TECHNET Archives

August 2008

TechNet@IPC.ORG
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<No subject> (12 Messages)
Archive Search (2 Messages)
AW: [RoHSUSAPushback] FW: [tinwhiskers] IPC expresses concerns on possible ROHS revisions (4 Messages)
Baking MSD's (2 Messages)
BGA reballing (4 Messages)
CEM Recomendation (1 Message)
CERAMIC COMPONENT ISSUE WITH SOLDER TOUCHING THE BODY (1 Message)
Check this out WOW (6 Messages)
Compatibility of Lead-Free alloys (3 Messages)
Complanarity Measurements (2 Messages)
Cracked component leads (5 Messages)
Different pad sizes on the same BGA (5 Messages)
Different Solder Iron (1 Message)
Diffuse topic (13 Messages)
Don't Wait Register today for upcoming IPC Webcast: Power System Design in High Speed PC Boards - September 11, 2008 10:00 am - 11:00 am (CT) (1 Message)
Drill backer material (2 Messages)
Elasticity (18 Messages)
Electromigration in solder bumps HELP!! (3 Messages)
ENIG (1 Message)
ENIG & BORON (8 Messages)
ENIG & BORON - NTC (1 Message)
ENIG finish (3 Messages)
ENIG White paper (27 Messages)
ENIG workshop at IPC September 22 (1 Message)
Flex Material Movement at Assembly (6 Messages)
Flux on cable wires (2 Messages)
FYI Nvidia solder issues (8 Messages)
Gloves for soldering (3 Messages)
Hawk Quad DPMO high (1 Message)
High temperature solder (6 Messages)
Hurry and register today for IPC's Advanced Packaging Webcast Series August 14, 2008 (1 Message)
iAg and sulfur NTC (2 Messages)
iAg, sulfur and selenium (1 Message)
Inspection of bottom only terminations / process verification (4 Messages)
IPC 7711/7721 training (1 Message)
IPC Deliverables (2 Messages)
IPC Webcast: Power System Design in High Speed PC Boards - September 11, 2008 10:00 am - 11:00 am (CT) (1 Message)
IPC's Upcoming High Density Interconnects Technology Conference, October 6-8, 2008, Dallas, Texas (1 Message)
IPC/SMTA High Performance Electronics Assembly Cleaning Symposium (1 Message)
IPC/SMTA High Performance Electronics Assembly Cleaning Symposium - October 28-29, 2008 Rosemont, Ill. (1 Message)
IPC6012 Sample Frequency / Method (9 Messages)
Last chance to register for IPC's Advanced Packaging Webcast Series August 21, 2008 (1 Message)
LGA footprint (5 Messages)
LGA/QFN voids % (7 Messages)
Liquid Masking Deposition Process (3 Messages)
looking for ENiG photos (2 Messages)
Looking for Potting Compound guidance (5 Messages)
Marking Adhesion (2 Messages)
Material question (4 Messages)
Maximum HASL thickness for SMT of QFN (7 Messages)
Measling (4 Messages)
measurement and acceptance of microvias (7 Messages)
Moisture in PCB Assemblies (11 Messages)
Multilayer Flex-Rigid Fabricators capable of the following (4 Messages)
NiAu Specification for Al Wedge Wire Bonding (17 Messages)
No-Flow Underfill CTE (3 Messages)
NTC (29 Messages)
NTC FYI Nvidia solder issues (1 Message)
NTC [TN] Different pad sizes on the same BGA (1 Message)
Paint suitable for reflow applications (5 Messages)
Paint suitable for reflow applications] (1 Message)
Plasma Surface Treatment For Conformal Coat (7 Messages)
Pre-condition (4 Messages)
PWA cleaning methods (9 Messages)
Question about heat transfer (5 Messages)
really, really NTC and its not Friday! (1 Message)
Register today for IPC's Upcoming HDI Technology Conference, October 6-8, 2008, Dallas, Texas (1 Message)
Register today for IPC's Upcoming High Density Interconnects Technology Conference, October 6-8, 2008, Dallas, Texas (1 Message)
Register today for the IPC's Roadmap webcast Series! (1 Message)
Register today for upcoming IPC Webcast: Power System Design in High Speed PC Boards - September 11, 2008 10:00 am - 11:00 am (CT) (1 Message)
Register today! IPC/SMTA High Performance Electronics Assembly Cleaning Symposium - October 28-29, 2008 Rosemont, Ill. (1 Message)
Repair Need for Inverted Chip Resistors (3 Messages)
Seam resistance pulse welding (2 Messages)
Smear and rework failure (11 Messages)
SOLDER FOR PCB  REFLOW PRO CESS (3 Messages)
SOLDER FOR PCB REFLOW PROCESS (6 Messages)
Solder Paste with craters [NTC] (6 Messages)
Solder Paste with craters. (20 Messages)
solder vertical fill on thermal pad (3 Messages)
Stain Mark after ESS (3 Messages)
Standard/Specification for LGA/QFN voids % (1 Message)
Step Stencil Requirements (4 Messages)
System (PC-Laptop) level realibility model (1 Message)
TechNet Wikipedia (5 Messages)
TG 130 or Tg 170 for ENIG (17 Messages)
They solder well... But they don't work! (2 Messages)
Trinocular Scope With Display (1 Message)
unsubscribe (2 Messages)
Use of QFN devices in high reliability applications (2 Messages)
Via hole fill (14 Messages)
Washing of conformally coated boards (8 Messages)
Wave solder Gloves? (4 Messages)
what damage can a battery leakage do on a TTL/CMOS controller card 1990 vintage (7 Messages)
where to buy ANSI-J-STD-004 and ANSI-J-STD-006 (2 Messages)
Wire bonding gurus ohoy! (11 Messages)
Yellow Colored Visible Dye Penetrant (4 Messages)
[LF] [TN] SN100 for Reflow Application (2 Messages)
[tinwhiskers] AW: [RoHSUSAPushback] RE:Xbox & RoHS (1 Message)
[TN] Compatibility of Lead-Free alloys (1 Message)
[TN] Compatibility of Lead-Free alloys - LINK CORRECTION (1 Message)
[TN] ENIG White paper (1 Message)
[TN] NiAu Specification for Al Wedge Wire Bonding (1 Message)
[TN] Smear and rework failure (1 Message)

Subject Sorted by Subject, Chronologically

From

Date
New Thread <No subject>
<No subject>
Graham Naisbitt
Wed, 27 Aug 2008 11:26:04 +0100
<No subject>
Paul Reid
Tue, 26 Aug 2008 15:01:44 -0400
<No subject>
Douglas O. Pauls
Tue, 26 Aug 2008 13:22:42 -0500
<No subject>
Inge
Tue, 26 Aug 2008 20:12:30 -0700
<No subject>
Ken Bloomquist
Tue, 26 Aug 2008 10:57:26 -0700
<No subject>
Whittaker, Dewey (EHCOE)
Tue, 26 Aug 2008 10:06:26 -0700
<No subject>
<>
Tue, 26 Aug 2008 12:14:40 EDT
<No subject>
Douglas O. Pauls
Tue, 26 Aug 2008 10:42:37 -0500
<No subject>
Bob Willis
Tue, 26 Aug 2008 16:21:23 +0100
<No subject>
Stadem, Richard D.
