TECHNET Archives

April 2009

TechNet@IPC.ORG
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李义 (3 Messages)
?? (1 Message)
Ahne Oosterhof (3 Messages)
Anil kher (1 Message)
Bev Christian (14 Messages)
Blair Hogg (4 Messages)
Bob Perkins (1 Message)
bob wettermann (7 Messages)
Brian Ellis (10 Messages)
Bush, Jeffrey D. (US SSA) (3 Messages)
Carl Proescholdt (1 Message)
Carrillo, Robert (1 Message)
Chris Mahanna (4 Messages)
Chuck Brummer (2 Messages)
Cindy S. Bohler (2 Messages)
Craig Sullivan (1 Message)
Croslin, Robert (1 Message)
Dale Ritzen (3 Messages)
Dave Dixon (1 Message)
David Bergman (2 Messages)
David D. Hillman (14 Messages)
Dean Stadem (2 Messages)
Dee Stover (2 Messages)
Dennis Fritz (7 Messages)
Douglas Erb (3 Messages)
Douglas Pauls (10 Messages)
Dwight Mattix (4 Messages)
EIMCNews (2 Messages)
Eric CHRISTISON (2 Messages)
Eric Kalgren (1 Message)
Forrester, Michael (H USA) (1 Message)
Frederick Miller (5 Messages)
Gary Bremer (1 Message)
Gary Camac (6 Messages)
George Milad (1 Message)
Graham Collins (6 Messages)
Graham Naisbitt (3 Messages)
Grunde Gjertsen (1 Message)
Guy Ramsey (6 Messages)
Harris Dy (1 Message)
Hernefjord Ingemar (4 Messages)
Ian Hanna (4 Messages)
Inge (22 Messages)
Ioan Tempea (3 Messages)
Jack Olson (1 Message)
James Liddle (1 Message)
James Mahoney (4 Messages)
Jerry Dengler (1 Message)
Jim Carlson (1 Message)
Joe Fjelstad (12 Messages)
Joe Macko (1 Message)
Joe Russeau (2 Messages)
John Burke (4 Messages)
John Foster (3 Messages)
John Goulet (7 Messages)
John Maxwell (2 Messages)
John Parsons (3 Messages)
Joyce Koo (17 Messages)
Kane, Amol (349) (3 Messages)
Karen Tellefsen (3 Messages)
Karnwal, Pankaj (1 Message)
Ken Bloomquist (8 Messages)
Kevin Glidden (7 Messages)
kwood716 (3 Messages)
Larry Dzaugis (1 Message)
Lee Hill (1 Message)
Lee parker (2 Messages)
Lee Whiteman (14 Messages)
Lenny Carter (1 Message)
Linda Langley (1 Message)
Liu, Edwin (4 Messages)
Louis Hart (3 Messages)
Marsal Tampubolon (1 Message)
Matthias Mansfeld (1 Message)
McGlaughlin, Jeffrey A (2 Messages)
Mike Fenner (5 Messages)
Mike Sewell (6 Messages)
mp3 (2 Messages)
Neil Maloney (2 Messages)
Nieznanski, John A - SSD (2 Messages)
P. Langeveld (1 Message)
Paul Edwards (4 Messages)
Paul Reid (2 Messages)
Pete Houwen (2 Messages)
Peter L (3 Messages)
Peter Swanson (2 Messages)
Peter Vigneau (1 Message)
Phil Nutting (7 Messages)
Post, Scott E (1 Message)
R Sedlak (4 Messages)
Randall L Bock (2 Messages)
Rex Waygood (1 Message)
Richard Stadem (1 Message)
Rios Edward-QDMB76 (2 Messages)
Robert Kondner (3 Messages)
Roger Mack (1 Message)
Rolfe, David (1 Message)
Selva Suganthi (2 Messages)
Simonik, Dave R. (David) (1 Message)
Stadem, Richard D. (42 Messages)
stephengregory5849 (1 Message)
Steve Gregory (13 Messages)
Steve Kelly (1 Message)
Steve Smith (1 Message)
Steven Creswick (8 Messages)
Stewart, Dougal (1 Message)
Syed Ahmad (4 Messages)
Tan Geok Ang (3 Messages)
Ted Tontis (4 Messages)
Temkin, Gregg (4 Messages)
Thayer, Wayne (9 Messages)
Upton, Shawn (1 Message)
Vladimir Igoshev (15 Messages)
Wenger, George M. (6 Messages)
Werner Engelmaier /* (26 Messages)
Whittaker, Dewey (EHCOE) (17 Messages)

Subject

From Sorted by Sender, Alphabetically

Date
New Sender 李义
Re: computer questioin
李义
Tue, 7 Apr 2009 16:37:32 +0800
NPTH or PTH?
李义
Thu, 16 Apr 2009 17:07:30 +0800
Re: Solder Paste In the Solder Pot
李义
Fri, 3 Apr 2009 10:23:57 +0800
New Sender ??
Re: Component stacking
??
Mon, 27 Apr 2009 21:51:54 +0800
New Sender Ahne Oosterhof
Re: Cable Shield
Ahne Oosterhof
Thu, 30 Apr 2009 12:41:44 -0700
Re: European Union Council Directive 80/181/EEC (Metric Directive)
Ahne Oosterhof
Tue, 14 Apr 2009 08:43:18 -0700
Re: General requirements for Radiation Equipment
Ahne Oosterhof
Thu, 23 Apr 2009 10:39:51 -0700
New Sender Anil kher
Chemical resistance ENIG
Anil kher
Sat, 4 Apr 2009 12:07:10 +0530
New Sender Bev Christian
Another Bev survey
Bev Christian
Thu, 16 Apr 2009 10:23:55 -0400
Re: Component stacking
Bev Christian
Fri, 24 Apr 2009 18:40:03 -0400
Re: Determining Root Cause
Bev Christian
Thu, 16 Apr 2009 17:09:54 -0400
Re: Friday Theorizing
Bev Christian
Fri, 10 Apr 2009 18:25:33 -0400
Re: Hand Sanitizer and PCB Assembly
Bev Christian
Mon, 27 Apr 2009 20:18:27 -0400
Re: Interesting test regime for handsets
Bev Christian
Sat, 11 Apr 2009 18:40:58 -0400
Re: LGAs in a military environment?
Bev Christian
Thu, 16 Apr 2009 10:57:44 -0400
Re: LGAs in a military environment?
Bev Christian
Thu, 16 Apr 2009 11:29:43 -0400
Re: LGAs in a military environment?
Bev Christian
Thu, 16 Apr 2009 13:51:40 -0400
NTC RE: [TN] Hand Sanitizer and PCB Assembly
Bev Christian
Tue, 28 Apr 2009 09:54:04 -0400
Re: Roll-to-Roll Research
Bev Christian
Mon, 6 Apr 2009 22:05:24 -0400
Re: Roll-to-Roll Research
Bev Christian
Tue, 7 Apr 2009 19:41:36 -0400
Re: Second time reflow of PoP on bottom side of PCBA
Bev Christian
Thu, 23 Apr 2009 20:06:40 -0400
Re: Straddle mount connector at SMT
Bev Christian
Mon, 20 Apr 2009 18:57:02 -0400
New Sender Blair Hogg
Re: Copper conductors
Blair Hogg
Wed, 1 Apr 2009 06:52:20 -0500
Re: Copper conductors
Blair Hogg
Wed, 1 Apr 2009 07:35:51 -0500
Re: Copper conductors
Blair Hogg
Wed, 1 Apr 2009 15:36:02 -0500
Test
Blair Hogg
Wed, 1 Apr 2009 12:13:03 -0500
New Sender Bob Perkins
Re: Solder Ball Problem
Bob Perkins
Thu, 23 Apr 2009 12:47:25 -0700
New Sender bob wettermann
Re: Actel QFN180 Assembly
bob wettermann
Thu, 30 Apr 2009 03:17:17 -0700
Determining Root Cause
bob wettermann
Thu, 16 Apr 2009 13:59:35 -0700
Re: European Union Council Directive 80/181/EEC (Metric Directive)
bob wettermann
Tue, 14 Apr 2009 07:35:56 -0700
Friday Theorizing
bob wettermann
Thu, 9 Apr 2009 08:17:08 -0700
Re: Friday Theorizing
bob wettermann
Thu, 9 Apr 2009 10:08:15 -0700
Re: Friday Theorizing
bob wettermann
Fri, 10 Apr 2009 08:16:13 -0700
Re: FW: Lead Free Reworking of Multilayer Ceramic Capacitors
bob wettermann
Wed, 29 Apr 2009 06:35:33 -0700
New Sender Brian Ellis
Copper conductors
Brian Ellis
Wed, 1 Apr 2009 10:13:33 +0300
Re: European Union Council Directive 80/181/EEC (Metric Directive)
Brian Ellis
Thu, 16 Apr 2009 11:16:34 +0300
Re: European Union Council Directive 80/181/EEC (Metric Directive)
Brian Ellis
Thu, 16 Apr 2009 18:35:57 +0300
Re: European Union Council Directive 80/181/EEC (Metric Directive)
Brian Ellis
Fri, 17 Apr 2009 08:42:33 +0300
Re: Hand Sanitizer and PCB Assembly
Brian Ellis
Mon, 27 Apr 2009 17:06:42 +0300
Re: Hand Sanitizer and PCB Assembly
Brian Ellis
Tue, 28 Apr 2009 08:19:32 +0300
Re: Hand Sanitizer and PCB Assembly
Brian Ellis
Tue, 28 Apr 2009 18:05:52 +0300
Re: Hand Sanitizer and PCB Assembly
Brian Ellis
Tue, 28 Apr 2009 18:29:42 +0300
Re: NTC - [TN] Gold/Tin Intermetallics, why are we afraid?
