Hello all,

 

1.	Process: lead free (SAC 305) solder paste
2.	fine pitch component (QFP)termination finish: SN /NI/Pd/CU
3.	PCB pads: ENIG

 

Requesting every one to comment on the above combination. Will I have any
major issues post reflow.?

 

 

Thanx

Badri

 

 

 








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