Interesting question. Are any of the chemistry players producing B
nickel for PCB apps? Haven't come across it myself, but for info the
typical B content of electroless Ni is lower than you would find in P
types, typically low B plating is <3% and high B 3-6%

Regards
Ian Fox
Lead Materials and Process engineer
Goodrich ECS
York Road
Hall Green
Birmingham B28 8LN
United Kingdom

Tel: +44 (0)121 607 3763
Fax: +44 (0)121 607 3658
E-mail: [log in to unmask] 



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lee Whiteman
Sent: 27 August 2008 13:23
To: [log in to unmask]
Subject: [TN] ENIG & BORON

Need to get educated on this one...

Was reading IPC-4552 and read that Boron and Phosphorus were used as
reducing agents. I know that too much Phosphorus (> 7%) can lead to
"Black Pad". 

Does Boron have the same effect as Phosphorus? If so, what is the UCL
for Boron in the ENIG process?

Just curious...

Thanks.

Lee Whiteman, PMP
Senior Member Engineering Staff
L-3 Communications East
Telephone: (856) 338-3508
FAX: (856) 338-2906
E-Mail: [log in to unmask]
 

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