Brian Ellis
Mon, 27 Apr 2009 17:37:56 +0300
Re: Solvent for cured cyanoacrylate adhesive
Brian Ellis
Thu, 2 Apr 2009 17:20:59 +0300
New Sender Bush, Jeffrey D. (US SSA)
Re: Do we have a UL R/C PWB?
Bush, Jeffrey D. (US SSA)
Mon, 6 Apr 2009 16:16:29 -0400
Re: NPTH or PTH?
Bush, Jeffrey D. (US SSA)
Thu, 16 Apr 2009 10:56:06 -0400
Re: when do vias require a thermal relief
Bush, Jeffrey D. (US SSA)
Tue, 7 Apr 2009 09:56:13 -0400
New Sender Carl Proescholdt
Hand Sanitizer and PCB Assembly
Carl Proescholdt
Mon, 27 Apr 2009 08:22:19 -0500
New Sender Carrillo, Robert
IPC-A-610 Flux Residues 10.4.1
Carrillo, Robert
Mon, 6 Apr 2009 16:59:38 -0400
New Sender Chris Mahanna
Re: Gold/Tin Intermetallics, why are we afraid?
Chris Mahanna
Thu, 16 Apr 2009 17:37:16 -0400
Re: Gold/Tin Intermetallics, why are we afraid?
Chris Mahanna
Thu, 16 Apr 2009 22:27:36 -0400
Re: Info on LPI tenting of vias, both sides
Chris Mahanna
Mon, 13 Apr 2009 13:25:10 -0400
Re: Info on LPI tenting of vias, both sides
Chris Mahanna
Tue, 14 Apr 2009 11:15:04 -0400
New Sender Chuck Brummer
Re: NTC: Some good news for someone finally!
Chuck Brummer
Fri, 3 Apr 2009 07:54:26 -0700
Re: FW: Video: Surprise fun in Antwerp train station
Chuck Brummer
Thu, 9 Apr 2009 07:51:15 -0700
New Sender Cindy S. Bohler
Component stacking
Cindy S. Bohler
Fri, 24 Apr 2009 17:35:07 -0500
The effects of vibration on SMT part overhang
Cindy S. Bohler
Mon, 20 Apr 2009 13:10:34 -0500
New Sender Craig Sullivan
Nitrogen use for selective soldering equipment
Craig Sullivan
Wed, 29 Apr 2009 13:26:56 -0500
New Sender Croslin, Robert
Re: threaded fastener selection guide
Croslin, Robert
Thu, 9 Apr 2009 14:09:17 -0400
New Sender Dale Ritzen
Re: Do we have a UL R/C PWB?
Dale Ritzen
Fri, 3 Apr 2009 09:59:30 -0500
Re: GM & Chrysler Out of NASCAR
Dale Ritzen
Wed, 1 Apr 2009 07:24:37 -0500
Re: GM & Chrysler Out of NASCAR
Dale Ritzen
Wed, 1 Apr 2009 07:42:09 -0500
New Sender Dave Dixon
Re: Hand Sanitizer and PCB Assembly
Dave Dixon
Tue, 28 Apr 2009 09:11:02 -0500
New Sender David Bergman
Decoupling Performance Class and Quality Assurance testing?
David Bergman
Wed, 8 Apr 2009 13:16:55 -0500
Re: Plating over metal
David Bergman
Wed, 8 Apr 2009 09:28:31 -0500
New Sender David D. Hillman
Re: Determining Root Cause
David D. Hillman
Thu, 16 Apr 2009 16:26:48 -0500
Re: Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)
David D. Hillman
Thu, 23 Apr 2009 22:40:39 -0500
Re: Gold/Tin Intermetallics, why are we afraid?
David D. Hillman
Wed, 15 Apr 2009 07:48:44 -0500
Re: Gold/Tin Intermetallics, why are we afraid?
David D. Hillman
Wed, 15 Apr 2009 11:01:43 -0500
Re: Gold/Tin Intermetallics, why are we afraid?
David D. Hillman
Wed, 15 Apr 2009 13:49:03 -0500
Re: Gold/Tin Intermetallics, why are we afraid?
David D. Hillman
Wed, 15 Apr 2009 15:23:18 -0500
Re: Gold/Tin Intermetallics, why are we afraid?
David D. Hillman
Thu, 16 Apr 2009 14:31:59 -0500
Re: IPC/EIA-J-STD 002 Steam Ageing
David D. Hillman
Thu, 23 Apr 2009 23:11:52 -0500
Re: NTC - [TN] Gold/Tin Intermetallics, why are we afraid?
David D. Hillman
Thu, 16 Apr 2009 14:53:04 -0500
Re: NTC - [TN] Gold/Tin Intermetallics, why are we afraid?
David D. Hillman
Thu, 16 Apr 2009 15:25:37 -0500
Re: Plating on screws
David D. Hillman
Thu, 23 Apr 2009 10:05:47 -0500
Re: Plating on screws
David D. Hillman
Fri, 24 Apr 2009 14:17:22 -0500
Re: Plating on screws
David D. Hillman
Fri, 24 Apr 2009 15:30:07 -0500
Re: Solderability fluxes
David D. Hillman
Thu, 9 Apr 2009 07:18:36 -0500
New Sender Dean Stadem
Re: Determining Root Cause
Dean Stadem
Fri, 17 Apr 2009 07:26:18 -0500
Re: Second time reflow of PoP on bottom side of PCBA
Dean Stadem
Thu, 23 Apr 2009 21:29:03 -0500
New Sender Dee Stover
when do vias require a thermal relief
Dee Stover
Mon, 6 Apr 2009 11:58:40 -0700
Re: [DC] when do vias require a thermal relief
Dee Stover
Mon, 6 Apr 2009 14:16:52 -0700
New Sender Dennis Fritz
Re: Edge connector repair
Dennis Fritz
Fri, 3 Apr 2009 13:07:28 -0400
Re: IPC/EIA-J-STD 002 Steam Ageing
Dennis Fritz
Thu, 23 Apr 2009 11:02:44 -0400
Re: IPC/EIA-J-STD 002 Steam Ageing
Dennis Fritz
Fri, 24 Apr 2009 07:18:57 -0400
Re: Plating on screws
Dennis Fritz
Wed, 29 Apr 2009 16:34:09 -0400
Re: Plating on screws
Dennis Fritz
Wed, 29 Apr 2009 20:51:20 -0400
Re: Plating over metal
Dennis Fritz
Wed, 8 Apr 2009 10:29:48 -0400
Re: Zinc Plating and whiskers
Dennis Fritz
Fri, 24 Apr 2009 12:53:54 -0400
New Sender Douglas Erb
Re: Cable Shielding
Douglas Erb
Thu, 30 Apr 2009 11:47:14 -0700
Re: Mystery Connector
Douglas Erb
Mon, 20 Apr 2009 14:10:58 -0700
Re: Mystery Connector
Douglas Erb
Mon, 20 Apr 2009 14:19:49 -0700
New Sender Douglas Pauls
Re: Gold/Tin Intermetallics, why are we afraid?
Douglas Pauls
Wed, 15 Apr 2009 16:53:03 -0500
Re: Hand Sanitizer and PCB Assembly
Douglas Pauls
Mon, 27 Apr 2009 11:09:50 -0500
Re: Hand Sanitizer and PCB Assembly
Douglas Pauls
Tue, 28 Apr 2009 10:25:56 -0500
Mystery Connector
Douglas Pauls
Mon, 20 Apr 2009 15:17:31 -0500
Re: Mystery Connector
Douglas Pauls
Thu, 23 Apr 2009 08:26:44 -0500
Re: Mystery Connector
Douglas Pauls
Thu, 23 Apr 2009 09:02:42 -0500
Re: NTC - [TN] Gold/Tin Intermetallics, why are we afraid?
Douglas Pauls
Thu, 16 Apr 2009 15:20:57 -0500
Re: NTC - [TN] Gold/Tin Intermetallics, why are we afraid?
Douglas Pauls
Thu, 16 Apr 2009 16:31:13 -0500
Re: NTC - [TN] Gold/Tin Intermetallics, why are we afraid?
Douglas Pauls
Mon, 27 Apr 2009 07:07:26 -0500
Re: STATIC DISSIPATIVE COATINGS
Douglas Pauls
Wed, 29 Apr 2009 14:31:08 -0500
New Sender Dwight Mattix
Re: NTC: Some good news for someone finally!
