Hello, I have some questions regarding PCB for data and microwave applications which I hope someone will give me some good inputs to. Questions: I would like to have some inputs abut solderability, shelf lifte etc. by using different surface treatment onto the cu-pattern on a PCB. Your experience by using: a. HAL b. Reflowed Sn/Pb c. Unreflowed Sn/Pb d. Electroless nickel/gold e. Organic passivation f. Other And above surface treatments in combination with: a. Surface mounted chip components b. Surface mounted fine-pitch IC c. "Standard" hole mounted components Best Regards Peter Dahlén Saab Ericsson Space [log in to unmask] fax. +46 31 359520 *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************