400

Encoder with contamination.Soldering or Supplier process.

Valdez, Raul (R.)

Fri, 3 Aug 2001 13:29:52 -0400

Vanderhoof, Brad

Wenger, George M (George)

Vanderhoof, Brad

Mon, 13 Aug 2001 09:11:01 -0700

Vinit Verma

Tombstoning

Vinit Verma

Mon, 27 Aug 2001 16:47:15 +0530

Weiner Mickey

total PWB production

Weiner Mickey

Tue, 7 Aug 2001 07:56:08 +0300

Wenger, George M (George)

Thu, 16 Aug 2001 14:44:49 -0400

Werner Engelmaier

Werner Engelmaier

Sat, 25 Aug 2001 06:23:02 EDT