Dwight Mattix
Fri, 3 Apr 2009 08:26:07 -0700
Re: PCB Failure analysis
Dwight Mattix
Mon, 6 Apr 2009 06:41:41 -0700
Re: PCB Failure analysis
Dwight Mattix
Mon, 6 Apr 2009 06:43:53 -0700
Re: PCB Failure analysis
Dwight Mattix
Tue, 7 Apr 2009 07:23:03 -0700
New Sender EIMCNews
Re: Plating on screws
EIMCNews
Fri, 24 Apr 2009 08:44:40 -0700
Re: Plating on screws
EIMCNews
Sun, 26 Apr 2009 13:28:28 -0700
New Sender Eric CHRISTISON
Re: LGAs in a military environment?
Eric CHRISTISON
Thu, 16 Apr 2009 16:47:33 +0100
Re: Solvent for cured cyanoacrylate adhesive
Eric CHRISTISON
Thu, 2 Apr 2009 15:41:31 +0100
New Sender Eric Kalgren
Pre-printed shrink tubing
Eric Kalgren
Fri, 24 Apr 2009 22:02:58 -0400
New Sender Forrester, Michael (H USA)
Wire Crimps: Machine Vs Hand Tool Specs
Forrester, Michael (H USA)
Mon, 6 Apr 2009 12:05:23 -0400
New Sender Frederick Miller
Re: threaded fastener selection guide
Frederick Miller
Thu, 9 Apr 2009 14:44:46 -0400
Re: threaded fastener selection guide
Frederick Miller
Thu, 9 Apr 2009 15:02:56 -0400
Re: threaded fastener selection guide
Frederick Miller
Thu, 9 Apr 2009 15:07:11 -0400
Re: Wire Crimps: Machine Vs Hand Tool Specs
Frederick Miller
Mon, 6 Apr 2009 12:16:52 -0400
Re: Wire Crimps: Machine Vs Hand Tool Specs
Frederick Miller
Mon, 6 Apr 2009 15:39:48 -0400
New Sender Gary Bremer
Re: Plating on screws
Gary Bremer
Wed, 29 Apr 2009 15:27:14 -0700
New Sender Gary Camac
Edge connector repair
Gary Camac
Fri, 3 Apr 2009 11:38:46 -0500
Re: Edge connector repair
Gary Camac
Fri, 3 Apr 2009 13:58:42 -0500
Plating on screws
Gary Camac
Thu, 23 Apr 2009 08:09:11 -0500
Re: Plating on screws
Gary Camac
Thu, 23 Apr 2009 16:20:16 -0500
Re: TH lead forming machines
Gary Camac
Mon, 6 Apr 2009 07:39:27 -0500
Re: TH lead forming machines
Gary Camac
Mon, 6 Apr 2009 07:51:19 -0500
New Sender George Milad
Re: Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)
George Milad
Sun, 26 Apr 2009 15:22:08 EDT
New Sender Graham Collins
Re: European Union Council Directive 80/181/EEC (Metric Dire ctive)
Graham Collins
Tue, 14 Apr 2009 13:10:35 -0300
Re: Hand Sanitizer and PCB Assembly
Graham Collins
Mon, 27 Apr 2009 13:13:02 -0300
LGAs in a military environment?
Graham Collins
Thu, 16 Apr 2009 07:32:15 -0300
Re: LGAs in a military environment?
Graham Collins
Thu, 16 Apr 2009 15:44:46 -0300
Re: Solder Ball Problem
Graham Collins
Thu, 23 Apr 2009 16:22:08 -0300
Re: Solder Paste In the Solder Pot
Graham Collins
Thu, 2 Apr 2009 15:59:57 -0300
New Sender Graham Naisbitt
Re: Hand Sanitizer and PCB Assembly
Graham Naisbitt
Wed, 29 Apr 2009 15:09:30 +0100
Re: IPC/EIA-J-STD 002 Steam Ageing
Graham Naisbitt
Fri, 24 Apr 2009 11:30:32 +0100
Re: NTC? SI vs imperial, cont.
Graham Naisbitt
Wed, 15 Apr 2009 13:29:54 +0100
New Sender Grunde Gjertsen
Re: Implementing Class 3 assembly processes
Grunde Gjertsen
Thu, 23 Apr 2009 07:46:30 +0200
New Sender Guy Ramsey
Re: Component stacking
Guy Ramsey
Mon, 27 Apr 2009 06:17:45 -0400
Re: Determining Root Cause
Guy Ramsey
Fri, 17 Apr 2009 07:30:23 -0400
Re: Determining Root Cause
Guy Ramsey
Fri, 17 Apr 2009 10:01:41 -0400
Re: Gold/Tin Intermetallics, why are we afraid?
Guy Ramsey
Wed, 15 Apr 2009 08:37:31 -0400
Re: Gold/Tin Intermetallics, why are we afraid?
Guy Ramsey
Wed, 15 Apr 2009 11:11:09 -0400
Re: Gold/Tin Intermetallics, why are we afraid?
Guy Ramsey
Wed, 15 Apr 2009 11:19:59 -0400
New Sender Harris Dy
PTF Technology
Harris Dy
Wed, 15 Apr 2009 20:22:01 -0700
New Sender Hernefjord Ingemar
Re: computer questioin
Hernefjord Ingemar
Tue, 7 Apr 2009 11:50:16 +0200
Re: Gold/Tin Intermetallics, why are we afraid?
Hernefjord Ingemar
Wed, 15 Apr 2009 08:42:04 +0200
Re: Nikon microscope camera DXM-1200
Hernefjord Ingemar
Thu, 2 Apr 2009 08:50:17 +0200
Re: Nitrogen use for selective soldering equipment
Hernefjord Ingemar
Thu, 30 Apr 2009 09:02:14 +0200
New Sender Ian Hanna
Re: Copper conductors
Ian Hanna
Wed, 1 Apr 2009 14:29:20 -0400
Re: Gold/Tin Intermetallics, why are we afraid?
Ian Hanna
Wed, 15 Apr 2009 10:26:52 -0400
Re: Gold/Tin Intermetallics, why are we afraid?
Ian Hanna
Thu, 16 Apr 2009 10:21:16 -0400
Re: LGAs in a military environment?
Ian Hanna
Thu, 16 Apr 2009 11:57:08 -0400
New Sender Inge
Re: Cable assembly
Inge
Mon, 13 Apr 2009 10:58:38 +0200
Re: Cable Shielding
Inge
Thu, 30 Apr 2009 21:13:15 +0200
computer questioin
Inge
Mon, 6 Apr 2009 22:26:37 +0200
Re: computer questioin
Inge
Mon, 6 Apr 2009 22:34:15 +0200
Re: computer questioin
Inge
Mon, 6 Apr 2009 23:38:32 +0200
Re: computer questioin
Inge
Mon, 6 Apr 2009 23:55:03 +0200
Re: European Union Council Directive 80/181/EEC (Metric Directive) - NTC
Inge
Tue, 14 Apr 2009 20:19:57 +0200
Re: European Union Council Directive 80/181/EEC (Metric Directive) - NTC
Inge
Tue, 14 Apr 2009 21:54:08 +0200
Re: European Union Council Directive 80/181/EEC (Metric Directive) - NTC
Inge
Tue, 14 Apr 2009 21:59:55 +0200
Re: European Union Council Directive 80/181/EEC (Metric Directive) - NTC
Inge
Tue, 14 Apr 2009 22:28:51 +0200
Re: Friday Theorizing
Inge
Thu, 9 Apr 2009 18:01:51 +0200
Re: Friday Theorizing
Inge
Thu, 9 Apr 2009 18:15:28 +0200
Re: Friday Theorizing
Inge
Thu, 9 Apr 2009 20:07:23 +0200
Re: Friday Theorizing
Inge
Fri, 10 Apr 2009 22:19:13 +0200
Gold/Tin Intermetallics, why are we afraid?
Inge
Tue, 14 Apr 2009 22:55:52 +0200
Re: Gold/Tin Intermetallics, why are we afraid?
Inge
Tue, 14 Apr 2009 23:15:23 +0200
Re: Gold/Tin Intermetallics, why are we afraid?
Inge
Tue, 14 Apr 2009 23:27:38 +0200
Re: Gold/Tin Intermetallics, why are we afraid?
Inge
Wed, 15 Apr 2009 19:42:24 +0200
Re: Gold/Tin Intermetallics, why are we afraid?
Inge
Wed, 15 Apr 2009 19:52:13 +0200
Re: LGA acceptance
Inge
Mon, 27 Apr 2009 19:50:31 +0200
Re: LGAs in a military environment?
Inge
Fri, 24 Apr 2009 18:50:16 +0200
Re: NTC - [TN] Gold/Tin Intermetallics, why are we afraid?
Inge
Fri, 24 Apr 2009 21:51:57 +0200
New Sender Ioan Tempea
Re: LGAs in a military environment?
