0402 Component spacing (3 Messages)
: Ionic contamination limit level for Ionograph (10 Messages)
Adhesive where no component is loaded... (32 Messages)
Adhesive where no component is loaded... (NTC) (1 Message)
Adhesive where no component is loaded...(NTC) (2 Messages)
Aluminum and Halogenated Fluorocarbons (1 Message)
Antw: [TN] Impact of Pad Geometry on Lead-Free Application (2 Messages)
AOI (1 Message)
apology for tornado warning (2 Messages)
Au/Sn plus silver epoxy (1 Message)
Bad laminate and warped board (11 Messages)
C-ya'll... (27 Messages)
Cable and harnesses assembly (3 Messages)
Call for Participation for IPC Annual Meeting 2003 Technical Conference (1 Message)
CCL edge quality (1 Message)
Checking and measuring voids in underfil (3 Messages)
Coil Winding Companies (5 Messages)
Combination Leadless and SnPb (5 Messages)
Conformal Coating Application Method for BGA (6 Messages)
contract assembly shops (1 Message)
Controlling pH of ammonia etcher (4 Messages)
Coplanarity of PLCC's (9 Messages)
copper corrosion with no cleans (2 Messages)
core fill (6 Messages)
core fill-NTC (3 Messages)
CR Technology's CRX-2000 capability (1 Message)
Cross-Hatching for Ground Portion of PCBs (2 Messages)
Cu- adhesion on HF- Materials (2 Messages)
Darrell R Beard/The Morey Corporation is out of the office. (1 Message)
DE-PANELIZING (3 Messages)
Dek automatic cleaning (2 Messages)
DPMO Questions (6 Messages)
Drill/Rout Software Question (3 Messages)
email address (1 Message)
EMI and heat removal properties of Via's (1 Message)
ENIG reflow profile vs HASL (9 Messages)
ENIG reflow profile vs. HASL (1 Message)
Enig? HASL? (4 Messages)
Equipment Show Stands (2 Messages)
Esd coat cleaning requirement (2 Messages)
ETSI vs. Mil-Std Cross-reference List? (1 Message)
FAB house challenge... (9 Messages)
formula lead to peeling strength of pad on finished PCB (2 Messages)
Fuji IP-II (2 Messages)
fuse/resistor installed between bifurcated terminals (3 Messages)
Galvanic Corrosion Testing (1 Message)
Gold Wire Bonding (2 Messages)
Grain direction in PCB (2 Messages)
Grand Pacific Opto (2 Messages)
High Voltage Capacitor Test House needed (1 Message)
Hot Boards! (9 Messages)
I'm still here... (5 Messages)
I'm still here...[ntc] (1 Message)
ICT and Surface Finish (2 Messages)
Immersion tin (1 Message)
Impact of Pad Geometry on Lead-Free Application (1 Message)
Inner layer separation (4 Messages)
Inspecting LCD's (1 Message)
Intermittent solder mask problems, again. (1 Message)
Ionograph (3 Messages)
IPC J-STD-004 Changes? (1 Message)
IPC Meeting Phoenix (2 Messages)
IPC's International Conference on Embedded Passives (1 Message)
IPC/HKPCA call for participation 2003 International Printed Circuit & Electronics Assembly Fair (1 Message)
Kester solderpaste... (3 Messages)
laser marking systems (10 Messages)
Lead Free (1 Message)
Lead Free Solder Update (1 Message)
Lead:Hole Ratio and Annular Ring Size (4 Messages)
Local assembly house in Shanghai region (1 Message)
Looking for Garland Service Co. (4 Messages)
Mechanical tests of surface finishing on flex (2 Messages)
MELF component/solder failure (1 Message)
MELF resistor failure (1 Message)
Micro-inch to copper weight conversion... (13 Messages)
MLF Component (2 Messages)
Nickel plated wire... (7 Messages)
NTC C-ya'll... Foot in Mouth (14 Messages)
OEM expectations... (7 Messages)
oxygen index (NTC) (1 Message)
Passivated Stainless-Steel parts (2 Messages)
PCB material info (2 Messages)
PCB plating (3 Messages)
PCB raw materials price index (2 Messages)
PCB_OPEN_VIAS_PROBLEMS (20 Messages)
perpendicularity of holes in a PCB (2 Messages)
Pin Grid Array (7 Messages)
Pin Holes (1 Message)
Plating holes of boards with 3oz copper layers (5 Messages)
Plugging under BGAs (17 Messages)
Power Boards (1 Message)
Printed Wire Board / Printed Circuit Board and Options C ards - G old Finger Thickness Round Robin Test (2 Messages)
Printed Wire Board / Printed Circuit Board and Options Cards - G old Finger Thickness Round Robin Test (1 Message)
problem with gold pads of the pcb (1 Message)
Profile (5 Messages)
PTH Hole Fill (5 Messages)
PWB PRICING (4 Messages)
Quatz Flip Chip die (2 Messages)
Quickbooks and Big Brother (9 Messages)
Reflow Fixture Opinions Sought (6 Messages)
Register Now for the IPC/SOLDERTEC Global Conference on Lead Free Electronics (2 Messages)
Removing a layer (5 Messages)
Ronald Bulwith (2 Messages)
ROSE for Flip Chip (13 Messages)
Rust (corrosion) Removal from sheet metal - Need urgent help. (6 Messages)
SARS and the electronics industry NTC (8 Messages)
Selective Soldering (1 Message)
Sideways Resistors (7 Messages)
SMT tape leader splicing tools (8 Messages)
Sn-Ni PCB plating (11 Messages)
Snec advanced mtg notice (1 Message)
Solder Fountain Parameters (3 Messages)
Solder paste, why the secrecy? (6 Messages)
Solder through conformal coating (8 Messages)
Soldering Stranded Wire (1 Message)
Source for Sealing Clips (2 Messages)
Stencil printing SMT Adhesives... (10 Messages)
Steve (1 Message)
Storage - Shelf life of populated PCBA's (1 Message)
Storage - Shelflife of populated PCBA's (2 Messages)
stripping boards (3 Messages)
SV: Controlling pH of ammonia etcher (1 Message)
Through-hole design vs. SMT design (4 Messages)
tin, gold (4 Messages)
tornado warning (1 Message)
Touchdown points (1 Message)
Trace thickness problem... (21 Messages)
Trace thickness problem...etc. (1 Message)
Trace thickness problem...some answers (1 Message)
Type 3 Chromate Conversion Coating (3 Messages)
UL Spacing requirements 1.5kV (4 Messages)
Unknown part (4 Messages)
Velcro ESD Straps for Trays (1 Message)
Voltage bias and IPC 2221 (2 Messages)
WaveRider(ECD Mole) vs. Wave Optimizer (3 Messages)
Wetting Balance Testing (22 Messages)
What is this defect? (6 Messages)
why do HDPE bottles get deformed? (4 Messages)
X-pert1700 Questions (1 Message)
X-ray beam damaging flash memories (5 Messages)
X-Ray Inspection of BGAs (4 Messages)
[TN] What is this defect? (1 Message)