TechNeter,
We use horizontal HASL machine. When
I measured the thickness of tin/lead
if the thickness was
over 1um, the component of tin was 64~69%,
if the thickness was under
1um (0.8~0.9um), the component of tin was always over 70%.
(Tin/lead made-up in solder
pot was 63+/-3%; 37+/-3%; board thicness was 1.6mm)
I did'nt know the reason
why?
In the case of component of tin was over 70%, what
will happen in
PCB Assembly manufacturing?
Any help would be appreciated.
Best regards,
Tri'.