Tue, 26 Aug 2008 10:07:48 -0500
<No subject>
Woolley, Mark D. (Mark)
Tue, 26 Aug 2008 08:37:08 -0600
<No subject>
James Verrette
Tue, 26 Aug 2008 10:25:29 -0400
New Thread Archive Search
Re: Archive Search
Fox, Ian
Thu, 28 Aug 2008 08:23:44 +0100
Archive Search
Rex Waygood
Wed, 27 Aug 2008 16:59:45 +0100
New Thread AW: [RoHSUSAPushback] FW: [tinwhiskers] IPC expresses concerns on possible ROHS revisions
Re: AW: [RoHSUSAPushback] FW: [tinwhiskers] IPC expresses concerns on possible ROHS revisions
Werner Engelmaier /*
Mon, 11 Aug 2008 10:45:17 EDT
Re: AW: [RoHSUSAPushback] FW: [tinwhiskers] IPC expresses concerns on possible ROHS revisions
John Burke
Mon, 11 Aug 2008 07:43:57 -0700
Re: AW: [RoHSUSAPushback] FW: [tinwhiskers] IPC expresses concerns on possible ROHS revisions
John Burke
Mon, 11 Aug 2008 07:33:20 -0700
Re: AW: [RoHSUSAPushback] FW: [tinwhiskers] IPC expresses concerns on possible ROHS revisions
John Burke
Sun, 10 Aug 2008 14:09:55 -0700
New Thread Baking MSD's
Re: Baking MSD's
Grunde Gjertsen
Mon, 1 Sep 2008 07:21:23 +0200
Baking MSD's
Ken Bloomquist
Fri, 29 Aug 2008 15:23:19 -0700
New Thread BGA reballing
Re: BGA reballing
Tan Geok Ang
Mon, 18 Aug 2008 09:22:50 +0800
Re: BGA reballing
John Queen
Sun, 17 Aug 2008 07:04:57 +0100
Re: BGA reballing
Werner Engelmaier /*
Sat, 16 Aug 2008 14:43:27 EDT
BGA reballing
John Queen
Sat, 16 Aug 2008 11:32:51 +0100
New Thread CEM Recomendation
CEM Recomendation
Bruce, David (GB - MAV)
Tue, 19 Aug 2008 10:17:01 -0400
New Thread CERAMIC COMPONENT ISSUE WITH SOLDER TOUCHING THE BODY
CERAMIC COMPONENT ISSUE WITH SOLDER TOUCHING THE BODY
Roberts, Jon
Tue, 26 Aug 2008 11:03:48 -0500
New Thread Check this out WOW
Re: Fw: Check this out WOW
Inge
Wed, 6 Aug 2008 10:09:44 -0700
Re: Fw: Check this out WOW
Croslin, Robert
Wed, 6 Aug 2008 11:47:36 -0400
Re: Fw: Check this out WOW
Joyce Koo
Wed, 6 Aug 2008 11:39:08 -0400
Re: Fw: Check this out WOW
Dale Ritzen
Wed, 6 Aug 2008 09:33:37 -0500
Re: Fw: Check this out WOW
Steve Gregory
Wed, 6 Aug 2008 08:56:28 -0500
Fw: Check this out WOW
Randy Bock Sr.
Wed, 6 Aug 2008 07:42:01 -0400
New Thread Compatibility of Lead-Free alloys
Re: Compatibility of Lead-Free alloys
Werner Engelmaier /*
Wed, 20 Aug 2008 11:56:28 EDT
Re: Compatibility of Lead-Free alloys
Whittaker, Dewey (EHCOE)
Wed, 20 Aug 2008 08:20:58 -0700
Compatibility of Lead-Free alloys
Phil Nutting
Wed, 20 Aug 2008 11:13:13 -0400
New Thread Complanarity Measurements
Re: Complanarity Measurements
Hernefjord Ingemar
Wed, 27 Aug 2008 08:46:44 +0200
Complanarity Measurements
bob wettermann
Tue, 26 Aug 2008 07:12:01 -0700
New Thread Cracked component leads
Re: Cracked component leads
Igoshev, Vladimir
Mon, 25 Aug 2008 11:20:03 -0400
Re: Cracked component leads
Victor Hernandez
Mon, 25 Aug 2008 09:56:04 -0500
Re: Cracked component leads
Ted Tontis
Mon, 25 Aug 2008 09:48:55 -0500
Re: Cracked component leads
Victor Hernandez
Mon, 25 Aug 2008 09:36:31 -0500
Cracked component leads
Ted Tontis
Mon, 25 Aug 2008 09:24:38 -0500
New Thread Different pad sizes on the same BGA
Re: Different pad sizes on the same BGA
Pete Houwen
Fri, 22 Aug 2008 08:11:53 -0500
Re: Different pad sizes on the same BGA
Ioan Tempea
Mon, 18 Aug 2008 10:17:14 -0400
Re: Different pad sizes on the same BGA
Joe Fjelstad
Sat, 16 Aug 2008 11:35:35 EDT
Re: Different pad sizes on the same BGA
Whittaker, Dewey (EHCOE)
Fri, 15 Aug 2008 13:24:46 -0700
Different pad sizes on the same BGA
Ioan Tempea
Fri, 15 Aug 2008 09:29:43 -0400
New Thread Different Solder Iron
Re: Different Solder Iron
Poh KH
Fri, 29 Aug 2008 00:03:06 +0800
New Thread Diffuse topic
Re: Diffuse topic
Joyce Koo
Thu, 21 Aug 2008 08:31:11 -0400
Re: Diffuse topic
Hernefjord Ingemar
Thu, 21 Aug 2008 09:01:53 +0200
Re: Diffuse topic
Hernefjord Ingemar
Thu, 21 Aug 2008 09:00:39 +0200
Re: Diffuse topic
Hernefjord Ingemar
Thu, 21 Aug 2008 08:54:24 +0200
Re: Diffuse topic
Igoshev, Vladimir
Wed, 20 Aug 2008 14:28:20 -0400
Re: Diffuse topic
Joyce Koo
Wed, 20 Aug 2008 14:25:33 -0400
Re: Diffuse topic
Igoshev, Vladimir
Wed, 20 Aug 2008 14:22:50 -0400
Re: Diffuse topic
Joyce Koo
Wed, 20 Aug 2008 14:19:18 -0400
Re: Diffuse topic
Stadem, Richard D.
Wed, 20 Aug 2008 10:35:28 -0500
Re: Diffuse topic
Woolley, Mark D. (Mark)
Wed, 20 Aug 2008 09:18:40 -0600
Re: Diffuse topic
Igoshev, Vladimir
Wed, 20 Aug 2008 11:09:26 -0400
Re: Diffuse topic
Steve Gregory
Wed, 20 Aug 2008 06:59:39 -0500
Diffuse topic
Hernefjord Ingemar
Wed, 20 Aug 2008 12:07:50 +0200
New Thread Don't Wait Register today for upcoming IPC Webcast: Power System Design in High Speed PC Boards - September 11, 2008 10:00 am - 11:00 am (CT)
Don't Wait Register today for upcoming IPC Webcast: Power System Design in High Speed PC Boards - September 11, 2008 10:00 am - 11:00 am (CT)
Michelle Michelotti
Thu, 21 Aug 2008 10:20:27 -0500
New Thread Drill backer material
Re: Drill backer material
Eddie Rocha
Tue, 26 Aug 2008 09:02:02 -0700
Drill backer material
Scott Westheimer
Mon, 25 Aug 2008 11:53:38 -0400
New Thread Elasticity
Re: Elasticity
Kevin Glidden
Tue, 19 Aug 2008 08:25:19 -0400
Re: Elasticity
Tan Geok Ang
Tue, 19 Aug 2008 09:17:59 +0800
Re: Elasticity
Paul Reid
Thu, 14 Aug 2008 12:08:56 -0400
Re: Elasticity
Joe Fjelstad
Thu, 14 Aug 2008 12:01:46 EDT
Re: Elasticity
Whittaker, Dewey (EHCOE)
Thu, 14 Aug 2008 07:29:17 -0700
Re: Elasticity
Eric CHRISTISON
Thu, 14 Aug 2008 15:19:02 +0100
Re: Elasticity
Hernefjord Ingemar
Thu, 14 Aug 2008 15:57:54 +0200
Re: Elasticity
Werner Engelmaier /*
Thu, 14 Aug 2008 09:44:45 EDT
Re: Elasticity
Eric CHRISTISON
Thu, 14 Aug 2008 13:55:12 +0100
Re: Elasticity
Rex Waygood
Thu, 14 Aug 2008 13:38:29 +0100
Re: Elasticity
Eric CHRISTISON
Thu, 14 Aug 2008 13:33:51 +0100
Re: Elasticity
Paul Reid
Thu, 14 Aug 2008 08:20:24 -0400
Re: Elasticity
Eric CHRISTISON
Thu, 14 Aug 2008 13:04:15 +0100
Re: Elasticity
Paul Reid
Thu, 14 Aug 2008 07:50:53 -0400
Re: Elasticity
Hernefjord Ingemar
Thu, 14 Aug 2008 12:04:50 +0200
Re: Elasticity
Tan Geok Ang
Thu, 14 Aug 2008 17:20:43 +0800
Re: Elasticity
Hernefjord Ingemar
Thu, 14 Aug 2008 10:07:26 +0200
Elasticity
Tan Geok Ang
Thu, 14 Aug 2008 09:11:00 +0800
New Thread Electromigration in solder bumps HELP!!
Re: Electromigration in solder bumps HELP!!
Inge
Thu, 21 Aug 2008 11:15:11 -0700
Re: Electromigration in solder bumps HELP!!
Igoshev, Vladimir
Thu, 21 Aug 2008 13:53:02 -0400
Electromigration in solder bumps HELP!!
Gabriela
Thu, 21 Aug 2008 20:16:49 +0300
New Thread ENIG
ENIG
Dave Connitt
Tue, 26 Aug 2008 10:04:55 -0400
New Thread ENIG & BORON
Re: ENIG & BORON
Edward Szpruch
Thu, 28 Aug 2008 09:45:03 +0300
Re: ENIG & BORON
Stadem, Richard D.
