TECHNET Archives

March 2007

TechNet@IPC.ORG
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- bogert (2 Messages)
<> (12 Messages)
Al Onderick (1 Message)
al shirazi (3 Messages)
Alexandra Curtis (1 Message)
Alistair Murray (1 Message)
arnaud grivon (5 Messages)
BADRI (2 Messages)
Barmuta, Michael (12 Messages)
Bev Christian (1 Message)
Bill Coleman (1 Message)
Bill Kasprzak (8 Messages)
Bill Kunkle (1 Message)
Bloomquist, Ken (5 Messages)
Bob Arciolla (1 Message)
Bob Barr (1 Message)
Bob Perkins (1 Message)
Bob Wilson (1 Message)
Brian Ellis (6 Messages)
Brooks,Bill (1 Message)
Chafin, Ken G. (1 Message)
Chezhian, Krishnan (Radhakrishnan) (1 Message)
Chris Ball (2 Messages)
Christopher Nash (4 Messages)
Chuck Brummer (1 Message)
Clayton @ Reliability Resources (2 Messages)
Colin McVean (3 Messages)
Craig Cullum (1 Message)
Creswick, Steven (22 Messages)
Dale Ritzen (4 Messages)
Dan Skweres (7 Messages)
Darrel Therriault (1 Message)
Dave Seymour (6 Messages)
David D. Hillman (3 Messages)
David Douthit (1 Message)
David Greig (2 Messages)
David Harman (1 Message)
Dehoyos, Ramon (19 Messages)
Dennis Fritz (3 Messages)
Donald Kyle (1 Message)
Donald Vischulis (1 Message)
Douglas O. Pauls (8 Messages)
Drew meyer (1 Message)
Dwight Mattix (1 Message)
Edward Mines (4 Messages)
ekalgren (2 Messages)
Ells Berkowitz (1 Message)
Eric Castonguay (1 Message)
Eric CHRISTISON (3 Messages)
Evans, Jack (1 Message)
Fox, Ian (1 Message)
Fran Juliot (2 Messages)
Frank Kimmey (1 Message)
Gabriela Bogdan (2 Messages)
Garry Foskett (1 Message)
Gary Bremer (1 Message)
Gary Warner (1 Message)
Gene Felder (2 Messages)
Genny Gibbard (4 Messages)
George Milad (2 Messages)
Gerard O'Brien (2 Messages)
Graham Collins (6 Messages)
Grant Emandien (1 Message)
Greg Scott (1 Message)
Gregg A. Owens (2 Messages)
Guy Ramsey (7 Messages)
Hans Shin (1 Message)
Haynes, Kim (1 Message)
Hernefjord Ingemar (31 Messages)
Hfjord (6 Messages)
Hogg, Blair K. (6 Messages)
Ian Hanna (10 Messages)
Inge (34 Messages)
Jack Crawford (1 Message)
Jack Evans (2 Messages)
James TerVeen (1 Message)
James Verrette (2 Messages)
Jeff Smith (1 Message)
Jeffrey Bush (20 Messages)
Jim Henderson (1 Message)
Joe Fjelstad (12 Messages)
Joe Russeau (1 Message)
Joel Alexander (2 Messages)
John Burke (25 Messages)
John Maxwell (2 Messages)
John Parsons (5 Messages)
Jones, Evamaria (1 Message)
Joyce Koo (12 Messages)
Juan T. Marugán (1 Message)
Kane, Amol (349) (9 Messages)
Kathy Kuhlow (2 Messages)
Kerry McMullen (3 Messages)
Kevin Glidden (2 Messages)
Kolmodin, Todd (1 Message)
Lee parker (4 Messages)
Leland Woodall (1 Message)
Leo Higgins (3 Messages)
Louis Hart (3 Messages)
Louis, Edwin @ CSE (3 Messages)
Lum Wee Mei (1 Message)
Macko, Joe @ IEC (1 Message)
Mark Eckert (2 Messages)
Marsico, James (9 Messages)
Marty W. Sheppard (1 Message)
Matt Kehoe-SIPAD Systems (5 Messages)
Matt Kehoe (1 Message)
McGlaughlin, Jeffrey A (4 Messages)
Michelle Michelotti (6 Messages)
Miguel Vallejo (1 Message)
Mike Buetow (1 Message)
Mike Fenner (7 Messages)
mp3 (2 Messages)
N Burtt (2 Messages)
Newland, Scott (1 Message)
Nowland, Russell Howard (Russell) (1 Message)
P. Langeveld (1 Message)
Pasquito, Helena (2 Messages)
Paul Baine (1 Message)
Paul Reid (1 Message)
Paymon Sani (17 Messages)
Peter Wong (2 Messages)
Phil Kinner (2 Messages)
Phil Nutting (6 Messages)
Phillip Bavaro (6 Messages)
prakash (1 Message)
pras chop (2 Messages)
R Sedlak (5 Messages)
Ralph Richart (2 Messages)
Randy Bock Sr. (1 Message)
Reuven Rokah (3 Messages)
Richard Kraszewski (2 Messages)
Roger Stoops (3 Messages)
Roland Jaquet (2 Messages)
Rolfe, David (1 Message)
Ryan Grant (8 Messages)
Scott Decker (2 Messages)
Scott Lefebvre (2 Messages)
Sherif Refaat (2 Messages)
Smith, Richard (1 Message)
Stadem, Richard D. (43 Messages)
Stephen Pence (1 Message)
Stephen Pierce (1 Message)
stephengregory5849 (3 Messages)
Steve Gregory (18 Messages)
Steve Kelly (2 Messages)
Steve Smith (1 Message)
Tan, Geok Ang (5 Messages)
Ted Kong (1 Message)
Ted Tontis (1 Message)
Tempea, Ioan (8 Messages)
Terry Kozlyk (2 Messages)
Thomas A. Frayda (1 Message)
Tina Nerad (9 Messages)
Tony Steinke (1 Message)
Upton, Shawn (9 Messages)
valerie St. Cyr (1 Message)
Victor G. Hernandez (13 Messages)
Wayne Thayer (8 Messages)
Wenger, George M. (4 Messages)
Werner Engelmaier (64 Messages)
West, Jim (3 Messages)
Whittaker, Dewey (EHCOE) (27 Messages)
Wood, Kenneth (1 Message)
Wrobel, Clayton (1 Message)
ZLATKO BIJEDIC (2 Messages)

Subject

From Sorted by Sender, Alphabetically

Date
New Sender - bogert
Re: FPGA (DSP)
- bogert
Mon, 12 Mar 2007 08:31:59 -0500
Use of Type AR Conformal Coating for Military PCBs
- Bogert
Fri, 2 Mar 2007 05:55:07 -0500
New Sender <>
Dry Film Thickness
<>
Fri, 16 Mar 2007 11:22:10 -0400
IPC ENIG SPECIFICATION
<>
Wed, 14 Mar 2007 20:30:34 -0500
Re: IPC ENIG SPECIFICATION
<>
Thu, 15 Mar 2007 06:32:09 -0500
Re: IPC ENIG SPECIFICATION
<>
Thu, 15 Mar 2007 07:36:09 -0500
NTC: The Silicon Zoo
<>
Sun, 25 Mar 2007 23:34:36 EDT
Re: Reflow Solder fixtures
<>
Wed, 21 Mar 2007 14:40:37 EDT
Re: Reflow Solder fixtures
<>
Wed, 21 Mar 2007 19:04:12 EDT
Re: Renewed respect for copper (non-technical content)
<>
Fri, 2 Mar 2007 07:27:26 -0500
Re: Rigid flex PCB manufacturer
<>
Thu, 22 Mar 2007 11:17:50 -0400
Solder Purity
<>
Tue, 6 Mar 2007 08:21:54 -0500
Solder Purity
<>
Thu, 15 Mar 2007 08:39:32 -0400
Re: Soldermask Blisters
<>
Fri, 23 Mar 2007 19:23:27 EDT
New Sender Al Onderick
Re: Footprint standards for Polarized components (Diodes)
Al Onderick
Wed, 28 Mar 2007 15:27:30 -0500
New Sender al shirazi
Re: SMT Solder Joint Strength
al shirazi
Fri, 16 Mar 2007 14:11:39 -0700
Re: SMT Solder Joint Strength
al shirazi
Fri, 16 Mar 2007 14:40:07 -0700
Re: SMT Solder Joint Strength
al shirazi
Fri, 16 Mar 2007 15:03:20 -0700
New Sender Alexandra Curtis
Register Today - Lead Free Materials and Surface Finishes Conference
Alexandra Curtis
Fri, 30 Mar 2007 09:52:17 -0500
New Sender Alistair Murray
Re: immersion silver and exposed copper in small vias
Alistair Murray
Tue, 6 Mar 2007 17:10:08 -0000
New Sender arnaud grivon
Re: Alternative SAC
arnaud grivon
Fri, 30 Mar 2007 13:29:53 +0200
Re: Gold Ball Bond attaching surface roughness
arnaud grivon
Wed, 21 Mar 2007 12:35:32 +0100
Hardness Characterization of a PCB Surface Finish
arnaud grivon
Fri, 23 Mar 2007 11:18:59 +0100
NiAu Specification for Al Wedge Wire Bonding
arnaud grivon
Wed, 14 Mar 2007 16:01:28 +0100
Re: NiAu Specification for Al Wedge Wire Bonding
arnaud grivon
Thu, 15 Mar 2007 14:50:53 +0100
New Sender BADRI
COMPATIBILITY
BADRI
Wed, 28 Mar 2007 19:37:18 +0530
Re: Paste Volume, off contact vs non off contact
BADRI
Sat, 10 Mar 2007 08:51:22 +0530
New Sender Barmuta, Michael
Re: (2) [TN] Paste Volume, off contact vs non off contact
Barmuta, Michael
Mon, 12 Mar 2007 13:12:58 -0700
Re: (2) [TN] Paste Volume, off contact vs non off contact
Barmuta, Michael
Mon, 12 Mar 2007 15:52:14 -0700
Re: immersion silver and exposed copper in small vias
Barmuta, Michael
Wed, 7 Mar 2007 07:53:37 -0800
Re: immersion silver and exposed copper in small vias
Barmuta, Michael
Wed, 7 Mar 2007 09:30:30 -0800
Re: IPC ENIG SPECIFICATION
Barmuta, Michael
Thu, 15 Mar 2007 07:46:51 -0700
Re: PCB plating Qualification
Barmuta, Michael
Tue, 13 Mar 2007 08:01:14 -0700
Re: PCB plating Qualification
Barmuta, Michael
Tue, 13 Mar 2007 10:13:12 -0700
Re: Soldering to Beryillum Copper
Barmuta, Michael
Wed, 28 Mar 2007 08:29:03 -0700
Re: Soldermask Blisters
Barmuta, Michael
Mon, 19 Mar 2007 10:06:20 -0700
Re: UV Bump
Barmuta, Michael
Fri, 30 Mar 2007 14:02:57 -0700
Re: Whisker contamination is solder pot
Barmuta, Michael
Wed, 21 Mar 2007 08:58:44 -0700
Re: Whisker contamination is solder pot
Barmuta, Michael
Wed, 21 Mar 2007 15:13:36 -0700
New Sender Bev Christian
Re: SMT Solder Joint Strength
Bev Christian
Fri, 16 Mar 2007 14:26:40 -0400
New Sender Bill Coleman
Re: Paste Volume, off contact vs non off contact
Bill Coleman
Fri, 9 Mar 2007 10:50:39 -0700
New Sender Bill Kasprzak
Re: Component Orientation Survey
Bill Kasprzak
Thu, 1 Mar 2007 09:30:09 -0500
Re: Component Orientation Survey
Bill Kasprzak
Thu, 1 Mar 2007 11:54:06 -0500
Re: I know it's not Friday but... NTC
Bill Kasprzak
Thu, 15 Mar 2007 13:52:36 -0400
Re: I know it's not Friday but...close enough [NTC]
Bill Kasprzak
Fri, 16 Mar 2007 14:15:22 -0400
Re: IPC ENIG SPECIFICATION
Bill Kasprzak
Thu, 15 Mar 2007 08:28:43 -0400
Re: Lead coating meniscus cracking
Bill Kasprzak
Wed, 7 Mar 2007 10:42:34 -0500
Re: Pad damage
Bill Kasprzak
Tue, 20 Mar 2007 14:13:45 -0400
Re: Qualification Testing for H1 Flux
Bill Kasprzak
Sat, 10 Mar 2007 07:47:17 -0500
New Sender Bill Kunkle
Re: Paste Volume, off contact vs non off contact
Bill Kunkle
Fri, 9 Mar 2007 13:11:13 -0500
New Sender Bloomquist, Ken
Re: Anybody else have trouble getting things from Pace?
