(none) (1 Message)
: Blowhole (process indicator) (2 Messages)
: Martin-Marietta Workmanship Standard (7 Messages)
: White residue using Kester flux & wire (2 Messages)
About IPC's std.. IPC 7721 and 7720 (5 Messages)
about the dye penetrant materials in solder joints FA (6 Messages)
Access to balls on a BGA from the opposite side of the B oard (6 Messages)
Access to balls on a BGA from the opposite side of the Board (1 Message)
Advice on Inspection Equipment Needeed (3 Messages)
Antw: [TN] fractured solder joints (1 Message)
Antw: [TN] Soldering Nickel (1 Message)
Anybody got a AirVac PCBRM 12 they want to sell? (1 Message)
Assistance on IPC610 (3 Messages)
ASSY: Component Polarity NTC (1 Message)
Au revoir (1 Message)
Ball Placement Tooling (1 Message)
bent component leads (3 Messages)
BGA packaging? (3 Messages)
BGA Visual Inspection - Name Correction (1 Message)
buried resistance/embedded components (1 Message)
Cell phone antenna enhances...NTC (1 Message)
Cleaning of Military PWAs That Have Been Soldered with N o-Clean Flux (1 Message)
Cleaning of Military PWAs That Have Been Soldered with No-Clean Flux (1 Message)
Cleaning of Military PWAs That Have Been Soldered withN o-CleanFlux (1 Message)
Cleaning of Military PWAs That Have Been Soldered withNo -CleanFlux (4 Messages)
Cleaning of Military PWAs That Have Been Soldered withNo-CleanFlux (5 Messages)
Conformal coating - Dip Vs Spray (3 Messages)
Contract Manufacturing Seminar (1 Message)
Cosmetic Requirements (1 Message)
cracks in solder joints (6 Messages)
Definition of Suported/ unsupported hole (10 Messages)
Definition of Supported/ unsupported hole (11 Messages)
DEK Enviromental Control Unit (ECU) (2 Messages)
DEK Environmental Control Unit (ECU) (3 Messages)
Direct copper bonding (3 Messages)
DPMO benchmarking (1 Message)
Drilling FR6 material (1 Message)
Econonic Boom (1 Message)
Electrolude DCA COnformal Coating Rework (2 Messages)
Electronics Assembly disposal (9 Messages)
Electrovert Omniflo-10 users.. (2 Messages)
ELni/au (6 Messages)
ESD and equipment isolation (1 Message)
ESD heel straps (13 Messages)
Evanohm (3 Messages)
Extraneous Metal On MLCCs (5 Messages)
Failure at IMC (1 Message)
Flex circuit registration (5 Messages)
Flip Chip and Tape automated bonding feasibility and Implementation Program (2 Messages)
flux on component side of PCB (4 Messages)
fluxing the top side of printed circuit board (2 Messages)
Foreign Inclusions (Interpretation) (2 Messages)
fractured solder joints (10 Messages)
Glue or Not to Glue? (2 Messages)
High operating temperature (9 Messages)
High Rel Circuit Board Fab (3 Messages)
How to de-populate a PWB? (8 Messages)
How to de-populate a PWB? (warning - another commercial plug) (3 Messages)
How to de-populate a PWB? part 2 (1 Message)
Hows ya balls? (2 Messages)
Immersion Tin (15 Messages)
Immersion Tin and SERA (1 Message)
Intermetallic Joint Failure (10 Messages)
IPC spec on silkscreen alignment (1 Message)
IPC spec on silkscreen alignment. (1 Message)
IPC standards on Flux residue that is non-conductive and non-corrosive? (2 Messages)
IPC Torque Specifications (4 Messages)
IPC's std.. IPC 7721 (2 Messages)
IPC-1720 AQP (Assemblers Qualification Profile) (4 Messages)
Isolation Resistance vs. Insulation Resistance (5 Messages)