Wed, 27 Aug 2008 09:10:20 -0500
Re: ENIG & BORON
Bev Christian
Wed, 27 Aug 2008 10:05:40 -0400
Re: ENIG & BORON
Dennis Fritz
Wed, 27 Aug 2008 10:00:46 -0400
Re: ENIG & BORON
Igoshev, Vladimir
Wed, 27 Aug 2008 09:58:36 -0400
Re: ENIG & BORON
Pete Houwen
Wed, 27 Aug 2008 07:52:59 -0500
Re: ENIG & BORON
Fox, Ian
Wed, 27 Aug 2008 13:35:08 +0100
ENIG & BORON
Lee Whiteman
Wed, 27 Aug 2008 08:23:09 -0400
New Thread ENIG & BORON - NTC
Re: ENIG & BORON - NTC
Ioan Tempea
Wed, 27 Aug 2008 10:08:51 -0400
New Thread ENIG finish
Re: ENIG finish
George Milad
Fri, 22 Aug 2008 13:28:08 EDT
Re: ENIG finish
Werner Engelmaier /*
Fri, 22 Aug 2008 09:25:26 EDT
ENIG finish
Dave Connitt
Fri, 22 Aug 2008 07:02:45 -0400
New Thread ENIG White paper
Re: ENIG White paper
Bob Willis
Tue, 26 Aug 2008 19:02:42 +0100
Re: ENIG White paper
Paul Edwards
Tue, 26 Aug 2008 10:31:07 -0700
Re: ENIG White paper
Bob Willis
Tue, 26 Aug 2008 13:44:41 +0100
Re: ENIG White paper
Stadem, Richard D.
Tue, 26 Aug 2008 07:24:53 -0500
Re: ENIG White paper
Bob Willis
Tue, 26 Aug 2008 07:50:40 +0100
Re: ENIG White paper
Tan Geok Ang
Tue, 26 Aug 2008 09:06:02 +0800
Re: ENIG White paper
Stadem, Richard D.
Mon, 25 Aug 2008 16:23:05 -0500
Re: ENIG White paper
Wenger, George M.
Mon, 25 Aug 2008 15:14:36 -0400
Re: ENIG White paper
Paul Edwards
Mon, 25 Aug 2008 11:49:29 -0700
Re: ENIG White paper
Stadem, Richard D.
Mon, 25 Aug 2008 08:24:35 -0500
Re: ENIG White paper
Werner Engelmaier /*
Mon, 25 Aug 2008 08:45:44 EDT
Re: ENIG White paper
Dave Connitt
Mon, 25 Aug 2008 07:32:00 -0400
Re: ENIG White paper
Bob METCALF
Fri, 22 Aug 2008 16:04:16 -0700
Re: ENIG White paper
John Burke
Thu, 21 Aug 2008 22:35:02 -0700
Re: ENIG White paper
John Burke
Thu, 21 Aug 2008 22:34:08 -0700
Re: ENIG White paper
Lee parker
Thu, 21 Aug 2008 20:05:50 -0400
Re: ENIG White paper
Ahne Oosterhof
Thu, 21 Aug 2008 14:40:26 -0700
Re: ENIG White paper
Wenger, George M.
Thu, 21 Aug 2008 16:41:54 -0400
Re: ENIG White paper
Dave Connitt
Thu, 21 Aug 2008 16:37:31 -0400
Re: ENIG White paper
Werner Engelmaier /*
Thu, 21 Aug 2008 16:29:46 EDT
Re: ENIG White paper
Dave Connitt
Thu, 21 Aug 2008 16:22:07 -0400
Re: ENIG White paper
Whittaker, Dewey (EHCOE)
Thu, 21 Aug 2008 12:58:23 -0700
Re: ENIG White paper
Werner Engelmaier /*
Thu, 21 Aug 2008 15:39:16 EDT
Re: ENIG White paper
Wenger, George M.
Thu, 21 Aug 2008 15:35:05 -0400
Re: ENIG White paper
Whittaker, Dewey (EHCOE)
Thu, 21 Aug 2008 12:23:13 -0700
Re: ENIG White paper
Werner Engelmaier /*
Thu, 21 Aug 2008 15:10:10 EDT
ENIG White paper
Dave Connitt
Thu, 21 Aug 2008 14:06:04 -0400
New Thread ENIG workshop at IPC September 22
ENIG workshop at IPC September 22
Dave Connitt
Mon, 25 Aug 2008 07:39:11 -0400
New Thread Flex Material Movement at Assembly
Re: Flex Material Movement at Assembly
John Anselmo
Wed, 20 Aug 2008 17:10:12 -0600
Re: Flex Material Movement at Assembly
James Mahoney
Wed, 20 Aug 2008 14:42:58 -0400
Re: Flex Material Movement at Assembly
Paul Edwards
Wed, 20 Aug 2008 09:51:23 -0700
Re: Flex Material Movement at Assembly
Stadem, Richard D.
Wed, 20 Aug 2008 11:04:12 -0500
Re: Flex Material Movement at Assembly
Stadem, Richard D.
Wed, 20 Aug 2008 10:59:54 -0500
Flex Material Movement at Assembly
John Anselmo
Wed, 20 Aug 2008 09:37:58 -0600
New Thread Flux on cable wires
Re: Flux on cable wires
Stadem, Richard D.
Wed, 20 Aug 2008 13:32:27 -0500
Flux on cable wires
Wilson, Bob
Wed, 20 Aug 2008 11:16:21 -0700
New Thread FYI Nvidia solder issues
Re: FYI Nvidia solder issues
Dwight Mattix
Thu, 28 Aug 2008 09:48:57 -0700
Re: FYI Nvidia solder issues
Dwight Mattix
Wed, 27 Aug 2008 18:50:28 -0700
Re: FYI Nvidia solder issues
Werner Engelmaier /*
Wed, 27 Aug 2008 20:11:31 EDT
Re: FYI Nvidia solder issues
Dwight Mattix
Wed, 27 Aug 2008 16:55:35 -0700
Re: FYI Nvidia solder issues
Guy Ramsey
Wed, 27 Aug 2008 18:50:03 -0400
Re: FYI Nvidia solder issues
John Burke
Wed, 27 Aug 2008 11:28:45 -0700
Re: FYI Nvidia solder issues
Paul Edwards
Wed, 27 Aug 2008 11:07:27 -0700
FYI Nvidia solder issues
John Burke
Wed, 27 Aug 2008 10:31:57 -0700
New Thread Gloves for soldering
Re: Gloves for soldering
Douglas O. Pauls
Thu, 21 Aug 2008 06:53:09 -0500
Re: Gloves for soldering
Peter Swanson
Thu, 21 Aug 2008 09:41:59 +0100
Gloves for soldering
Brian Ellis
Thu, 21 Aug 2008 08:59:59 +0300
New Thread Hawk Quad DPMO high
Hawk Quad DPMO high
Guy Ramsey
Fri, 29 Aug 2008 09:39:55 -0400
New Thread High temperature solder
Re: High temperature solder
Charles Dennehy
Wed, 6 Aug 2008 10:48:51 -0400
Re: High temperature solder
Douglas Peck
Tue, 5 Aug 2008 22:53:25 -0400
Re: High temperature solder
<>
Tue, 5 Aug 2008 22:57:52 EDT
Re: High temperature solder
Paul Edwards
Tue, 5 Aug 2008 16:17:48 -0700
Re: High temperature solder
Steve Gregory
Tue, 5 Aug 2008 15:20:47 -0500
High temperature solder
Chares Dennehy
Tue, 5 Aug 2008 14:15:54 -0500
New Thread Hurry and register today for IPC's Advanced Packaging Webcast Series August 14, 2008
Hurry and register today for IPC's Advanced Packaging Webcast Series August 14, 2008
Michelle Michelotti
Tue, 5 Aug 2008 10:50:01 -0500
New Thread iAg and sulfur NTC
Re: iAg and sulfur NTC
Douglas O. Pauls
Tue, 26 Aug 2008 13:51:08 -0500
Re: iAg and sulfur NTC
Bev Christian
Tue, 26 Aug 2008 14:38:05 -0400
New Thread iAg, sulfur and selenium
Re: iAg, sulfur and selenium
Bev Christian
Tue, 26 Aug 2008 15:02:32 -0400
New Thread Inspection of bottom only terminations / process verification
Re: Inspection of bottom only terminations / process verification
Rex Waygood
Fri, 8 Aug 2008 08:30:38 +0100
Re: Inspection of bottom only terminations / process verification
Kevin Glidden
Thu, 7 Aug 2008 15:38:12 -0400
Re: Inspection of bottom only terminations / process verification
Steve Gregory
Thu, 7 Aug 2008 13:57:21 -0500
Re: Inspection of bottom only terminations / process verification
Kevin Glidden
Thu, 7 Aug 2008 13:42:33 -0400
New Thread IPC 7711/7721 training
Re: IPC 7711/7721 training
Stadem, Richard D.