Bloomquist, Ken
Thu, 8 Mar 2007 13:32:13 -0800
Engineering Question
Bloomquist, Ken
Fri, 16 Mar 2007 07:48:59 -0700
Re: Engineering Question
Bloomquist, Ken
Fri, 16 Mar 2007 08:16:56 -0700
Re: Engineering Question
Bloomquist, Ken
Fri, 16 Mar 2007 08:43:51 -0700
Re: immersion silver and exposed copper in small viasNTC
Bloomquist, Ken
Wed, 7 Mar 2007 14:41:31 -0800
New Sender Bob Arciolla
ESD question
Bob Arciolla
Mon, 5 Mar 2007 08:57:11 -0500
New Sender Bob Barr
Press-fit Soldering
Bob Barr
Mon, 26 Mar 2007 10:07:23 -0600
New Sender Bob Perkins
BGA footprint
Bob Perkins
Thu, 1 Mar 2007 16:36:18 -0800
New Sender Bob Wilson
Footprint standards for Polarized components (Diodes)
Bob Wilson
Wed, 28 Mar 2007 15:48:19 -0700
New Sender Brian Ellis
Re: copper deterioration (NTC?)
Brian Ellis
Fri, 9 Mar 2007 14:16:42 +0200
Re: ESD control and fans
Brian Ellis
Tue, 13 Mar 2007 11:39:22 +0200
Re: Good books to read?
Brian Ellis
Wed, 28 Mar 2007 13:08:34 +0300
Re: Nickel Foot
Brian Ellis
Wed, 21 Mar 2007 18:12:53 +0200
Re: PCB Cleanliness
Brian Ellis
Thu, 29 Mar 2007 11:09:30 +0300
Re: Soldermask Blisters
Brian Ellis
Tue, 20 Mar 2007 10:40:55 +0200
New Sender Brooks,Bill
Re: Pad damage
Brooks,Bill
Tue, 20 Mar 2007 10:12:27 -0800
New Sender Chafin, Ken G.
PCB Cleanliness
Chafin, Ken G.
Wed, 28 Mar 2007 17:12:52 -0400
New Sender Chezhian, Krishnan (Radhakrishnan)
Re: Dry Film Thickness
Chezhian, Krishnan (Radhakrishnan)
Fri, 16 Mar 2007 23:33:46 +0800
New Sender Chris Ball
Re: Component Orientation Survey
Chris Ball
Thu, 1 Mar 2007 10:27:57 -0500
Re: I know it's not Friday but... NTC
Chris Ball
Thu, 15 Mar 2007 14:14:31 -0500
New Sender Christopher Nash
Re: Alternative SAC
Christopher Nash
Fri, 30 Mar 2007 12:00:37 -0400
Gold %
Christopher Nash
Mon, 26 Mar 2007 11:41:39 -0400
Re: Gold %
Christopher Nash
Mon, 26 Mar 2007 14:09:33 -0400
Re: Soldering using Sn96
Christopher Nash
Fri, 30 Mar 2007 08:43:23 -0400
New Sender Chuck Brummer
Re: Dry Film Thickness
Chuck Brummer
Fri, 16 Mar 2007 10:29:45 -0700
New Sender Clayton @ Reliability Resources
Environmental Tests For PCB
Clayton @ Reliability Resources
Fri, 30 Mar 2007 12:36:54 -0700
Re: SMT Solder Joint Strength
Clayton @ Reliability Resources
Fri, 16 Mar 2007 13:56:14 -0700
New Sender Colin McVean
Re: Hardness Characterization of a PCB Surface Finish
Colin McVean
Fri, 23 Mar 2007 10:42:32 -0000
Re: ROHS lead free question (NTC)
Colin McVean
Thu, 29 Mar 2007 09:31:18 +0100
Re: whodunit?
Colin McVean
Fri, 9 Mar 2007 16:13:53 -0000
New Sender Craig Cullum
Renewed respect for copper (non-technical content)
Craig Cullum
Thu, 1 Mar 2007 16:05:40 -0600
New Sender Creswick, Steven
Re: AlSiC
Creswick, Steven
Wed, 21 Mar 2007 07:15:31 -0400
Re: AlSiC
Creswick, Steven
Thu, 22 Mar 2007 08:20:01 -0400
Re: AlSiC
Creswick, Steven
Thu, 22 Mar 2007 08:38:15 -0400
Re: AlSiC conclusion
Creswick, Steven
Thu, 22 Mar 2007 14:22:22 -0400
Re: Cofired gold
Creswick, Steven
Thu, 29 Mar 2007 10:13:48 -0400
Re: Cofired gold
Creswick, Steven
Thu, 29 Mar 2007 12:57:32 -0400
Re: Cofired gold
Creswick, Steven
Fri, 30 Mar 2007 06:55:59 -0400
Re: Gold Ball Bond attaching surface roughness
Creswick, Steven
Thu, 15 Mar 2007 08:36:03 -0400
Re: Gold Ball Bond attaching surface roughness
Creswick, Steven
Thu, 15 Mar 2007 14:51:10 -0400
Re: Gold Ball Bond attaching surface roughness
Creswick, Steven
Fri, 16 Mar 2007 06:12:21 -0400
Re: Gold Ball Bond attaching surface roughness
Creswick, Steven
Mon, 19 Mar 2007 06:21:24 -0400
Re: Gold Ball Bond attaching surface roughness
Creswick, Steven
Mon, 19 Mar 2007 13:02:28 -0400
Re: Gold Ball Bond attaching surface roughness
Creswick, Steven
Wed, 21 Mar 2007 10:13:19 -0400
Re: IPC ENIG SPECIFICATION
Creswick, Steven
Thu, 15 Mar 2007 06:04:00 -0400
Re: Renewed respect for copper (non-technical content)
Creswick, Steven
Fri, 2 Mar 2007 05:54:25 -0500
Re: Seam resistance pulse welding
Creswick, Steven
Tue, 13 Mar 2007 12:37:33 -0400
Re: Soldering to Beryillum Copper
Creswick, Steven
Wed, 28 Mar 2007 12:08:55 -0400
Re: Soldering to Beryillum Copper
Creswick, Steven
Wed, 28 Mar 2007 12:24:33 -0400
Re: Soldering to Beryillum Copper
Creswick, Steven
Thu, 29 Mar 2007 07:09:51 -0400
Re: structural adhesive
Creswick, Steven
Thu, 22 Mar 2007 14:40:51 -0400
Re: structural adhesive
Creswick, Steven
Thu, 22 Mar 2007 15:04:00 -0400
Re: FW: [TN] BGA Die Attach Criteria
Creswick, Steven
Wed, 14 Mar 2007 09:18:29 -0400
New Sender Dale Ritzen
Re: Component Orientation Survey
Dale Ritzen
Thu, 1 Mar 2007 07:55:26 -0600
Re: Component Orientation Survey
Dale Ritzen
Thu, 1 Mar 2007 08:40:19 -0600
EN 1000015 vs. ESD 20.20
Dale Ritzen
Thu, 8 Mar 2007 16:29:38 -0600
FR408 vs. FR-4 in RoHS Compliant SMT Process
Dale Ritzen
Mon, 12 Mar 2007 10:21:41 -0600
New Sender Dan Skweres
HEAT SINKS
Dan Skweres
Tue, 20 Mar 2007 09:55:35 -0600
Re: HEAT SINKS
Dan Skweres
Tue, 20 Mar 2007 10:28:40 -0600
Re: HEAT SINKS
Dan Skweres
Tue, 20 Mar 2007 13:40:15 -0600
Re: HEAT SINKS
Dan Skweres
Tue, 20 Mar 2007 13:42:02 -0600
Re: HEAT SINKS
Dan Skweres
Tue, 20 Mar 2007 13:50:12 -0600
TEST
Dan Skweres
Fri, 9 Mar 2007 16:57:47 -0600
Re: whodunit?
Dan Skweres
Fri, 9 Mar 2007 10:15:56 -0600
New Sender Darrel Therriault
Darrel Therriault is out of the office until 11/27/06.
Darrel Therriault
Thu, 29 Mar 2007 01:12:50 -0700
New Sender Dave Seymour
Re: Comps on opposite side of PCB sharing GND vias
Dave Seymour
Tue, 13 Mar 2007 08:43:43 -0400
Re: Engineering Question
Dave Seymour
Fri, 16 Mar 2007 11:22:49 -0400
Re: HEAT SINKS
Dave Seymour
Tue, 20 Mar 2007 11:03:23 -0400
Laminate Qualification.
Dave Seymour
Thu, 1 Mar 2007 14:26:14 -0500
Re: Laminate Qualification.
Dave Seymour
Fri, 2 Mar 2007 10:26:43 -0500
T260 tests
Dave Seymour
Fri, 23 Mar 2007 10:19:29 -0400
New Sender David D. Hillman
Re: Alternative SAC (NTC)
David D. Hillman
Fri, 30 Mar 2007 11:45:12 -0500
Re: Solderability problems on through holes only.
David D. Hillman
Sat, 24 Mar 2007 11:43:09 -0500
Re: Soldering using Sn96
David D. Hillman
Fri, 30 Mar 2007 07:25:21 -0500
New Sender David Douthit
Re: Weather coating
David Douthit
Sun, 25 Mar 2007 20:57:34 -0700
New Sender David Greig
Re: BGA footprint
David Greig
Fri, 2 Mar 2007 10:31:09 -0000
Re: BGA footprint
David Greig
Fri, 2 Mar 2007 17:35:19 -0000
New Sender David Harman
ROHS lead free question
David Harman
Thu, 22 Mar 2007 17:04:03 -0700
New Sender Dehoyos, Ramon
Re: CC fixture issue
Dehoyos, Ramon
Fri, 9 Mar 2007 12:55:01 -0500
Re: COMPATIBILITY
Dehoyos, Ramon
Wed, 28 Mar 2007 15:26:09 -0400
Re: Component Orientation Survey
Dehoyos, Ramon
Thu, 1 Mar 2007 09:43:25 -0500
Re: Double sided reflow
Dehoyos, Ramon
Wed, 28 Mar 2007 16:27:32 -0400
Re: Engineering Question
Dehoyos, Ramon
Fri, 16 Mar 2007 11:40:47 -0400
Re: Engineering Question
Dehoyos, Ramon
Fri, 16 Mar 2007 12:41:01 -0400
Re: ESD charges in conformal coatings
Dehoyos, Ramon
Tue, 27 Mar 2007 08:33:03 -0400
Re: ESD charges in conformal coatings (conclusion)
Dehoyos, Ramon
Thu, 29 Mar 2007 08:37:02 -0400
Re: Flip-flop panels
Dehoyos, Ramon
Fri, 2 Mar 2007 15:19:59 -0500
Re: I know it's not Friday but...close enough [NTC]
Dehoyos, Ramon
Fri, 16 Mar 2007 10:25:02 -0400
Re: number topics?
Dehoyos, Ramon
Thu, 29 Mar 2007 09:51:58 -0400
Re: PCB plating Qualification
Dehoyos, Ramon
Fri, 16 Mar 2007 10:57:20 -0400
Re: Prediction comes true (NTC)
Dehoyos, Ramon
Thu, 1 Mar 2007 10:12:34 -0500
Re: Solder Purity
Dehoyos, Ramon
Thu, 15 Mar 2007 09:03:14 -0400
Re: Soldermask Blisters
Dehoyos, Ramon
Mon, 19 Mar 2007 13:12:50 -0400
Re: Use of Type AR Conformal Coating for Military PCBs
Dehoyos, Ramon
Mon, 5 Mar 2007 09:14:48 -0500
Re: Use of Type AR Conformal Coating for Military PCBs
Dehoyos, Ramon
Mon, 5 Mar 2007 09:25:26 -0500
Re: Whisker contamination is solder pot
Dehoyos, Ramon
Wed, 21 Mar 2007 11:54:34 -0400
Re: whodunit?
Dehoyos, Ramon
Fri, 9 Mar 2007 12:35:10 -0500
New Sender Dennis Fritz
Re: "Greenish colour on traces"
Dennis Fritz
Sat, 17 Mar 2007 19:43:58 EDT
Re: Nickel Foot
Dennis Fritz
Tue, 20 Mar 2007 13:31:37 EDT
Re: Seeking PCB proto manufacturers
Dennis Fritz
Wed, 7 Mar 2007 08:11:41 EST
New Sender Donald Kyle
Re: Soldering using Sn96
Donald Kyle
Fri, 30 Mar 2007 07:12:10 -0500
New Sender Donald Vischulis
Re: FW: [TN] Solderability problems on through holes only.
Donald Vischulis
Sat, 24 Mar 2007 13:15:14 -0500
New Sender Douglas O. Pauls
Re: A_50 SIR Phoenix Board
Douglas O. Pauls
Mon, 19 Mar 2007 21:47:22 -0500
Re: CC fixture issue
Douglas O. Pauls
Fri, 9 Mar 2007 08:25:09 -0600
Re: Component Orientation Survey
Douglas O. Pauls
Thu, 1 Mar 2007 10:10:25 -0600
Re: ESD question
Douglas O. Pauls
Mon, 5 Mar 2007 08:23:45 -0600
Re: Use of Type AR Conformal Coating for Military PCBs
Douglas O. Pauls
Mon, 5 Mar 2007 07:36:28 -0600
Re: Use of Type AR Conformal Coating for Military PCBs
Douglas O. Pauls
Mon, 5 Mar 2007 08:18:18 -0600
Re: Use of Type AR Conformal Coating for Military PCBs
Douglas O. Pauls
Mon, 5 Mar 2007 08:43:55 -0600
Re: whodunit?
