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Tue, 14 May 1996 09:48:39 -0400 |
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| From [log in to unmask] Thu May 16 12: |
58:43 1996 |
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Is there any corrrelation with the gritty sodler joints and dip connections
to either the power or ground planes?
At 09:10 PM 5/14/96 +0800, Poh Kong Hui wrote:
>Dear Technet,
>
>Whenever, I'm running a 100% through-hole board, that is densely populated
>with mainly DIP components, and a only few capacitors and resistors., 20 to
>30% of the solder joints are gritty.
>
>It had never happened to board of mixed technology.
>I have sent the solder for lab. analysis, and the result is within the
>recommended specification.
>
>The Board is :-
>10 x 10 sq.inch
>4 layers
>
>The wave-solder Machine used :-
>The wave-solder machine used is SEHO 2000 - a full-blown nitrogenous tunnel.
>The solder pot temperature is set at 245 deg.cel or 473 deg.F.
>The top side temperature is measured at about 194 deg.F / 90 deg.C.
>Conveyor speed is set 0.90 metre/minute.
>The solid content of the flux is 1%.
>
>Could anybody advise me why this is happening, and how to solve it. Our
>rework operators are touching every gritty joint.
>
>
>Poh Kong Hui
>Nera Electronics
>
>
Regards,
Gary Ferrari
Chairman IPC-D-275
Tech Circuits
(203)269-3311
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