Mon, 25 Aug 2008 15:52:43 -0500
New Thread IPC Deliverables
Re: IPC Deliverables
Gary Ferrari
Thu, 21 Aug 2008 12:22:07 -0400
IPC Deliverables
kwood716
Thu, 21 Aug 2008 12:03:52 -0400
New Thread IPC Webcast: Power System Design in High Speed PC Boards - September 11, 2008 10:00 am - 11:00 am (CT)
IPC Webcast: Power System Design in High Speed PC Boards - September 11, 2008 10:00 am - 11:00 am (CT)
Michelle Michelotti
Thu, 28 Aug 2008 13:47:21 -0500
New Thread IPC's Upcoming High Density Interconnects Technology Conference, October 6-8, 2008, Dallas, Texas
IPC's Upcoming High Density Interconnects Technology Conference, October 6-8, 2008, Dallas, Texas
Michelle Michelotti
Mon, 25 Aug 2008 09:26:41 -0500
New Thread IPC/SMTA High Performance Electronics Assembly Cleaning Symposium
IPC/SMTA High Performance Electronics Assembly Cleaning Symposium
Tina Nerad
Fri, 1 Aug 2008 13:47:44 -0500
New Thread IPC/SMTA High Performance Electronics Assembly Cleaning Symposium - October 28-29, 2008 Rosemont, Ill.
IPC/SMTA High Performance Electronics Assembly Cleaning Symposium - October 28-29, 2008 Rosemont, Ill.
Michelle Michelotti
Wed, 20 Aug 2008 08:31:59 -0500
New Thread IPC6012 Sample Frequency / Method
Re: IPC6012 Sample Frequency / Method
deac descoteaux
Fri, 15 Aug 2008 16:13:42 -0400
Re: IPC6012 Sample Frequency / Method
Wolfgang Erat
Fri, 15 Aug 2008 14:17:38 -0400
Re: IPC6012 Sample Frequency / Method
Franklin D Asbell
Thu, 14 Aug 2008 16:40:32 -0500
Re: IPC6012 Sample Frequency / Method
Dave Schaefer
Thu, 14 Aug 2008 15:37:50 -0500
Re: IPC6012 Sample Frequency / Method
Dave Schaefer
Thu, 14 Aug 2008 15:24:41 -0500
Re: IPC6012 Sample Frequency / Method
Brown, Elaine
Thu, 14 Aug 2008 16:24:07 -0400
Re: IPC6012 Sample Frequency / Method
Franklin D Asbell
Thu, 14 Aug 2008 15:02:30 -0500
Re: IPC6012 Sample Frequency / Method
Werner Engelmaier /*
Thu, 14 Aug 2008 15:38:41 EDT
IPC6012 Sample Frequency / Method
Dave Schaefer
Thu, 14 Aug 2008 13:43:49 -0500
New Thread Last chance to register for IPC's Advanced Packaging Webcast Series August 21, 2008
Last chance to register for IPC's Advanced Packaging Webcast Series August 21, 2008
Michelle Michelotti
Wed, 20 Aug 2008 08:43:22 -0500
New Thread LGA footprint
Re: LGA footprint
John Foster
Wed, 27 Aug 2008 12:53:53 -0700
Re: LGA footprint
weiner, mickey
Wed, 27 Aug 2008 09:17:18 +0300
Re: LGA footprint
kwood716
Tue, 26 Aug 2008 14:18:22 -0400
Re: LGA footprint
Joyce Koo
Tue, 26 Aug 2008 10:42:09 -0400
LGA footprint
Mark Larson
Tue, 26 Aug 2008 09:06:19 -0500
New Thread LGA/QFN voids %
Re: LGA/QFN voids %
Tan Geok Ang
Mon, 1 Sep 2008 08:33:01 +0800
Re: LGA/QFN voids %
John Burke
Fri, 29 Aug 2008 06:37:22 -0700
Re: LGA/QFN voids %
Bob Willis
Fri, 29 Aug 2008 09:53:44 +0100
Re: LGA/QFN voids %
Rex Waygood
Fri, 29 Aug 2008 09:33:00 +0100
Re: LGA/QFN voids %
Bernard, David
Fri, 29 Aug 2008 09:07:31 +0100
Re: LGA/QFN voids %
Rex Waygood
Fri, 29 Aug 2008 08:42:03 +0100
LGA/QFN voids %
Tan Geok Ang
Fri, 29 Aug 2008 09:31:56 +0800
New Thread Liquid Masking Deposition Process
Re: Liquid Masking Deposition Process
Rex Waygood
Tue, 5 Aug 2008 08:06:16 +0100
Re: Liquid Masking Deposition Process
Joyce Koo
Mon, 4 Aug 2008 19:49:47 -0400
Liquid Masking Deposition Process
Chris Schaefer
Mon, 4 Aug 2008 18:15:53 -0500
New Thread looking for ENiG photos
Re: looking for ENiG photos
Steve Gregory
Mon, 11 Aug 2008 07:52:19 -0500
Re: looking for ENiG photos
Hernefjord Ingemar
Mon, 11 Aug 2008 13:32:00 +0200
New Thread Looking for Potting Compound guidance
Re: Looking for Potting Compound guidance
Honsowetz, Eric
Wed, 6 Aug 2008 14:31:18 -0400
Re: Looking for Potting Compound guidance
Sauer, Steve (Xetron)
Tue, 5 Aug 2008 14:22:04 -0500
Re: Looking for Potting Compound guidance
Kevin Glidden
Tue, 5 Aug 2008 15:06:35 -0400
Re: Looking for Potting Compound guidance
Ken Bloomquist
Tue, 5 Aug 2008 11:38:19 -0700
Looking for Potting Compound guidance
Carl VanWormer
Tue, 5 Aug 2008 10:34:20 -0700
New Thread Marking Adhesion
Re: Marking Adhesion
David D. Hillman
Mon, 11 Aug 2008 11:17:25 -0500
Marking Adhesion
Stolar, Paul W
Mon, 11 Aug 2008 09:38:13 -0500
New Thread Material question
Re: Material question
Temkin, Gregg
Thu, 14 Aug 2008 15:57:58 -0700
Re: Material question
Mike Sewell
Thu, 14 Aug 2008 12:22:28 -0500
Re: Material question
Wilson, Bob
Thu, 14 Aug 2008 10:30:51 -0700
Material question
Bill Dworak
Thu, 14 Aug 2008 10:01:34 -0700
New Thread Maximum HASL thickness for SMT of QFN
Re: Maximum HASL thickness for SMT of QFN
Wenger, George M.
Wed, 20 Aug 2008 10:01:27 -0400
Re: Maximum HASL thickness for SMT of QFN
Guy Ramsey
Wed, 20 Aug 2008 08:01:07 -0400
Re: Maximum HASL thickness for SMT of QFN
Stadem, Richard D.
Tue, 19 Aug 2008 14:55:59 -0500
Re: Maximum HASL thickness for SMT of QFN
Guy Ramsey
Tue, 19 Aug 2008 15:48:55 -0400
Re: Maximum HASL thickness for SMT of QFN
Stadem, Richard D.
Tue, 19 Aug 2008 13:48:27 -0500
Re: Maximum HASL thickness for SMT of QFN
James Mahoney
Tue, 19 Aug 2008 13:36:50 -0400
Maximum HASL thickness for SMT of QFN
James Verrette
Tue, 19 Aug 2008 13:22:12 -0400
New Thread Measling
Re: Measling
Ted Kong
Fri, 22 Aug 2008 09:22:04 -0700
Re: Measling
Victor Hernandez
Fri, 22 Aug 2008 09:27:34 -0500
Re: Measling
Pete Houwen
Fri, 22 Aug 2008 08:31:21 -0500
Measling
Ted Kong
Thu, 21 Aug 2008 17:26:26 -0700
New Thread measurement and acceptance of microvias
Re: measurement and acceptance of microvias
Whittaker, Dewey (EHCOE)
Mon, 11 Aug 2008 10:28:53 -0700
Re: measurement and acceptance of microvias
Dwight Mattix
Mon, 11 Aug 2008 10:17:45 -0700
Re: measurement and acceptance of microvias
Whittaker, Dewey (EHCOE)
Fri, 8 Aug 2008 07:59:23 -0700
Re: measurement and acceptance of microvias
Bob Willis
Fri, 8 Aug 2008 13:05:06 +0100
Re: measurement and acceptance of microvias
Gerald Gagnon
Thu, 7 Aug 2008 14:13:58 -0400
Re: measurement and acceptance of microvias
Paul Reid
Thu, 7 Aug 2008 13:25:19 -0400
measurement and acceptance of microvias
Louis Hart
Wed, 6 Aug 2008 17:12:25 -0400
New Thread Moisture in PCB Assemblies
Re: Moisture in PCB Assemblies
Graham Naisbitt
Thu, 28 Aug 2008 22:58:39 +0100
Re: Moisture in PCB Assemblies
Stadem, Richard D.
