回覆 : [TN] CTE of FR4 and other materials in JPG format (1 Message)
(fab) Specify Multilayer Build (5 Messages)
(no subject) (1 Message)
.004 Cores (2 Messages)
0603 devices and wave flow (3 Messages)
400 micron Laminate (1 Message)
: Assy: Xray Utilization (9 Messages)
: SMT Hand placing time standards... (1 Message)
<No subject> (2 Messages)
About E-Ni/E-Pd/I-Au (1 Message)
About Wire Bonding (1 Message)
Admin Test Message - Disregard (1 Message)
Allegro RS274X Output (1 Message)
another test ― disregard (1 Message)
Any advice on Omikron (Immersion White Tin)? (4 Messages)
AOI MARKING PENS (3 Messages)
Are you looking for an SMT line? (1 Message)
asking of a spec' MIL-STD-105 (1 Message)
Assembly survey (3 Messages)
Assy: Max Soldering Temp/Time spec. (3 Messages)
ASSY: stacking 1206 chip resistors (12 Messages)
ASSY: vertical integration of 1206 chip resistors (1 Message)
ASSY:board marking labels for reflow (2 Messages)
Attaching TC's for profiling (2 Messages)
Attaching Thermocouples for Profiling (5 Messages)
Autoclaving Flex PWBs (1 Message)
AW: [TN] Via's under BGA's (1 Message)
Backfill with dielectric control (1 Message)
BGA (3 Messages)
BGA Acceptable crititerial (1 Message)
BGA Assembly (3 Messages)
BGA Assembly pricing (1 Message)
BGA on thru-hole pads (3 Messages)
BGA Reflow question (3 Messages)
BGA Rework (1 Message)
BGA rework question (2 Messages)
BGA X-ray image interpretation (1 Message)
BGA: Tape & Reel vs. Trays (1 Message)
Blind & Buried Via (2 Messages)
Blind and Buried Via Design (1 Message)
Braun? Brown? Process (4 Messages)
Braun? Brown? Process Thanks! (1 Message)
Burnt FR4 (2 Messages)
Call For Abstracts - InterPACK® '99 (1 Message)
Carbon film resistors (2 Messages)
Career Advice (1 Message)
Ceramic vs. Plastic Components (2 Messages)
Chemicals List (2 Messages)
Component Baking Guideline (3 Messages)
Confomal coating adhesion (6 Messages)
Confomal coating adhesion - reply (1 Message)
conformal coat machines (2 Messages)
Conformal Coat Masking (2 Messages)
Conformal coating adhesion (1 Message)
Conformal Coating Manufactures (3 Messages)
Copper ductility (2 Messages)
Copper ductility -Reply (2 Messages)
Copper plating & Copper thickness (3 Messages)
Copper Question (3 Messages)
CTE of FR4 and other materials (1 Message)
CTE of FR4 and other materials in JPG format (1 Message)
Current Carrying Capacity of Conductors (1 Message)
Cutters (8 Messages)
Cyanate Ester E glass processing (1 Message)
DC Current Probe (1 Message)
Depanelizing boards (3 Messages)
DESIGN SERVICE BUREAU USING ZUKEN VISULA (1 Message)
DFM HELP (1 Message)
Differential impedance (2 Messages)
Digital Camera Assembly Process (1 Message)
digital pwb design survey (2 Messages)
Double sided BGA assembly (3 Messages)
Effects of X-Ray inspection on GaAs components. (1 Message)
EMI Shields (5 Messages)
Environmental Stress Screening (ESS) (1 Message)
ESD Smocks (2 Messages)
FAB : Deburr Brushes (1 Message)
Fab: Cyanide plating bath on "standby mode" (3 Messages)
Fab: Multiple surface finishes (3 Messages)
fab: repair inner layer trace (3 Messages)
Failure of Rigid Flex (3 Messages)
Flex Circuit Materials (1 Message)
Flex market figures (2 Messages)
FR4 thermal expansion (10 Messages)
FR4 thermal expansion -Reply (1 Message)
Galvanic action (4 Messages)
