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August 2008

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Subject:
From:
"Igoshev, Vladimir" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Igoshev, Vladimir
Date:
Wed, 27 Aug 2008 09:58:36 -0400
Content-Type:
text/plain
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text/plain (62 lines)
It's very rare in use (I think I saw it just once or twice over quite a
few years) and it wouldn't be prone to Black Pad, even though it could
be susceptible to Brittle Fracture.

Regards,

Vladimir

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lee Whiteman
Sent: Wednesday, August 27, 2008 8:23 AM
To: [log in to unmask]
Subject: [TN] ENIG & BORON

Need to get educated on this one...

Was reading IPC-4552 and read that Boron and Phosphorus were used as
reducing agents. I know that too much Phosphorus (> 7%) can lead to
"Black Pad". 

Does Boron have the same effect as Phosphorus? If so, what is the UCL
for Boron in the ENIG process?

Just curious...

Thanks.

Lee Whiteman, PMP
Senior Member Engineering Staff
L-3 Communications East
Telephone: (856) 338-3508
FAX: (856) 338-2906
E-Mail: [log in to unmask]
 

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