Thu, 28 Aug 2008 12:40:47 -0500
Re: Moisture in PCB Assemblies
Stadem, Richard D.
Thu, 28 Aug 2008 12:33:53 -0500
Re: Moisture in PCB Assemblies
Werner Engelmaier /*
Thu, 28 Aug 2008 13:05:32 EDT
Re: Moisture in PCB Assemblies
Joe Macko
Thu, 28 Aug 2008 09:45:46 -0700
Re: Moisture in PCB Assemblies
<>
Wed, 27 Aug 2008 19:36:46 -0400
Re: Moisture in PCB Assemblies
Werner Engelmaier /*
Wed, 27 Aug 2008 15:23:05 EDT
Re: Moisture in PCB Assemblies
Stadem, Richard D.
Wed, 27 Aug 2008 09:48:15 -0500
Re: Moisture in PCB Assemblies
Dennis Fritz
Wed, 27 Aug 2008 10:09:44 -0400
Re: Moisture in PCB Assemblies
Bev Christian
Tue, 26 Aug 2008 19:57:22 -0400
Moisture in PCB Assemblies
<>
Tue, 26 Aug 2008 19:19:20 -0400
New Thread Multilayer Flex-Rigid Fabricators capable of the following
Re: Multilayer Flex-Rigid Fabricators capable of the following
deac descoteaux
Tue, 12 Aug 2008 09:51:29 -0400
Re: Multilayer Flex-Rigid Fabricators capable of the following
James Mahoney
Tue, 12 Aug 2008 09:29:42 -0400
Re: Multilayer Flex-Rigid Fabricators capable of the following
McGlaughlin, Jeffrey A
Mon, 11 Aug 2008 16:17:24 -0400
Multilayer Flex-Rigid Fabricators capable of the following
David Greig
Mon, 11 Aug 2008 20:54:40 +0100
New Thread NiAu Specification for Al Wedge Wire Bonding
Re: NiAu Specification for Al Wedge Wire Bonding
Inge
Mon, 18 Aug 2008 13:30:50 -0700
Re: NiAu Specification for Al Wedge Wire Bonding
Stadem, Richard D.
Mon, 18 Aug 2008 14:54:23 -0500
Re: NiAu Specification for Al Wedge Wire Bonding
stephengregory5849
Sat, 16 Aug 2008 10:46:19 -0500
Re: NiAu Specification for Al Wedge Wire Bonding
Mike Fenner
Sat, 16 Aug 2008 00:59:46 +0100
Re: NiAu Specification for Al Wedge Wire Bonding
John Burke
Fri, 15 Aug 2008 16:42:03 -0700
Re: NiAu Specification for Al Wedge Wire Bonding
Steve Gregory
Fri, 15 Aug 2008 12:36:31 -0500
Re: NiAu Specification for Al Wedge Wire Bonding
Mike Fenner
Fri, 15 Aug 2008 17:27:11 +0100
Re: NiAu Specification for Al Wedge Wire Bonding
Whittaker, Dewey (EHCOE)
Fri, 15 Aug 2008 06:45:40 -0700
Re: NiAu Specification for Al Wedge Wire Bonding
Whittaker, Dewey (EHCOE)
Fri, 15 Aug 2008 06:37:50 -0700
Re: NiAu Specification for Al Wedge Wire Bonding
Steve Gregory
Fri, 15 Aug 2008 07:07:01 -0500
Re: NiAu Specification for Al Wedge Wire Bonding
Hernefjord Ingemar
Fri, 15 Aug 2008 10:11:39 +0200
Re: NiAu Specification for Al Wedge Wire Bonding
Hernefjord Ingemar
Fri, 15 Aug 2008 10:04:37 +0200
Re: NiAu Specification for Al Wedge Wire Bonding
Joyce Koo
Wed, 13 Aug 2008 09:41:33 -0400
Re: NiAu Specification for Al Wedge Wire Bonding
Hernefjord Ingemar
Wed, 13 Aug 2008 13:12:11 +0200
Re: NiAu Specification for Al Wedge Wire Bonding
Hernefjord Ingemar
Mon, 11 Aug 2008 15:03:33 +0200
Re: NiAu Specification for Al Wedge Wire Bonding
Steve Gregory
Mon, 11 Aug 2008 07:47:39 -0500
Re: NiAu Specification for Al Wedge Wire Bonding
Hernefjord Ingemar
Mon, 11 Aug 2008 14:05:07 +0200
New Thread No-Flow Underfill CTE
Re: No-Flow Underfill CTE
Stadem, Richard D.
Thu, 7 Aug 2008 13:32:12 -0500
Re: No-Flow Underfill CTE
Werner Engelmaier /*
Thu, 7 Aug 2008 14:12:23 EDT
No-Flow Underfill CTE
Gumpert, Ben
Thu, 7 Aug 2008 08:46:43 -0400
New Thread NTC
Re: NTC
John Burke
Wed, 27 Aug 2008 14:24:14 -0700
Re: NTC
Craig Cullum
Wed, 27 Aug 2008 16:27:06 -0500
Re: NTC
Ken Bloomquist
Wed, 27 Aug 2008 12:38:34 -0700
Re: NTC
John Burke
Wed, 27 Aug 2008 11:30:13 -0700
Re: NTC
James Verrette
Wed, 27 Aug 2008 14:23:25 -0400
Re: NTC
Stadem, Richard D.
Wed, 27 Aug 2008 12:57:54 -0500
Re: NTC
James Verrette
Wed, 27 Aug 2008 12:56:27 -0400
Re: NTC
Hernefjord Ingemar
Wed, 27 Aug 2008 15:57:47 +0200
Re: NTC
Pete Houwen
Wed, 27 Aug 2008 07:43:15 -0500
Re: NTC
Paul Reid
Wed, 27 Aug 2008 08:30:34 -0400
Re: NTC
Douglas O. Pauls
Wed, 27 Aug 2008 06:59:58 -0500
Re: NTC
Joyce Koo
Wed, 27 Aug 2008 07:35:06 -0400
Re: NTC
Graham Naisbitt
Wed, 27 Aug 2008 12:14:34 +0100
Re: NTC
Brian Ellis
Wed, 27 Aug 2008 14:11:42 +0300
Re: NTC
Werner Engelmaier /*
Wed, 27 Aug 2008 06:40:56 EDT
Re: NTC
Graham Naisbitt
Wed, 27 Aug 2008 11:31:01 +0100
Re: NTC
Graham Collins
Wed, 27 Aug 2008 07:09:52 -0300
Re: NTC
Paul Reid
Tue, 26 Aug 2008 17:25:34 -0400
Re: NTC
Whittaker, Dewey (EHCOE)
Tue, 26 Aug 2008 14:47:47 -0700
Re: NTC
Steve Gregory
Tue, 26 Aug 2008 16:43:45 -0500
Re: NTC
Douglas O. Pauls
Tue, 26 Aug 2008 16:42:15 -0500
Re: NTC
Whittaker, Dewey (EHCOE)
Tue, 26 Aug 2008 14:16:57 -0700
Re: NTC
Lee Whiteman
Tue, 26 Aug 2008 17:13:35 -0400
Re: NTC
Bev Christian
Tue, 26 Aug 2008 17:06:34 -0400
Re: NTC
R Sedlak
Tue, 26 Aug 2008 14:06:14 -0700
Re: NTC
David D. Hillman
Tue, 26 Aug 2008 16:03:57 -0500
Re: NTC
Bev Christian
Tue, 26 Aug 2008 17:03:46 -0400
Re: NTC
Douglas O. Pauls
Tue, 26 Aug 2008 15:58:34 -0500
Re: NTC
Bev Christian
Tue, 26 Aug 2008 16:52:18 -0400
New Thread NTC FYI Nvidia solder issues
Re: NTC FYI Nvidia solder issues
Guy Ramsey
Thu, 28 Aug 2008 06:22:17 -0400
New Thread NTC [TN] Different pad sizes on the same BGA
Re: NTC [TN] Different pad sizes on the same BGA
John Burke
Fri, 15 Aug 2008 16:49:04 -0700
New Thread Paint suitable for reflow applications
Re: Paint suitable for reflow applications
Charlie Pitarys
Thu, 14 Aug 2008 15:36:54 -0500
Re: Paint suitable for reflow applications
Eric CHRISTISON
Thu, 14 Aug 2008 17:28:18 +0100
Re: Paint suitable for reflow applications
R Sedlak
Thu, 14 Aug 2008 08:31:50 -0700
Re: Paint suitable for reflow applications
Mike Fenner
Thu, 14 Aug 2008 10:57:22 +0100
Paint suitable for reflow applications
Eric CHRISTISON
Thu, 14 Aug 2008 09:44:54 +0100
New Thread Paint suitable for reflow applications]
Re: Paint suitable for reflow applications]
Eric CHRISTISON
Fri, 15 Aug 2008 09:10:24 +0100
New Thread Plasma Surface Treatment For Conformal Coat
Re: Plasma Surface Treatment For Conformal Coat
Creswick, Steven
Mon, 11 Aug 2008 08:56:01 -0400
Re: Plasma Surface Treatment For Conformal Coat
Joyce Koo
Mon, 11 Aug 2008 08:25:25 -0400
Re: Plasma Surface Treatment For Conformal Coat
Hernefjord Ingemar
Mon, 11 Aug 2008 14:18:01 +0200
Re: Plasma Surface Treatment For Conformal Coat
Creswick, Steven
Mon, 11 Aug 2008 08:08:47 -0400
Re: Plasma Surface Treatment For Conformal Coat
Creswick, Steven
Mon, 11 Aug 2008 07:54:00 -0400
Re: Plasma Surface Treatment For Conformal Coat
Steve Gregory
Mon, 11 Aug 2008 06:51:22 -0500
Re: Plasma Surface Treatment For Conformal Coat
Hernefjord Ingemar
Mon, 11 Aug 2008 13:04:58 +0200
New Thread Pre-condition
Re: Pre-condition
arnaud grivon
Thu, 28 Aug 2008 09:17:24 +0200
Pre-condition
Lin Leo
Thu, 28 Aug 2008 09:55:37 +0800
Re: Pre-condition
Creswick, Steven
Fri, 22 Aug 2008 08:43:59 -0400
Pre-condition
Lin Leo
Fri, 22 Aug 2008 20:24:09 +0800
New Thread PWA cleaning methods
Re: PWA cleaning methods
Brian Ellis
Thu, 21 Aug 2008 08:52:18 +0300
Re: PWA cleaning methods
Ken Bloomquist
Wed, 20 Aug 2008 12:39:06 -0700
Re: PWA cleaning methods
Mengers, William D.
