Hi All!!
I've been getting into a number of debates about "Process Indicators" as
described in the IPC-610...mostly with our inspectors. I know their hearts are
in the right place, but it seems that many times they will reject the
assemblies with "Process Indicators" back to our operators to touch them up, so that
they look more like the "Target Condition", to be more cosmetically pleasing.
I've tried to explain things as best I can, but find that sometimes our
operators are touching up way more solder joints than they need too...they're
being "trained", as it were, by our inspectors. The operators know that if
something isn't "pretty" enough, it's going to come back to them...so they're
putting more labor into product than they should.
I'm trying to find some way, any way, to be able to show our inspectors that
to touch-up something because it doesn't look like the target condition,
doesn't mean one is making things any better...I understand that beauty is in
the eye of beholder.
There was some talk in the past about the Intermetallic Layer being
thickened during subsequent reflow cycles, and causing fractures, but Werner said
that he's never seen a failure because of a thick Intermetallic layer.
Process Indicators may happen as spelled out in the -610, sometimes not only
because of the assembly process, but because of the design, or other factors.
I look at Process Indicators as a "Flag" to investigate whether or not the
issues can be addressed and resolved properly, if they can't be resolved, then
it's not a defect. Am I wrong about this?
As always, TIA!
-Steve Gregory-
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