0402 issues (2 Messages)
200u pcb (4 Messages)
68-pin PCMCIA Connectors (3 Messages)
95Sn/5Pb Tinned leads (3 Messages)
<No subject> (2 Messages)
About Land Bond Strength, Unsupported component Hole (2 Messages)
Alloy 42 (13 Messages)
ammoniacal etchers (2 Messages)
Antw: [TN] Is HASL board a better choice? (1 Message)
Antw: [TN] STRESS STRAIN CURVE (1 Message)
Antw: [TN] Temperature Cycle to product life (5 Messages)
Bare PCB Bake-out before Assy (3 Messages)
Bareboard testing (1 Message)
Bellcore Specification (3 Messages)
Best Practices in High Volume Lay up & Lamination (3 Messages)
bga (3 Messages)
BGA equipment (1 Message)
bga reflowprofiling (1 Message)
BGA Soldering Problem (23 Messages)
Board Whit Tin finish (11 Messages)
Board White Tin finish (2 Messages)
Boston area company needs someone to modify an existing Allegeo pcb layout. (2 Messages)
CAD data format? (1 Message)
Cad Data Help Needed (11 Messages)
calculating anode area (1 Message)
Ceramic to metal and other seals (5 Messages)
CMM Inspection Vendors (1 Message)
Conformal Coat Curing (4 Messages)
Conformal coating and no clean flux. (4 Messages)
Contamination or exposed copper (2 Messages)
Counting Components (1 Message)
Counting Components Accurately (2 Messages)
Cracked capacitors question (11 Messages)
Critical question via plugging- Does need to apply from bothsides? (3 Messages)
Cross-reference database (1 Message)
dek 288 opinions (1 Message)
dek 288 opinions (take 2) (1 Message)
Designer/Assembler: Need help on 0603 spacing problem. (2 Messages)
Die Attach (2 Messages)
drilling problems (5 Messages)
DW 1765 (1 Message)
Dymaxion II (1 Message)
ECD Oven/Wave rider (1 Message)
EIA standard RS_274X (3 Messages)
embedded capacitors in substrates (3 Messages)
embedded R,C in laminates! (2 Messages)
ENIG (3 Messages)
ENIG + BGA's (1 Message)
Environmental Controls (5 Messages)
EOS Damage prevention (2 Messages)
EPE Corporation..."Hot Strip" thermal wire strippers (7 Messages)
Fab: Photoplotter Film - Fuji (1 Message)
Flip chip in packages (1 Message)
Flipped 12 pin Resistor Network (1 Message)
Flying Probe Testers (1 Message)
formflex tooling (1 Message)
Gold Plating Roughness of Mobile phone keypad (4 Messages)
Grad Schools with PCB Research (3 Messages)
HASL finishing (2 Messages)
heatsinks (2 Messages)
Help Solder mask wrinkled (4 Messages)
Help with screen printing Liquid soldermask (1 Message)
I Really Screwed Up (1 Message)
Immersion and electroplated gold (2 Messages)
Immersion Gold Problems (3 Messages)
Immersion Silver (3 Messages)
IMMERSION SILVER SURFACE FINISH (4 Messages)
Industry Standard for storage of Process and Product dat a (1 Message)
Industry Standard for storage of Process and Product data (4 Messages)
IPC ANNOUNCES 2001 CALENDAR OF EVENTS (1 Message)
IPC-A-600, Class 3 product v/s Bellcore (Telcordia) GR-78, compar ison on PCB (1 Message)
IPC-A-610 Barrel Vertical Fill Interpretation (5 Messages)
IPC-A-610 in french??? (1 Message)
IPC-CC-830A requirements : which class ? (1 Message)
Is HASL board a better choice compare to immersion gold? (4 Messages)
Is HASL board a better choice? (1 Message)
Is IPC-PC-90 still an active document? (4 Messages)
Is it possible to repair BGA pad? (4 Messages)
ITRI (1 Message)
KASE test (2 Messages)
KASE test II (1 Message)
Labeling of PC boards (5 Messages)
Lambda for LTCC silver vias (1 Message)
Land Bond Strength and Peel Strength-Help (1 Message)
Laser Drilling Source (1 Message)
led matrix (2 Messages)
Ledco Dryfilm Laminator (2 Messages)
liquid flux dispenser (1 Message)
Listserv unavailable Nov 17-18 (1 Message)
Look out...heres a bad one!!! (2 Messages)
Low Inductance capacitors (LICA) (2 Messages)
Low-Temp Substrate Standards (1 Message)