Douglas O. Pauls
Mon, 12 Mar 2007 12:06:00 -0500
New Sender Drew meyer
Re: Alternative SAC (NTC)
Drew meyer
Fri, 30 Mar 2007 09:54:48 -0600
New Sender Dwight Mattix
Re: Laminate material selection
Dwight Mattix
Mon, 12 Mar 2007 07:12:56 -0700
New Sender Edward Mines
cleaning conformally coated boards
Edward Mines
Thu, 29 Mar 2007 07:10:23 -0700
conformal coating repair
Edward Mines
Tue, 6 Mar 2007 06:30:17 -0800
number topics?
Edward Mines
Thu, 29 Mar 2007 06:46:20 -0700
weather coatings
Edward Mines
Tue, 27 Mar 2007 10:00:57 -0700
New Sender ekalgren
Re: Approved Substitute for Mil-P-13949/7 (GR)
ekalgren
Mon, 26 Mar 2007 10:27:20 -0400
NTC: Double Posting
ekalgren
Wed, 21 Mar 2007 12:51:21 -0400
New Sender Ells Berkowitz
Re: Reflow Solder fixtures
Ells Berkowitz
Fri, 30 Mar 2007 14:03:14 -0600
New Sender Eric Castonguay
Lead-free Foxtor connector removal
Eric Castonguay
Thu, 22 Mar 2007 14:49:57 -0600
New Sender Eric CHRISTISON
Re: Chip Scale Packagine (CSP)
Eric CHRISTISON
Tue, 13 Mar 2007 14:09:45 +0000
Re: Explanation of Cpk (Ppk)
Eric CHRISTISON
Wed, 28 Mar 2007 16:57:49 +0100
Re: PCB plating Qualification
Eric CHRISTISON
Tue, 13 Mar 2007 16:27:09 +0000
New Sender Evans, Jack
Re: Whisker contamination is solder pot
Evans, Jack
Wed, 21 Mar 2007 13:57:04 -0700
New Sender Fox, Ian
Re: Seam resistance pulse welding
Fox, Ian
Thu, 15 Mar 2007 11:21:58 -0000
New Sender Fran Juliot
immersion silver and exposed copper in small vias
Fran Juliot
Tue, 6 Mar 2007 09:57:56 -0600
Re: Pad damage
Fran Juliot
Tue, 20 Mar 2007 09:50:07 -0500
New Sender Frank Kimmey
Re: Flip-flop panels
Frank Kimmey
Fri, 2 Mar 2007 11:32:01 -0800
New Sender Gabriela Bogdan
Alternative SAC
Gabriela Bogdan
Fri, 30 Mar 2007 13:17:48 +0200
Re: Alternative SAC
Gabriela Bogdan
Fri, 30 Mar 2007 13:45:54 +0200
New Sender Garry Foskett
Re: Pad damage
Garry Foskett
Tue, 20 Mar 2007 14:23:49 -0000
New Sender Gary Bremer
Footprint standards for Polarized components (Diodes)
Gary Bremer
Tue, 27 Mar 2007 21:47:22 -0700
New Sender Gary Warner
Re: <List>[TN] immersion silver and exposed copper in small vias
Gary Warner
Tue, 6 Mar 2007 11:48:00 -0700
New Sender Gene Felder
Re: ESD control and fans
Gene Felder
Tue, 13 Mar 2007 08:08:00 -0700
Re: ESD question
Gene Felder
Mon, 5 Mar 2007 08:17:07 -0800
New Sender Genny Gibbard
Re: Engineering Question [NTC]
Genny Gibbard
Fri, 16 Mar 2007 10:34:47 -0600
Re: I know it's not Friday but...close enough [NTC]
Genny Gibbard
Thu, 15 Mar 2007 16:23:06 -0600
Re: ROHS lead free question
Genny Gibbard
Fri, 23 Mar 2007 08:56:44 -0600
Re: Solder Resist Encroachment onto BGA pads
Genny Gibbard
Fri, 30 Mar 2007 10:26:18 -0600
New Sender George Milad
Re: IPC ENIG SPECIFICATION
George Milad
Thu, 15 Mar 2007 10:53:00 EDT
Re: IPC ENIG SPECIFICATION
George Milad
Thu, 15 Mar 2007 12:04:44 EDT
New Sender Gerard O'Brien
Re: FR408 vs. FR-4 in RoHS Compliant SMT Process
Gerard O'Brien
Mon, 12 Mar 2007 12:22:11 -0500
Re: FR408 vs. FR-4 in RoHS Compliant SMT Process
Gerard O'Brien
Mon, 12 Mar 2007 14:53:01 -0500
New Sender Graham Collins
Re: ESD question
Graham Collins
Mon, 5 Mar 2007 09:11:49 -0500
whodunit?
Graham Collins
Fri, 9 Mar 2007 10:39:37 -0500
Re: whodunit?
Graham Collins
Fri, 9 Mar 2007 11:12:26 -0500
Re: whodunit?
Graham Collins
Fri, 9 Mar 2007 14:00:23 -0500
Re: whodunit?
Graham Collins
Fri, 9 Mar 2007 14:08:55 -0500
Re: whodunit?
Graham Collins
Mon, 12 Mar 2007 11:14:10 -0400
New Sender Grant Emandien
Metal-core PCBs
Grant Emandien
Fri, 16 Mar 2007 12:41:39 +0200
New Sender Greg Scott
Re: Component Orientation Survey
Greg Scott
Thu, 1 Mar 2007 08:39:28 -0800
New Sender Gregg A. Owens
SMT Solder Joint Strength
Gregg A. Owens
Fri, 16 Mar 2007 11:05:25 -0700
Re: SMT Solder Joint Strength
Gregg A. Owens
Fri, 16 Mar 2007 11:58:30 -0700
New Sender Guy Ramsey
Re: Chip Scale Packagine (CSP)
Guy Ramsey
Thu, 15 Mar 2007 08:40:22 -0400
Re: Double sided reflow
Guy Ramsey
Wed, 28 Mar 2007 16:56:08 -0400
Re: ESD question
Guy Ramsey
Tue, 6 Mar 2007 09:07:54 -0500
Re: Paste Volume, off contact vs non off contact
Guy Ramsey
Fri, 9 Mar 2007 15:39:04 -0500
Re: Post Assembly Bow and Twist
Guy Ramsey
Thu, 8 Mar 2007 09:07:46 -0500
Re: Solder Purity
Guy Ramsey
Thu, 15 Mar 2007 08:55:08 -0400
Re: SV: [TN] Prediction comes true (NTC)
Guy Ramsey
Thu, 1 Mar 2007 16:24:13 -0500
New Sender Hans Shin
Re: IPC 6012 : Outgassing Criteria
Hans Shin
Thu, 29 Mar 2007 08:35:56 -0700
New Sender Haynes, Kim
Re: BGA footprint
Haynes, Kim
Fri, 2 Mar 2007 10:41:34 -0600
New Sender Hernefjord Ingemar
Re: "Greenish colour on traces"
Hernefjord Ingemar
Mon, 19 Mar 2007 15:57:25 +0100
Re: AlSiC
Hernefjord Ingemar
Thu, 22 Mar 2007 08:04:57 +0100
Re: AlSiC
Hernefjord Ingemar
Thu, 22 Mar 2007 08:07:55 +0100
Re: Chip Capacitor Reliability Question
Hernefjord Ingemar
Tue, 6 Mar 2007 09:11:13 +0100
Cofired gold
Hernefjord Ingemar
Thu, 29 Mar 2007 15:38:32 +0200
Re: copper deterioration (NTC?)
Hernefjord Ingemar
Fri, 9 Mar 2007 13:25:16 +0100
Re: copper deterioration (NTC?)
Hernefjord Ingemar
Fri, 9 Mar 2007 14:45:43 +0100
ESD charges in conformal coatings
Hernefjord Ingemar
Tue, 27 Mar 2007 13:09:18 +0200
Re: ESD charges in conformal coatings
Hernefjord Ingemar
Tue, 27 Mar 2007 14:34:15 +0200
Re: ESD charges in conformal coatings
Hernefjord Ingemar
Tue, 27 Mar 2007 14:53:32 +0200
Re: ESD charges in conformal coatings (conclusion)
Hernefjord Ingemar
Thu, 29 Mar 2007 07:57:42 +0200
Re: ESD question
Hernefjord Ingemar
Mon, 5 Mar 2007 15:18:14 +0100
Re: ESD question
Hernefjord Ingemar
Mon, 5 Mar 2007 16:17:22 +0100
Re: ESD question
Hernefjord Ingemar
Tue, 6 Mar 2007 12:58:31 +0100
Re: FPGA (DSP)
Hernefjord Ingemar
Mon, 12 Mar 2007 12:14:32 +0100
Re: FPGA (DSP)
Hernefjord Ingemar
Mon, 12 Mar 2007 16:02:12 +0100
Re: FPGA (DSP)
Hernefjord Ingemar
Mon, 12 Mar 2007 16:28:17 +0100
Re: FPGA (DSP)
Hernefjord Ingemar
Tue, 13 Mar 2007 14:16:15 +0100
Re: FPGA (DSP)
Hernefjord Ingemar
Wed, 14 Mar 2007 15:52:27 +0100
Re: Gold Ball Bond attaching surface roughness
Hernefjord Ingemar
Mon, 19 Mar 2007 12:06:25 +0100
Re: Gold Ball Bond attaching surface roughness
Hernefjord Ingemar
Mon, 19 Mar 2007 15:07:34 +0100
Re: Gold Ball Bond attaching surface roughness
Hernefjord Ingemar
Mon, 19 Mar 2007 16:40:25 +0100
Re: Gold Ball Bond attaching surface roughness
Hernefjord Ingemar
Thu, 22 Mar 2007 08:12:32 +0100
Re: Gold Ball Bond attaching surface roughness
Hernefjord Ingemar
Thu, 22 Mar 2007 08:28:23 +0100
Re: Metal-core PCBs
Hernefjord Ingemar
Mon, 19 Mar 2007 08:33:30 +0100
Re: NiAu Specification for Al Wedge Wire Bonding
Hernefjord Ingemar
Wed, 14 Mar 2007 16:45:22 +0100
Re: NiAu Specification for Al Wedge Wire Bonding
Hernefjord Ingemar
Thu, 15 Mar 2007 15:56:48 +0100
Seam resistance pulse welding
Hernefjord Ingemar
Tue, 13 Mar 2007 15:08:04 +0100
Re: SMT Solder Joint Strength
Hernefjord Ingemar
Mon, 19 Mar 2007 10:40:22 +0100
Re: Soldering to Beryillum Copper
Hernefjord Ingemar
Thu, 29 Mar 2007 07:52:11 +0200
Re: Use of Type AR Conformal Coating for Military PCBs
Hernefjord Ingemar
Mon, 5 Mar 2007 14:50:33 +0100
New Sender Hfjord
SV: [TN] Cofired gold
Hfjord
Thu, 29 Mar 2007 18:33:39 +0200
SV: [TN] Cofired gold
Hfjord
Fri, 30 Mar 2007 21:27:58 +0200
SV: [TN] Cofired gold
Hfjord
Fri, 30 Mar 2007 21:48:23 +0200
SV: [TN] Good books to read?
Hfjord
Thu, 29 Mar 2007 18:37:37 +0200
SV: [TN] ROHS lead free question (NTC)
Hfjord
Sat, 31 Mar 2007 10:42:53 +0200
SV: [TN] SV: [TN] Cofired gold
Hfjord
Sat, 31 Mar 2007 11:25:54 +0200
New Sender Hogg, Blair K.
Re: Alternative SAC (NTC)
Hogg, Blair K.
Fri, 30 Mar 2007 08:16:06 -0400
Re: ESD question
Hogg, Blair K.
Mon, 5 Mar 2007 09:21:48 -0500
Re: FPGA (DSP)
Hogg, Blair K.
Tue, 13 Mar 2007 08:56:21 -0400
Re: HEAT SINKS
Hogg, Blair K.
Tue, 20 Mar 2007 13:48:57 -0400
Re: I know it's not Friday but...close enough [NTC]
Hogg, Blair K.
Fri, 16 Mar 2007 16:39:05 -0400
Re: immersion silver and exposed copper in small vias
Hogg, Blair K.