Ioan Tempea
Thu, 16 Apr 2009 11:25:04 -0400
Re: LGAs in a military environment?
Ioan Tempea
Thu, 16 Apr 2009 14:32:34 -0400
TH lead forming machines
Ioan Tempea
Sun, 5 Apr 2009 21:48:09 -0400
New Sender Jack Olson
IPC APEX/EXPO
Jack Olson
Wed, 1 Apr 2009 08:05:21 -0500
New Sender James Liddle
FW: Lead Free Reworking of Multilayer Ceramic Capacitors
James Liddle
Wed, 29 Apr 2009 08:01:00 +0000
New Sender James Mahoney
Re: Copper repair
James Mahoney
Fri, 3 Apr 2009 13:21:00 -0400
Re: Edge connector repair
James Mahoney
Fri, 3 Apr 2009 12:43:58 -0400
Re: Implementing Class 3 assembly processes
James Mahoney
Thu, 23 Apr 2009 08:47:11 -0400
Re: FW: IPC 6013B
James Mahoney
Wed, 8 Apr 2009 15:19:12 -0400
New Sender Jerry Dengler
Re: Solder Paste In the Solder Pot
Jerry Dengler
Thu, 2 Apr 2009 14:48:04 -0400
New Sender Jim Carlson
Re: Bad resistors
Jim Carlson
Mon, 20 Apr 2009 06:26:17 -0500
New Sender Joe Fjelstad
Re: European Union Council Directive 80/181/EEC (Metric Directive)
Joe Fjelstad
Tue, 14 Apr 2009 11:51:41 EDT
Re: European Union Council Directive 80/181/EEC (Metric Directive) - NTC
Joe Fjelstad
Tue, 14 Apr 2009 12:02:52 EDT
Re: European Union Council Directive 80/181/EEC (Metric Directive) - NTC
Joe Fjelstad
Tue, 14 Apr 2009 14:54:06 EDT
Re: Hand Sanitizer and PCB Assembly
Joe Fjelstad
Tue, 28 Apr 2009 11:48:27 EDT
Re: Hand Sanitizer and PCB Assembly NTC
Joe Fjelstad
Tue, 28 Apr 2009 12:56:30 EDT
Interesting test regime for handsets
Joe Fjelstad
Sat, 11 Apr 2009 16:45:44 EDT
Re: Interesting test regime for handsets
Joe Fjelstad
Sun, 12 Apr 2009 13:51:07 EDT
Re: NTC? SI vs imperial, cont.
Joe Fjelstad
Wed, 15 Apr 2009 12:00:53 EDT
Re: NTC? SI vs imperial, cont.
Joe Fjelstad
Wed, 15 Apr 2009 12:21:31 EDT
Re: PTF Technology
Joe Fjelstad
Thu, 16 Apr 2009 10:49:33 EDT
Re: Roll-to-Roll Research
Joe Fjelstad
Tue, 7 Apr 2009 10:37:02 EDT
Re: Roll-to-Roll Research
Joe Fjelstad
Tue, 7 Apr 2009 11:52:46 EDT
New Sender Joe Macko
threaded fastener selection guide
Joe Macko
Wed, 8 Apr 2009 07:43:51 -0700
New Sender Joe Russeau
Re: Hand Sanitizer and PCB Assembly
Joe Russeau
Mon, 27 Apr 2009 13:49:02 -0400
Re: Hand Sanitizer and PCB Assembly
Joe Russeau
Tue, 28 Apr 2009 11:50:10 -0400
New Sender John Burke
Re: Determining Root Cause
John Burke
Fri, 17 Apr 2009 08:35:12 -0700
Re: European Union Council Directive 80/181/EEC (Metric Directive)
John Burke
Mon, 13 Apr 2009 15:22:10 -0700
Re: Hand Sanitizer and PCB Assembly
John Burke
Mon, 27 Apr 2009 15:02:59 -0700
Re: Hand Sanitizer and PCB Assembly
John Burke
Tue, 28 Apr 2009 08:17:56 -0700
New Sender John Foster
Re: computer questioin
John Foster
Mon, 6 Apr 2009 13:49:43 -0700
Re: Hand Sanitizer and PCB Assembly
John Foster
Mon, 27 Apr 2009 14:22:04 -0700
Re: Info on LPI tenting of vias, both sides
John Foster
Mon, 13 Apr 2009 09:49:55 -0700
New Sender John Goulet
Re: Bad resistors
John Goulet
Sun, 19 Apr 2009 17:10:35 +0000
Re: Component stacking
John Goulet
Sun, 26 Apr 2009 13:48:25 +0000
Re: Edge connector repair
John Goulet
Sun, 19 Apr 2009 16:06:44 +0000
Re: Solder Paste In the Solder Pot
John Goulet
Sun, 19 Apr 2009 16:36:48 +0000
Re: TH lead forming machines
John Goulet
Sun, 19 Apr 2009 16:28:53 +0000
Re: The effects of vibration on SMT part overhang
John Goulet
Mon, 20 Apr 2009 20:49:56 +0000
Re: Traces and vias under components
John Goulet
Sun, 19 Apr 2009 19:22:41 +0000
New Sender John Maxwell
Re: LGAs in a military environment?
John Maxwell
Thu, 16 Apr 2009 11:31:28 -0700
Re: LGAs in a military environment?
John Maxwell
Thu, 16 Apr 2009 13:48:00 -0700
New Sender John Parsons
Solder Ball Problem
John Parsons
Thu, 23 Apr 2009 11:15:43 -0700
Re: Solder Ball Problem
John Parsons
Thu, 23 Apr 2009 11:58:13 -0700
Re: Solder Ball Problem
John Parsons
Thu, 23 Apr 2009 13:10:44 -0700
New Sender Joyce Koo
Re: Cable assembly
Joyce Koo
Mon, 13 Apr 2009 06:19:48 -0400
Re: Copper conductors
Joyce Koo
Wed, 1 Apr 2009 14:15:46 -0400
Re: European Union Council Directive 80/181/EEC (Metric Directive)
Joyce Koo
Tue, 14 Apr 2009 12:23:42 -0400
Re: Gold/Tin Intermetallics, why are we afraid?
Joyce Koo
Tue, 14 Apr 2009 17:18:15 -0400
Re: Gold/Tin Intermetallics, why are we afraid?
Joyce Koo
Wed, 15 Apr 2009 12:36:21 -0400
Re: Gold/Tin Intermetallics, why are we afraid?
Joyce Koo
Wed, 15 Apr 2009 16:26:34 -0400
Re: Gold/Tin Intermetallics, why are we afraid?
Joyce Koo
Wed, 15 Apr 2009 17:11:16 -0400
Re: Gold/Tin Intermetallics, why are we afraid?
Joyce Koo
Wed, 15 Apr 2009 17:33:35 -0400
Re: Gold/Tin Intermetallics, why are we afraid?
Joyce Koo
Thu, 16 Apr 2009 15:48:50 -0400
Re: Hand Sanitizer and PCB Assembly
Joyce Koo
Tue, 28 Apr 2009 10:01:47 -0400
Re: LGAs in a military environment?
Joyce Koo
Thu, 16 Apr 2009 11:32:00 -0400
Re: LGAs in a military environment?
Joyce Koo
Thu, 16 Apr 2009 15:31:14 -0400
Re: NTC: Some good news for someone finally!
