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November 2004

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Subject:
From:
"Misner, Bruce" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Misner, Bruce
Date:
Tue, 9 Nov 2004 12:12:08 -0600
Content-Type:
text/plain
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text/plain (54 lines)
Just always remember...Ag conductive adhesive is not compatable with tin
based component finishes...or any non-conductive oxide growths for that
matter. If you have Au, PtAu, PdAg or the like finishes on components and
similar finishes on your substrate or PWB, conductive adhesive can be quite
effective, otherwise the interface will increase in resistance over
time...I've seen 2-3 ohms in 6 months to as much as 20-40 ohms in a few
weeks.

Regards,
Bruce Misner

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Peter L
Sent: Friday, November 05, 2004 8:20 PM
To: [log in to unmask]
Subject: [TN] Conductive Adhesive


Hello Technet,

Can someone share their experience on Pros/cons (in particularly process
implication) of applying conductive adhesive Vs solder paste? We have a
request by one customer to investigate conductive adhesive (stencil print
compatible) as a potential substitute for Pb-Sn solder and eventually lead-
free.

Rgds,

Peter

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