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October 1998

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Subject:
From:
David D Sullivan <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 9 Oct 1998 05:15:42 -0500
Content-Type:
text/plain
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text/plain (62 lines)
J M,

When I was at IPC last April, MacDermid had a conveyorized copper treatment
process which had a very small footprint.  I talked to Bob Hamilton of
MacDermid who is their technical specialist for this process.  You can call
him in the US at (203) 575-5700.

Regards,

Dave Sullivan
Rockwell Collins




J M <[log in to unmask]> on 10/08/98 01:24:47 PM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
      to J M <[log in to unmask]>

To:   [log in to unmask]
cc:
Subject:  [TN] Oxide / Durabond Alternatives




We are in the process of selecting a new line for prelamination, and we
would like to know of other proven alternatives to Oxide/Durabond.
We also would like to have a fully conveyorized system capable of
linking to conveyorized AOI and to Lamination.
Thank you for your help

______________________________________________________
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