Joyce Koo
Fri, 3 Apr 2009 10:38:23 -0400
OSP damage
Joyce Koo
Wed, 29 Apr 2009 17:33:11 -0400
Re: PCB Failure analysis
Joyce Koo
Mon, 6 Apr 2009 10:57:21 -0400
Re: Plating on screws
Joyce Koo
Fri, 24 Apr 2009 12:29:19 -0400
Re: Plating over metal
Joyce Koo
Wed, 8 Apr 2009 10:28:37 -0400
New Sender Kane, Amol (349)
IPC/EIA-J-STD 002 Steam Ageing
Kane, Amol (349)
Thu, 23 Apr 2009 09:37:07 -0400
Re: IPC/EIA-J-STD 002 Steam Ageing
Kane, Amol (349)
Thu, 23 Apr 2009 11:45:25 -0400
Stencil Life
Kane, Amol (349)
Mon, 13 Apr 2009 13:08:46 -0400
New Sender Karen Tellefsen
Re: Hand Sanitizer and PCB Assembly
Karen Tellefsen
Mon, 27 Apr 2009 09:42:57 -0400
Re: Hand Sanitizer and PCB Assembly
Karen Tellefsen
Mon, 27 Apr 2009 10:58:30 -0400
Re: Hand Sanitizer and PCB Assembly
Karen Tellefsen
Tue, 28 Apr 2009 09:41:56 -0400
New Sender Karnwal, Pankaj
Re: PCB Failure analysis
Karnwal, Pankaj
Tue, 7 Apr 2009 13:18:23 +0530
New Sender Ken Bloomquist
Re: European Union Council Directive 80/181/EEC (Metric Dire ctive)
Ken Bloomquist
Tue, 14 Apr 2009 07:46:04 -0800
Re: European Union Council Directive 80/181/EEC (Metric Dire ctive)
Ken Bloomquist
Tue, 14 Apr 2009 08:20:15 -0800
Re: Hand Sanitizer and PCB Assembly
Ken Bloomquist
Mon, 27 Apr 2009 07:14:44 -0800
Re: Hand Sanitizer and PCB Assembly
Ken Bloomquist
Tue, 28 Apr 2009 07:06:57 -0800
Re: solder fatigue analysis for slowly changing thermal envi ronment
Ken Bloomquist
Mon, 27 Apr 2009 10:56:41 -0800
Solder Paste In the Solder Pot
Ken Bloomquist
Thu, 2 Apr 2009 10:42:35 -0800
Re: Solder Paste In the Solder Pot
Ken Bloomquist
Thu, 2 Apr 2009 12:26:15 -0800
Re: threaded fastener selection guide
Ken Bloomquist
Thu, 9 Apr 2009 10:58:25 -0800
New Sender Kevin Glidden
Re: Info on dry-film tenting of vias, both sides
Kevin Glidden
Mon, 13 Apr 2009 13:18:24 -0400
Info on LPI tenting of vias, both sides
Kevin Glidden
Mon, 13 Apr 2009 12:44:56 -0400
Re: Info on LPI tenting of vias, both sides
Kevin Glidden
Mon, 13 Apr 2009 13:44:43 -0400
Re: Info on LPI tenting of vias, both sides
Kevin Glidden
Mon, 13 Apr 2009 14:32:26 -0400
Info PCB Design for High Current / Short Duration Pulse
Kevin Glidden
Tue, 21 Apr 2009 14:01:48 -0400
Re: solder fatigue analysis for slowly changing thermal environment
Kevin Glidden
Fri, 24 Apr 2009 15:12:59 -0400
Re: solder fatigue analysis for slowly changing thermal environment
Kevin Glidden
Mon, 27 Apr 2009 08:10:25 -0500
New Sender kwood716
Re: Info PCB Design for High Current / Short Duration Pulse
kwood716
Wed, 22 Apr 2009 16:07:52 -0400
Re: LGAs in a military environment?
kwood716
Thu, 16 Apr 2009 08:05:14 -0400
Re: LGAs in a military environment?
kwood716
Thu, 16 Apr 2009 09:39:52 -0400
New Sender Larry Dzaugis
Re: [DC] when do vias require a thermal relief
Larry Dzaugis
Mon, 6 Apr 2009 17:27:01 -0500
New Sender Lee Hill
Re: Nikon microscope camera DXM-1200
Lee Hill
Wed, 1 Apr 2009 11:29:20 -0400
New Sender Lee parker
Re: Roll-to-Roll Research
Lee parker
Tue, 7 Apr 2009 11:13:32 -0400
Re: STATIC DISSIPATIVE COATINGS
Lee parker
Wed, 29 Apr 2009 20:07:38 -0400
New Sender Lee Whiteman
DYMAX ADHESIVES
Lee Whiteman
Wed, 8 Apr 2009 16:47:32 -0400
Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)
Lee Whiteman
Thu, 23 Apr 2009 14:11:01 -0400
Re: Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)
Lee Whiteman
Thu, 23 Apr 2009 15:51:51 -0400
Re: European Union Council Directive 80/181/EEC (Metric Directive) - NTC
Lee Whiteman
Tue, 14 Apr 2009 13:00:50 -0400
Re: European Union Council Directive 80/181/EEC (Metric Directive) - NTC
Lee Whiteman
Tue, 14 Apr 2009 15:10:07 -0400
Re: Hand Sanitizer and PCB Assembly
Lee Whiteman
Mon, 27 Apr 2009 12:46:03 -0400
Re: Implementing Class 3 assembly processes
Lee Whiteman
Wed, 22 Apr 2009 16:07:25 -0400
Re: LGAs in a military environment?
Lee Whiteman
Thu, 16 Apr 2009 11:05:31 -0400
Re: LGAs in a military environment?
Lee Whiteman
Thu, 16 Apr 2009 11:42:35 -0400
Re: LGAs in a military environment?
Lee Whiteman
Fri, 24 Apr 2009 16:32:36 -0400
Re: Mystery Connector
Lee Whiteman
Mon, 20 Apr 2009 17:11:27 -0400
Re: NTC - [TN] Gold/Tin Intermetallics, why are we afraid?
Lee Whiteman
Thu, 16 Apr 2009 17:20:34 -0400
STATIC DISSIPATIVE COATINGS
Lee Whiteman
Wed, 29 Apr 2009 13:08:15 -0400
Re: FW: Video: Surprise fun in Antwerp train station
Lee Whiteman
Thu, 9 Apr 2009 11:00:30 -0400
New Sender Lenny Carter
Do we have a UL R/C PWB?
Lenny Carter
Fri, 3 Apr 2009 10:53:34 -0400
New Sender Linda Langley
Plating over metal
Linda Langley
Wed, 8 Apr 2009 10:22:59 -0400
New Sender Liu, Edwin
Re: Cable assembly
Liu, Edwin
Mon, 13 Apr 2009 16:42:50 +0800
Re: Cable assembly
Liu, Edwin
Mon, 13 Apr 2009 17:08:39 +0800
New technique------USB 3.0
Liu, Edwin
Wed, 15 Apr 2009 16:29:50 +0800
Re: Wire Crimps: Machine Vs Hand Tool Specs
Liu, Edwin
Tue, 14 Apr 2009 11:37:36 +0800
New Sender Louis Hart
CAM position
Louis Hart
Thu, 9 Apr 2009 18:39:55 -0400
Re: NTC GM & Chrysler Out of NASCAR
Louis Hart
Fri, 3 Apr 2009 12:28:58 -0400
NTC? SI vs imperial, cont.
Louis Hart
Tue, 14 Apr 2009 12:06:36 -0400
New Sender Marsal Tampubolon
Re: Determining Root Cause
Marsal Tampubolon
Fri, 17 Apr 2009 13:45:34 +0700
New Sender Matthias Mansfeld
Re: computer questioin
Matthias Mansfeld
Mon, 6 Apr 2009 23:05:08 +0200
New Sender McGlaughlin, Jeffrey A
Re: Info PCB Design for High Current / Short Duration Pulse
McGlaughlin, Jeffrey A
Tue, 21 Apr 2009 14:17:19 -0400
Re: IPC-A-610 Flux Residues 10.4.1
McGlaughlin, Jeffrey A
Tue, 7 Apr 2009 07:58:08 -0400
New Sender Mike Fenner
Re: Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)
Mike Fenner
Fri, 24 Apr 2009 12:08:47 +0100
Re: European Union Council Directive 80/181/EEC (Metric Directive)
Mike Fenner
Tue, 14 Apr 2009 16:16:20 +0100
Re: Solder Ball Problem
Mike Fenner
Fri, 24 Apr 2009 13:26:25 +0100
Re: Solder Paste In the Solder Pot
Mike Fenner
Mon, 6 Apr 2009 09:36:33 +0100
Re: STATIC DISSIPATIVE COATINGS
Mike Fenner
Wed, 29 Apr 2009 18:51:21 +0100
New Sender Mike Sewell
Cable Shield
Mike Sewell
Wed, 29 Apr 2009 11:57:19 -0500
Re: Cable Shield
Mike Sewell
Thu, 30 Apr 2009 14:47:41 -0500
Cable Shielding
Mike Sewell
Thu, 30 Apr 2009 13:12:16 -0500
Re: Nitrogen use for selective soldering equipment
Mike Sewell
Thu, 30 Apr 2009 07:41:16 -0500
Re: Plating over metal
Mike Sewell
Wed, 8 Apr 2009 09:28:26 -0500
Re: Pre-printed shrink tubing
Mike Sewell
Mon, 27 Apr 2009 07:40:20 -0500
New Sender mp3
PCB Failure analysis
mp3
Mon, 6 Apr 2009 10:35:57 +0530
Re: PCB Failure analysis
mp3
Tue, 7 Apr 2009 19:59:02 +0530
New Sender Neil Maloney
Re: Mystery Connector
Neil Maloney
Mon, 20 Apr 2009 16:54:28 -0500
Re: NTC RE: GM & Chrysler Out of NASCAR
Neil Maloney
Wed, 1 Apr 2009 14:23:05 -0500
New Sender Nieznanski, John A - SSD
solder fatigue analysis for slowly changing thermal environment
Nieznanski, John A - SSD
Wed, 22 Apr 2009 14:11:14 -0400
Re: solder fatigue analysis for slowly changing thermal environment
Nieznanski, John A - SSD
Thu, 23 Apr 2009 18:51:45 -0400
New Sender P. Langeveld
Re: Solder Ball Problem
P. Langeveld
Sat, 25 Apr 2009 21:26:49 +0200
New Sender Paul Edwards
Re: Determining Root Cause
Paul Edwards
Thu, 16 Apr 2009 14:22:56 -0700
Re: LGAs in a military environment?
