"CL-CODE-MFR" code (3 Messages)
(Archive Copy) Re: [TN] Alternatives to Conformal Coating? (1 Message)
(QFN) Microchip Carrier with Center PAD (3 Messages)
63/37 paste and Lead free component (1 Message)
90/10 solder (1 Message)
<No subject> (1 Message)
A Friday question (11 Messages)
Alternatives to Conformal Coating? (14 Messages)
Antw: Re: [TN] English expression (2 Messages)
Antw: [TN] 63/37 paste and Lead free component (1 Message)
Antw: [TN] Solderability issue... (1 Message)
Aqueous batch washer (2 Messages)
Aqueous cleaner mats?? (3 Messages)
Assemblies built to withstand very high G-loads... (8 Messages)
AW: [TN] AW: [TN] Video analysis of solder joint formation - NTC (2 Messages)
AW: [TN] Video analysis of solder joint formation (1 Message)
AW: [TN] Video analysis of solder joint formation - NTC (1 Message)
Battery Life Test (2 Messages)
BGA Environmental Protection (3 Messages)
BGA repairs (2 Messages)
Boston area Mtg IPC/DC, 18-Nov (1 Message)
CAD data for assembling of PCB. (5 Messages)
Calculating cost to assemble (3 Messages)
Calculation of Connector Contact DC Resistance (2 Messages)
cap shear test spec (2 Messages)
CC (1 Message)
Central & South American shops (1 Message)
Champagne Voids (6 Messages)
Component counters (4 Messages)
Conductive Adhesive (8 Messages)
Contamination on the fabs.... (6 Messages)
Controlled Impedance Design (7 Messages)
Coplanarity for SMT connectors (2 Messages)
copper weight (18 Messages)
CSP&UBGA manual reballing problems (1 Message)
Cu Sputtering (4 Messages)
Current Capacity for Via (1 Message)
D-Pack, holes, solder (6 Messages)
Dennis Petrosky/NY-BIN/Ametek is out of the office. (2 Messages)
design consideration solder methodology (1 Message)
Desmear Line (1 Message)
DFM Cost Factors (2 Messages)
DI water heaters (3 Messages)
Die Penetrant SJ Crack Inspection Process (6 Messages)
Diode Pin Numbering Question... (2 Messages)
Electrodeposited Silver vs. Immersion Silver (12 Messages)
Embedded Passive Components Conference - Last Chance to Register (1 Message)
English expression (22 Messages)
ENIG (2 Messages)
ENIG as edge-connector finish (6 Messages)
Entek Plus Cu106A HT (2 Messages)
ESD Footwear Questions (2 Messages)
excessive baking (1 Message)
Field Failures and reworked PCAs? (4 Messages)
Flow soldering gold plated pads? (3 Messages)
flux names (1 Message)
Forum members in Singapore (1 Message)
Forum? (7 Messages)
FR4 and Lead free (7 Messages)
FR4 versus FR5 (3 Messages)
Friday NTC: how to feel really stupid (2 Messages)
Friday Question - Heavy Costs (20 Messages)
gold removal from smt components per J-STD-001 ? (2 Messages)
Guidelines for Cleaning by Flux Type (2 Messages)
High G- forces (1 Message)
High Pot Test Mats (1 Message)
HTC Vapor Phase System (1 Message)
Humidity test (3 Messages)
Immersion Silver (18 Messages)
Immersion White Tin Plating Specification (6 Messages)
In-House Training Programs (3 Messages)
Ionic contamination (1 Message)
IPC Designers Council Pacific Northwest Chapter Meeting Notice (1 Message)
IPC J-STD-001 Certified Trainer Courses... (4 Messages)
IPC Solder Paste Test Method stencils (3 Messages)
IPC web server down (2 Messages)
IPC-1720A Assembly Qualification Profile (3 Messages)
Jumper Wire - Better insulation? (10 Messages)
Label 0.25"X0.75" (6 Messages)
labor price-break for having board on sub-panel (array) (2 Messages)
Laser seamwelding (5 Messages)
Last Chance to Register for Lead Free North America (1 Message)
