Hi,

   I am hoping that someone can help us with a clarification regarding

   solder purity/composition requirements. Specifically the following:



   ANSI J STD 006 on page 3 lists allowable impurities in the solder alloy

   when purchased. One component in particular is indium @ 0.10 allowable

   limit.

   However, ANSI J STD 001 which is the assembly specification used in

   daily production lists on page 5 allowable solder impurities which does

   not include/allow Indium.

   ANSI J STD 001 which is also the specification used for testing lists on

   page 5 allowable solder impurities which also does not allow Indium.



   Perhaps we are interpreting the sentence associated with the table on

   both 001 and 003 wrong, however the sentence does state:  “the balance

   of the bath shall be lead and/or the items listed above.” How can you

   allow Indium in the raw purchased solder and not allow it in the

   production solder?



   Thank you in advance for your thoughts and clarifications.







Brian Guidi

Senior Product Engineer / N.P.I.

Teledyne Printed Circuit Technology

Tel: (603) 889-6191  X:310

Fax: (603) 886-2977

E-mail: [log in to unmask]



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