Tue, 6 Mar 2007 16:43:50 -0500
New Sender Ian Hanna
Re: FR408 vs. FR-4 in RoHS Compliant SMT Process
Ian Hanna
Mon, 12 Mar 2007 11:48:03 -0500
Re: immersion silver and exposed copper in small vias
Ian Hanna
Tue, 6 Mar 2007 16:26:11 -0500
Re: IPC 6012 : Outgassing Criteria
Ian Hanna
Thu, 29 Mar 2007 12:42:52 -0400
Re: Solder Resist Encroachment onto BGA pads
Ian Hanna
Fri, 30 Mar 2007 11:26:11 -0500
Re: Solder Resist Encroachment onto BGA pads
Ian Hanna
Fri, 30 Mar 2007 12:37:30 -0400
Re: Solder Resist Encroachment onto BGA pads
Ian Hanna
Fri, 30 Mar 2007 14:05:27 -0500
Re: Solderability problems on through holes only.
Ian Hanna
Wed, 21 Mar 2007 15:26:08 -0500
Re: Soldering to Beryillum Copper
Ian Hanna
Wed, 28 Mar 2007 15:04:10 -0400
Re: Via aspect ratio in mixed dielectric PCB's
Ian Hanna
Thu, 29 Mar 2007 09:37:03 -0500
Re: Whisker contamination is solder pot
Ian Hanna
Wed, 21 Mar 2007 14:14:50 -0400
New Sender Inge
Re: "Greenish colour on traces"
Inge
Sun, 18 Mar 2007 09:47:53 +0100
Re: "Greenish colour on traces"
Inge
Mon, 19 Mar 2007 18:46:38 +0100
AlSiC
Inge
Tue, 20 Mar 2007 20:39:20 +0100
Re: AlSiC
Inge
Fri, 23 Mar 2007 20:03:39 +0100
Re: AlSiC conclusion
Inge
Thu, 22 Mar 2007 18:55:57 +0100
Re: BGA Die Attach Criteria
Inge
Tue, 13 Mar 2007 18:44:42 +0100
Re: ESD charges in conformal coatings (conclusion)
Inge
Wed, 28 Mar 2007 19:08:24 +0200
Re: ESD control and fans
Inge
Tue, 13 Mar 2007 18:19:11 +0100
FPGA (DSP)
Inge
Sat, 10 Mar 2007 20:04:38 +0100
Re: FPGA (DSP)
Inge
Sun, 11 Mar 2007 19:07:12 +0100
Re: FPGA (DSP)
Inge
Sun, 11 Mar 2007 23:12:23 +0100
Re: FPGA (DSP)
Inge
Mon, 12 Mar 2007 21:33:09 +0100
Friday Poem NTC
Inge
Fri, 2 Mar 2007 18:50:25 +0100
Re: Gold Ball Bond attaching surface roughness
Inge
Thu, 15 Mar 2007 18:23:07 +0100
Re: Gold Ball Bond attaching surface roughness
Inge
Thu, 15 Mar 2007 22:18:22 +0100
Re: Gold Ball Bond attaching surface roughness
Inge
Thu, 15 Mar 2007 22:31:26 +0100
Re: Gold Ball Bond attaching surface roughness
Inge
Fri, 16 Mar 2007 20:02:27 +0100
Re: Gold Ball Bond attaching surface roughness
Inge
Mon, 19 Mar 2007 18:59:34 +0100
Re: Gold Ball Bond attaching surface roughness
Inge
Wed, 21 Mar 2007 20:31:41 +0100
Re: Hardness Characterization of a PCB Surface Finish
Inge
Fri, 23 Mar 2007 19:51:18 +0100
Re: HEAT SINKS
Inge
Tue, 20 Mar 2007 19:25:11 +0100
Re: I know it's not Friday but...close enough [NTC]
Inge
Thu, 15 Mar 2007 22:29:26 +0100
Re: I know it's not Friday but...close enough [NTC]
Inge
Fri, 16 Mar 2007 19:43:15 +0100
Re: I know it's not Friday but...close enough [NTC]
Inge
Fri, 16 Mar 2007 20:43:33 +0100
NTC: Anrufen: Trikeman
Inge
Fri, 16 Mar 2007 21:26:39 +0100
Re: Pad damage
Inge
Tue, 20 Mar 2007 19:16:35 +0100
Re: ROHS lead free question
Inge
Fri, 23 Mar 2007 19:53:25 +0100
Re: structural adhesive
Inge
Thu, 22 Mar 2007 22:01:11 +0100
SV: [TN] Component Orientation Survey
Inge
Thu, 1 Mar 2007 18:30:55 +0100
SV: [TN] Prediction comes true (NTC)
Inge
Thu, 1 Mar 2007 19:48:01 +0100
SV: [TN] Prediction comes true (NTC)
Inge
Thu, 1 Mar 2007 20:05:19 +0100
SV: [TN] Prediction comes true (NTC)
Inge
Thu, 1 Mar 2007 22:08:12 +0100
SV: [TN] SV: [TN] Prediction comes true (NTC)
Inge
Thu, 1 Mar 2007 23:11:23 +0100
Re: whodunit?
Inge
Sat, 10 Mar 2007 19:29:36 +0100
New Sender Jack Crawford
Re: Solder Purity
Jack Crawford
Thu, 15 Mar 2007 16:58:20 -0500
New Sender Jack Evans
Whisker contamination is solder pot
Jack Evans
Wed, 21 Mar 2007 09:57:21 -0600
Re: Whisker contamination is solder pot
Jack Evans
Wed, 21 Mar 2007 13:04:14 -0600
New Sender James TerVeen
Alpha 5003 flux
James TerVeen
Tue, 6 Mar 2007 09:39:06 -0500
New Sender James Verrette
Re: ESD charges in conformal coatings
James Verrette
Wed, 28 Mar 2007 08:52:35 -0400
Small volume quick turn custom cable supplier
James Verrette
Thu, 15 Mar 2007 16:18:57 -0400
New Sender Jeff Smith
CC fixture issue
Jeff Smith
Thu, 8 Mar 2007 14:10:36 -0600
New Sender Jeffrey Bush
Re: Dry Film Thickness
Jeffrey Bush
Fri, 16 Mar 2007 15:46:16 -0400
Re: Explanation of Cpk (Ppk)
Jeffrey Bush
Wed, 28 Mar 2007 16:48:19 -0400
Re: FR408 vs. FR-4 in RoHS Compliant SMT Process
Jeffrey Bush
Mon, 12 Mar 2007 14:43:25 -0400
Re: Hardness Characterization of a PCB Surface Finish
Jeffrey Bush
Fri, 23 Mar 2007 08:23:33 -0400
Re: I know it's not Friday but...close enough [NTC]
Jeffrey Bush
Fri, 16 Mar 2007 08:12:01 -0400
Re: immersion silver and exposed copper in small vias
Jeffrey Bush
Tue, 6 Mar 2007 16:58:11 -0500
Re: IPC 6012 : Outgassing Criteria
Jeffrey Bush
Thu, 29 Mar 2007 10:59:47 -0400
Re: IPC 6012 : Outgassing Criteria
Jeffrey Bush
Thu, 29 Mar 2007 15:34:58 -0400
Re: IPC ENIG SPECIFICATION
Jeffrey Bush
Thu, 15 Mar 2007 12:45:42 -0400
Re: Laminate material selection
Jeffrey Bush
Mon, 12 Mar 2007 12:00:05 -0400
Re: Legend Ink and ENIG
Jeffrey Bush
Tue, 27 Mar 2007 07:28:03 -0400
Re: Nickel Foot
Jeffrey Bush
Wed, 21 Mar 2007 07:51:54 -0400
Re: Pad damage
Jeffrey Bush
Wed, 21 Mar 2007 07:50:08 -0400
Re: PCB laminate and immersion silver
Jeffrey Bush
Thu, 15 Mar 2007 12:48:25 -0400
Re: PCB Temp Guidelines
Jeffrey Bush
Fri, 23 Mar 2007 13:31:47 -0400
Re: Solder Resist Encroachment onto BGA pads
Jeffrey Bush
Fri, 30 Mar 2007 13:45:23 -0400
Re: Solder Resist Encroachment onto BGA pads
Jeffrey Bush
Fri, 30 Mar 2007 17:19:32 -0400
unsubscribe
Jeffrey Bush
Fri, 30 Mar 2007 17:21:30 -0400
Re: Via aspect ratio in mixed dielectric PCB's
Jeffrey Bush
Thu, 29 Mar 2007 10:51:23 -0400
Re: whodunit?
Jeffrey Bush
Fri, 9 Mar 2007 12:18:27 -0500
New Sender Jim Henderson
Re: whodunit?
Jim Henderson
Fri, 9 Mar 2007 11:47:00 -0500
New Sender Joe Fjelstad
<No subject>
Joe Fjelstad
Tue, 27 Mar 2007 19:31:22 -0400
<No subject>
Joe Fjelstad
Tue, 27 Mar 2007 23:11:59 EDT
Re: Engineering Question [NTC]
Joe Fjelstad
Sat, 17 Mar 2007 16:57:03 -0400
Re: Flex Circuit Scratch...
Joe Fjelstad
Thu, 15 Mar 2007 13:22:25 EDT
I know it's not Friday but... NTC
Joe Fjelstad
Thu, 15 Mar 2007 13:36:02 EDT
Re: Prediction comes true (NTC)
Joe Fjelstad
Thu, 1 Mar 2007 19:33:15 EST
Re: Rigid Flex routing
Joe Fjelstad
Thu, 29 Mar 2007 13:38:23 EDT
Re: ROHS lead free question
Joe Fjelstad
Fri, 23 Mar 2007 21:49:25 EDT
Re: SV: [TN] Prediction comes true (NTC)
Joe Fjelstad
Fri, 2 Mar 2007 14:34:07 EST
Re: whodunit?
Joe Fjelstad
Fri, 9 Mar 2007 12:53:48 EST
Re: [LF] Polymer Core BGA Balls
Joe Fjelstad
Wed, 7 Mar 2007 13:31:28 EST
Re: [LF] Polymer Core BGA Balls
Joe Fjelstad
Wed, 7 Mar 2007 15:02:18 EST
New Sender Joe Russeau
Re: I know it's not Friday but...close enough [NTC]
Joe Russeau
Fri, 16 Mar 2007 13:37:38 -0600
New Sender Joel Alexander
ESD control and fans
Joel Alexander
Mon, 12 Mar 2007 14:52:19 -0500
Re: IPC ENIG SPECIFICATION
Joel Alexander
Thu, 15 Mar 2007 08:19:24 -0400
New Sender John Burke
Re: Alternative SAC (NTC)
John Burke
Fri, 30 Mar 2007 07:30:36 -0700
Re: Alternative SAC (NTC)
John Burke
Fri, 30 Mar 2007 09:41:14 -0700
Re: Alternative SAC (NTC)
John Burke
Fri, 30 Mar 2007 09:49:26 -0700
Re: Anybody else have trouble getting things from Pace?
John Burke
Thu, 8 Mar 2007 15:14:32 -0800
Re: Anybody else have trouble getting things from Pace?
John Burke
Thu, 8 Mar 2007 15:26:23 -0800
Re: APEX NTC
John Burke
Fri, 2 Mar 2007 08:44:00 -0800
Re: copper deterioration (NTC?)
John Burke
Thu, 8 Mar 2007 11:24:45 -0800
Re: Engineering Question
John Burke
Fri, 16 Mar 2007 08:36:26 -0700
Re: Engineering Question
John Burke
Fri, 16 Mar 2007 09:07:12 -0700
Re: Engineering Question
John Burke
Fri, 16 Mar 2007 09:43:12 -0700
Re: I know it's not Friday but...close enough [NTC]
John Burke
Fri, 16 Mar 2007 10:31:41 -0700
Re: immersion silver and exposed copper in small vias
John Burke
Wed, 7 Mar 2007 12:31:13 -0800
Re: immersion silver and exposed copper in small viasNTC
John Burke
Wed, 7 Mar 2007 13:58:39 -0800
Re: Laminate material selection
John Burke
Mon, 12 Mar 2007 10:05:49 -0700
NTC Alternative lead free soldering reviewed
John Burke
Sat, 31 Mar 2007 18:13:26 -0700
Re: Renewed respect for copper (non-technical content)
John Burke
Thu, 1 Mar 2007 14:41:42 -0800
Re: Solder Resist Encroachment onto BGA pads
John Burke
Fri, 30 Mar 2007 09:44:32 -0700
Re: Solder Resist Encroachment onto BGA pads
John Burke
Fri, 30 Mar 2007 10:53:55 -0700
Re: Solderability problems on through holes only.
John Burke
Thu, 22 Mar 2007 08:49:31 -0700
Re: Soldering to Beryillum Copper
John Burke
Wed, 28 Mar 2007 09:46:51 -0700
Re: Soldering to Beryillum Copper
John Burke
Wed, 28 Mar 2007 11:53:50 -0700
Re: Soldering to Beryillum Copper
John Burke
Wed, 28 Mar 2007 13:52:56 -0700
Re: SV: [TN] Prediction comes true (NTC)
John Burke
Thu, 1 Mar 2007 13:42:15 -0800
Re: SV: [TN] Prediction comes true (NTC)
John Burke
Thu, 1 Mar 2007 14:39:09 -0800
Re: whodunit?
