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August 2008

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Wed, 27 Aug 2008 09:10:20 -0500
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Peter/Bev
Read my posting on the effects of too little/too much P that I posted
about a month ago. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: Wednesday, August 27, 2008 9:06 AM
To: [log in to unmask]
Subject: Re: [TN] ENIG & BORON

Peter,
I believe it never was a function of percent P, but always process
control. High P was indeed found, but as a result of process control
problems. And I believe sulfur content in the nickel bath was a big
issue. I remember one IPC where one laminate maker could turn it on and
off with the presence of a particular sulfur compound in the nickel
bath. 
Bev
RIM

----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Wed Aug 27 08:52:59 2008
Subject: Re: [TN] ENIG & BORON

"I know that too much Phosphorus (> 7%) can lead to "Black Pad". "

Actually, the occurance of Black Pad has become far less frequent since
the introduction of Hi-P nickel baths, with about 9%-13% P.  It's now
more a matter of process control than P content.

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