Wed, 20 Aug 2008 13:58:59 -0500
Re: PWA cleaning methods
Mike Fenner
Wed, 20 Aug 2008 17:51:40 +0100
Re: PWA cleaning methods
Paul Edwards
Wed, 20 Aug 2008 09:41:06 -0700
Re: PWA cleaning methods
Kevin Glidden
Wed, 20 Aug 2008 12:30:29 -0400
Re: PWA cleaning methods
Douglas O. Pauls
Wed, 20 Aug 2008 11:12:15 -0500
Re: PWA cleaning methods
Stadem, Richard D.
Wed, 20 Aug 2008 11:02:46 -0500
PWA cleaning methods
William D. Mengers
Wed, 20 Aug 2008 10:13:00 -0500
New Thread Question about heat transfer
Re: Question about heat transfer
Joyce Koo
Sun, 31 Aug 2008 21:37:16 -0400
Re: Question about heat transfer
Eli Sarig
Sun, 31 Aug 2008 20:58:48 +0300
Re: Question about heat transfer
Reuven Rokah
Thu, 28 Aug 2008 09:16:00 +0300
Re: Question about heat transfer
Werner Engelmaier /*
Wed, 27 Aug 2008 15:50:28 EDT
Question about heat transfer
Eli Sarig
Wed, 27 Aug 2008 22:23:45 +0300
New Thread really, really NTC and its not Friday!
Re: really, really NTC and its not Friday!
Bev Christian
Tue, 26 Aug 2008 17:15:31 -0400
New Thread Register today for IPC's Upcoming HDI Technology Conference, October 6-8, 2008, Dallas, Texas
Register today for IPC's Upcoming HDI Technology Conference, October 6-8, 2008, Dallas, Texas
Michelle Michelotti
Wed, 6 Aug 2008 08:51:31 -0500
New Thread Register today for IPC's Upcoming High Density Interconnects Technology Conference, October 6-8, 2008, Dallas, Texas
Register today for IPC's Upcoming High Density Interconnects Technology Conference, October 6-8, 2008, Dallas, Texas
Michelle Michelotti
Thu, 14 Aug 2008 14:51:26 -0500
New Thread Register today for the IPC's Roadmap webcast Series!
Register today for the IPC's Roadmap webcast Series!
Michelle Michelotti
Thu, 28 Aug 2008 11:15:38 -0500
New Thread Register today for upcoming IPC Webcast: Power System Design in High Speed PC Boards - September 11, 2008 10:00 am - 11:00 am (CT)
Register today for upcoming IPC Webcast: Power System Design in High Speed PC Boards - September 11, 2008 10:00 am - 11:00 am (CT)
Michelle Michelotti
Wed, 6 Aug 2008 11:21:30 -0500
New Thread Register today! IPC/SMTA High Performance Electronics Assembly Cleaning Symposium - October 28-29, 2008 Rosemont, Ill.
Register today! IPC/SMTA High Performance Electronics Assembly Cleaning Symposium - October 28-29, 2008 Rosemont, Ill.
Michelle Michelotti
Mon, 11 Aug 2008 08:53:31 -0500
New Thread Repair Need for Inverted Chip Resistors
Re: Repair Need for Inverted Chip Resistors
legg
Fri, 1 Aug 2008 11:40:22 -0500
Re: Repair Need for Inverted Chip Resistors
Brian Chandler
Fri, 1 Aug 2008 09:36:18 -0500
Re: Repair Need for Inverted Chip Resistors
Rex Waygood
Fri, 1 Aug 2008 07:53:50 +0100
New Thread Seam resistance pulse welding
Re: Seam resistance pulse welding
Creswick, Steven
Mon, 11 Aug 2008 08:00:16 -0400
Re: Seam resistance pulse welding
Hernefjord Ingemar
Mon, 11 Aug 2008 13:11:39 +0200
New Thread Smear and rework failure
Re: Smear and rework failure
Paul Reid
Fri, 8 Aug 2008 18:37:27 -0400
Re: Smear and rework failure
mp3
Fri, 8 Aug 2008 12:49:36 +0530
Re: Smear and rework failure
mp3
Fri, 8 Aug 2008 13:01:57 +0530
Re: Smear and rework failure
Joe Fjelstad
Thu, 7 Aug 2008 19:47:00 EDT
Re: Smear and rework failure
Franklin D Asbell
Thu, 7 Aug 2008 18:40:03 -0500
Re: Smear and rework failure
Werner Engelmaier /*
Thu, 7 Aug 2008 17:31:34 EDT
Re: Smear and rework failure
Whittaker, Dewey (EHCOE)
Thu, 7 Aug 2008 13:01:54 -0700
Re: Smear and rework failure
Whittaker, Dewey (EHCOE)
Thu, 7 Aug 2008 14:25:33 -0700
Re: Smear and rework failure
Werner Engelmaier /*
Thu, 7 Aug 2008 17:21:28 EDT
Re: Smear and rework failure
Werner Engelmaier /*
Thu, 7 Aug 2008 14:25:59 EDT
Smear and rework failure
mp3
Thu, 7 Aug 2008 19:14:20 +0530
New Thread SOLDER FOR PCB  REFLOW PRO CESS
Re: SOLDER FOR PCB  REFLOW PRO CESS
Mike Fenner
Thu, 7 Aug 2008 11:51:09 +0100
Re: SOLDER FOR PCB  REFLOW PRO CESS
Joyce Koo
Wed, 6 Aug 2008 11:35:31 -0400
Re: SOLDER FOR PCB  REFLOW PRO CESS
Werner Engelmaier /*
Wed, 6 Aug 2008 10:25:53 EDT
New Thread SOLDER FOR PCB REFLOW PROCESS
Re: SOLDER FOR PCB REFLOW PROCESS
Guy Ramsey
Thu, 7 Aug 2008 11:11:40 -0400
Re: SOLDER FOR PCB REFLOW PROCESS
Pasquito, Helena
Thu, 7 Aug 2008 10:21:13 -0400
Re: SOLDER FOR PCB REFLOW PROCESS
Joe Macko
Thu, 7 Aug 2008 07:02:40 -0700
Re: SOLDER FOR PCB REFLOW PROCESS
Gumpert, Ben
Wed, 6 Aug 2008 09:45:00 -0400
Re: SOLDER FOR PCB REFLOW PROCESS
Poh KH
Wed, 6 Aug 2008 19:26:22 +0800
SOLDER FOR PCB REFLOW PROCESS
Anat Douek
Wed, 6 Aug 2008 10:50:18 +0200
New Thread Solder Paste with craters [NTC]
Re: Solder Paste with craters [NTC]
Steve Gregory
Fri, 1 Aug 2008 16:21:10 -0500
Re: Solder Paste with craters [NTC]
Inge
Fri, 1 Aug 2008 13:44:47 -0700
Re: Solder Paste with craters [NTC]
Whittaker, Dewey (EHCOE)
Fri, 1 Aug 2008 09:10:59 -0700
Re: Solder Paste with craters [NTC]
Stadem, Richard D.
