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George;
IP-D-275 establishes the requirements for the designed board fabrication and
assembly. The IPC-RB-276 specifies the board fabrication performance
requirements, which complements the requirements set forth in IPC-D-275. The
J-STD-001 provides a similar function for the assembly operations. This is
usually the sequesnce of standard implementation, not necessarily in reverse
as you imply.
Regards,
Gary Ferrari
IPC Staff
At 08:55 AM 7/26/96 -0500, George Franck X2648 N408 wrote:
>Good Morning
>
>Requirements question.
>
>A customer requests that designs "meet the requirements of
>ANSI-J-STD-001A-1995 for preparation and soldering of electrical
>connections." [Assume Class 2.]
>
>Question: In the above statement, are there any PWB Fab requirements,
>design or acceptance ?
>
>What I found: In J-001 there are references to IPC-D-275 and IPC-RB-276.
>References I found are: inside front cover, 2.1.2, 2.2.1, 3.4.1, and 5.0.
>
>Point of confusion: My gut tells me there's gotta be a call out in here
>somewhere, but these references do not look like requirements to me, they
>look like general information.
>
>Thanks for you help
>George Franck
>
>
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