John Burke
Fri, 9 Mar 2007 09:41:04 -0800
New Sender John Maxwell
Re: "Greenish colour on traces"
John Maxwell
Mon, 19 Mar 2007 09:06:16 -0700
Re: Chip Capacitor Reliability Question
John Maxwell
Mon, 5 Mar 2007 17:27:49 -0800
New Sender John Parsons
A_50 SIR Phoenix Board
John Parsons
Mon, 19 Mar 2007 15:03:00 -0700
Re: Flip-flop panels
John Parsons
Fri, 2 Mar 2007 10:51:18 -0800
Re: Flip-flop panels
John Parsons
Fri, 2 Mar 2007 11:29:34 -0800
UV Bump
John Parsons
Fri, 30 Mar 2007 13:12:38 -0700
Re: UV Bump
John Parsons
Fri, 30 Mar 2007 13:50:54 -0700
New Sender Jones, Evamaria
Re: Pad damage
Jones, Evamaria
Tue, 20 Mar 2007 10:10:33 -0400
New Sender Joyce Koo
Re: Cofired gold
Joyce Koo
Fri, 30 Mar 2007 08:48:24 -0500
Re: Component Orientation Survey
Joyce Koo
Thu, 1 Mar 2007 08:53:41 -0500
Re: Component Orientation Survey
Joyce Koo
Thu, 1 Mar 2007 09:25:19 -0500
Re: copper deterioration (NTC?)
Joyce Koo
Fri, 9 Mar 2007 08:58:28 -0500
Re: ESD question
Joyce Koo
Tue, 6 Mar 2007 08:40:54 -0500
Re: Gold Ball Bond attaching surface roughness
Joyce Koo
Wed, 21 Mar 2007 10:02:32 -0500
Re: IPC ENIG SPECIFICATION
Joyce Koo
Thu, 15 Mar 2007 08:52:21 -0500
new roadmap
Joyce Koo
Fri, 9 Mar 2007 10:19:33 -0500
Re: NiAu Specification for Al Wedge Wire Bonding
Joyce Koo
Thu, 15 Mar 2007 10:07:19 -0500
Re: PCB Temp Guidelines
Joyce Koo
Fri, 23 Mar 2007 10:23:20 -0500
Re: SV: [TN] Component Orientation Survey
Joyce Koo
Thu, 1 Mar 2007 12:59:38 -0500
Re: weather coatings
Joyce Koo
Tue, 27 Mar 2007 13:30:03 -0500
New Sender Juan T. Marugán
Re: EN 1000015 vs. ESD 20.20
Juan T. Marugán
Fri, 9 Mar 2007 01:09:02 -0600
New Sender Kane, Amol (349)
PCB plating Qualification
Kane, Amol (349)
Tue, 13 Mar 2007 07:18:07 -0400
Re: PCB plating Qualification
Kane, Amol (349)
Tue, 13 Mar 2007 12:03:42 -0400
Soldering to Beryillum Copper
Kane, Amol (349)
Wed, 28 Mar 2007 10:58:51 -0400
Re: Soldering to Beryillum Copper
Kane, Amol (349)
Wed, 28 Mar 2007 11:36:16 -0400
Re: Soldering to Beryillum Copper
Kane, Amol (349)
Wed, 28 Mar 2007 12:04:41 -0400
Re: Soldering to Beryillum Copper
Kane, Amol (349)
Wed, 28 Mar 2007 12:16:36 -0400
Re: Soldering to Beryillum Copper
Kane, Amol (349)
Wed, 28 Mar 2007 12:36:54 -0400
Re: Soldering to Beryillum Copper
Kane, Amol (349)
Wed, 28 Mar 2007 13:22:53 -0400
Re: Soldering to Beryillum Copper
Kane, Amol (349)
Thu, 29 Mar 2007 07:07:21 -0400
New Sender Kathy Kuhlow
Re: Explanation of Cpk (Ppk)
Kathy Kuhlow
Wed, 28 Mar 2007 14:12:38 -0500
Re: UV Bump
Kathy Kuhlow
Fri, 30 Mar 2007 15:45:27 -0500
New Sender Kerry McMullen
Re: Flex Circuit Scratch...
Kerry McMullen
Thu, 15 Mar 2007 13:25:45 -0500
Re: Polymer Core BGA Balls
Kerry McMullen
Wed, 7 Mar 2007 10:11:17 -0500
Re: whodunit?
Kerry McMullen
Fri, 9 Mar 2007 12:17:07 -0500
New Sender Kevin Glidden
Re: immersion silver and exposed copper in small vias
Kevin Glidden
Tue, 6 Mar 2007 16:20:17 -0500
Re: Post Assembly Bow and Twist
Kevin Glidden
Thu, 8 Mar 2007 08:36:05 -0500
New Sender Kolmodin, Todd
Re: whodunit?
Kolmodin, Todd
Fri, 9 Mar 2007 12:27:09 -0500
New Sender Lee parker
Re: Explanation of Cpk (Ppk)
Lee parker
Wed, 28 Mar 2007 11:45:53 -0400
Re: immersion silver and exposed copper in small vias
Lee parker
Wed, 7 Mar 2007 09:40:52 -0500
Re: immersion silver and exposed copper in small vias
Lee parker
Wed, 7 Mar 2007 11:01:36 -0500
Re: T260 tests
Lee parker
Fri, 23 Mar 2007 11:21:26 -0400
New Sender Leland Woodall
Chip Capacitor Reliability Question
Leland Woodall
Mon, 5 Mar 2007 18:22:27 -0600
New Sender Leo Higgins
Re: AlSiC
Leo Higgins
Thu, 22 Mar 2007 23:19:00 -0700
Re: Gold Ball Bond attaching surface roughness
Leo Higgins
Sun, 18 Mar 2007 15:18:11 -0700
Re: Gold Ball Bond attaching surface roughness
Leo Higgins
Thu, 22 Mar 2007 23:32:05 -0700
New Sender Louis Hart
component orientation
Louis Hart
Thu, 1 Mar 2007 13:26:13 -0500
copper deterioration (NTC?)
Louis Hart
Thu, 8 Mar 2007 14:15:54 -0500
Re: Explanation of Cpk (Ppk)
Louis Hart
Wed, 28 Mar 2007 12:20:06 -0400
New Sender Louis, Edwin @ CSE
Re: COMPATIBILITY
Louis, Edwin @ CSE
Wed, 28 Mar 2007 12:57:14 -0400
Re: IPC 6012 : Outgassing Criteria
Louis, Edwin @ CSE
Thu, 29 Mar 2007 12:01:52 -0400
Re: T260 tests
Louis, Edwin @ CSE
Thu, 29 Mar 2007 15:27:58 -0400
New Sender Lum Wee Mei
IPC 6012 : Outgassing Criteria
Lum Wee Mei
Thu, 29 Mar 2007 11:17:26 +0800
New Sender Macko, Joe @ IEC
Re: Double sided reflow
Macko, Joe @ IEC
Wed, 28 Mar 2007 12:33:53 -0800
New Sender Mark Eckert
Weather coating
Mark Eckert
Sun, 25 Mar 2007 21:24:10 -0600
Re: weather coatings
Mark Eckert
Thu, 29 Mar 2007 22:58:23 -0600
New Sender Marsico, James
Re: AlSiC
Marsico, James
Wed, 21 Mar 2007 07:21:55 -0400
Re: AlSiC
Marsico, James
Thu, 22 Mar 2007 08:26:33 -0400
Re: AlSiC
Marsico, James
Thu, 22 Mar 2007 08:30:23 -0400
Re: AlSiC conclusion
Marsico, James
Thu, 22 Mar 2007 14:16:58 -0400
Re: ESD charges in conformal coatings
Marsico, James
Tue, 27 Mar 2007 07:25:47 -0400
Laminate material selection
Marsico, James
Mon, 12 Mar 2007 08:31:01 -0400
Soldering using Sn96
Marsico, James
Fri, 30 Mar 2007 07:46:19 -0400
Re: Soldering using Sn96
Marsico, James
Fri, 30 Mar 2007 08:20:52 -0400
structural adhesive
Marsico, James
Thu, 22 Mar 2007 14:25:45 -0400
New Sender Marty W. Sheppard
Approved Substitute for Mil-P-13949/7 (GR)
Marty W. Sheppard
Mon, 26 Mar 2007 06:47:28 -0600
New Sender Matt Kehoe-SIPAD Systems
Re: (2) [TN] Paste Volume, off contact vs non off contact
Matt Kehoe-SIPAD Systems
Mon, 12 Mar 2007 18:19:05 -0400
Re: Paste Volume, off contact vs non off contact
Matt Kehoe-SIPAD Systems
Mon, 12 Mar 2007 08:52:11 -0400
Re: Paste Volume, off contact vs non off contact
Matt Kehoe-SIPAD Systems
Mon, 12 Mar 2007 08:56:54 -0400
Re: Paste Volume, off contact vs non off contact
Matt Kehoe-SIPAD Systems
Mon, 12 Mar 2007 08:50:23 -0400
Re: Reflow Solder fixtures
Matt Kehoe-SIPAD Systems
Wed, 21 Mar 2007 13:52:22 -0400
New Sender Matt Kehoe
Paste Volume, off contact vs non off contact
Matt Kehoe
Fri, 9 Mar 2007 11:00:46 -0600
New Sender McGlaughlin, Jeffrey A
Re: Component Orientation Survey
McGlaughlin, Jeffrey A
Thu, 1 Mar 2007 09:02:01 -0500
Post Assembly Bow and Twist
McGlaughlin, Jeffrey A
Thu, 8 Mar 2007 07:04:50 -0500
Re: Post Assembly Bow and Twist
McGlaughlin, Jeffrey A
Thu, 8 Mar 2007 09:12:38 -0500
Reflow Solder fixtures
McGlaughlin, Jeffrey A
Wed, 21 Mar 2007 13:13:20 -0400
New Sender Michelle Michelotti
IPC's Design for Manufacture workshop on April 17, 2007 - Leeds, UK
Michelle Michelotti
Thu, 29 Mar 2007 09:57:38 -0500
Join IPC's REACH Webcast Series April 11 & 18, 2007
Michelle Michelotti
Fri, 30 Mar 2007 08:38:04 -0500
Join IPC, in Singapore, for a series of workshops! Register today!
Michelle Michelotti
Mon, 26 Mar 2007 10:31:13 -0500
Register Now for IPC's Design for Manufacture Workshop
Michelle Michelotti
Thu, 1 Mar 2007 11:29:50 -0600
Register Now!
Michelle Michelotti
Fri, 2 Mar 2007 09:45:44 -0600
Remember to Register for IPC's workshops on April 17 & 18, 2007!
Michelle Michelotti
Tue, 27 Mar 2007 09:10:34 -0500
New Sender Miguel Vallejo
Re: Solderability problems on through holes only.
Miguel Vallejo
Wed, 21 Mar 2007 14:21:13 -0700
New Sender Mike Buetow
<No subject>
Mike Buetow
Tue, 27 Mar 2007 18:50:04 -0500
New Sender Mike Fenner
Re: immersion silver and exposed copper in small vias NTC
Mike Fenner
Wed, 7 Mar 2007 11:57:19 -0000
Re: Prediction comes true (NTC)
Mike Fenner
Thu, 1 Mar 2007 18:29:59 -0000
Re: ROHS lead free question
Mike Fenner
Fri, 23 Mar 2007 12:23:03 -0000
Re: ROHS lead free question
Mike Fenner
Fri, 23 Mar 2007 22:08:15 -0000
Re: ROHS lead free question
Mike Fenner
Thu, 29 Mar 2007 09:23:47 +0100
Re: Solder Purity
Mike Fenner
Thu, 15 Mar 2007 18:17:13 -0000
Re: Soldering using Sn96
Mike Fenner
Fri, 30 Mar 2007 17:40:16 +0100
New Sender mp3
Rigid Flex routing
mp3
Sun, 25 Mar 2007 19:18:05 +0530
Re: Rigid Flex routing
mp3
Mon, 26 Mar 2007 18:27:20 +0530
New Sender N Burtt
Re: IPC ENIG SPECIFICATION
N Burtt
Thu, 15 Mar 2007 09:27:04 -0600
PCB laminate and immersion silver
N Burtt
Thu, 15 Mar 2007 11:39:55 -0600
New Sender Newland, Scott
Re: [LF] Polymer Core BGA Balls
Newland, Scott
Fri, 9 Mar 2007 07:59:38 -0500
New Sender Nowland, Russell Howard (Russell)
Re: Panel tab breakoff burrs
Nowland, Russell Howard (Russell)
Tue, 20 Mar 2007 12:35:52 -0500
New Sender P. Langeveld
Re: Gold %
P. Langeveld
Mon, 26 Mar 2007 19:39:16 +0200
New Sender Pasquito, Helena
Via aspect ratio in mixed dielectric PCB's
Pasquito, Helena
Wed, 28 Mar 2007 14:38:24 -0400
Re: Via aspect ratio in mixed dielectric PCB's
Pasquito, Helena
Thu, 29 Mar 2007 10:11:07 -0400
New Sender Paul Baine
Qualification Testing for H1 Flux
Paul Baine
Fri, 9 Mar 2007 13:17:28 -0500
New Sender Paul Reid
Re: Laminate Qualification.
