Everyone,

I'm trying to find out a couple of things...

First of all, has anyone conducted any studies on the probability of a 
fractured chip capacitor moving from an open to a shorted condition?

Secondly, if an open condition cannot be detected during electrical testing, 
and the unit has been sealed with adhesive around the enclosure (unable to 
open without having to scrap), is there a method available to check if the 
component has seen any damage?  We have a Feinfocus X-ray unit, and the 
results we've been able to obtain have not been encouraging.  The board is in 
an aluminum and zinc frame and has been conformally coated with acrylic 
material.

Thanks in advance for your help!

Leland Woodall

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