Fri, 1 Aug 2008 11:02:31 -0500
Re: Solder Paste with craters [NTC]
Kelly Morris
Fri, 1 Aug 2008 10:24:44 -0500
Re: Solder Paste with craters [NTC]
Stadem, Richard D.
Fri, 1 Aug 2008 10:29:54 -0500
New Thread Solder Paste with craters.
Re: Solder Paste with craters.
Victor Hernandez
Mon, 4 Aug 2008 08:48:03 -0500
Re: Solder Paste with craters.
Ashok Dhawan
Mon, 4 Aug 2008 08:41:40 -0500
Re: Solder Paste with craters.
Leif Erik Laerum
Mon, 4 Aug 2008 08:23:15 -0500
Re: Solder Paste with craters.
Ashok Dhawan
Mon, 4 Aug 2008 07:53:02 -0500
Re: Solder Paste with craters.
Inge
Fri, 1 Aug 2008 13:55:59 -0700
Re: Solder Paste with craters.
Bill Kunkle
Fri, 1 Aug 2008 11:59:57 -0400
Re: Solder Paste with craters.
Joyce Koo
Fri, 1 Aug 2008 11:04:27 -0400
Re: Solder Paste with craters.
Joyce Koo
Fri, 1 Aug 2008 11:03:13 -0400
Re: Solder Paste with craters.
Whittaker, Dewey (EHCOE)
Fri, 1 Aug 2008 06:59:47 -0700
Re: Solder Paste with craters.
Whittaker, Dewey (EHCOE)
Fri, 1 Aug 2008 06:53:50 -0700
Re: Solder Paste with craters.
Whittaker, Dewey (EHCOE)
Fri, 1 Aug 2008 06:27:41 -0700
Re: Solder Paste with craters.
John Burke
Fri, 1 Aug 2008 07:47:16 -0700
Re: Solder Paste with craters.
Stadem, Richard D.
Fri, 1 Aug 2008 09:05:49 -0500
Re: Solder Paste with craters.
Leif Erik Laerum
Fri, 1 Aug 2008 09:09:00 -0500
Re: Solder Paste with craters.
Victor Hernandez
Fri, 1 Aug 2008 08:48:18 -0500
Re: Solder Paste with craters.
Joyce Koo
Fri, 1 Aug 2008 09:29:07 -0400
Re: Solder Paste with craters.
Stadem, Richard D.
Fri, 1 Aug 2008 08:25:18 -0500
Re: Solder Paste with craters.
Guy Ramsey
Fri, 1 Aug 2008 08:07:12 -0400
Re: Solder Paste with craters.
Steve Gregory
Fri, 1 Aug 2008 06:42:36 -0500
Re: Solder Paste with craters.
Guy Ramsey
Fri, 1 Aug 2008 07:09:57 -0400
New Thread solder vertical fill on thermal pad
Re: solder vertical fill on thermal pad
Stadem, Richard D.
Wed, 27 Aug 2008 08:39:54 -0500
Re: solder vertical fill on thermal pad
stephengregory5849
Tue, 26 Aug 2008 21:57:47 -0500
solder vertical fill on thermal pad
Luan Nguyen
Wed, 27 Aug 2008 09:26:31 +0700
New Thread Stain Mark after ESS
Re: Stain Mark after ESS
Lum Wee Mei
Thu, 21 Aug 2008 10:56:57 +0800
Re: Stain Mark after ESS
Kevin Glidden
Mon, 18 Aug 2008 08:36:15 -0400
Stain Mark after ESS
Lum Wee Mei
Sat, 16 Aug 2008 13:23:16 +0800
New Thread Standard/Specification for LGA/QFN voids %
Standard/Specification for LGA/QFN voids %
Tan Geok Ang
Tue, 26 Aug 2008 08:52:27 +0800
New Thread Step Stencil Requirements
Re: Step Stencil Requirements
Bill Kunkle
Wed, 27 Aug 2008 10:44:57 -0400
Re: FW: Step Stencil Requirements
Bill Coleman
Wed, 27 Aug 2008 08:34:54 -0600
FW: Step Stencil Requirements
Kane, Amol (349)
Wed, 27 Aug 2008 10:26:35 -0400
Step Stencil Requirements
Kane, Amol (349)
Wed, 27 Aug 2008 08:13:25 -0400
New Thread System (PC-Laptop) level realibility model
System (PC-Laptop) level realibility model
al shirazi
Thu, 28 Aug 2008 10:16:45 -0700
New Thread TechNet Wikipedia
Re: TechNet Wikipedia
David Bergman
Sun, 10 Aug 2008 15:49:52 -0500
Re: TechNet Wikipedia
Bev Christian
Sun, 10 Aug 2008 12:28:08 -0400
Re: TechNet Wikipedia
Jack Crawford
Sun, 10 Aug 2008 11:33:55 -0500
Re: TechNet Wikipedia
Brian Ellis
Sun, 10 Aug 2008 19:05:02 +0300
TechNet Wikipedia
David Tremmel
Sat, 9 Aug 2008 13:28:24 -0500
New Thread TG 130 or Tg 170 for ENIG
Re: TG 130 or Tg 170 for ENIG
Scott Westheimer
Thu, 14 Aug 2008 18:57:47 -0400
Re: TG 130 or Tg 170 for ENIG
Bob Willis
Fri, 15 Aug 2008 07:29:40 +0100
Re: TG 130 or Tg 170 for ENIG
Werner Engelmaier /*
Thu, 14 Aug 2008 17:25:38 EDT
Re: TG 130 or Tg 170 for ENIG
Whittaker, Dewey (EHCOE)
Thu, 14 Aug 2008 13:05:42 -0700
Re: TG 130 or Tg 170 for ENIG
Paul Reid
Thu, 14 Aug 2008 15:26:58 -0400
Re: TG 130 or Tg 170 for ENIG
Werner Engelmaier /*
Thu, 14 Aug 2008 15:25:45 EDT
Re: TG 130 or Tg 170 for ENIG
Werner Engelmaier /*
Thu, 14 Aug 2008 15:24:00 EDT
Re: TG 130 or Tg 170 for ENIG
Reuven Rokah
Thu, 14 Aug 2008 21:29:17 +0300
Re: TG 130 or Tg 170 for ENIG
Inge
Thu, 14 Aug 2008 11:01:01 -0700
Re: TG 130 or Tg 170 for ENIG
Inge
Thu, 14 Aug 2008 10:54:11 -0700
Re: TG 130 or Tg 170 for ENIG
Whittaker, Dewey (EHCOE)
Thu, 14 Aug 2008 10:42:32 -0700
Re: TG 130 or Tg 170 for ENIG
Whittaker, Dewey (EHCOE)
Thu, 14 Aug 2008 10:40:47 -0700
Re: TG 130 or Tg 170 for ENIG
Inge
Thu, 14 Aug 2008 10:37:45 -0700
Re: TG 130 or Tg 170 for ENIG
John Burke
Thu, 14 Aug 2008 10:27:17 -0700
Re: TG 130 or Tg 170 for ENIG
Wilson, Bob
Thu, 14 Aug 2008 09:57:27 -0700
Re: TG 130 or Tg 170 for ENIG
Douglas O. Pauls
Thu, 14 Aug 2008 11:23:27 -0500
TG 130 or Tg 170 for ENIG
Lenny Carter
Thu, 14 Aug 2008 12:19:44 -0400
New Thread They solder well... But they don't work!
Re: They solder well... But they don't work!
Wrobel, Clayton
Fri, 1 Aug 2008 11:17:34 -0400
Re: They solder well... But they don't work!
