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July 1997

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>From willli Tue Jul 8 07:
31:22 1997
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Tue, 08 Jul 1997 14:41:36 +0000
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From [log in to unmask] Tue Jul 8 08:
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Hello,

I have some questions regarding PCB for data and microwave applications
which I hope someone will give me some good inputs to.

Questions:

I would like to have some inputs abut solderability, shelf lifte etc. by
using different surface treatment onto the cu-pattern on a PCB. Your
experience by using:

a.	HAL
b.	Reflowed Sn/Pb
c.	Unreflowed Sn/Pb
d.	Electroless nickel/gold
e.           Organic passivation
f.	Other

And above surface treatments in combination with:

a.	Surface mounted chip components
b.	Surface mounted fine-pitch IC
c.	"Standard" hole mounted components 


Best Regards

Peter Dahlén

Saab Ericsson Space
[log in to unmask]
fax. +46 31 359520



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