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November 2004

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Subject:
Re: Solder Mask expectations / pushing the envelope?
From:
Franklin D Asbell <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Franklin D Asbell <[log in to unmask]>
Date:
Mon, 15 Nov 2004 15:08:51 -0600
Content-Type:
text/plain
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text/plain (23 lines) 
I'm thinking it's not so much a solder mask issue as a cleanliness issue
before the application of solder mask.

Dendritic growth is probably what is occurring. Contaminates on the
copper/glass prior to solder mask are occurring with the application of
current, causing these growths to bridge traces causing shorts.

A good precleaning process, pumice scrub followed by chemical clean perhaps,
would remove all contaminates that may cause these growths, and subsequent
shorts.

Franklin

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