Paul Reid
Thu, 1 Mar 2007 15:46:20 -0500
New Sender Paymon Sani
Re: COMPATIBILITY
Paymon Sani
Wed, 28 Mar 2007 11:57:44 -0400
Re: COMPATIBILITY
Paymon Sani
Wed, 28 Mar 2007 13:49:01 -0400
Re: COMPATIBILITY
Paymon Sani
Wed, 28 Mar 2007 14:37:17 -0400
Re: Double sided reflow
Paymon Sani
Wed, 28 Mar 2007 16:53:32 -0400
Re: Double sided reflow
Paymon Sani
Wed, 28 Mar 2007 23:07:59 -0400
Re: Gold %
Paymon Sani
Mon, 26 Mar 2007 12:29:16 -0400
IPC Surface Finish Inspection - ENIG
Paymon Sani
Wed, 28 Mar 2007 16:59:00 -0400
Nickel Foot
Paymon Sani
Tue, 20 Mar 2007 12:22:31 -0400
Re: Nickel Foot
Paymon Sani
Wed, 21 Mar 2007 11:59:45 -0400
Solder Resist Encroachment onto BGA pads
Paymon Sani
Fri, 30 Mar 2007 12:02:13 -0400
Re: Solder Resist Encroachment onto BGA pads
Paymon Sani
Fri, 30 Mar 2007 13:15:26 -0400
Re: Solder Resist Encroachment onto BGA pads
Paymon Sani
Fri, 30 Mar 2007 15:23:32 -0400
Re: Solder Resist Encroachment onto BGA pads
Paymon Sani
Fri, 30 Mar 2007 22:36:48 -0400
Re: Solderability problems on through holes only.
Paymon Sani
Wed, 21 Mar 2007 17:01:52 -0400
Re: Solderability problems on through holes only.
Paymon Sani
Thu, 22 Mar 2007 09:32:21 -0400
Re: Solderability problems on through holes only.
Paymon Sani
Sat, 24 Mar 2007 08:49:51 -0400
Surface finish inspection
Paymon Sani
Thu, 29 Mar 2007 13:13:40 -0400
New Sender Peter Wong
Solderability problems on through holes only.
Peter Wong
Wed, 21 Mar 2007 13:17:55 -0700
Re: Solderability problems on through holes only.
Peter Wong
Wed, 21 Mar 2007 14:48:25 -0700
New Sender Phil Kinner
Re: Use of Type AR Conformal Coating for Military PCBs
Phil Kinner
Mon, 5 Mar 2007 15:39:37 -0000
Re: UV Bump
Phil Kinner
Fri, 30 Mar 2007 22:10:19 +0100
New Sender Phil Nutting
Re: Anybody else have trouble getting things from Pace?
Phil Nutting
Thu, 8 Mar 2007 16:56:56 -0500
Re: Component Orientation Survey
Phil Nutting
Thu, 1 Mar 2007 10:32:05 -0500
Re: Component Orientation Survey
Phil Nutting
Thu, 1 Mar 2007 08:56:31 -0500
Re: HEAT SINKS
Phil Nutting
Tue, 20 Mar 2007 14:32:40 -0400
Re: Laminate material selection
Phil Nutting
Mon, 12 Mar 2007 12:58:57 -0400
Re: Whisker contamination is solder pot
Phil Nutting
Wed, 21 Mar 2007 15:00:08 -0400
New Sender Phillip Bavaro
Re: Double sided reflow
Phillip Bavaro
Thu, 29 Mar 2007 03:44:49 +0800
Re: Double sided reflow
Phillip Bavaro
Thu, 29 Mar 2007 05:12:37 +0800
Re: ESD charges in conformal coatings (conclusion)
Phillip Bavaro
Thu, 29 Mar 2007 03:30:52 +0800
high temp adhesive film
Phillip Bavaro
Fri, 30 Mar 2007 13:20:08 +0800
Panel tab breakoff burrs
Phillip Bavaro
Wed, 21 Mar 2007 01:01:07 +0800
Re: Reflow Solder fixtures
Phillip Bavaro
Thu, 22 Mar 2007 03:31:57 -0700
New Sender prakash
Re: Cognex Vision Card Repair Update...
prakash
Sun, 11 Mar 2007 23:29:56 +0800
New Sender pras chop
Toolings and Fixture checklist required
pras chop
Fri, 2 Mar 2007 06:46:41 +0000
Toolings and Fixture checklist required --- (URGENT)
pras chop
Mon, 5 Mar 2007 06:42:57 +0000
New Sender R Sedlak
Re: Dry Film Thickness
R Sedlak
Fri, 16 Mar 2007 12:54:10 -0700
Re: Nickel Foot
R Sedlak
Tue, 20 Mar 2007 10:30:51 -0700
Re: PCB Cleanliness
R Sedlak
Wed, 28 Mar 2007 14:53:53 -0700
Re: PCB Cleanliness/Soft Water
R Sedlak
Thu, 29 Mar 2007 05:28:02 -0700
Re: Solderability problems on through holes only.
R Sedlak
Wed, 21 Mar 2007 13:28:47 -0700
New Sender Ralph Richart
Legend Ink and ENIG
Ralph Richart
Mon, 26 Mar 2007 18:26:46 -0700
Soldermask Blisters
Ralph Richart
Mon, 19 Mar 2007 08:58:06 -0700
New Sender Randy Bock Sr.
Re: NTC: Double Posting
Randy Bock Sr.
Wed, 21 Mar 2007 12:52:34 -0400
New Sender Reuven Rokah
Re: SMT Solder Joint Strength
Reuven Rokah
Fri, 16 Mar 2007 21:21:16 +0200
Re: SMT Solder Joint Strength
Reuven Rokah
Fri, 16 Mar 2007 21:43:43 +0200
Re: SMT Solder Joint Strength
Reuven Rokah
Fri, 16 Mar 2007 22:17:38 +0200
New Sender Richard Kraszewski
Re: Explanation of CpK (Ppk)
Richard Kraszewski
Wed, 28 Mar 2007 11:51:11 -0500
Re: PCB PACKAGING MATERIAL & Baking Question
Richard Kraszewski
Mon, 26 Mar 2007 14:00:05 -0500
New Sender Roger Stoops
Re: Component Orientation Survey
Roger Stoops
Thu, 1 Mar 2007 11:20:18 -0500
Re: ESD question
Roger Stoops
Mon, 5 Mar 2007 09:22:03 -0500
Re: whodunit?
Roger Stoops
Fri, 9 Mar 2007 10:44:09 -0500
New Sender Roland Jaquet
Seeking PCB proto manufacturers
Roland Jaquet
Wed, 7 Mar 2007 09:42:59 +0100
Re: Seeking PCB proto manufacturers
Roland Jaquet
Wed, 7 Mar 2007 15:57:15 +0100
New Sender Rolfe, David
Thick BT board Suppliers
Rolfe, David
Tue, 27 Mar 2007 13:41:41 -0400
New Sender Ryan Grant
Re: (2) [TN] Paste Volume, off contact vs non off contact
Ryan Grant
Tue, 13 Mar 2007 08:42:24 -0600
Re: Engineering Question
Ryan Grant
Fri, 16 Mar 2007 09:30:50 -0600
Explanation of Cpk (Ppk)
Ryan Grant
Wed, 28 Mar 2007 09:39:06 -0600
Re: Explanation of Cpk (Ppk)
Ryan Grant
Wed, 28 Mar 2007 16:52:03 -0600
Re: Flip-flop panels
Ryan Grant
Fri, 2 Mar 2007 14:15:27 -0700
Re: Paste Volume, off contact vs non off contact
Ryan Grant
Fri, 9 Mar 2007 15:14:07 -0700
Re: Via in Pad question
Ryan Grant
Fri, 2 Mar 2007 15:17:59 -0700
Re: [LF] Polymer Core BGA Balls
Ryan Grant
Fri, 9 Mar 2007 15:21:06 -0700
New Sender Scott Decker
Re: I know it's not Friday but...close enough [NTC]
Scott Decker
Fri, 16 Mar 2007 10:02:52 -0700
Re: Post Assembly Bow and Twist
Scott Decker
Thu, 8 Mar 2007 08:24:12 -0700
New Sender Scott Lefebvre
PCB PACKAGING MATERIAL & Baking Question
Scott Lefebvre
Mon, 26 Mar 2007 11:58:20 -0700
Re: Reflow Solder fixtures
Scott Lefebvre
Thu, 22 Mar 2007 10:51:28 -0700
New Sender Sherif Refaat
Re: Flip-flop panels
Sherif Refaat
Fri, 2 Mar 2007 16:31:32 -0500
Re: Number of allowed X-outs?
Sherif Refaat
Fri, 2 Mar 2007 10:23:57 -0500
New Sender Smith, Richard
Re: Post Assembly Bow and Twist
Smith, Richard
Thu, 8 Mar 2007 13:52:32 -0500
New Sender Stadem, Richard D.
Re: "Greenish colour on traces"
Stadem, Richard D.
Mon, 19 Mar 2007 07:30:49 -0500
Re: AlSiC conclusion
Stadem, Richard D.
Thu, 22 Mar 2007 13:10:16 -0500
Re: Alternative SAC (NTC)
Stadem, Richard D.
Fri, 30 Mar 2007 09:49:03 -0500
Re: A_50 SIR Phoenix Board
Stadem, Richard D.
Tue, 20 Mar 2007 08:01:47 -0500
Re: BGA footprint
Stadem, Richard D.
Fri, 2 Mar 2007 08:03:40 -0600
Re: BGA footprint
Stadem, Richard D.
Fri, 2 Mar 2007 11:09:22 -0600
Re: BGA footprint
Stadem, Richard D.
Fri, 2 Mar 2007 12:25:03 -0600
Re: Component Orientation Survey
Stadem, Richard D.
Thu, 1 Mar 2007 08:59:25 -0600
Re: Double sided reflow
Stadem, Richard D.
Wed, 28 Mar 2007 16:41:09 -0500
Re: Double sided reflow
Stadem, Richard D.
Wed, 28 Mar 2007 16:44:46 -0500
Re: Engineering Question
Stadem, Richard D.
Fri, 16 Mar 2007 10:22:26 -0500
Re: Engineering Question
Stadem, Richard D.
Fri, 16 Mar 2007 11:21:08 -0500
Re: Engineering Question
Stadem, Richard D.
Fri, 16 Mar 2007 11:22:27 -0500
Re: ESD question
Stadem, Richard D.
Mon, 5 Mar 2007 08:51:33 -0600
Re: Flip-flop panels
Stadem, Richard D.
Fri, 2 Mar 2007 14:58:41 -0600
Re: Flip-flop panels
Stadem, Richard D.
Fri, 2 Mar 2007 15:35:06 -0600
Re: FPGA (DSP)
Stadem, Richard D.
Wed, 14 Mar 2007 08:09:49 -0500
Re: Gold %
Stadem, Richard D.
Mon, 26 Mar 2007 12:33:56 -0500
Re: Gold %
Stadem, Richard D.
Mon, 26 Mar 2007 12:58:33 -0500
Re: Gold Ball Bond attaching surface roughness
Stadem, Richard D.
Thu, 15 Mar 2007 17:30:14 -0500
Re: Gold Ball Bond attaching surface roughness
Stadem, Richard D.
Thu, 15 Mar 2007 17:35:18 -0500
Re: I know it's not Friday but...close enough [NTC]
Stadem, Richard D.
Fri, 16 Mar 2007 13:06:46 -0500
Re: immersion silver and exposed copper in small viasNTC
Stadem, Richard D.
Wed, 7 Mar 2007 14:47:45 -0600
Re: IPC ENIG SPECIFICATION
Stadem, Richard D.
Thu, 15 Mar 2007 10:51:49 -0500
Re: IPC ENIG SPECIFICATION
Stadem, Richard D.
Thu, 15 Mar 2007 11:47:58 -0500
Re: NTC: Double Posting
Stadem, Richard D.
Wed, 21 Mar 2007 12:29:00 -0500
Re: Number of allowed X-outs?
Stadem, Richard D.
Fri, 2 Mar 2007 09:47:09 -0600
Re: Pad damage
Stadem, Richard D.
Tue, 20 Mar 2007 09:31:10 -0500
Re: PCB PACKAGING MATERIAL & Baking Question
Stadem, Richard D.
Tue, 27 Mar 2007 06:43:10 -0500
Re: Prediction comes true
Stadem, Richard D.
Thu, 1 Mar 2007 07:06:00 -0600
Re: Prediction comes true (NTC)
Stadem, Richard D.
Thu, 1 Mar 2007 12:59:34 -0600
Re: Press-fit Soldering
Stadem, Richard D.
Mon, 26 Mar 2007 10:33:08 -0500
Re: Reflow Solder fixtures
Stadem, Richard D.