Oscar Fallah
Thu, 31 Jul 2008 23:55:02 -0700
New Thread Trinocular Scope With Display
Re: Trinocular Scope With Display
Ashok Dhawan
Mon, 4 Aug 2008 09:17:31 -0500
New Thread unsubscribe
Re: unsubscribe
Ahne Oosterhof
Wed, 27 Aug 2008 07:38:25 -0700
unsubscribe
bob wettermann
Wed, 27 Aug 2008 06:46:05 -0700
New Thread Use of QFN devices in high reliability applications
Re: Use of QFN devices in high reliability applications
Pete Houwen
Mon, 4 Aug 2008 08:23:11 -0500
Re: Use of QFN devices in high reliability applications
Temkin, Gregg
Fri, 1 Aug 2008 07:25:19 -0700
New Thread Via hole fill
Re: Via hole fill
Stadem, Richard D.
Thu, 21 Aug 2008 11:48:54 -0500
Re: Via hole fill
Whittaker, Dewey (EHCOE)
Thu, 21 Aug 2008 09:49:02 -0700
Re: Via hole fill
Jason Zhao
Thu, 21 Aug 2008 11:38:08 -0500
Re: Via hole fill
Whittaker, Dewey (EHCOE)
Thu, 21 Aug 2008 09:18:03 -0700
Re: Via hole fill
Eddie Rocha
Thu, 21 Aug 2008 09:08:05 -0700
Re: Via hole fill
Victor Hernandez
Thu, 21 Aug 2008 10:53:37 -0500
Re: Via hole fill
Eddie Rocha
Thu, 21 Aug 2008 08:32:05 -0700
Re: Via hole fill
Grunde Gjertsen
Thu, 21 Aug 2008 15:36:34 +0200
Re: Via hole fill
Werner Engelmaier /*
Thu, 21 Aug 2008 08:18:44 EDT
Re: Via hole fill
Grunde Gjertsen
Thu, 21 Aug 2008 08:23:16 +0200
Re: Via hole fill
Stephen Pierce
Tue, 19 Aug 2008 09:05:12 -0700
Re: Via hole fill
McGlaughlin, Jeffrey A
Tue, 19 Aug 2008 08:06:13 -0400
Re: Via hole fill
Smith, Rick
Tue, 19 Aug 2008 07:46:33 -0400
Via hole fill
Scott Westheimer
Mon, 18 Aug 2008 13:45:40 -0400
New Thread Washing of conformally coated boards
Re: Washing of conformally coated boards
Graham Naisbitt
Wed, 13 Aug 2008 13:14:14 +0100
Re: Washing of conformally coated boards
Hernefjord Ingemar
Tue, 12 Aug 2008 10:02:49 +0200
Re: Washing of conformally coated boards
Joyce Koo
Mon, 11 Aug 2008 13:36:26 -0400
Re: Washing of conformally coated boards
Phil Nutting
Mon, 11 Aug 2008 12:45:32 -0400
Re: Washing of conformally coated boards
Graham Naisbitt
Mon, 11 Aug 2008 16:11:20 +0100
Re: Washing of conformally coated boards
Ioan Tempea
Mon, 11 Aug 2008 10:39:28 -0400
Re: Washing of conformally coated boards
Brian Ellis
Mon, 11 Aug 2008 17:23:29 +0300
Washing of conformally coated boards
Ioan Tempea
Mon, 11 Aug 2008 09:56:35 -0400
New Thread Wave solder Gloves?
Re: Wave solder Gloves?
N Burtt
Tue, 19 Aug 2008 04:06:04 -0500
Re: Wave solder Gloves?
Phil Nutting
Mon, 18 Aug 2008 12:48:17 -0400
Re: Wave solder Gloves?
Davis, Larry
Mon, 18 Aug 2008 08:50:26 -0700
Wave solder Gloves?
Steve Gregory
Mon, 18 Aug 2008 10:38:44 -0500
New Thread what damage can a battery leakage do on a TTL/CMOS controller card 1990 vintage
Re: what damage can a battery leakage do on a TTL/CMOS controller card 1990 vintage
Joyce Koo
Thu, 28 Aug 2008 04:42:33 -0400
Re: what damage can a battery leakage do on a TTL/CMOS controller card 1990 vintage
Brian Ellis
Thu, 28 Aug 2008 13:13:57 +0300
Re: what damage can a battery leakage do on a TTL/CMOS controller card 1990 vintage
Anil kher
Thu, 28 Aug 2008 13:51:43 +0530
Re: what damage can a battery leakage do on a TTL/CMOS controller card 1990 vintage
Hernefjord Ingemar
Thu, 28 Aug 2008 10:02:33 +0200
Re: what damage can a battery leakage do on a TTL/CMOS controller card 1990 vintage
Brian Ellis
Thu, 28 Aug 2008 10:30:56 +0300
Re: what damage can a battery leakage do on a TTL/CMOS controller card 1990 vintage
Hernefjord Ingemar
Thu, 28 Aug 2008 09:09:06 +0200
what damage can a battery leakage do on a TTL/CMOS controller card 1990 vintage
Anil kher
Wed, 27 Aug 2008 22:13:04 +0530
New Thread where to buy ANSI-J-STD-004 and ANSI-J-STD-006
Re: where to buy ANSI-J-STD-004 and ANSI-J-STD-006
Grunde Gjertsen
Thu, 21 Aug 2008 07:13:49 +0200
where to buy ANSI-J-STD-004 and ANSI-J-STD-006
Wilson, Bob
Wed, 20 Aug 2008 16:20:00 -0700
New Thread Wire bonding gurus ohoy!
Re: Wire bonding gurus ohoy!
Creswick, Steven
Thu, 28 Aug 2008 06:03:34 -0400
Re: Wire bonding gurus ohoy!
Inge
Mon, 25 Aug 2008 20:07:53 -0700
Re: Wire bonding gurus ohoy!
Creswick, Steven
Mon, 25 Aug 2008 14:53:18 -0400
Re: Wire bonding gurus ohoy!
Creswick, Steven
Mon, 25 Aug 2008 07:40:15 -0400
Re: Wire bonding gurus ohoy!
Creswick, Steven
Wed, 20 Aug 2008 11:30:18 -0400
Re: Wire bonding gurus ohoy!
Steve Gregory
Wed, 20 Aug 2008 07:10:15 -0500
Re: Wire bonding gurus ohoy!
Creswick, Steven
Tue, 19 Aug 2008 13:58:28 -0400
Re: Wire bonding gurus ohoy!
Inge
Tue, 19 Aug 2008 10:44:38 -0700
Re: Wire bonding gurus ohoy!
Creswick, Steven
Tue, 19 Aug 2008 12:57:36 -0400
Re: Wire bonding gurus ohoy!
Steve Gregory
Mon, 18 Aug 2008 07:29:33 -0500
Wire bonding gurus ohoy!
Hernefjord Ingemar
Mon, 18 Aug 2008 11:13:21 +0200
New Thread Yellow Colored Visible Dye Penetrant
Re: Yellow Colored Visible Dye Penetrant
Bob Willis
Fri, 15 Aug 2008 13:51:20 +0100
Re: Yellow Colored Visible Dye Penetrant
Victor Hernandez
Fri, 15 Aug 2008 07:16:05 -0500
Re: Yellow Colored Visible Dye Penetrant
Bob Willis
Fri, 15 Aug 2008 07:13:32 +0100
Yellow Colored Visible Dye Penetrant
bob wettermann
Thu, 14 Aug 2008 14:32:56 -0700
New Thread [LF] [TN] SN100 for Reflow Application
Re: FW: [LF] [TN] SN100 for Reflow Application
Rex Waygood
Tue, 19 Aug 2008 08:04:07 +0100
Re: FW: [LF] [TN] SN100 for Reflow Application
Stadem, Richard D.
Mon, 18 Aug 2008 15:54:20 -0500
New Thread [tinwhiskers] AW: [RoHSUSAPushback] RE:Xbox & RoHS
Re: [tinwhiskers] AW: [RoHSUSAPushback] RE:Xbox & RoHS
Werner Engelmaier /*
Mon, 11 Aug 2008 20:37:23 EDT
New Thread [TN] Compatibility of Lead-Free alloys
FW: [TN] Compatibility of Lead-Free alloys
Phil Nutting
Mon, 25 Aug 2008 08:32:39 -0400
New Thread [TN] Compatibility of Lead-Free alloys - LINK CORRECTION
FW: [TN] Compatibility of Lead-Free alloys - LINK CORRECTION
Phil Nutting
Mon, 25 Aug 2008 08:43:35 -0400
New Thread [TN] ENIG White paper
FW: [TN] ENIG White paper
Stadem, Richard D.
Mon, 25 Aug 2008 16:15:54 -0500
New Thread [TN] NiAu Specification for Al Wedge Wire Bonding
FW: [TN] NiAu Specification for Al Wedge Wire Bonding
Martin Tarr
Fri, 15 Aug 2008 11:40:26 +0100
New Thread [TN] Smear and rework failure
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mp3
Fri, 8 Aug 2008 13:09:11 +0530

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