Paul Edwards
Thu, 16 Apr 2009 10:11:51 -0700
Re: LGAs in a military environment?
Paul Edwards
Thu, 16 Apr 2009 11:52:17 -0700
Re: Wire Crimps: Machine Vs Hand Tool Specs
Paul Edwards
Mon, 6 Apr 2009 11:36:38 -0700
New Sender Paul Reid
Re: Info PCB Design for High Current / Short Duration Pulse
Paul Reid
Thu, 23 Apr 2009 11:07:14 -0400
Re: PCB Failure analysis
Paul Reid
Tue, 7 Apr 2009 12:33:15 -0400
New Sender Pete Houwen
Re: when do vias require a thermal relief
Pete Houwen
Tue, 7 Apr 2009 08:42:05 -0500
Re: when do vias require a thermal relief
Pete Houwen
Tue, 7 Apr 2009 10:05:29 -0500
New Sender Peter L
Second time reflow of PoP on bottom side of PCBA
Peter L
Thu, 23 Apr 2009 19:00:12 -0500
Straddle mount connector at SMT
Peter L
Tue, 14 Apr 2009 17:54:52 -0500
Re: Straddle mount connector at SMT
Peter L
Mon, 20 Apr 2009 12:30:11 -0500
New Sender Peter Swanson
Re: Solvent for cured cyanoacrylate adhesive
Peter Swanson
Thu, 2 Apr 2009 14:38:59 +0100
Re: STATIC DISSIPATIVE COATINGS
Peter Swanson
Wed, 29 Apr 2009 18:28:15 +0100
New Sender Peter Vigneau
Re: Edge connector repair
Peter Vigneau
Fri, 3 Apr 2009 13:04:46 -0400
New Sender Phil Nutting
Re: Cable Shield
Phil Nutting
Thu, 30 Apr 2009 16:06:14 -0400
Re: European Union Council Directive 80/181/EEC (Metric Dire ctive)
Phil Nutting
Tue, 14 Apr 2009 12:03:35 -0400
European Union Council Directive 80/181/EEC (Metric Directive)
Phil Nutting
Mon, 13 Apr 2009 15:20:07 -0400
Re: NPTH or PTH?
Phil Nutting
Thu, 16 Apr 2009 09:10:42 -0400
Re: NTC - [TN] Gold/Tin Intermetallics, why are we afraid?
Phil Nutting
Thu, 16 Apr 2009 16:20:52 -0400
Re: Plating on screws
Phil Nutting
Thu, 23 Apr 2009 11:20:46 -0400
Re: TH lead forming machines
Phil Nutting
Mon, 6 Apr 2009 08:30:40 -0400
New Sender Post, Scott E
Re: LGAs in a military environment?
Post, Scott E
Thu, 16 Apr 2009 09:27:34 -0400
New Sender R Sedlak
Re: Friday Theorizing
R Sedlak
Thu, 9 Apr 2009 12:05:43 -0700
Re: Plating on screws
R Sedlak
Thu, 23 Apr 2009 09:38:23 -0700
Re: Solvent for cured cyanoacrylate adhesive
R Sedlak
Thu, 2 Apr 2009 06:37:14 -0700
Re: Solvent for cured cyanoacrylate adhesive
R Sedlak
Thu, 2 Apr 2009 11:07:25 -0700
New Sender Randall L Bock
Re: Hand Sanitizer and PCB Assembly
Randall L Bock
Mon, 27 Apr 2009 13:54:22 -0400
FW: Video: Surprise fun in Antwerp train station
Randall L Bock
Wed, 8 Apr 2009 10:23:43 -0400
New Sender Rex Waygood
Re: Hand Sanitizer and PCB Assembly
Rex Waygood
Mon, 27 Apr 2009 16:58:12 +0100
New Sender Richard Stadem
Re: Friday Theorizing
Richard Stadem
Fri, 10 Apr 2009 08:58:26 -0500
New Sender Rios Edward-QDMB76
Implementing Class 3 assembly processes
Rios Edward-QDMB76
Wed, 22 Apr 2009 15:48:49 -0400
Re: Implementing Class 3 assembly processes
Rios Edward-QDMB76
Thu, 23 Apr 2009 10:34:47 -0400
New Sender Robert Kondner
Re: Do we have a UL R/C PWB?
Robert Kondner
Fri, 3 Apr 2009 13:45:57 -0400
Re: Roll-to-Roll Research
Robert Kondner
Tue, 7 Apr 2009 10:56:58 -0400
Re: Straddle mount connector at SMT
Robert Kondner
Tue, 14 Apr 2009 19:16:05 -0400
New Sender Roger Mack
Re: Gold/Tin Intermetallics, why are we afraid?
Roger Mack
Wed, 15 Apr 2009 08:58:36 -0500
New Sender Rolfe, David
Copper repair
Rolfe, David
Fri, 3 Apr 2009 13:17:36 -0400
New Sender Selva Suganthi
Help me - NC pin without pad on the pcb
Selva Suganthi
Mon, 20 Apr 2009 11:34:08 +0530
Fw: [TN] Help me - NC pin without pad on the pcb
Selva Suganthi
Mon, 20 Apr 2009 11:40:37 +0530
New Sender Simonik, Dave R. (David)
Re: Solvent for cured cyanoacrylate adhesive
Simonik, Dave R. (David)
Thu, 2 Apr 2009 09:38:37 -0400
New Sender Stadem, Richard D.
Re: Actel QFN180 Assembly
Stadem, Richard D.
Wed, 29 Apr 2009 15:11:30 -0500
Re: Cable Shielding
Stadem, Richard D.
Thu, 30 Apr 2009 13:26:23 -0500
Re: computer questioin
Stadem, Richard D.
Tue, 7 Apr 2009 08:43:36 -0500
Re: Decoupling Performance Class and Quality Assurance testing?
Stadem, Richard D.
Wed, 8 Apr 2009 13:37:47 -0500
Re: Determining Root Cause
Stadem, Richard D.
Thu, 16 Apr 2009 16:07:49 -0500
Re: Determining Root Cause
Stadem, Richard D.
Thu, 16 Apr 2009 16:28:49 -0500
Re: Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)
Stadem, Richard D.
Thu, 23 Apr 2009 15:52:08 -0500
Re: European Union Council Directive 80/181/EEC (Metric Dire ctive)
Stadem, Richard D.
Tue, 14 Apr 2009 10:52:54 -0500
Re: European Union Council Directive 80/181/EEC (Metric Directive)
Stadem, Richard D.
Tue, 14 Apr 2009 07:01:03 -0500
Re: European Union Council Directive 80/181/EEC (Metric Directive)
Stadem, Richard D.
Tue, 14 Apr 2009 10:50:40 -0500
Re: European Union Council Directive 80/181/EEC (Metric Directive)
Stadem, Richard D.
Tue, 14 Apr 2009 11:09:25 -0500
Re: Friday Theorizing
Stadem, Richard D.
Thu, 9 Apr 2009 12:41:49 -0500
Re: Friday Theorizing
Stadem, Richard D.
Mon, 13 Apr 2009 09:01:04 -0500
General requirements for Radiation Equipment
Stadem, Richard D.
Tue, 21 Apr 2009 11:02:03 -0500
Re: General requirements for Radiation Equipment
Stadem, Richard D.
Thu, 23 Apr 2009 13:12:50 -0500
Re: Gold/Tin Intermetallics, why are we afraid?
Stadem, Richard D.
Wed, 15 Apr 2009 07:51:17 -0500
Re: Gold/Tin Intermetallics, why are we afraid?
Stadem, Richard D.
Wed, 15 Apr 2009 11:16:03 -0500
Re: Gold/Tin Intermetallics, why are we afraid?
Stadem, Richard D.
Wed, 15 Apr 2009 12:43:43 -0500
Re: Gold/Tin Intermetallics, why are we afraid?
Stadem, Richard D.
Thu, 16 Apr 2009 14:44:52 -0500
Re: Hand Sanitizer and PCB Assembly
Stadem, Richard D.
Tue, 28 Apr 2009 09:14:55 -0500
Re: Hand Sanitizer and PCB Assembly
Stadem, Richard D.
Tue, 28 Apr 2009 11:54:39 -0500
Re: Hand Sanitizer and PCB Assembly
Stadem, Richard D.
Tue, 28 Apr 2009 11:55:48 -0500
Re: Hand Sanitizer and PCB Assembly
Stadem, Richard D.
Wed, 29 Apr 2009 09:25:21 -0500
Re: FW: Lead Free Reworking of Multilayer Ceramic Capacitors
Stadem, Richard D.
Wed, 29 Apr 2009 08:22:45 -0500
Re: FW: Lead Free Reworking of Multilayer Ceramic Capacitors
Stadem, Richard D.
Wed, 29 Apr 2009 10:09:04 -0500
Re: LGAs in a military environment?
Stadem, Richard D.
Thu, 16 Apr 2009 09:02:46 -0500
Re: LGAs in a military environment?
Stadem, Richard D.