Wed, 21 Mar 2007 12:33:52 -0500
Re: Reflow Solder fixtures
Stadem, Richard D.
Wed, 21 Mar 2007 12:33:30 -0500
Re: SMT Solder Joint Strength
Stadem, Richard D.
Fri, 16 Mar 2007 15:37:01 -0500
Re: SMT Solder Joint Strength
Stadem, Richard D.
Fri, 16 Mar 2007 15:39:01 -0500
Re: SMT Solder Joint Strength
Stadem, Richard D.
Fri, 16 Mar 2007 16:02:03 -0500
Re: Solder Resist Encroachment onto BGA pads
Stadem, Richard D.
Fri, 30 Mar 2007 11:15:47 -0500
Re: Solderability problems on through holes only.
Stadem, Richard D.
Wed, 21 Mar 2007 15:40:15 -0500
Re: Solderability problems on through holes only.
Stadem, Richard D.
Wed, 21 Mar 2007 16:25:15 -0500
Re: Solderability problems on through holes only.
Stadem, Richard D.
Thu, 22 Mar 2007 11:04:43 -0500
Re: Via aspect ratio in mixed dielectric PCB's
Stadem, Richard D.
Thu, 29 Mar 2007 09:22:10 -0500
Re: Via in Pad question
Stadem, Richard D.
Sat, 3 Mar 2007 06:38:12 -0600
New Sender Stephen Pence
Re: Reflow Solder fixtures
Stephen Pence
Wed, 21 Mar 2007 14:02:37 -0400
New Sender Stephen Pierce
Re: Laminate Qualification.
Stephen Pierce
Mon, 5 Mar 2007 13:23:27 -0800
New Sender stephengregory5849
Re: Gold Ball Bond attaching surface roughness
stephengregory5849
Thu, 15 Mar 2007 17:47:37 -0500
Re: I know it's not Friday but...close enough [NTC]
stephengregory5849
Thu, 15 Mar 2007 17:49:53 -0500
Re: unsubscribe
stephengregory5849
Fri, 30 Mar 2007 18:27:03 -0500
New Sender Steve Gregory
Anybody else have trouble getting things from Pace?
Steve Gregory
Thu, 8 Mar 2007 15:19:40 -0600
Re: Component Orientation Survey
Steve Gregory
Thu, 1 Mar 2007 07:02:50 -0600
Flex Circuit Scratch...
Steve Gregory
Thu, 15 Mar 2007 09:35:14 -0500
Re: Flip-flop panels
Steve Gregory
Fri, 2 Mar 2007 13:09:25 -0600
Re: Good books to read?
Steve Gregory
Tue, 27 Mar 2007 13:25:18 -0500
Re: HEAT SINKS
Steve Gregory
Tue, 20 Mar 2007 13:10:56 -0500
Re: HEAT SINKS
Steve Gregory
Tue, 20 Mar 2007 13:45:16 -0500
Re: I know it's not Friday but...close enough [NTC]
Steve Gregory
Thu, 15 Mar 2007 14:20:56 -0500
Re: immersion silver and exposed copper in small vias
Steve Gregory
Tue, 6 Mar 2007 15:24:24 -0600
Re: Laminate Qualification.
Steve Gregory
Thu, 1 Mar 2007 15:32:31 -0600
Re: Metal-core PCBs
Steve Gregory
Fri, 16 Mar 2007 09:00:13 -0500
Re: Reflow Solder fixtures
Steve Gregory
Wed, 21 Mar 2007 12:23:50 -0500
Re: Solder Resist Encroachment onto BGA pads
Steve Gregory
Fri, 30 Mar 2007 12:50:47 -0500
Re: Solder Resist Encroachment onto BGA pads
Steve Gregory
Fri, 30 Mar 2007 15:11:22 -0500
Re: Soldering using Sn96
Steve Gregory
Fri, 30 Mar 2007 06:58:12 -0500
Re: Soldermask Blisters
Steve Gregory
Mon, 19 Mar 2007 14:43:37 -0500
Re: Toolings and Fixture checklist required --- (URGENT)
Steve Gregory
Mon, 5 Mar 2007 06:57:57 -0600
Re: whodunit?
Steve Gregory
Fri, 9 Mar 2007 10:48:11 -0600
New Sender Steve Kelly
Re: Flex Circuit Scratch...
Steve Kelly
Thu, 15 Mar 2007 16:55:56 -0400
IPC 6012 versus 6013
Steve Kelly
Mon, 5 Mar 2007 16:55:02 -0500
New Sender Steve Smith
Re: Component Orientation Survey
Steve Smith
Thu, 1 Mar 2007 09:10:33 -0500
New Sender Tan, Geok Ang
"Greenish colour on traces"
Tan, Geok Ang
Sat, 17 Mar 2007 20:06:10 +0800
Re: "Greenish colour on traces"
Tan, Geok Ang
Sun, 18 Mar 2007 15:49:22 +0800
Re: "Greenish colour on traces"
Tan, Geok Ang
Mon, 19 Mar 2007 07:27:45 +0800
Re: "Greenish colour on traces"
Tan, Geok Ang
Mon, 19 Mar 2007 21:27:52 +0800
Re: Laminate Qualification.
Tan, Geok Ang
Fri, 2 Mar 2007 08:34:12 +0800
New Sender Ted Kong
Rigid flex PCB manufacturer
Ted Kong
Wed, 21 Mar 2007 14:01:01 -0700
New Sender Ted Tontis
Re: Component Orientation Survey
Ted Tontis
Thu, 1 Mar 2007 10:24:43 -0600
New Sender Tempea, Ioan
Re: Component Orientation Survey
Tempea, Ioan
Thu, 1 Mar 2007 07:53:26 -0500
Double sided reflow
Tempea, Ioan
Tue, 27 Mar 2007 15:42:32 -0400
Re: Double sided reflow
Tempea, Ioan
Wed, 28 Mar 2007 16:13:01 -0400
Re: Double sided reflow... clarification
Tempea, Ioan
Fri, 30 Mar 2007 08:12:04 -0400
Flip-flop panels
Tempea, Ioan
Fri, 2 Mar 2007 13:23:13 -0500
Re: Flip-flop panels
Tempea, Ioan
Fri, 2 Mar 2007 14:15:33 -0500
Re: Solderability problems on through holes only.
Tempea, Ioan
Thu, 22 Mar 2007 07:49:08 -0400
Re: Soldering to Beryillum Copper
Tempea, Ioan
Wed, 28 Mar 2007 11:40:17 -0400
New Sender Terry Kozlyk
Re: BGA footprint
Terry Kozlyk
Fri, 2 Mar 2007 05:00:56 -0700
Comps on opposite side of PCB sharing GND vias
Terry Kozlyk
Tue, 13 Mar 2007 05:10:17 -0600
New Sender Thomas A. Frayda
IPC-4101/101 vs /121
Thomas A. Frayda
Tue, 6 Mar 2007 13:50:03 -0600
New Sender Tina Nerad
An IPC webcast you shouldn't miss - Embedded Passive Components - Costs More or Costs Less?
Tina Nerad
Thu, 22 Mar 2007 09:25:37 -0500
Call for registration - IPC Lead Free workshops - 4/17/07 & 4/18/07, in Bannockburn, IL
Tina Nerad
Tue, 13 Mar 2007 15:19:40 -0500
Call for Registration - IPC REACH Webcast Series
Tina Nerad
Thu, 15 Mar 2007 14:56:49 -0500
IPC International Conference on Lead Free Materials & Surface Finishes, May 8-9, 2007, in San Jose, CA
Tina Nerad
Mon, 19 Mar 2007 16:06:41 -0500
IPC Workshop: Compliant Electronics for EU Applications on 3/13-14/07 in Dallas, TX
Tina Nerad
Thu, 8 Mar 2007 13:01:40 -0600
IPC's Designing with your 'Thumbs' - May 21, 2007, Bannockburn, IL
Tina Nerad
Mon, 19 Mar 2007 10:42:11 -0500
IPC/JEDEC Global Conference on Lead Free Reliability & Reliability Testing for RoHS Lead Free Electronics, April 10-12, 2007, in Boston, MA
Tina Nerad
Wed, 21 Mar 2007 10:40:24 -0500
IPC/JEDEC Global Conference on LF Reliability & Reliability Testing for RoHS LF Electronics - April 10-12, 2007 in Boston, MA
Tina Nerad
Mon, 5 Mar 2007 14:12:46 -0600
REACH Webcast Series - April 11 & 18, 2007
Tina Nerad
Wed, 21 Mar 2007 16:00:19 -0500
New Sender Tony Steinke
Re: Nickel Foot
Tony Steinke
Tue, 20 Mar 2007 16:23:39 -0500
New Sender Upton, Shawn
Chip Scale Packagine (CSP)
Upton, Shawn
Tue, 13 Mar 2007 09:50:39 -0400
Re: Chip Scale Packagine (CSP)
Upton, Shawn
Tue, 13 Mar 2007 10:30:13 -0400
Re: Chip Scale Packagine (CSP)
Upton, Shawn
Thu, 15 Mar 2007 08:08:16 -0400
Re: Chip Scale Packagine (CSP)
Upton, Shawn
Thu, 15 Mar 2007 08:48:34 -0400
Re: Component Orientation Survey
Upton, Shawn
Thu, 1 Mar 2007 09:03:20 -0500
Re: Component Orientation Survey
Upton, Shawn
Thu, 1 Mar 2007 09:34:22 -0500
Re: Comps on opposite side of PCB sharing GND vias
Upton, Shawn
Tue, 13 Mar 2007 08:25:10 -0400
PCB Temp Guidelines
Upton, Shawn
Fri, 23 Mar 2007 10:10:48 -0400
Re: ROHS lead free question (NTC)
Upton, Shawn
Thu, 29 Mar 2007 07:59:44 -0400
New Sender valerie St. Cyr
Re: Laminate material selection
valerie St. Cyr
Mon, 12 Mar 2007 13:00:32 -0400
New Sender Victor G. Hernandez
BGA Die Attach Criteria
Victor G. Hernandez
Tue, 13 Mar 2007 06:55:42 -0500
Gold Ball Bond attaching surface roughness
Victor G. Hernandez
Thu, 15 Mar 2007 07:25:17 -0500
Re: Gold Ball Bond attaching surface roughness
Victor G. Hernandez
Thu, 15 Mar 2007 13:48:00 -0500
Re: Gold Ball Bond attaching surface roughness
Victor G. Hernandez
Thu, 15 Mar 2007 15:26:18 -0500
Re: Gold Ball Bond attaching surface roughness
Victor G. Hernandez
Fri, 16 Mar 2007 05:38:28 -0500
Re: Gold Ball Bond attaching surface roughness
Victor G. Hernandez
Mon, 19 Mar 2007 06:40:42 -0500
Re: Gold Ball Bond attaching surface roughness
Victor G. Hernandez
Mon, 19 Mar 2007 09:39:42 -0500
Re: Gold Ball Bond attaching surface roughness
Victor G. Hernandez
Mon, 19 Mar 2007 12:47:13 -0500
Re: Gold Ball Bond attaching surface roughness
Victor G. Hernandez
Wed, 21 Mar 2007 06:43:40 -0500
Re: Gold Ball Bond attaching surface roughness
Victor G. Hernandez
Wed, 21 Mar 2007 09:38:37 -0500
Re: IPC 6012 : Outgassing Criteria
Victor G. Hernandez
Thu, 29 Mar 2007 10:23:35 -0500
Re: Solder Resist Encroachment onto BGA pads
Victor G. Hernandez
Fri, 30 Mar 2007 14:17:55 -0500
FW: [TN] BGA Die Attach Criteria
Victor G. Hernandez
Wed, 14 Mar 2007 06:46:34 -0500
New Sender Wayne Thayer
Re: BGA footprint
Wayne Thayer
Thu, 1 Mar 2007 22:05:56 -0500
Re: Cofired gold
Wayne Thayer
Fri, 30 Mar 2007 06:18:18 -0400
Re: FPGA (DSP)
Wayne Thayer
Sun, 11 Mar 2007 09:59:47 -0500
Re: FPGA (DSP)
Wayne Thayer
Mon, 12 Mar 2007 08:56:57 -0400
Re: immersion silver and exposed copper in small vias
Wayne Thayer
Tue, 6 Mar 2007 15:51:42 -0500
Re: Paste Volume, off contact vs non off contact
Wayne Thayer
Mon, 12 Mar 2007 15:49:46 -0400
Re: Press-fit Soldering
Wayne Thayer
Mon, 26 Mar 2007 12:30:27 -0400
Re: SV: [TN] Cofired gold
Wayne Thayer
Fri, 30 Mar 2007 16:10:51 -0400
New Sender Wenger, George M.
Re: Chip Capacitor Reliability Question
Wenger, George M.
Mon, 5 Mar 2007 21:12:36 -0500
Re: IPC ENIG SPECIFICATION
Wenger, George M.
Wed, 14 Mar 2007 22:26:18 -0400
Re: Solderability problems on through holes only.
Wenger, George M.
