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August 2008

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Subject:
Re: Via hole fill
From:
Stephen Pierce <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stephen Pierce <[log in to unmask]>
Date:
Tue, 19 Aug 2008 09:05:12 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (29 lines) 
IPC-4761 is useful as a design guide; however, it does not address
specifications.

The D-33a task group is currently working on an update to IPC-6012 that will
address cap plating requirements.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Scott Westheimer
Sent: Monday, August 18, 2008 10:46 AM
To: [log in to unmask]
Subject: [TN] Via hole fill

Can someone be so kind as to direct me to the IPC specification that covers
filled via's. I am looking for the min average copper plating thickness
required. These are non-conductive filled via's.
 
Thanks in advance.Scott B. Westheimer5709 Clarks Fork DriveRaleigh, NC
[log in to unmask]: (919)713-0748Cell NC: (919)961-5364 

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