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May 2000

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Subject:
HASL Tin-Lead component in thin coating
From:
Le Dai Tri <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 9 May 2000 15:16:19 +0700
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TechNeter,

We use horizontal HASL machine. When I measured the thickness of tin/lead 
    if the thickness was over 1um, the component of tin was 64~69%, 
    if the thickness was under 1um (0.8~0.9um), the component of tin was always over 70%. 
    (Tin/lead made-up in solder pot was 63+/-3%; 37+/-3%; board thicness was 1.6mm)
I did'nt know the reason why? 

In the case of component of tin was over 70%, what will happen in 
PCB Assembly manufacturing?

Any help would be appreciated.

Best regards,
Tri'.

_______________________________________
PWB Development section                                                             
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