Technetters, I am searching for the best way to etch a microsection. The way we currently do it is Hydrogen peroxide/ammonia. It seems inconsistent as it is used throughout the day. When the etch is new we get an extremely good line of demarcation between the clad and plated copper. Occasionally, we see a line where the plater actually pulls the rack out of the bath, plugs the hole and returns it to the bath for a higher thickness. We apply the etch with a cotton swab for approximately 10 seconds. I am wondering if this is a common technique for microsection etching? T.A. Gaylor *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************