Hello,
I have some questions regarding PCB for data and microwave applications
which I hope someone will give me some good inputs to.
Questions:
I would like to have some inputs abut solderability, shelf lifte etc. by
using different surface treatment onto the cu-pattern on a PCB. Your
experience by using:
a. HAL
b. Reflowed Sn/Pb
c. Unreflowed Sn/Pb
d. Electroless nickel/gold
e. Organic passivation
f. Other
And above surface treatments in combination with:
a. Surface mounted chip components
b. Surface mounted fine-pitch IC
c. "Standard" hole mounted components
Best Regards
Peter Dahlén
Saab Ericsson Space
[log in to unmask]
fax. +46 31 359520
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