Thu, 16 Apr 2009 10:11:02 -0500
Re: LGAs in a military environment?
Stadem, Richard D.
Thu, 16 Apr 2009 14:06:51 -0500
Re: LGAs in a military environment?
Stadem, Richard D.
Thu, 16 Apr 2009 14:08:26 -0500
Re: Plating on screws
Stadem, Richard D.
Fri, 24 Apr 2009 10:54:28 -0500
Re: Plating on screws
Stadem, Richard D.
Fri, 24 Apr 2009 11:05:19 -0500
Re: Roll-to-Roll Research
Stadem, Richard D.
Tue, 7 Apr 2009 08:22:32 -0500
Re: Solder Ball Problem
Stadem, Richard D.
Thu, 23 Apr 2009 13:35:02 -0500
Re: Solder Paste In the Solder Pot
Stadem, Richard D.
Thu, 2 Apr 2009 14:03:05 -0500
Re: Solder Paste In the Solder Pot
Stadem, Richard D.
Thu, 2 Apr 2009 14:12:26 -0500
Re: Solder Paste In the Solder Pot
Stadem, Richard D.
Thu, 2 Apr 2009 14:15:27 -0500
Re: Solvent for cured cyanoacrylate adhesive
Stadem, Richard D.
Thu, 2 Apr 2009 08:29:09 -0500
Re: Solvent for cured cyanoacrylate adhesive
Stadem, Richard D.
Thu, 2 Apr 2009 08:56:43 -0500
Re: Solvent for cured cyanoacrylate adhesive
Stadem, Richard D.
Thu, 2 Apr 2009 13:27:55 -0500
Re: Stencil Life
Stadem, Richard D.
Mon, 13 Apr 2009 12:50:08 -0500
Re: when do vias require a thermal relief
Stadem, Richard D.
Tue, 7 Apr 2009 09:25:16 -0500
FW: [TN] Gold/Tin Intermetallics, why are we afraid?
Stadem, Richard D.
Wed, 15 Apr 2009 10:44:43 -0500
New Sender stephengregory5849
Re: Straddle mount connector at SMT
stephengregory5849
Tue, 14 Apr 2009 20:51:37 -0500
New Sender Steve Gregory
Actel QFN180 Assembly
Steve Gregory
Wed, 29 Apr 2009 10:10:54 -0500
Re: Actel QFN180 Assembly
Steve Gregory
Wed, 29 Apr 2009 14:31:32 -0500
GM & Chrysler Out of NASCAR
Steve Gregory
Wed, 1 Apr 2009 07:03:21 -0500
Re: Hand Sanitizer and PCB Assembly
Steve Gregory
Tue, 28 Apr 2009 10:29:07 -0500
Re: LGAs in a military environment?
Steve Gregory
Thu, 16 Apr 2009 07:15:54 -0500
NTC RE: GM & Chrysler Out of NASCAR
Steve Gregory
Wed, 1 Apr 2009 07:07:30 -0500
NTC: Some good news for someone finally!
Steve Gregory
Fri, 3 Apr 2009 08:57:38 -0500
Re: Solder Ball Problem
Steve Gregory
Thu, 23 Apr 2009 13:42:54 -0500
Re: Solder Paste In the Solder Pot
Steve Gregory
Thu, 2 Apr 2009 14:00:57 -0500
Solvent for cured cyanoacrylate adhesive
Steve Gregory
Thu, 2 Apr 2009 08:08:54 -0500
Re: Stencil Life
Steve Gregory
Mon, 13 Apr 2009 13:00:50 -0500
Re: TH lead forming machines
Steve Gregory
Mon, 6 Apr 2009 07:17:09 -0500
Re: Zinc Plating and whiskers
Steve Gregory
Fri, 24 Apr 2009 12:09:28 -0500
New Sender Steve Kelly
FW: IPC 6013B
Steve Kelly
Wed, 8 Apr 2009 15:10:11 -0400
New Sender Steve Smith
Re: Plating on screws
Steve Smith
Fri, 24 Apr 2009 16:20:30 -0400
New Sender Steven Creswick
Re: Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)
Steven Creswick
Thu, 23 Apr 2009 15:49:52 -0400
Re: European Union Council Directive 80/181/EEC (Metric Directive) - NTC
Steven Creswick
Tue, 14 Apr 2009 11:54:59 -0400
Re: European Union Council Directive 80/181/EEC (Metric Directive) - NTC
Steven Creswick
Tue, 14 Apr 2009 15:30:38 -0400
Re: Friday Theorizing
Steven Creswick
Thu, 9 Apr 2009 12:11:48 -0400
Re: Gold/Tin Intermetallics, why are we afraid?
Steven Creswick
Wed, 15 Apr 2009 09:07:11 -0400
Re: Gold/Tin Intermetallics, why are we afraid?
Steven Creswick
Wed, 15 Apr 2009 13:54:00 -0400
Re: NTC? SI vs imperial, cont.
Steven Creswick
Wed, 15 Apr 2009 12:05:11 -0400
Re: threaded fastener selection guide
Steven Creswick
Wed, 8 Apr 2009 10:59:04 -0400
New Sender Stewart, Dougal
Re: GM & Chrysler Out of NASCAR
Stewart, Dougal
Wed, 1 Apr 2009 13:37:01 +0100
New Sender Syed Ahmad
Roll-to-Roll Research
Syed Ahmad
Mon, 6 Apr 2009 11:16:51 -0500
Re: Roll-to-Roll Research
Syed Ahmad
Tue, 7 Apr 2009 04:08:09 -0500
Re: Roll-to-Roll Research
Syed Ahmad
Tue, 7 Apr 2009 11:18:08 -0500
Re: Roll-to-Roll Research
Syed Ahmad
Tue, 7 Apr 2009 11:24:03 -0500
New Sender Tan Geok Ang
Re: Actel QFN180 Assembly
Tan Geok Ang
Thu, 30 Apr 2009 09:07:52 +0800
Re: Implementing Class 3 assembly processes
Tan Geok Ang
Thu, 23 Apr 2009 13:21:51 +0800
Re: Second time reflow of PoP on bottom side of PCBA
Tan Geok Ang
Fri, 24 Apr 2009 08:47:26 +0800
New Sender Ted Tontis
Re: computer questioin
Ted Tontis
Mon, 6 Apr 2009 16:01:52 -0500
Re: computer questioin
Ted Tontis
Tue, 7 Apr 2009 08:32:31 -0500
Re: Determining Root Cause
Ted Tontis
Thu, 16 Apr 2009 16:40:25 -0500
Re: STATIC DISSIPATIVE COATINGS
Ted Tontis
Wed, 29 Apr 2009 12:24:33 -0500
New Sender Temkin, Gregg
Re: Copper conductors
Temkin, Gregg
Wed, 1 Apr 2009 12:27:54 -0700
Re: LGAs in a military environment?
Temkin, Gregg
Thu, 16 Apr 2009 06:21:56 -0700
Re: LGAs in a military environment?
Temkin, Gregg
Thu, 16 Apr 2009 07:29:15 -0700
Re: Solvent for cured cyanoacrylate adhesive
Temkin, Gregg
Thu, 2 Apr 2009 07:20:16 -0700
New Sender Thayer, Wayne
Re: Actel QFN180 Assembly
Thayer, Wayne
Thu, 30 Apr 2009 11:37:29 -0400
Bad resistors
Thayer, Wayne
Wed, 15 Apr 2009 14:54:15 -0400
Re: Bad resistors
Thayer, Wayne
Mon, 20 Apr 2009 08:31:21 -0400
Re: Friday Theorizing
Thayer, Wayne
Thu, 9 Apr 2009 15:14:44 -0400
Re: Gold/Tin Intermetallics, why are we afraid?
Thayer, Wayne
Wed, 15 Apr 2009 16:23:58 -0400
Re: Help me - NC pin without pad on the pcb
Thayer, Wayne
Mon, 20 Apr 2009 08:23:14 -0400
Re: FW: Lead Free Reworking of Multilayer Ceramic Capacitors
Thayer, Wayne
Wed, 29 Apr 2009 10:32:17 -0400
Re: LGAs in a military environment?
Thayer, Wayne
Thu, 16 Apr 2009 10:47:07 -0400
Re: LGAs in a military environment?
Thayer, Wayne
Thu, 16 Apr 2009 13:44:15 -0400
New Sender Upton, Shawn
Re: when do vias require a thermal relief
Upton, Shawn
Mon, 6 Apr 2009 15:24:48 -0400
New Sender Vladimir Igoshev
Re: Gold/Tin Intermetallics, why are we afraid?
Vladimir Igoshev
Tue, 14 Apr 2009 21:07:36 +0000
Re: Gold/Tin Intermetallics, why are we afraid?
Vladimir Igoshev
Tue, 14 Apr 2009 22:55:36 +0000
Re: Gold/Tin Intermetallics, why are we afraid?
Vladimir Igoshev
Tue, 14 Apr 2009 23:36:01 +0000
Re: Gold/Tin Intermetallics, why are we afraid?
