Dear Technettes

One of our PCB Manufacturers has recently started using the "Omikron"
(Immersion White Tin) process as an alternative to Hot Air Leveling.
They are asking us (the designers) whether they can use it for our boards.

I've looked through the archives, and there seem to be no major problems
noted so far. Still, it's a couple of months since it's been discussed,
and it is a new(ish) process. So, here goes :

Does anyone know of any particular adverse design or assembly implications
of using this process? Do you know (even as hearsay) of any problems with
the process?


Thanks, and Regards

Brian Rusten

Contract PCB Design Engineer
JNA Telecommunications Ltd  Ph (02) 9935 5777      Fax (02) 9417 3862
(Now "A Lucent Company")

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