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August 2008

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Subject:
From:
"Whittaker, Dewey (EHCOE)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Whittaker, Dewey (EHCOE)
Date:
Tue, 26 Aug 2008 10:06:26 -0700
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So it's not good in a cryogenic environment?
Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Douglas O. Pauls
Sent: Tuesday, August 26, 2008 8:43 AM
To: [log in to unmask]
Subject: [TN]

It is also not good to use if you are processing Vidalia onions.  A 
presentation I was at earlier this year on industrial controllers talked

about corrosion on electronics in an onion processing plant in Georgia.
As 
it turns out, Vidalia onions are high in sulfur.

Doug Pauls




"Stadem, Richard D." <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
08/26/2008 10:07 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
"Stadem, Richard D." <[log in to unmask]>


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Subject
[TN]






Thats one for all of us to keep in the files. Thanks Mark!

I know that IAg is not a good choice for things like control boards for
washers and dryers and dishwashers (the laundry and dish soaps contain
large amounts of sulfides), heating furnaces or heating units, under
hood automotive applications, heavy industrial controls, devices mounted
in coastal salt spray areas, car wash controls, near swimming pools or
other areas with any chlorine concentration. 

Typical use of IAg is in office products, telecommunications, medical
devices, consumer electronics, computers, etc.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Woolley, Mark D.
(Mark)
Sent: Tuesday, August 26, 2008 9:37 AM
To: [log in to unmask]
Subject: [TN]

Any environment that contains sulfur, like hydrogen sulfide or sulfur
dioxide should preclude the use of IAg.  The sulfur will react with the
silver and "grow" sulfides which can be electrically conductive
resulting is shorts between vias.  This can occur even when the
concentrations are within OSHA limits for human exposure. 
Silver sulfides can be semiconductors or conductors depending on the
chemical composition.  They are black in color instead of silver, any
exposed silver will be affected.

Mark Woolley
Failure Analyst

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of James Verrette
Sent: Tuesday, August 26, 2008 8:25 AM
To: [log in to unmask]
Subject: [TN]

What characteristics of the end use environment would cause IAg to not
be an appropriate finish and why?
 
Jim Verrette
Senior Electrical Engineer
 
------------------------------

Date: Mon, 25 Aug 2008 08:24:35 -0500

From: "Stadem, Richard D." <[log in to unmask]>

Subject: Re: ENIG White paper

Dave,

You write as if you are not at all familiar with IAg, which is totally

understandable. However, IAg has been around in full production mode for

many years now, and is rapidly becoming the most-used finish in the

market. Do not confuse it with immersion tin finish, which has little or

no shelf life.

IAg-finished circuit boards have a recommended shelf or storage life of

about 1 year. However, if packaged properly in a hermetically sealed bag

with silver saver paper liners, and stored away from sulfates, it is

possible to use boards up to 5 years old or even longer with no issues

whatsoever. All you need to do is call out the packaging on the

fabrication drawing per IPC 4553.

I have soldered IAg boards that sat around exposed to the elements for

more than 4 years in previous lives, and they soldered up just fine, no

change in the DPMO.

Some of the bare boards we use here at GD are 34" by 40", 48 layers,

1/2" thick, cost is about $48,000 each. Their finish is IAg. =20

I have had a lot of experience with IAg over the past 10 years or so,

having seen at least 150,000 IAg boards assembled and soldered with

every type of component you can think of, and I have never experienced

any issues with them. I have experienced many, many issues with ENIG,

however, and that is the finish that would keep me up at night waiting

for the bomb to go off. There are many reliability issues associated

with ENIG such as black pad, brittle nickel, etc., etc, but just think

about the fact that you are soldering to nickel, which has a dissolution

rate about 50 times slower than copper.

Should you ever have a solderability issue with IAg, you can have the

fabricator rework the finish. If you have an issue with ENIG, the only

thing you can do is rework your scrap account.

However, you need to take the end-use environment into consideration

when you select a circuit board finish. ENIG (unfortunately) may be your

best choice. I would fully qualify just one assembly at a time, and I

would fully qualify it. For Space use, I would not suggest IAg.

-----Original Message-----


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