Vladimir Igoshev
Wed, 15 Apr 2009 12:44:47 +0000
Re: Gold/Tin Intermetallics, why are we afraid?
Vladimir Igoshev
Wed, 15 Apr 2009 13:17:24 +0000
Re: Gold/Tin Intermetallics, why are we afraid?
Vladimir Igoshev
Wed, 15 Apr 2009 15:29:08 +0000
Re: Gold/Tin Intermetallics, why are we afraid?
Vladimir Igoshev
Wed, 15 Apr 2009 16:41:24 +0000
Re: Gold/Tin Intermetallics, why are we afraid?
Vladimir Igoshev
Wed, 15 Apr 2009 17:37:08 +0000
Re: Gold/Tin Intermetallics, why are we afraid?
Vladimir Igoshev
Wed, 15 Apr 2009 18:13:39 +0000
Re: Gold/Tin Intermetallics, why are we afraid?
Vladimir Igoshev
Wed, 15 Apr 2009 19:03:05 +0000
Re: Gold/Tin Intermetallics, why are we afraid?
Vladimir Igoshev
Wed, 15 Apr 2009 20:15:43 +0000
Re: Gold/Tin Intermetallics, why are we afraid?
Vladimir Igoshev
Wed, 15 Apr 2009 20:22:08 +0000
Re: Gold/Tin Intermetallics, why are we afraid?
Vladimir Igoshev
Wed, 15 Apr 2009 16:33:28 -0400
Re: OSP damage
Vladimir Igoshev
Wed, 29 Apr 2009 17:57:32 -0400
Re: Plating on screws
Vladimir Igoshev
Wed, 29 Apr 2009 18:34:43 -0400
New Sender Wenger, George M.
Re: Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)
Wenger, George M.
Fri, 24 Apr 2009 05:59:23 -0400
Re: Gold/Tin Intermetallics, why are we afraid?
Wenger, George M.
Tue, 14 Apr 2009 17:41:00 -0400
Re: Gold/Tin Intermetallics, why are we afraid?
Wenger, George M.
Wed, 15 Apr 2009 08:58:27 -0400
Re: Gold/Tin Intermetallics, why are we afraid?
Wenger, George M.
Wed, 15 Apr 2009 17:31:10 -0400
Re: Gold/Tin Intermetallics, why are we afraid?
Wenger, George M.
Thu, 16 Apr 2009 19:01:34 -0400
Re: NTC - [TN] Gold/Tin Intermetallics, why are we afraid?
Wenger, George M.
Thu, 16 Apr 2009 19:07:28 -0400
New Sender Werner Engelmaier /*
Re: Decoupling Performance Class and Quality Assurance testing?
Werner Engelmaier /*
Wed, 8 Apr 2009 15:44:23 -0400
Re: European Union Council Directive 80/181/EEC (Metric Directive) - NTC
Werner Engelmaier /*
Tue, 14 Apr 2009 15:39:13 -0400
Re: European Union Council Directive 80/181/EEC (Metric Directive) - NTC
Werner Engelmaier /*
Tue, 14 Apr 2009 16:06:03 -0400
Re: Gold/Tin Intermetallics, why are we afraid?
Werner Engelmaier /*
Wed, 15 Apr 2009 11:45:28 -0400
Re: Gold/Tin Intermetallics, why are we afraid?
Werner Engelmaier /*
Wed, 15 Apr 2009 13:19:34 -0400
Re: Gold/Tin Intermetallics, why are we afraid?
Werner Engelmaier /*
Wed, 15 Apr 2009 16:07:19 -0400
Re: Gold/Tin Intermetallics, why are we afraid?
Werner Engelmaier /*
Wed, 15 Apr 2009 16:13:36 -0400
Re: Gold/Tin Intermetallics, why are we afraid?
Werner Engelmaier /*
Wed, 15 Apr 2009 16:21:09 -0400
Re: Gold/Tin Intermetallics, why are we afraid?
Werner Engelmaier /*
Wed, 15 Apr 2009 16:33:47 EDT
Re: Gold/Tin Intermetallics, why are we afraid?
Werner Engelmaier /*
Wed, 15 Apr 2009 17:29:59 -0400
Re: Gold/Tin Intermetallics, why are we afraid?
Werner Engelmaier /*
Wed, 15 Apr 2009 17:44:58 -0400
Re: Hand Sanitizer and PCB Assembly
Werner Engelmaier /*
Tue, 28 Apr 2009 11:58:13 -0400
Re: Hand Sanitizer and PCB Assembly
Werner Engelmaier /*
Tue, 28 Apr 2009 12:09:43 -0400
Re: LGA acceptance
Werner Engelmaier /*
Mon, 27 Apr 2009 14:01:02 -0400
Re: LGAs in a military environment?
Werner Engelmaier /*
Thu, 16 Apr 2009 11:10:08 -0400
Re: LGAs in a military environment?
Werner Engelmaier /*
Thu, 16 Apr 2009 11:33:18 -0400
Re: LGAs in a military environment?
Werner Engelmaier /*
Thu, 16 Apr 2009 13:23:04 -0400
Re: NTC - [TN] Gold/Tin Intermetallics, why are we afraid?
Werner Engelmaier /*
Sat, 25 Apr 2009 14:35:41 -0400
Re: PCB Failure analysis
Werner Engelmaier /*
Mon, 6 Apr 2009 13:45:06 -0400
Re: solder fatigue analysis for slowly changing thermal environment
Werner Engelmaier /*
Thu, 23 Apr 2009 14:44:16 -0400
Re: solder fatigue analysis for slowly changing thermal environment
Werner Engelmaier /*
Fri, 24 Apr 2009 09:50:07 -0400
Re: solder fatigue analysis for slowly changing thermal environment
Werner Engelmaier /*
Fri, 24 Apr 2009 17:32:43 -0400
Re: solder fatigue analysis for slowly changing thermal environment
Werner Engelmaier /*
Mon, 27 Apr 2009 13:16:28 -0400
Re: solder fatigue analysis for slowly changing thermal environment
Werner Engelmaier /*
Mon, 27 Apr 2009 14:06:23 -0400
Re: The effects of vibration on SMT part overhang
Werner Engelmaier /*
Mon, 20 Apr 2009 14:26:49 -0400
Re: when do vias require a thermal relief
Werner Engelmaier /*
Mon, 6 Apr 2009 15:13:43 -0400
New Sender Whittaker, Dewey (EHCOE)
Re: Determining Root Cause
Whittaker, Dewey (EHCOE)
Thu, 16 Apr 2009 14:14:27 -0700
Re: Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)
Whittaker, Dewey (EHCOE)
Fri, 24 Apr 2009 07:06:04 -0700
Re: Gold/Tin Intermetallics, why are we afraid?
Whittaker, Dewey (EHCOE)
Wed, 15 Apr 2009 07:02:44 -0700
Re: Gold/Tin Intermetallics, why are we afraid?
Whittaker, Dewey (EHCOE)
Wed, 15 Apr 2009 09:55:47 -0700
Re: Hand Sanitizer and PCB Assembly
Whittaker, Dewey (EHCOE)
Mon, 27 Apr 2009 07:21:39 -0700
Re: Hand Sanitizer and PCB Assembly
Whittaker, Dewey (EHCOE)
Mon, 27 Apr 2009 08:52:21 -0700
Re: Hand Sanitizer and PCB Assembly
Whittaker, Dewey (EHCOE)
Mon, 27 Apr 2009 09:15:24 -0700
Re: Hand Sanitizer and PCB Assembly
Whittaker, Dewey (EHCOE)
Tue, 28 Apr 2009 07:25:36 -0700
Re: Hand Sanitizer and PCB Assembly
Whittaker, Dewey (EHCOE)
Tue, 28 Apr 2009 07:53:31 -0700
Re: Hand Sanitizer and PCB Assembly
Whittaker, Dewey (EHCOE)
Wed, 29 Apr 2009 07:36:52 -0700
Re: Info on LPI tenting of vias, both sides
Whittaker, Dewey (EHCOE)
Mon, 13 Apr 2009 10:55:39 -0700
Re: Info on LPI tenting of vias, both sides
Whittaker, Dewey (EHCOE)
Thu, 16 Apr 2009 14:10:35 -0700
Re: NTC - [TN] Gold/Tin Intermetallics, why are we afraid?
Whittaker, Dewey (EHCOE)
Thu, 16 Apr 2009 13:50:44 -0700
Re: NTC - [TN] Gold/Tin Intermetallics, why are we afraid?
Whittaker, Dewey (EHCOE)
Mon, 27 Apr 2009 07:16:02 -0700
Re: Plating on screws
Whittaker, Dewey (EHCOE)
Wed, 29 Apr 2009 13:45:06 -0700
Re: solder fatigue analysis for slowly changing thermal environment
Whittaker, Dewey (EHCOE)
Mon, 27 Apr 2009 10:50:47 -0700
Re: STATIC DISSIPATIVE COATINGS
Whittaker, Dewey (EHCOE)
Wed, 29 Apr 2009 10:15:06 -0700

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