geek (5 Messages)
Gold Finger Critical Contact Area (1 Message)
Gold removal service (3 Messages)
Gull wing lead forming (3 Messages)
Harman wire-bonding book (1 Message)
Heat seal connectors to LCD (2 Messages)
Heller 1900 (1 Message)
HELP NEEDED ON OSP QUALITY ON THE THM COMPONENT SOLD (2 Messages)
HELP NEEDED ON OSP QUALITY ON THE THM COMPONENT SOLDERBILITY (1 Message)
Help on design rules for chip capacitors (4 Messages)
Help with design and assembly of Micro BGA's TI "MicroSt ar" and Tessera uBGA style (1 Message)
Help with design and assembly of Micro BGA's TI "MicroStar" and Tessera uBGA style (1 Message)
Hermetic Sealing (2 Messages)
Hidden Via (1 Message)
High Temp Solder - the "real" world (1 Message)
Hot Bar Soldering (6 Messages)
Hot bar soldering flex on ceramic (4 Messages)
Hot: Trace width and air gap for 1mm pitch BGA (3 Messages)
ICD defect (4 Messages)
ICT for bare boards (14 Messages)
IMAPS/SMTA Seminar 10/22/98 @ Lucent Technologies (1 Message)
Immersion Tin Process (4 Messages)
In-house Specifications (2 Messages)
Inserts into PWB (2 Messages)
Intel uBGA Flash, Bottom Side SMT? (2 Messages)
Ionic Contamination due to No-Clean Fluxes (7 Messages)
IPC - A - 600 (2 Messages)
IPC - A - 600 or 610? (1 Message)
IPC J-Std-001 Class What reliability? (2 Messages)
IPC Rework Documents (2 Messages)
IPC Standards for Fiducials (3 Messages)
IPC-A-610B Class II vs Class III (1 Message)
IPC-R-700 (1 Message)
j-std-001b (2 Messages)
Japanese Solderability Specs (2 Messages)
Land size (2 Messages)
Laser direct imaging (3 Messages)
laser drilling / ablation (1 Message)
LED 7 segment displays in SMT package (3 Messages)
LED failures (4 Messages)
LED failures -Reply (1 Message)
Longitudinal PTH cracking (2 Messages)
Looking for custom vibrating tube feeder for Fuji IP2 (2 Messages)
Looking for susceptibility simu. software for RFI (1 Message)
Loss of chips thru wave solder (2 Messages)
LPI Filled Vias (1 Message)
LPI Filled Vias ? (4 Messages)
LPI Filled Vias-correction (1 Message)
Mail Link to SMTP Undeliverable Message (1 Message)
Micro BGA (1 Message)
microannex els (2 Messages)
Microelectronics Market for Imaging Chemicals (1 Message)
MIL S 13949 to IPC 4101 Conversion GMN versus GFT (1 Message)
Military Specifications (4 Messages)
MS-105 (1 Message)
NAWCADLKE SPECIFICATION (2 Messages)
No-Clean Solder Ball. (5 Messages)
One more thing on stacked chip components. (1 Message)
OSP and Loctite 7360 (1 Message)
Oxide / Durabond Alternatives (6 Messages)
Oxide / Durabond Alternatives -Reply (2 Messages)
Oxide process controls (3 Messages)
P and B content in electroless nickel (2 Messages)
Partnering with CM's (1 Message)
PCB ASSEMBLY COST ANALYS (2 Messages)
PCB ASSEMBLY COST ANALYS (Can we put on TN?) (1 Message)
PCB ASSEMBLY COST ANALYSIS (9 Messages)
PCB Designers (2 Messages)
PCB for fine pitch (3 Messages)
Percent Phosphorous in plating solution causing excess intermetal lics in Au/Ni/Cu solder joints (1 Message)
Percent Phosphorous in plating solution causing excess intermetallics in Au/Ni/Cu solder joints (1 Message)
Phosphor in Electroless Nickel (1 Message)
Phosphour in Elcetroless Nickel (1 Message)
Phosphour in Electroless Nickel (3 Messages)
Please help, if you can. (1 Message)
Plugged/tented vias (4 Messages)
Prepreg Thickness (1 Message)
