Close but no cigar,
Duapol's max operating temp is 260 C, delmat is 300 C and duastone is 360 C.
This is right off their data sheets for the black ESD products. We use all
of them so we have no preference usually, but the durapol does not tolerate
reflow ovens very good.
Jim
----- Original Message -----
From: "Chad Haima" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, May 07, 2003 1:13 PM
Subject: Re: [TN] Reflow Fixture Opinions Sought
> Rick,
> I'd have to disagree with Jim. We have many customers that have used
> Durapol through reflow with no issues. The esd versions of Delmat,
> Durastone, and Durapol are all temperature specified at or around 300
> degrees Celsius and are non-flammable. I do agree Jim on a full process
> fixture as opposed to reflow only to address some of your concerns.
>
> Chad
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of jim
> Sent: Wednesday, May 07, 2003 11:05 AM
> To: [log in to unmask]
> Subject: Re: [TN] Reflow Fixture Opinions Sought
>
> Rick,
>
> You cannot use Durapol in the reflow oven. It will burn up in just a
> hundred
> or so passes. You need to use Durastone or Delmat.
>
> You may also want to consider using a fixture that you can run through
> the
> screen printer to avoid handling after printing.
>
> Jim
>
> ----- Original Message -----
> From: "Rick Thompson" <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Wednesday, May 07, 2003 12:48 PM
> Subject: [TN] Reflow Fixture Opinions Sought
>
>
> We have a customer who is requesting that we use a reflow fixture
> consisting
> of a Durapol plate with removable tooling pins to accomodate several
> different large PWBs through the reflow process. These fixtures would
> run on
> the flat belt rather than edge rails and would require that we remove
> large
> (16"x12") fully loaded boards from the conveyor rails to install on
> these
> fixtures prior to reflow. Components on the board range include a number
> of
> BGAs and micro-BGAs. The intent of the fixtures is to keep the board
> from
> flexing during reflow. My concern is that all the handling and flexing
> of
> boards with components in solder paste is going to increase the chances
> of
> soldering problems due to part separation from the paste if the board is
> flexed.
>
> Question: Has anyone used this type of concept on large, densely
> populated
> boards. Comments on pros and cons? Any other insights would be
> appreciated
> as I'm looking for supporting evidence to dissuade them from this
> approach
> which is primarily aimed as saving fixture costs over dedicated SMT
> fixtures.
>
> Thanks in advance.
>
>
> Rick Thompson
>
> Sr. SMT Process Engineer
> SMTEK International, Inc.
> +1 (805) 532-2800
> [log in to unmask]
>
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