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| From [log in to unmask] Wed Feb 28 15: |
28:51 1996 |
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At 04:48 PM 2/27/96 -0800, you wrote:
>
><Text_1>
> Our company just started using surface mount components and as I'm
> creating the land patterns, I notice that on the resistors &
> capacitors, the width of the part is greater than the width of the
> pad. What is the reason for this and would it cause a problem if I
> made the pad the same size as the part?
>
> Thanks,
> Mike Wedlock
> Aerospace Avionics
>
>
Mike;
It was noticed that on some of the larger chip components, that the volume
of solder was too great. This volume caused some cracking of the component
during the soldering process. To reduce this volume, the land pattern width
was reduced.
Gary Ferrari
Tech Circuits
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