TechNeter, We use horizontal HASL machine. When I measured the thickness of tin/lead if the thickness was over 1um, the component of tin was 64~69%, if the thickness was under 1um (0.8~0.9um), the component of tin was always over 70%. (Tin/lead made-up in solder pot was 63+/-3%; 37+/-3%; board thicness was 1.6mm) I did'nt know the reason why? In the case of component of tin was over 70%, what will happen in PCB Assembly manufacturing? Any help would be appreciated. Best regards, Tri'. _______________________________________ PWB Development section E-Mail : [log in to unmask]