Wed, 21 Mar 2007 17:14:56 -0400
Re: Soldering using Sn96
Wenger, George M.
Fri, 30 Mar 2007 08:39:09 -0400
New Sender Werner Engelmaier
Re: Chip Capacitor Reliability Question
Werner Engelmaier
Tue, 6 Mar 2007 11:52:11 EST
Re: COMPATIBILITY
Werner Engelmaier
Wed, 28 Mar 2007 13:19:35 EDT
Re: Engineering Question  [NTC]
Werner Engelmaier
Fri, 16 Mar 2007 12:44:37 EDT
Re: Engineering Question
Werner Engelmaier
Fri, 16 Mar 2007 11:08:06 EDT
Re: Engineering Question
Werner Engelmaier
Fri, 16 Mar 2007 11:51:44 EDT
Re: Engineering Question
Werner Engelmaier
Fri, 16 Mar 2007 11:55:16 EDT
Re: Engineering Question
Werner Engelmaier
Fri, 16 Mar 2007 12:33:34 EDT
Re: Engineering Question
Werner Engelmaier
Fri, 16 Mar 2007 12:49:56 EDT
Re: Engineering Question
Werner Engelmaier
Fri, 16 Mar 2007 12:58:09 EDT
Re: Environmental Tests For PCB
Werner Engelmaier
Fri, 30 Mar 2007 20:00:08 EDT
Re: FR408 vs. FR-4 in RoHS Compliant SMT Process
Werner Engelmaier
Mon, 12 Mar 2007 13:03:45 EDT
Re: FR408 vs. FR-4 in RoHS Compliant SMT Process
Werner Engelmaier
Mon, 12 Mar 2007 13:12:26 EDT
Re: Gold %
Werner Engelmaier
Mon, 26 Mar 2007 14:04:42 EST
Re: Gold Ball Bond attaching surface roughness
Werner Engelmaier
Wed, 21 Mar 2007 22:38:49 EDT
Re: I know it's not Friday but...close enough [NTC]
Werner Engelmaier
Thu, 15 Mar 2007 14:54:05 EDT
Re: I know it's not Friday but...close enough [NTC]
Werner Engelmaier
Thu, 15 Mar 2007 15:43:16 EDT
Re: I know it's not Friday but...close enough [NTC]
Werner Engelmaier
Fri, 16 Mar 2007 13:45:58 EDT
Re: I know it's not Friday but...close enough [NTC]
Werner Engelmaier
Fri, 16 Mar 2007 13:48:32 EDT
Re: I know it's not Friday but...close enough [NTC]
Werner Engelmaier
Fri, 16 Mar 2007 14:55:19 EDT
Re: I know it's not Friday but...close enough [NTC]
Werner Engelmaier
Fri, 16 Mar 2007 16:00:14 EDT
Re: immersion silver and exposed copper in small vias
Werner Engelmaier
Tue, 6 Mar 2007 19:05:19 EST
Re: immersion silver and exposed copper in small vias
Werner Engelmaier
Wed, 7 Mar 2007 13:43:51 EST
Re: IPC ENIG SPECIFICATION
Werner Engelmaier
Thu, 15 Mar 2007 08:06:53 EDT
Re: IPC ENIG SPECIFICATION
Werner Engelmaier
Thu, 15 Mar 2007 10:27:25 EDT
Re: IPC ENIG SPECIFICATION
Werner Engelmaier
Thu, 15 Mar 2007 10:30:23 EDT
Re: Lead coating meniscus cracking
Werner Engelmaier
Wed, 7 Mar 2007 10:16:32 EST
Re: Nickel Foot
Werner Engelmaier
Wed, 21 Mar 2007 22:15:26 EDT
Re: PCB PACKAGING MATERIAL & Baking Question
Werner Engelmaier
Tue, 27 Mar 2007 07:33:25 EDT
Re: PCB plating Qualification
Werner Engelmaier
Tue, 13 Mar 2007 10:27:10 EDT
Re: PCB plating Qualification
Werner Engelmaier
Tue, 13 Mar 2007 12:23:44 EDT
Polymer Core BGA Balls
Werner Engelmaier
Wed, 7 Mar 2007 09:50:25 EST
Re: Post Assembly Bow and Twist
Werner Engelmaier
Thu, 8 Mar 2007 09:26:20 EST
Re: SMT Solder Joint Strength
Werner Engelmaier
Fri, 16 Mar 2007 14:53:40 EDT
Re: SMT Solder Joint Strength
Werner Engelmaier
Fri, 16 Mar 2007 15:04:01 EDT
Re: SMT Solder Joint Strength
Werner Engelmaier
Fri, 16 Mar 2007 15:25:22 EDT
Re: SMT Solder Joint Strength
Werner Engelmaier
Fri, 16 Mar 2007 15:28:45 EDT
Re: SMT Solder Joint Strength
Werner Engelmaier
Fri, 16 Mar 2007 16:04:05 EDT
Re: SMT Solder Joint Strength
Werner Engelmaier
Fri, 16 Mar 2007 16:50:30 EDT
Re: SMT Solder Joint Strength
Werner Engelmaier
Fri, 16 Mar 2007 17:31:12 EDT
Re: SMT Solder Joint Strength
Werner Engelmaier
Fri, 16 Mar 2007 17:34:26 EDT
Re: SMT Solder Joint Strength
Werner Engelmaier
Fri, 16 Mar 2007 17:37:41 EDT
Re: SMT Solder Joint Strength
Werner Engelmaier
Fri, 16 Mar 2007 17:57:51 EDT
Re: Solder Resist Encroachment onto BGA pads
Werner Engelmaier
Fri, 30 Mar 2007 19:23:16 EDT
Re: Solder Resist Encroachment onto BGA pads
Werner Engelmaier
Fri, 30 Mar 2007 19:25:09 EDT
Re: Solder Resist Encroachment onto BGA pads
Werner Engelmaier
Fri, 30 Mar 2007 22:58:10 EDT
Re: Solderability problems on through holes only.
Werner Engelmaier
Wed, 21 Mar 2007 22:44:49 EDT
Re: Solderability problems on through holes only.
Werner Engelmaier
Fri, 23 Mar 2007 08:43:03 EDT
Re: Solderability problems on through holes only.
Werner Engelmaier
Fri, 23 Mar 2007 17:36:27 EDT
Re: Solderability problems on through holes only.
Werner Engelmaier
Fri, 23 Mar 2007 17:39:49 EDT
Re: Soldering to Beryillum Copper
Werner Engelmaier
Wed, 28 Mar 2007 13:09:20 EDT
Re: Soldering to Beryillum Copper
Werner Engelmaier
Wed, 28 Mar 2007 13:15:23 EDT
Re: Soldering using Sn96
Werner Engelmaier
Fri, 30 Mar 2007 18:41:42 EDT
Re: T260 tests
Werner Engelmaier
Fri, 23 Mar 2007 17:52:10 EDT
Re: T260 tests
Werner Engelmaier
Thu, 29 Mar 2007 18:15:53 EDT
Re: Via aspect ratio in mixed dielectric PCB's
Werner Engelmaier
Wed, 28 Mar 2007 16:59:48 EDT
Re: Via aspect ratio in mixed dielectric PCB's
Werner Engelmaier
Thu, 29 Mar 2007 10:23:49 EDT
Re: Via aspect ratio in mixed dielectric PCB's
Werner Engelmaier
Thu, 29 Mar 2007 10:33:52 EDT
Re: whodunit?
Werner Engelmaier
Fri, 9 Mar 2007 11:55:00 EST
Re: whodunit?
Werner Engelmaier
Mon, 12 Mar 2007 13:16:17 EDT
Re: [LF] Polymer Core BGA Balls
Werner Engelmaier
Wed, 7 Mar 2007 13:49:25 EST
Re: [LF] Polymer Core BGA Balls
Werner Engelmaier
Wed, 7 Mar 2007 15:06:12 EST
Re: [LF] Polymer Core BGA Balls
Werner Engelmaier
Wed, 7 Mar 2007 20:11:20 EST
Re: [LF] Polymer Core BGA Balls
Werner Engelmaier
Fri, 9 Mar 2007 17:25:47 EST
Re: FW: [TN] immersion silver and exposed copper in small vias
Werner Engelmaier
Tue, 6 Mar 2007 19:06:55 EST
New Sender West, Jim
Good books to read?
West, Jim
Tue, 27 Mar 2007 14:12:10 -0400
Lead coating meniscus cracking
West, Jim
Wed, 7 Mar 2007 10:12:50 -0500
Pad damage
West, Jim
Tue, 20 Mar 2007 10:07:04 -0400
New Sender Whittaker, Dewey (EHCOE)
Re: Alternative SAC (NTC)
Whittaker, Dewey (EHCOE)
Fri, 30 Mar 2007 07:56:40 -0700
Re: Alternative SAC (NTC)
Whittaker, Dewey (EHCOE)
Fri, 30 Mar 2007 08:00:03 -0700
Re: Alternative SAC (NTC)
Whittaker, Dewey (EHCOE)
Fri, 30 Mar 2007 10:26:39 -0700
Re: Chip Capacitor Reliability Question
Whittaker, Dewey (EHCOE)
Tue, 6 Mar 2007 10:16:23 -0700
Re: Component Orientation Survey
Whittaker, Dewey (EHCOE)
Thu, 1 Mar 2007 06:47:18 -0700
Re: Component Orientation Survey
Whittaker, Dewey (EHCOE)
Thu, 1 Mar 2007 07:10:07 -0700
Re: copper deterioration (NTC?)
Whittaker, Dewey (EHCOE)
Thu, 8 Mar 2007 13:38:06 -0700
Re: Flip-flop panels
Whittaker, Dewey (EHCOE)
Fri, 2 Mar 2007 14:31:19 -0700
Re: immersion silver and exposed copper in small vias
Whittaker, Dewey (EHCOE)
Tue, 6 Mar 2007 15:34:16 -0700
Re: immersion silver and exposed copper in small vias
Whittaker, Dewey (EHCOE)
Wed, 7 Mar 2007 09:39:56 -0700
Re: immersion silver and exposed copper in small vias
Whittaker, Dewey (EHCOE)
Wed, 7 Mar 2007 11:03:25 -0700
Re: Laminate material selection
Whittaker, Dewey (EHCOE)
Mon, 12 Mar 2007 09:45:39 -0700
Re: Lead coating meniscus cracking
Whittaker, Dewey (EHCOE)
Wed, 7 Mar 2007 12:09:02 -0700
Re: Post Assembly Bow and Twist
Whittaker, Dewey (EHCOE)
Thu, 8 Mar 2007 07:11:27 -0700
Re: Prediction comes true (NTC)
Whittaker, Dewey (EHCOE)
Thu, 1 Mar 2007 11:33:16 -0700
Re: Prediction comes true (NTC)
Whittaker, Dewey (EHCOE)
Thu, 1 Mar 2007 12:13:35 -0700
Re: Prediction comes true (NTC)
Whittaker, Dewey (EHCOE)
Fri, 2 Mar 2007 06:52:28 -0700
Re: Qualification Testing for H1 Flux
Whittaker, Dewey (EHCOE)
Fri, 9 Mar 2007 11:56:57 -0700
Re: Soldering to Beryillum Copper
Whittaker, Dewey (EHCOE)
Wed, 28 Mar 2007 11:45:49 -0700
Re: Soldering to Beryillum Copper
Whittaker, Dewey (EHCOE)
Wed, 28 Mar 2007 12:19:01 -0700
Re: Soldering using Sn96
Whittaker, Dewey (EHCOE)
Fri, 30 Mar 2007 08:14:12 -0700
Re: Soldermask Blisters
Whittaker, Dewey (EHCOE)
Mon, 26 Mar 2007 07:25:52 -0700
Re: SV: [TN] Prediction comes true (NTC)
Whittaker, Dewey (EHCOE)
Thu, 1 Mar 2007 14:33:26 -0700
Re: SV: [TN] Prediction comes true (NTC)
Whittaker, Dewey (EHCOE)
Thu, 1 Mar 2007 14:53:35 -0700
Re: SV: [TN] Prediction comes true (NTC)
Whittaker, Dewey (EHCOE)
Fri, 2 Mar 2007 06:43:32 -0700
Re: whodunit?
Whittaker, Dewey (EHCOE)
Mon, 12 Mar 2007 08:06:22 -0700
Re: whodunit?
Whittaker, Dewey (EHCOE)
Mon, 12 Mar 2007 09:55:03 -0700
New Sender Wood, Kenneth
Re: Engineering Question
Wood, Kenneth
Fri, 16 Mar 2007 12:53:38 -0400
New Sender Wrobel, Clayton
Re: APEX NTC
Wrobel, Clayton
Fri, 2 Mar 2007 10:40:55 -0500
New Sender ZLATKO BIJEDIC
Re: Flex Circuit Scratch...
ZLATKO BIJEDIC
Thu, 15 Mar 2007 16:04:31 -0700
Re: Legend Ink and ENIG
ZLATKO BIJEDIC
Wed, 28 Mar 2007 19:32:47 -0700

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