Lead Free is not Free, is Costly (10 Messages)
Lead Free North America Conference - December 1-3 in Boston, MA (1 Message)
Lead free Tin Plating problems... (2 Messages)
LongBoards (9 Messages)
Looking for a contact (1 Message)
Matthew L Hamand is out of the office. (1 Message)
max peak temp bt (2 Messages)
Moisture - Post Baking condition (1 Message)
moisture saturation curve (1 Message)
Need help (for sputtered Cu source) (4 Messages)
new member (16 Messages)
NOMAIL (1 Message)
NTC - other forums (5 Messages)
NTC repeated paragraph (1 Message)
NTC: etiquette (11 Messages)
NTC: Friday and I wanna know.... (9 Messages)
NTC: home computer (16 Messages)
NTC: odd Friday (1 Message)
Official IPC J-STD-001 Certified Trainer Courses... (1 Message)
Open traces (2 Messages)
OSP standard (4 Messages)
OT: ODB++ files (4 Messages)
out of office reply (1 Message)
Oxide replacement (5 Messages)
Pad design to keep SMT connector from shifting during re flow. (2 Messages)
Pad design to keep SMT connector from shifting during reflow. (3 Messages)
Panels vs. Pallets (1 Message)
PCB Materials (3 Messages)
Plating through a 2 layer board hole after assembly? (2 Messages)
plugging vias (7 Messages)
PM Procedures for Ionising Air Guns (1 Message)
Poor ENIG Solderability (7 Messages)
Press fit tooling (3 Messages)
Process Indicators... (14 Messages)
Profiling Equipment Recommendations (1 Message)
PWB Immersion Silver Finish (3 Messages)
Re-balling of BGAs (9 Messages)
Re; Controlled Impedance Design (1 Message)
Recall: gold removal from smt components per J-STD-001 ? (1 Message)
Removal of Connector (8 Messages)
repeated paragraph (4 Messages)
Resistor Pack Preference - Concave or Convex (1 Message)
Samtec PCS2 Socket issue... (9 Messages)
SIGNOFF (1 Message)
Silkscreen removal (2 Messages)
SMT Soldering Test of ENIG (2 Messages)
SNEC Mtg (2 Messages)
SNEC mtg date correction (1 Message)
SOD323 problem... (17 Messages)
Solder Attach to Area Array Packages (1 Message)
solder float test (2 Messages)
Solder Mask expectations / pushing the envelope? (10 Messages)
Solder material qualification (1 Message)
Solder or Sodder? Even more NTC (3 Messages)
Solder or Sodder? More NTC (2 Messages)
Solder resist inspection underneath components (7 Messages)
Solderability issue... (5 Messages)
Soldered heat slug (3 Messages)
Special Discounts on 001D and 610D Workshops (1 Message)
Specification status / MIL-C-5541 (3 Messages)
Specifications for Drilled hole roughness as per IPC (4 Messages)
Standard status (5 Messages)
Strange Soldermask Defect. (2 Messages)
Strange Soldermask Defect... (26 Messages)
Surface Finish for keypad membrane switches (6 Messages)
Tape and reel parts (2 Messages)
Technet Unsubscribe (1 Message)
Tescon P&P (1 Message)
thicker conformal coating - selective encapsulant (1 Message)
Tin whiskers (4 Messages)
Trays for SMT connectors (2 Messages)
Upcoming Lead Free, RoHS and WEEE Events (1 Message)
Users of Allied High Tech X-sect equip? (1 Message)
Via hole failures (with pictures) (12 Messages)
Via-on-pad / via-in-pad (8 Messages)
Video analysis of solder joint formation (17 Messages)
Video analysis of solder joint formation - Working NOW!!!! (1 Message)
VOCs (2 Messages)
water based conformal coatings (5 Messages)
Wave and Reflow soldering fluids (1 Message)
You are invited to IPC Designers Learning Symposium, Montreal Canada (1 Message)
[TN] (3 Messages)
[TN] Via-on-pad / via-in-pad (1 Message)