LPI , SMOBC. (2 Messages)
Manual Stencil Cleaning (3 Messages)
Maximum component thickness through wave soldering (1 Message)
Metric female screwlock kits for connectors... (2 Messages)
micro sand blasting (5 Messages)
Microelectronics International is MCB Journal of the Week (1 Message)
MULTILAYER BOARD LAY-UP (3 Messages)
Multilayer Bonding Varnish (2 Messages)
Need to contact users of ALTERA 484 PBGAs. (1 Message)
Ni/Au solderabilty (11 Messages)
No clean wick (5 Messages)
No clean wick...Canada Distributors (1 Message)
Odd form assembly/inserter equipment recommendations (1 Message)
Omegameter 500 help needed (5 Messages)
Omegameter-Ionic contamination (3 Messages)
Orbotech/Frontline Genesis CAM software (1 Message)
Orbotech/Frontline Genesis CAM software + others (1 Message)
Pallet Fixtures for Wave soldering (4 Messages)
Parts and Materials Shortages Question (3 Messages)
PCB Bow & Warp Testing (2 Messages)
PCB Corrosion (10 Messages)
PCB Quote Service site (3 Messages)
PCB Separating Equipment (6 Messages)
PCB Test Equipment (1 Message)
PCB Warp & Twist and then Flat again? (4 Messages)
pcb's with thick copper (3 Messages)
PIN diode, not PWB issue (1 Message)
Press fit connector fractures (4 Messages)
Printed Circuits Handbook (ed. Coombs) (3 Messages)
Process Documentation (1 Message)
Processing high Tg materials (1 Message)
Pros and Cons between Unix and NT (1 Message)
Protel 99SE Training in the Minneapolis aera (1 Message)
PS Supplier (1 Message)
Query: Is there an industry standard for pretreating PWB/PCB before underfilling? (1 Message)
Re2010 (2 Messages)
Removal of UV cured notation (3 Messages)
Request for info concerning the mechanical forces on components during their placement on PCBs (1 Message)
Rework of BGA without removing; re-reflowing (1 Message)
RF circuits and ICT testing (2 Messages)
RLC electrical measurement (1 Message)
seeking feedback on inkjet application for barcode/2-D on pcb (1 Message)
Semiconductor Information (2 Messages)
Silicone (2 Messages)
So long for a little bit. (1 Message)
Software for chemical lab. (4 Messages)
Solder Joint Problem (2 Messages)
solder under chip components (7 Messages)
spec on stray copper (3 Messages)
Specifications (5 Messages)
Steam Aging (4 Messages)
stress cracks from PEM insert (1 Message)
Stress Cracks on PCB (8 Messages)
STRESS STRAIN CURVE (1 Message)
Technologies for filling blind micro vias (2 Messages)
tekmar (3 Messages)
Temperature Cycle to product life (9 Messages)
Temperature Cycle to product life2 (1 Message)
Test Fixture (3 Messages)
Test Services Reference (1 Message)
Thanks (1 Message)
Thermal Shock---Help (1 Message)
Thick Copper (1 Message)
Thin FR#4 substrate (4 Messages)
Thin-film specialist (7 Messages)
Thru hole fill (3 Messages)
TN: Lamba for LTCC thermal vias (1 Message)
TN: Lambda for LTCC thermal vias (1 Message)
TN: PIN diode bonding tab (4 Messages)
TN: PIN doide bonding tab (1 Message)
transporting assemblies inside manufacturing facility (3 Messages)
Unsuscribe (2 Messages)
Used Temperature Profiling equipment (3 Messages)
Via in Pad (VIP) Technology (1 Message)
Virus Alert - Please Read (4 Messages)
Virus Alert - Please Read - this is a hoax! (2 Messages)
voiding (3 Messages)
voids in small holes (2 Messages)
Voltage isolation on flex circuits (2 Messages)
Wafer Level CSP????? (3 Messages)
Warp&Twist and ITRI (1 Message)
Warp/Bow after reflow (11 Messages)
Wave Soldering (6 Messages)
what is the Perfect Coupon (3 Messages)
What kind of CAD files are these? (8 Messages)
Who can do this technology? (2 Messages)
Wire Strippers (1 Message)
[Heatsinks] (1 Message)
[TN] BGA Soldering Problem (1 Message)
]Wave Pallet Examples (3 Messages)