Price Quote (1 Message)
Product Safety (3 Messages)
Protective coating for glass (1 Message)
PTH Plugging (1 Message)
Pull force (1 Message)
pure tin surface finish (1 Message)
pure tin surface finish requirement (5 Messages)
pwb design survey (2 Messages)
question (2 Messages)
quoting for an SMT assembly job, help! (1 Message)
Reg: Dicing operations (3 Messages)
Reg: Voids in Solder Bumps (1 Message)
Reliability Data for Pad Repair (1 Message)
Replacing Mil-S-13949 (3 Messages)
Rework (2 Messages)
RF soldermask defined pads (2 Messages)
Risu and Rasu (2 Messages)
RTV (4 Messages)
Sealbrite (4 Messages)
Shelf Life/Storage for Bare PCB (8 Messages)
SMD pull test (2 Messages)
SMT Assembly on Ceramic substrate? (10 Messages)
SMT Government/Industry projections (1 Message)
SNEC mtg notice (1 Message)
Solder alloy properties (1 Message)
Solder splatter on wave solder machine (8 Messages)
Solderability Problems (11 Messages)
Solderability Test for SMT: Dip and Look or Wetting Bala nce? (1 Message)
Solderability Test for SMT: Dip and Look or Wetting Balance? (3 Messages)
Soldering Brass to Copper (3 Messages)
Soldering Palladium plated leads (6 Messages)
Soldering to Gold using "No Clean" flux (1 Message)
Soldering to Nickel (3 Messages)
Soldermask covered vias?? (3 Messages)
Soldermask covered vias?? -Reply (1 Message)
Something abobut Au plating (1 Message)
Stacking Chip Components (1 Message)
Subscribe (6 Messages)
Technet @ the EXPO (2 Messages)
TechNet: confirmation required (1D4C91) (1 Message)
TechNet: confirmation required (75C57F) (1 Message)
Technology Roadmaps (2 Messages)
Teflon Board Assembly (3 Messages)
Temp Profiling (2 Messages)
Test (3 Messages)
Thermal Aging Of Solder Joints (5 Messages)
This is a test. (1 Message)
Through Hole Component leads & their solder land size (1 Message)
Throwing Power (6 Messages)
TN: Need help on sun sparc 5 front end system for MD fire9000 plotter. (1 Message)
Tolerance on Collapsed height of BGA Balls (3 Messages)
top side solderpaste (2 Messages)
Trace Repairs (2 Messages)
Transmission line and Microstrip theory (2 Messages)
transparent silver coating (1 Message)
Types of BGAs (5 Messages)
unsubscribe users.. (1 Message)
Vacuum failures (1 Message)
Via's under BGA (1 Message)
Via's under BGA's (4 Messages)
Vias in chip components pads? (3 Messages)
Vias stealing solder from BGA's pads (1 Message)
Voiding in BGA (6 Messages)
Wanting to Know (1 Message)
Water absorption rate (2 Messages)
Water Absorption Rate. (1 Message)
Water soluble temporary solder mask (2 Messages)
Wave Solder Process Tools (1 Message)
wave solder service & support (2 Messages)
Wave Soldering SMT Timing Devices (1 Message)
WG: OSP & through hole components _ (1 Message)
Wirebond Arc Description (JEDEC) (1 Message)
Wirebonding (2 Messages)
WTECH (2 Messages)
Xray inspection (1 Message)
[TN] Ceramic vs. Plastic Components (1 Message)
[TN] Confomal coating adhesion (1 Message)
[TN] Depanelizing boards (1 Message)
[TN] Ionic Contamination due to No-Clean Fluxes (2 Messages)
[TN] PCB ASSEMBLY COST ANALYSIS (2 Messages)
[TN] PCB ASSEMBLY COST ANALYSIS -Reply (1 Message)
[TN] Re[2]: [TN] PCB ASSEMBLY COST ANALYSIS (3 Messages)
[TN] Teflon Board Assembly (1 Message)
[TN] Via's under BGA's (1 Message)
[TN] Voiding in BGA (1 Message)