Jim Herard/Endicott/IBM is out of the office. (1 Message)
Labor estimation (3 Messages)
Lead Emission Calcs for EPA TRI Reporting? (2 Messages)
lead free assembly (3 Messages)
liquid residue between lands (2 Messages)
Looking for Soldering Theory Proofs (3 Messages)
looking for users of Lloyd Doyle Phasor Inspection System (1 Message)
Mark Orlowski/PEMSTAR Inc is out of the office. (1 Message)
Masking Caps (5 Messages)
Metal core PCB's (1 Message)
Metcal SP200 soldering Iron (7 Messages)
Moisture sensitive device (4 Messages)
Moisture Sensitive Devices (7 Messages)
My Friday TechNet post (1 Message)
Need user assist with IPC website issues (2 Messages)
Nickle-Palladium lead finish (3 Messages)
No UV block (2 Messages)
Not gold fingers on prototype conductive elastomer switc h (1 Message)
Not gold fingers on prototype conductive elastomer switch (1 Message)
NTC (1 Message)
NTC: Looking for a service bureau (or equivalent) that c anhandleSCI CARDS files? (1 Message)
NTC: Looking for a service bureau (or equivalent) that can handle SCI CARDS files? (2 Messages)
NTC: Looking for a service bureau (or equivalent) that canhandleSCI CARDS files? (1 Message)
Optocoupler's (5 Messages)
OT Cell phone antenna enhances...NTC (2 Messages)
OT- Anybody else getting strange emails? (11 Messages)
OT- wasn't an experiment.. (The other side) (2 Messages)
Oxidation problem in Silver plated components leads (11 Messages)
PCB Finish (2 Messages)
PCB lay-out problem... (17 Messages)
Peel Strength (1 Message)
PWB measling and moisture (2 Messages)
Re column grid arrays (3 Messages)
recommended land pattern (2 Messages)
Reflow on Wave. (10 Messages)
Reflowing tin. (1 Message)
Registration of soldermask (6 Messages)
Reverse engineering a PCB... (5 Messages)
Rigid Flex (1 Message)
Rigid-Flex Bake Requirements?? (5 Messages)
Rigid-Flex vendors... (6 Messages)
Rod Smith/Endicott/IBM is out of the office. (4 Messages)
Seeking PWA Test Information (2 Messages)
Seho Solder System 8000 (2 Messages)
Shelf life of Immersion Silver Fabs (6 Messages)
Sign off Technet (1 Message)
SNEC Meeting (5 Messages)
SNEC Mtg - corrected date (1 Message)
Solder beads on soldermask relieved traces (2 Messages)
Soldering Nickel (5 Messages)
soldermask ring v. full coat for BGA design (1 Message)
Sorry for the weird messages (1 Message)
Subj: [TN] Wire bondable gold (1 Message)
subscribe TechNet David Bailey (1 Message)
Suggestions for Dye penetrants used for BGA solder joint crack te sting (2 Messages)
SURFACE FINISHES (1 Message)
TDR Testing (3 Messages)
Testing Fuse Wire (1 Message)
Tetra treatment (6 Messages)
thanks (1 Message)
Throughhole insertion (5 Messages)
tin whiskers - matte tin (4 Messages)
TN: Smooth bright solder Joint (5 Messages)
US Competitivness--No Tech Content (9 Messages)
very small technical comment - Metcal (2 Messages)
Virus (1 Message)
Voltage Breakdown of Thick Laminates (2 Messages)
Washing Semi gloss boards. (7 Messages)
Wavesoldering Ceramic Caps (8 Messages)
Wessel Drills (2 Messages)
Wire bondable gold (8 Messages)
Wrappage Percentage for printed boards with BGA and micr o BGA (2 Messages)
Wrappage Percentage for printed boards with BGA and micro BGA (1 Message)
[DC] BGA Coating Question (1 Message)
[TN] Advice on Inspection Equipment Needeed (1 Message)