Technetters,
I am searching for the best way to etch a microsection. The way we
currently do it is Hydrogen peroxide/ammonia. It seems inconsistent as
it is used throughout the day. When the etch is new we get an extremely
good line of demarcation between the clad and plated copper.
Occasionally, we see  a line where the plater actually pulls the rack
out of the bath,  plugs the hole and returns it to the bath for a higher
thickness. We apply the etch with a cotton swab for approximately 10
seconds.

I am  wondering if this is a common technique  for microsection etching? 

T.A. Gaylor 

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